KR20140109965A - 은 나노와이어-기반 투명 전기 전도성 코팅의 레이저 패턴화 - Google Patents

은 나노와이어-기반 투명 전기 전도성 코팅의 레이저 패턴화 Download PDF

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KR20140109965A
KR20140109965A KR1020147019612A KR20147019612A KR20140109965A KR 20140109965 A KR20140109965 A KR 20140109965A KR 1020147019612 A KR1020147019612 A KR 1020147019612A KR 20147019612 A KR20147019612 A KR 20147019612A KR 20140109965 A KR20140109965 A KR 20140109965A
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South Korea
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transparent
layer
laser
electrically conductive
plane
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KR1020147019612A
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English (en)
Korean (ko)
Inventor
마크 제이 펠레라이트
존 피 바에트졸드
존 제이 스트라딩거
핑팬 우
히야신스 엘 레추가
마노즈 니르말
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쓰리엠 이노베이티브 프로퍼티즈 컴파니
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Publication of KR20140109965A publication Critical patent/KR20140109965A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/02—Materials and properties organic material
    • G02F2202/022—Materials and properties organic material polymeric
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/36—Micro- or nanomaterials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/026—Nanotubes or nanowires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Nanotechnology (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
KR1020147019612A 2011-12-21 2012-12-10 은 나노와이어-기반 투명 전기 전도성 코팅의 레이저 패턴화 Withdrawn KR20140109965A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161578521P 2011-12-21 2011-12-21
US61/578,521 2011-12-21
PCT/US2012/068731 WO2013095971A1 (en) 2011-12-21 2012-12-10 Laser patterning of silver nanowire - based transparent electrically conducting coatings

Publications (1)

Publication Number Publication Date
KR20140109965A true KR20140109965A (ko) 2014-09-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147019612A Withdrawn KR20140109965A (ko) 2011-12-21 2012-12-10 은 나노와이어-기반 투명 전기 전도성 코팅의 레이저 패턴화

Country Status (5)

Country Link
US (1) US9603242B2 (enExample)
JP (1) JP6162717B2 (enExample)
KR (1) KR20140109965A (enExample)
CN (1) CN104094362B (enExample)
WO (1) WO2013095971A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102296023B1 (ko) * 2020-03-06 2021-09-01 황성건 투과율 가변형 스마트 윈도우 필름 및 이의 제조방법

