JP2014141271A - ローラー - Google Patents
ローラー Download PDFInfo
- Publication number
- JP2014141271A JP2014141271A JP2013010025A JP2013010025A JP2014141271A JP 2014141271 A JP2014141271 A JP 2014141271A JP 2013010025 A JP2013010025 A JP 2013010025A JP 2013010025 A JP2013010025 A JP 2013010025A JP 2014141271 A JP2014141271 A JP 2014141271A
- Authority
- JP
- Japan
- Prior art keywords
- roller
- pressing
- pressing roller
- adhesive tape
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005452 bending Methods 0.000 claims abstract description 30
- 230000002093 peripheral effect Effects 0.000 abstract description 33
- 239000002390 adhesive tape Substances 0.000 abstract description 32
- 230000002265 prevention Effects 0.000 abstract description 18
- 230000008878 coupling Effects 0.000 abstract 2
- 238000010168 coupling process Methods 0.000 abstract 2
- 238000005859 coupling reaction Methods 0.000 abstract 2
- 239000006260 foam Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 9
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Labeling Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Rolls And Other Rotary Bodies (AREA)
Abstract
【解決手段】ローラー1は、押圧ローラー2と、押圧ローラー2の軸心A1と平行な軸心A2を有するとともに押圧ローラー2の直径よりも大きい直径を有し、押圧ローラー2に隣接して配設されるとともに外周部5が押圧ローラー2の外周部3に当接した状態で押圧ローラー2を転動可能に押圧する撓み防止ローラー4と、押圧ローラー2と撓み防止ローラー4とを連結する連結部6と、を備えているため、1本のローラーのみからなる場合に比べて剛性を上げることができ、押圧ローラー2が僅かに撓むことを防止できる。したがって、押圧ローラー2は、粘着テープ9に対して均一な押圧力を付与することができ、粘着テープ9と板状物Wとの間に気泡が形成されることを防ぎつつ板状物Wに粘着テープ9を貼着することができる。
【選択図】図1
Description
その結果、後の研削において板状物の仕上げ厚みにばらつきが発生することはなく、板状物のダイシングやエキスパンド中にチップ飛びが発生することもなくなる。
また、本発明にかかるローラーには、押圧ローラーの直径よりも大きい撓み防止ローラーを備えていることから、押圧ローラーの撓みを防止しつつ押圧ローラーを小径に形成することができる。したがって、変形しやすい外周を備える押圧ローラーであっても、対象物に当接する面積を抑えることができ、対象物の押圧時に押圧ローラーにおける微細なうねりやくぼみなどを平坦にするために過度な荷重を加える必要がない。これにより、例えばテープ貼着装置に該ローラーを組み込む際に、テープ貼着装置の剛性や精度を高くする必要がなくなり、装置が大掛かりになることを防止できる。
しかし、ローラー1には、押圧ローラー2の直径よりも大きい撓み防止ローラー4を備えていることから、押圧ローラー2の撓みを防止しつつ押圧ローラー2を小径に形成することができる。したがって、弾性部材からなり変形しやすい外周部3を備える押圧ローラー2であっても、粘着テープ9に当接する面積を抑えることができ、粘着テープ9の押圧時に押圧ローラー2における微細なうねりやくぼみなどを平坦にするために過度な荷重を加える必要がない。
4:撓み防止ローラー 4a:軸部 5:外周部 5a:周面 6:連結部
7:遊び 7a:第1の貫通孔 7b:第2の貫通孔 8:隙間 9:粘着テープ
10:ローラー 11:押圧ローラー 11a:軸部 12:外周部
13:撓み防止ローラー 13a:軸部 14:外周部
15:連結部 16:遊び 17:逃げ部
W:板状物 Wa:上面 D:デバイス
Claims (4)
- ローラーであって、
押圧ローラーと、
該押圧ローラーの軸心と平行な軸心を有するとともに該押圧ローラーの直径よりも大きい直径を有し、該押圧ローラーに隣接して配設されるとともに外周が該押圧ローラーの外周に当接した状態で該押圧ローラーを転動可能に押圧する撓み防止ローラーと、
該押圧ローラーと該撓み防止ローラーとを連結する連結部と、を備えるローラー。 - 前記押圧ローラーの少なくとも外周は、弾性部材からなる請求項1に記載のローラー。
- 前記連結部は、押圧時に前記押圧ローラーが前記撓み防止ローラーに対して相対的に沈みこむことを許容する遊びを有し該押圧ローラーと該撓み防止ローラーとを連結する請求項2に記載のローラー。
- 前記押圧ローラーの直径は、6〜8mmである請求項1〜3に記載のローラー。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013010025A JP6058407B2 (ja) | 2013-01-23 | 2013-01-23 | ローラー |
TW102143490A TWI606533B (zh) | 2013-01-23 | 2013-11-28 | roller |
KR1020130155218A KR20140095008A (ko) | 2013-01-23 | 2013-12-13 | 롤러 |
CN201410025022.3A CN103943566A (zh) | 2013-01-23 | 2014-01-20 | 辊 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013010025A JP6058407B2 (ja) | 2013-01-23 | 2013-01-23 | ローラー |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014141271A true JP2014141271A (ja) | 2014-08-07 |
JP6058407B2 JP6058407B2 (ja) | 2017-01-11 |
Family
ID=51191169
