KR20140069325A - 진공 유지부 내에서의 표면 조도 제어 - Google Patents

진공 유지부 내에서의 표면 조도 제어 Download PDF

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Publication number
KR20140069325A
KR20140069325A KR1020147011591A KR20147011591A KR20140069325A KR 20140069325 A KR20140069325 A KR 20140069325A KR 1020147011591 A KR1020147011591 A KR 1020147011591A KR 20147011591 A KR20147011591 A KR 20147011591A KR 20140069325 A KR20140069325 A KR 20140069325A
Authority
KR
South Korea
Prior art keywords
chuck
support
vacuum
light
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020147011591A
Other languages
English (en)
Korean (ko)
Inventor
로버트 에이 퍼거슨
Original Assignee
일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 filed Critical 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Publication of KR20140069325A publication Critical patent/KR20140069325A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/08—Work-clamping means other than mechanically-actuated
    • B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/11—Vacuum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/34—Accessory or component

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Laser Beam Processing (AREA)
KR1020147011591A 2011-09-30 2012-09-28 진공 유지부 내에서의 표면 조도 제어 Withdrawn KR20140069325A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/250,871 US8960686B2 (en) 2011-09-30 2011-09-30 Controlled surface roughness in vacuum retention
US13/250,871 2011-09-30
PCT/US2012/057779 WO2013049476A1 (en) 2011-09-30 2012-09-28 Controlled surface roughness in vacuum retention

Publications (1)

Publication Number Publication Date
KR20140069325A true KR20140069325A (ko) 2014-06-09

Family

ID=47991829

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147011591A Withdrawn KR20140069325A (ko) 2011-09-30 2012-09-28 진공 유지부 내에서의 표면 조도 제어

Country Status (6)

Country Link
US (1) US8960686B2 (https=)
JP (1) JP2014534612A (https=)
KR (1) KR20140069325A (https=)
CN (1) CN103843127A (https=)
TW (1) TW201330169A (https=)
WO (1) WO2013049476A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9266192B2 (en) 2012-05-29 2016-02-23 Electro Scientific Industries, Inc. Method and apparatus for processing workpieces
US9502278B2 (en) * 2013-04-22 2016-11-22 International Business Machines Corporation Substrate holder assembly for controlled layer transfer
CN104088875B (zh) * 2014-07-20 2017-08-15 广东格林精密部件股份有限公司 一种气压式防气泡组装夹具
JP6934305B2 (ja) * 2017-02-17 2021-09-15 株式会社ディスコ ウエーハの保持方法
US11036147B2 (en) * 2019-03-20 2021-06-15 Kla Corporation System and method for converting backside surface roughness to frontside overlay
NL2023097B1 (en) * 2019-05-09 2020-11-30 Suss Microtec Lithography Gmbh Stamp replication device and method for producing a holding means for a stamp replication device as well as a stamp
US10801969B1 (en) * 2019-09-12 2020-10-13 Lumentum Operations Llc Testing device for bottom-emitting or bottom-detecting optical devices
CN113053774A (zh) * 2019-12-27 2021-06-29 迪科特测试科技(苏州)有限公司 探测装置
US11524392B2 (en) * 2020-11-24 2022-12-13 Applied Materials, Inc. Minimal contact gripping of thin optical devices
EP4360123A4 (en) * 2021-06-24 2025-04-30 Samsung Electronics Co., Ltd APPARATUS AND METHOD FOR TRANSFERRING LIGHT-EMITTING DIODES

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02239621A (ja) 1989-03-13 1990-09-21 Fuji Electric Co Ltd 真空チャツク装置
US5959098A (en) * 1996-04-17 1999-09-28 Affymetrix, Inc. Substrate preparation process
US6399143B1 (en) * 1996-04-09 2002-06-04 Delsys Pharmaceutical Corporation Method for clamping and electrostatically coating a substrate
JP2000164647A (ja) * 1998-11-24 2000-06-16 Matsushita Electric Ind Co Ltd ウエハカセット及び半導体集積回路の検査装置
JP2000286329A (ja) 1999-03-31 2000-10-13 Hoya Corp 基板保持チャックとその製造方法、露光方法、半導体装置の製造方法及び露光装置
JP4090416B2 (ja) * 2003-09-30 2008-05-28 日東電工株式会社 粘着テープ付ワークの離脱方法及び離脱装置
WO2005092564A1 (ja) * 2004-03-25 2005-10-06 Ibiden Co., Ltd. 真空チャックおよび吸着板
JP4705450B2 (ja) * 2005-03-11 2011-06-22 株式会社ディスコ ウェーハの保持機構
US20070026772A1 (en) * 2005-07-28 2007-02-01 Dolechek Kert L Apparatus for use in processing a semiconductor workpiece
JP2007115961A (ja) * 2005-10-21 2007-05-10 Tecdia Kk 基板保持装置
CN100468619C (zh) * 2006-08-23 2009-03-11 北京北方微电子基地设备工艺研究中心有限责任公司 刻蚀设备的控温装置及其控制晶片温度的方法
US20110266274A1 (en) 2006-11-27 2011-11-03 Toshiki Ebata Quartz encapsulated heater assembly
JP5074125B2 (ja) 2007-08-09 2012-11-14 リンテック株式会社 固定治具並びにワークの処理方法
JP2009183997A (ja) * 2008-02-08 2009-08-20 Lintec Corp ワークの支持体および該支持体を用いたワークの加工方法
KR101517020B1 (ko) * 2008-05-15 2015-05-04 삼성디스플레이 주식회사 유기전계발광표시장치의 제조장치 및 제조방법

Also Published As

Publication number Publication date
CN103843127A (zh) 2014-06-04
WO2013049476A1 (en) 2013-04-04
US20130082448A1 (en) 2013-04-04
TW201330169A (zh) 2013-07-16
JP2014534612A (ja) 2014-12-18
US8960686B2 (en) 2015-02-24

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PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000