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150013292A (ko) 2012-05-18 2015-02-04 쓰리엠 이노베이티브 프로퍼티즈 컴파니 오버코팅된 나노와이어 투명 전도성 코팅의 코로나 패터닝
US10029916B2 (en) 2012-06-22 2018-07-24 C3Nano Inc. Metal nanowire networks and transparent conductive material
US9920207B2 (en) 2012-06-22 2018-03-20 C3Nano Inc. Metal nanostructured networks and transparent conductive material
CN105144346B (zh) * 2013-02-21 2017-12-15 恩耐公司 多层结构的激光刻图
US9842665B2 (en) 2013-02-21 2017-12-12 Nlight, Inc. Optimization of high resolution digitally encoded laser scanners for fine feature marking
US10464172B2 (en) 2013-02-21 2019-11-05 Nlight, Inc. Patterning conductive films using variable focal plane to control feature size
US9537042B2 (en) * 2013-02-21 2017-01-03 Nlight, Inc. Non-ablative laser patterning
US10020807B2 (en) 2013-02-26 2018-07-10 C3Nano Inc. Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks
US20140251672A1 (en) * 2013-03-05 2014-09-11 Ronald Steven Cok Micro-channel connection pad
US20150053459A1 (en) 2013-08-20 2015-02-26 Carestream Health, Inc. Patterning of electrically conductive films
BR112016006975A2 (pt) 2013-09-30 2017-08-01 3M Innovative Properties Co revestimento protetor para padrão condutivo impresso em condutores transparentes de nanofio dotados de um padrão
EP3052431A1 (en) * 2013-10-01 2016-08-10 Covestro Deutschland AG Uv-patternable hard-coating for transparent conductive film
US20150107878A1 (en) 2013-10-21 2015-04-23 Carestream Health, Inc. Invisible patterns for transparent electrically conductive films
US11274223B2 (en) 2013-11-22 2022-03-15 C3 Nano, Inc. Transparent conductive coatings based on metal nanowires and polymer binders, solution processing thereof, and patterning approaches
US20150209897A1 (en) 2014-01-27 2015-07-30 Carestream Health, Inc. Polarized laser for patterning of silver nanowire transparent conductive films
US9779851B2 (en) * 2014-03-27 2017-10-03 E I Du Pont De Nemours And Company Thermoformable polymer thick film transparent conductor with haptic response and its use in capacitive switch circuits
US11343911B1 (en) 2014-04-11 2022-05-24 C3 Nano, Inc. Formable transparent conductive films with metal nanowires
DE102014210461A1 (de) * 2014-06-03 2015-12-03 Robert Bosch Gmbh Leiterplatte mit einer Heizleiterbahn zum Aushärten einer Vergussmasse
US10618131B2 (en) 2014-06-05 2020-04-14 Nlight, Inc. Laser patterning skew correction
US9183968B1 (en) 2014-07-31 2015-11-10 C3Nano Inc. Metal nanowire inks for the formation of transparent conductive films with fused networks
US10310201B2 (en) 2014-08-01 2019-06-04 Nlight, Inc. Back-reflection protection and monitoring in fiber and fiber-delivered lasers
US10201082B2 (en) 2014-09-22 2019-02-05 Basf Se Transparent conductive layer, a film comprising the layer, and a process for its production
KR101637920B1 (ko) * 2015-01-06 2016-07-08 연세대학교 산학협력단 투명필름히터 및 그의 제조방법
CN104616833B (zh) * 2015-01-12 2017-01-04 浙江大学 大面积制备银纳米线透明电极的方法及银纳米线透明电极
US9837783B2 (en) 2015-01-26 2017-12-05 Nlight, Inc. High-power, single-mode fiber sources
US10050404B2 (en) 2015-03-26 2018-08-14 Nlight, Inc. Fiber source with cascaded gain stages and/or multimode delivery fiber with low splice loss
