KR20140095008A - 롤러 - Google Patents

롤러 Download PDF

Info

Publication number
KR20140095008A
KR20140095008A KR1020130155218A KR20130155218A KR20140095008A KR 20140095008 A KR20140095008 A KR 20140095008A KR 1020130155218 A KR1020130155218 A KR 1020130155218A KR 20130155218 A KR20130155218 A KR 20130155218A KR 20140095008 A KR20140095008 A KR 20140095008A
Authority
KR
South Korea
Prior art keywords
roller
pressing roller
pressing
adhesive tape
plate
Prior art date
Application number
KR1020130155218A
Other languages
English (en)
Korean (ko)
Inventor
도루 다카자와
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20140095008A publication Critical patent/KR20140095008A/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Labeling Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Rolls And Other Rotary Bodies (AREA)
KR1020130155218A 2013-01-23 2013-12-13 롤러 KR20140095008A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-010025 2013-01-23
JP2013010025A JP6058407B2 (ja) 2013-01-23 2013-01-23 ローラー

Publications (1)

Publication Number Publication Date
KR20140095008A true KR20140095008A (ko) 2014-07-31

Family

ID=51191169

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130155218A KR20140095008A (ko) 2013-01-23 2013-12-13 롤러

Country Status (4)

Country Link
JP (1) JP6058407B2 (ja)
KR (1) KR20140095008A (ja)
CN (1) CN103943566A (ja)
TW (1) TWI606533B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10286643B2 (en) * 2014-08-14 2019-05-14 Lg Chem, Ltd. Peeling bar for peeling polarizing film from panel, peeling apparatus and peeling method using the same

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5939555B1 (ja) * 2015-02-12 2016-06-22 稲葉 昭博 表示体の製造方法
JP6461269B2 (ja) * 2016-12-23 2019-01-30 株式会社 ベアック フィルム部材貼り付け装置、フィルム部材貼り付け方法及びガイド部材
KR20180135936A (ko) * 2016-12-23 2018-12-21 베아크 가부시끼가이샤 필름 부재 첩부 장치, 필름 부재 첩부 방법 및 가이드 부재
CN107867430A (zh) * 2017-12-05 2018-04-03 深圳市宝德自动化精密设备有限公司 一种曲面贴膜机构的覆膜头
JP6967272B2 (ja) * 2017-12-05 2021-11-17 株式会社 ベアック フィルム部材貼り付け装置及びフィルム部材貼り付け方法
JP7214466B2 (ja) * 2018-12-21 2023-01-30 株式会社ディスコ 保護部材の形成方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS577608Y2 (ja) * 1977-10-07 1982-02-13
JPS60164385A (ja) * 1984-02-06 1985-08-27 Rohm Co Ltd 半導体レ−ザのチツプ製造方法
US4727392A (en) * 1985-05-13 1988-02-23 The Mead Corporation Pressure development apparatus for imaging sheets employing photosensitive microcapsules
JP2002148794A (ja) * 2000-11-15 2002-05-22 Fuji Photo Film Co Ltd 感光層転写装置及び方法
JP4187065B2 (ja) * 2003-01-17 2008-11-26 日東電工株式会社 粘着テープ貼付け方法およびその装置
JP4855097B2 (ja) * 2006-02-14 2012-01-18 株式會社塩山製作所 半導体チップ分離装置
JP5343957B2 (ja) * 2010-11-15 2013-11-13 株式会社Ｉｈｉ 帯板製造設備とその方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10286643B2 (en) * 2014-08-14 2019-05-14 Lg Chem, Ltd. Peeling bar for peeling polarizing film from panel, peeling apparatus and peeling method using the same

Also Published As

Publication number Publication date
JP2014141271A (ja) 2014-08-07
CN103943566A (zh) 2014-07-23
TWI606533B (zh) 2017-11-21
JP6058407B2 (ja) 2017-01-11
TW201429689A (zh) 2014-08-01

Similar Documents

Publication Publication Date Title
KR20140095008A (ko) 롤러
US10189142B2 (en) Method for polishing a semiconductor wafer
JP5207909B2 (ja) キャリア、キャリアを被覆する方法並びに半導体ウェハの両面を同時に材料除去する加工方法
EP2428318A3 (en) Method of polishing an object to form a convex or concave surface on said object and polishing pad
WO2006038030A3 (en) Equipment for wafer bonding
KR20130029757A (ko) 면진 장치
WO2009063899A1 (ja) 軸部仕上げ加工装置
PH12019501778A1 (en) Pressure-sensitive adhesive tape for semiconductor substrate fabrication and method for manufacturing semiconductor device
JP4913346B2 (ja) 切削装置の切削工具装着機構
WO2009020052A1 (ja) 塗布方法
KR102124310B1 (ko) 시트 부착 장치 및 부착 방법
CN105666403B (zh) 半导体制程设备的o形环的安装方法及导片、滚轮与治具
JP2016074052A (ja) 研磨パッド固定用テープおよび研磨パッド
JP4662284B2 (ja) 保持治具
TWI666722B (zh) 搬送具與大型搬送具與搬送方法與搬送具單元
US20180200864A1 (en) Polishing pad and polishing method
JP5882008B2 (ja) 半導体ウエハの裏面研削に使用される表面保護部材の評価方法および該方法に用いる評価装置
US10103055B2 (en) Expansion sheet, expansion sheet manufacturing method, and expansion sheet expanding method
US20140238213A1 (en) Method for performing a mechanical operation in a structure comprising two layers of different stiffness
JP2013243311A (ja) 表面保護テープ
JP5551457B2 (ja) 接着シート用支持媒体および支持フレーム
KR102208848B1 (ko) 익스팬드 시트
JP7041051B2 (ja) 摩擦が低減された支持表面を特徴とするウエハチャック
JP2009054624A (ja) ウェーハ補助シート、半導体ウェーハのブレーキング装置及びブレーキング方法
EP2197027A3 (en) Positioning stage, bump forming apparatus equipped with the positioning stage, and bump forming method performed using the positioning stage

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20131213

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20171212

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 20131213

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20190408

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20191001

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20190408

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I