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013010025A Active JP6058407B2 (ja) | 2013-01-23 | 2013-01-23 | ローラー |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6058407B2 (ja) |
KR (1) | KR20140095008A (ja) |
CN (1) | CN103943566A (ja) |
TW (1) | TWI606533B (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5939555B1 (ja) * | 2015-02-12 | 2016-06-22 | 稲葉 昭博 | 表示体の製造方法 |
JP2018104196A (ja) * | 2016-12-23 | 2018-07-05 | 株式会社 ベアック | フィルム部材貼り付け装置、フィルム部材貼り付け方法及びガイド部材 |
WO2019111662A1 (ja) * | 2017-12-05 | 2019-06-13 | 株式会社 ベアック | フィルム部材貼り付け装置及びフィルム部材貼り付け方法 |
JP2020102515A (ja) * | 2018-12-21 | 2020-07-02 | 株式会社ディスコ | 保護部材の形成方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101546068B1 (ko) * | 2014-08-14 | 2015-08-20 | 주식회사 엘지화학 | 패널로부터 편광 필름을 박리하기 위한 박리바, 이를 이용한 박리 장치 및 박리 방법 |
CN109311616B (zh) * | 2016-12-23 | 2020-09-22 | 倍科有限公司 | 薄膜构件粘贴装置、薄膜构件粘贴方法以及引导构件 |
CN107867430A (zh) * | 2017-12-05 | 2018-04-03 | 深圳市宝德自动化精密设备有限公司 | 一种曲面贴膜机构的覆膜头 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5461599U (ja) * | 1977-10-07 | 1979-04-28 | ||
JP2002148794A (ja) * | 2000-11-15 | 2002-05-22 | Fuji Photo Film Co Ltd | 感光層転写装置及び方法 |
JP2007220703A (ja) * | 2006-02-14 | 2007-08-30 | Enzan Seisakusho Co Ltd | 半導体チップ分離装置 |
JP2011031305A (ja) * | 2010-11-15 | 2011-02-17 | Ihi Corp | 帯板製造設備とその方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60164385A (ja) * | 1984-02-06 | 1985-08-27 | Rohm Co Ltd | 半導体レ−ザのチツプ製造方法 |
US4727392A (en) * | 1985-05-13 | 1988-02-23 | The Mead Corporation | Pressure development apparatus for imaging sheets employing photosensitive microcapsules |
JP4187065B2 (ja) * | 2003-01-17 | 2008-11-26 | 日東電工株式会社 | 粘着テープ貼付け方法およびその装置 |
-
2013
- 2013-01-23 JP JP2013010025A patent/JP6058407B2/ja active Active
- 2013-11-28 TW TW102143490A patent/TWI606533B/zh active
- 2013-12-13 KR KR1020130155218A patent/KR20140095008A/ko not_active Application Discontinuation
-
2014
- 2014-01-20 CN CN201410025022.3A patent/CN103943566A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5461599U (ja) * | 1977-10-07 | 1979-04-28 | ||
JP2002148794A (ja) * | 2000-11-15 | 2002-05-22 | Fuji Photo Film Co Ltd | 感光層転写装置及び方法 |
JP2007220703A (ja) * | 2006-02-14 | 2007-08-30 | Enzan Seisakusho Co Ltd | 半導体チップ分離装置 |
JP2011031305A (ja) * | 2010-11-15 | 2011-02-17 | Ihi Corp | 帯板製造設備とその方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5939555B1 (ja) * | 2015-02-12 | 2016-06-22 | 稲葉 昭博 | 表示体の製造方法 |
JP2016148754A (ja) * | 2015-02-12 | 2016-08-18 | 稲葉 昭博 | 表示体の製造方法 |
JP2018104196A (ja) * | 2016-12-23 | 2018-07-05 | 株式会社 ベアック | フィルム部材貼り付け装置、フィルム部材貼り付け方法及びガイド部材 |
WO2019111662A1 (ja) * | 2017-12-05 | 2019-06-13 | 株式会社 ベアック | フィルム部材貼り付け装置及びフィルム部材貼り付け方法 |
JP2019099346A (ja) * | 2017-12-05 | 2019-06-24 | 株式会社 ベアック | フィルム部材貼り付け装置及びフィルム部材貼り付け方法 |
JP2020102515A (ja) * | 2018-12-21 | 2020-07-02 | 株式会社ディスコ | 保護部材の形成方法 |
JP7214466B2 (ja) | 2018-12-21 | 2023-01-30 | 株式会社ディスコ | 保護部材の形成方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201429689A (zh) | 2014-08-01 |
CN103943566A (zh) | 2014-07-23 |
KR20140095008A (ko) | 2014-07-31 |
TWI606533B (zh) | 2017-11-21 |
JP6058407B2 (ja) | 2017-01-11 |
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