JP2018517237A (ja) 2015-04-16 2018-06-28 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ パターニングされた透明導電膜及び透明導電膜の製造方法
US10902970B2 (en) 2015-04-16 2021-01-26 Basf Se Patterned transparent conductive film and process for producing such a patterned transparent conductive film
JP6669443B2 (ja) * 2015-06-02 2020-03-18 昭和電工株式会社 金属ナノワイヤを用いた導電パターンの保護膜用樹脂組成物及び透明導電基板
US10520671B2 (en) 2015-07-08 2019-12-31 Nlight, Inc. Fiber with depressed central index for increased beam parameter product
KR20170018718A (ko) * 2015-08-10 2017-02-20 삼성전자주식회사 비정질 합금을 이용한 투명 전극 및 그 제조 방법
US11179807B2 (en) 2015-11-23 2021-11-23 Nlight, Inc. Fine-scale temporal control for laser material processing
WO2017091606A1 (en) 2015-11-23 2017-06-01 Nlight, Inc. Predictive modification of laser diode drive current waveform in high power laser systems
US10434600B2 (en) 2015-11-23 2019-10-08 Nlight, Inc. Fine-scale temporal control for laser material processing
KR20170067002A (ko) * 2015-12-07 2017-06-15 울산과학기술원 전자 빔을 이용한 도전성 나노와이어 네트워크의 제조방법, 이를 적용한 투명 전극 및 전자 장치
CN105446014B (zh) * 2015-12-24 2019-05-14 昆山龙腾光电有限公司 可实现视角切换的液晶显示装置
EP3389915B1 (en) 2016-01-19 2021-05-05 NLIGHT, Inc. Method of processing calibration data in 3d laser scanner systems
US20190114003A1 (en) * 2016-04-05 2019-04-18 3M Innovative Properties Company Nanowire contact pads with enhanced adhesion to metal interconnects
KR101812024B1 (ko) * 2016-06-10 2017-12-27 한국기계연구원 열선 및 이를 포함하는 면상 발열 시트
US10732439B2 (en) 2016-09-29 2020-08-04 Nlight, Inc. Fiber-coupled device for varying beam characteristics
US10423015B2 (en) 2016-09-29 2019-09-24 Nlight, Inc. Adjustable beam characteristics
US10730785B2 (en) 2016-09-29 2020-08-04 Nlight, Inc. Optical fiber bending mechanisms
KR20160142271A (ko) 2016-12-01 2016-12-12 서울대학교산학협력단 구리 나노와이어를 포함하는 투명전극의 제조방법 및 이에 따라 제조되는 구리 나노와이어를 포함하는 투명전극
US11173548B2 (en) 2017-04-04 2021-11-16 Nlight, Inc. Optical fiducial generation for galvanometric scanner calibration
KR102371678B1 (ko) 2017-06-12 2022-03-07 삼성디스플레이 주식회사 금속 나노선 전극 및 이의 제조 방법
CN110785684B (zh) * 2017-06-29 2022-06-03 3M创新有限公司 制品及其制造方法
US12032124B2 (en) 2017-08-04 2024-07-09 Vitro Flat Glass Llc Flash annealing of transparent conductive oxide and semiconductor coatings
CN107808708A (zh) * 2017-12-06 2018-03-16 武汉华星光电半导体显示技术有限公司 纳米银透明导电膜及其制备方法和触摸屏
US10664077B2 (en) 2017-12-06 2020-05-26 Wuhan China Optoelectronics Semiconductor Display Technology Co., Ltd. AgNW transparent conductive film and manufacturing method thereof and touch panel
CN108089381A (zh) * 2018-01-02 2018-05-29 京东方科技集团股份有限公司 侧面电极制作方法
TWI687531B (zh) * 2018-01-26 2020-03-11 謝孟修 陶瓷電路板及其製法
CN108845722B (zh) * 2018-06-30 2021-10-26 广州国显科技有限公司 导电膜结构及其制作方法、触控面板
CN112908518B (zh) * 2018-10-30 2022-11-08 苏州诺菲纳米科技有限公司 透明导电电极
EP3942360A4 (en) * 2019-03-20 2022-11-16 Sage Electrochromics, Inc. PATTERNED CLEAR CONDUCTIVE LAYER IN STOCK
CN110471205A (zh) * 2019-09-10 2019-11-19 珠海兴业新材料科技有限公司 一种含纳米银线透明导电膜的pdlc液晶调光膜的制备方法
KR20210068955A (ko) * 2019-12-02 2021-06-10 주식회사 코윈디에스티 레이저를 이용한 포토레지스트 패턴 리페어 방법
CN114049987A (zh) * 2021-10-27 2022-02-15 浙江鑫柔科技有限公司 一种金属网格导电膜及其制备方法

