KR20140013023A - 에칭액 - Google Patents

에칭액 Download PDF

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Publication number
KR20140013023A
KR20140013023A KR1020137026220A KR20137026220A KR20140013023A KR 20140013023 A KR20140013023 A KR 20140013023A KR 1020137026220 A KR1020137026220 A KR 1020137026220A KR 20137026220 A KR20137026220 A KR 20137026220A KR 20140013023 A KR20140013023 A KR 20140013023A
Authority
KR
South Korea
Prior art keywords
copper
acid
group
film
etching
Prior art date
Application number
KR1020137026220A
Other languages
English (en)
Korean (ko)
Inventor
요시히로 무카이
히데쿠니 야스에
사토루 요시자키
요시타카 니시지마
Original Assignee
나가세케무텍쿠스가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 나가세케무텍쿠스가부시키가이샤 filed Critical 나가세케무텍쿠스가부시키가이샤
Publication of KR20140013023A publication Critical patent/KR20140013023A/ko

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
KR1020137026220A 2011-03-08 2012-03-05 에칭액 KR20140013023A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2011-050200 2011-03-08
JP2011050200 2011-03-08
PCT/JP2012/055519 WO2012121193A1 (ja) 2011-03-08 2012-03-05 エッチング液

Publications (1)

Publication Number Publication Date
KR20140013023A true KR20140013023A (ko) 2014-02-04

Family

ID=46798155

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137026220A KR20140013023A (ko) 2011-03-08 2012-03-05 에칭액

Country Status (5)

Country Link
JP (1) JPWO2012121193A1 (zh)
KR (1) KR20140013023A (zh)
CN (1) CN103459672A (zh)
TW (1) TW201250059A (zh)
WO (1) WO2012121193A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116103655A (zh) * 2022-12-25 2023-05-12 江苏中德电子材料科技有限公司 一种集成电路用金属碱性蚀刻液及其制备方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105506628B (zh) * 2015-12-03 2018-01-12 苏州鑫德杰电子有限公司 一种大叶海藻浸提物蚀刻液及其制备方法
WO2017164090A1 (ja) * 2016-03-24 2017-09-28 株式会社Adeka エッチング液組成物及びエッチング方法
KR102435551B1 (ko) * 2017-06-20 2022-08-25 삼성디스플레이 주식회사 식각액 조성물 및 이를 이용한 금속 패턴과 박막 트랜지스터 기판 제조 방법
CN110499509A (zh) * 2019-10-10 2019-11-26 昆山成功环保科技有限公司 用于晶圆级封装的铜种子蚀刻液
CN111809183B (zh) * 2020-07-14 2022-08-09 北京航空航天大学宁波创新研究院 一种铜镓合金的金相腐蚀液以及金相显示方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000328268A (ja) * 1999-05-13 2000-11-28 Shikoku Chem Corp 銅および銅合金のエッチング処理剤
JP4916455B2 (ja) * 2008-01-15 2012-04-11 株式会社Ａｄｅｋａ 銅含有材料用エッチング剤組成物
JP4957584B2 (ja) * 2008-02-29 2012-06-20 東ソー株式会社 エッチング用組成物及びエッチング方法
JP4685180B2 (ja) * 2009-07-09 2011-05-18 株式会社Ａｄｅｋａ 銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法
JP5443863B2 (ja) * 2009-07-09 2014-03-19 株式会社Ａｄｅｋａ 銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法
JP2011017052A (ja) * 2009-07-09 2011-01-27 Adeka Corp 銅含有材料のウエットエッチングシステム及びパターニング方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116103655A (zh) * 2022-12-25 2023-05-12 江苏中德电子材料科技有限公司 一种集成电路用金属碱性蚀刻液及其制备方法

Also Published As

Publication number Publication date
CN103459672A (zh) 2013-12-18
JPWO2012121193A1 (ja) 2014-07-17
WO2012121193A1 (ja) 2012-09-13
TW201250059A (en) 2012-12-16

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