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4895630A (en) 1985-08-28 1990-01-23 W. H. Brady Co. Rapidly removable undercoating for vacuum deposition of patterned layers onto substrates
US5867238A (en) 1991-01-11 1999-02-02 Minnesota Mining And Manufacturing Company Polymer-dispersed liquid crystal device having an ultraviolet-polymerizable matrix and a variable optical transmission and a method for preparing same
KR940704009A (ko) 1992-01-10 1994-12-12 테릴 켄트 퀼리 개량 전극을 구비한 광 변조 장치(light modulating devices incorporating an improved electrode)
US5641426A (en) 1994-04-29 1997-06-24 Minnesota Mining And Manufacturing Company Light modulating device having a vinyl ether-based matrix
US20030148024A1 (en) 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
US6236442B1 (en) 1998-09-03 2001-05-22 Eastman Kodak Company Method of making liquid crystal display having patterned conductive images
US6394870B1 (en) * 1999-08-24 2002-05-28 Eastman Kodak Company Forming a display having conductive image areas over a light modulating layer
EP2154212A1 (en) * 2002-06-13 2010-02-17 Cima Nano Tech Israel Ltd A method for the production of conductive and transparent nano-coatings
US7601406B2 (en) 2002-06-13 2009-10-13 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
US7018713B2 (en) 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US7175876B2 (en) 2003-06-27 2007-02-13 3M Innovative Properties Company Patterned coating method employing polymeric coatings
JP4655939B2 (ja) * 2004-02-09 2011-03-23 旭硝子株式会社 透明電極の製造方法
JPWO2006068204A1 (ja) * 2004-12-21 2008-06-12 旭硝子株式会社 透明導電膜付き基板とそのパターニング方法
KR101095325B1 (ko) 2005-09-22 2011-12-16 후지필름 가부시키가이샤 광-투과성 전자파 차폐필름, 광-투과성 전자파 차폐필름의제조 방법, 디스플레이 패널용 필름, 디스플레이 패널용광학 필터 및 플라즈마 디스플레이 패널
US7655544B2 (en) 2005-10-21 2010-02-02 Utah State University Self-assembled nanostructures
US8092904B2 (en) 2006-03-31 2012-01-10 3M Innovative Properties Company Optical article having an antistatic layer
US20100171948A1 (en) 2006-06-14 2010-07-08 President And Fellows Of Harvard College Metalized semiconductor substrates for raman spectroscopy
US8018568B2 (en) * 2006-10-12 2011-09-13 Cambrios Technologies Corporation Nanowire-based transparent conductors and applications thereof
CN102324462B (zh) * 2006-10-12 2015-07-01 凯博瑞奥斯技术公司 基于纳米线的透明导体及其应用
US8178028B2 (en) 2006-11-06 2012-05-15 Samsung Electronics Co., Ltd. Laser patterning of nanostructure-films
US7786024B2 (en) 2006-11-29 2010-08-31 Nanosys, Inc. Selective processing of semiconductor nanowires by polarized visible radiation
US20090321364A1 (en) 2007-04-20 2009-12-31 Cambrios Technologies Corporation Systems and methods for filtering nanowires
US8846169B2 (en) 2007-12-28 2014-09-30 3M Innovative Properties Company Flexible encapsulating film systems
JP2011515510A (ja) 2008-02-26 2011-05-19 カンブリオス テクノロジーズ コーポレイション 導電性特徴をスクリーン印刷するための方法および組成物
JP2011517367A (ja) 2008-02-28 2011-06-02 スリーエム イノベイティブ プロパティズ カンパニー 基材上に導電体をパターン化する方法
US8546067B2 (en) 2008-03-21 2013-10-01 The Board Of Trustees Of The University Of Illinois Material assisted laser ablation
JP5289859B2 (ja) * 2008-08-13 2013-09-11 日本写真印刷株式会社 導電性パターン被覆体の製造方法および導電性パターン被覆体
JP5259368B2 (ja) * 2008-12-15 2013-08-07 日本写真印刷株式会社 導電性ナノファイバーシート及びその製造方法
KR101058844B1 (ko) 2008-12-31 2011-08-24 한국생산기술연구원 레이저를 이용한 회로 제조방법
US8275223B2 (en) 2009-02-02 2012-09-25 Ibiden Co., Ltd. Opto-electrical hybrid wiring board and method for manufacturing the same
JP5506235B2 (ja) * 2009-04-24 2014-05-28 日本写真印刷株式会社 艶消し状導電性ナノファイバーシート及びその製造方法
CN102388422B (zh) * 2010-05-28 2013-03-13 信越聚合物株式会社 透明导电膜及使用该透明导电膜的导电性基板
WO2012145157A1 (en) 2011-04-15 2012-10-26 3M Innovative Properties Company Transparent electrode for electronic displays

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102296023B1 (ko) * 2020-03-06 2021-09-01 황성건 투과율 가변형 스마트 윈도우 필름 및 이의 제조방법

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