KR20130079701A - Test handler - Google Patents

Abstract

PURPOSE: A test handler is provided to reduce the weight of match plates, thereby facilitating the exchange or movement of match plates. CONSTITUTION: A test handler includes a pushing device. The pushing device has twice as many match plates (710) as the number of test trays included in a test chamber. The match plate comprises pushing units (711, 712) and an installation plate (713). The pushing units support semiconductor devices which are electrically connected to a tester. The installation plate includes installation holes (713a, 713b) to install the pushing units in a matrix shape.

Description

Test handler {TEST HANDLER}

The present invention relates to a test handler supported for testing a semiconductor device prior to shipping the produced semiconductor device.

The test handler supports a semiconductor device manufactured through a predetermined manufacturing process so that the semiconductor device can be tested by a tester. The test handler classifies semiconductor devices according to the test results and loads the semiconductor devices on a customer tray.

FIG. 1 is a conceptual diagram of a general test handler 100 viewed from a plane.

As shown in FIG. 1, the test handler 100 includes a test tray 110, a loading device 120, a soak chamber 130, a test chamber 140, a test chamber 140, a pushing device 150, And a desock chamber 160 (DESOAK CHAMBER), an unloading device 170 and the like.

As illustrated in FIG. 2, the test tray 110 includes a plurality of inserts 111 on which the semiconductor device D may be seated. The test tray 110 may be installed in a somewhat movable manner, and a closed path defined by a plurality of transfer devices (not shown). Circulate along (C).

The loading device 120 moves the untested semiconductor device loaded in the customer tray to a test tray at a loading position LP.

The soak chamber 130 is provided for preheating or precooling according to the test environmental conditions before testing the semiconductor device seated in the test tray 110 transferred from the loading position LP. do.

The test chamber 140 is provided for testing a semiconductor device seated on the test tray 110 that has been preheated / precooled in the soak chamber 130 and then transferred to a test position (TP: TEST POSITION). Here, one test tray 110 may be accommodated in the test chamber 140, or two or more test trays 110 may be accommodated to increase the processing capacity, as is well known.

The pushing device 150 pushes the semiconductor device seated in the test tray 110 in the test chamber 140 toward the tester TECK docked (coupled) to the test chamber 140. Is provided for electrically connecting. The present invention relates to such a pushing device 150, which will be described in more detail later.

The desock chamber 160 is provided to return the heated or cooled semiconductor device seated on the test tray 110 transferred from the test chamber 140 to room temperature.

The unloading device 170 sorts the semiconductor devices mounted on the test tray 110 from the desock chamber 160 to the unloading position UP and moves them to empty customer trays.

As described above, the semiconductor device is placed in the test tray 110, the soak chamber 120, the test chamber 130, the desock chamber 140, and the unloading position UP from the loading position LP. After circulating along the closed path (C) leading back to the loading position (LP).

The test handler 100 having the basic circulation path as described above has an underhead docking type test handler and a test tray 110 in which a test of a semiconductor device is mounted while the test tray 110 is horizontal. Is divided into side docking type test handlers in which the semiconductor device is tested in a vertical state. Therefore, in the case of the side docking test handler 100, the vertical test is performed to change the posture of the horizontal test tray in which the semiconductor device is settled to the vertical state, or to move the completed test to the empty customer tray. One or two posture converting devices for converting the posture to the horizontal state should be provided.

Subsequently, the pushing device 150 related to the present invention will be described in more detail.

As shown in the schematic side view of FIG. 3, the general pushing device 150 configured in the conventional test handler 100 includes two match plates 50, a duct 60, and a driving source 70. And the like.

The two match plates 50 each comprise a plurality of pushing units 51, mounting plates 52, etc., as referenced in the plan view of FIG. As shown in FIG. 3, the plurality of pushing units 51 included in one match plate 50 are provided in a number capable of electrically contacting the tester side with semiconductor devices loaded in one test tray 110. do. Therefore, the number of test trays 110 and the number of match plates 50 accommodated in the test chamber 140 are the same. 5, test boards 211 and 212 are installed in the tester 200 as many times as the number of test trays 110 accommodated in the test chamber 140, so that one test board 211/212 is provided. It is in charge of testing the semiconductor devices loaded in one test tray 110. That is, the number of test trays 110, the number of match plates 50, and the number of test boards 211, 212 of the tester 200 accommodated in the test chamber 140 are the same.

On the other hand, the pushing unit 51 is installed using the mounting hole 52a formed in the mounting plate 52, as shown in Figure 6a, the pusher 51a, the mounting member 51b, two bolts 51c- 1, 51c-2 and two springs 51d-1 and 51d-2.

The pusher 51a is provided to support the semiconductor element.

The front end of the mounting member 51b is in contact with the pusher 51a and the rear end of the mounting member 51b is engaged by the mounting hole 52a of the mounting plate 52. The pusher 51a is provided by two bolts 51c-1 and 51c-2. Is coupled to.

The springs 51d-1 and 51d-2 elastically support the pusher 51 with respect to the mounting plate 52. Therefore, as shown in FIG. 6B, when the front end of the pusher 51 supports the semiconductor element in electrical contact with the tester, the repulsive force on the tester side is configured to be retracted to a certain degree.

Of course, the number of bolts and springs corresponding to one pusher may be configured differently depending on how the pushing unit is configured.

The duct 60 is provided to supply temperature control air to the semiconductor device, as known through the patent registration publications 10-0934033 and 10-0709114. In this duct 60, two match plates 50 are supported between the support rails 61 so that the two match plates 50 can be advanced together in the tester direction by the operation of the driving source 70. Put together. Accordingly, the duct 60 also serves as a supporting member for supporting the two match plates 50, and the match plate 50 is detached in the direction of the arrow of FIG. 3.

As the driving source 70, a motor or a cylinder may be used, and the test tray 110 is moved to the tester side while the match plate 50 coupled to the duct 60 is eventually advanced by moving the duct 60 toward the tester side. It provides a driving force to close or release the contact. Of course, one or more driving sources may be used depending on the structure and designer of the equipment.

However, by increasing the number of semiconductor devices that can be tested at one time in order to increase the processing capacity, the number of semiconductor devices that can be loaded in one test tray also increases and correspondingly, the test tray and Matchplates have also grown in size. As a result, the weight of the matchplates increases more and more, placing a heavy burden on the administrator when moving heavy matchplates made of metal, such as exchanging matchplates.

Accordingly, it is an object of the present invention to provide a technique that can lighten the weight of one matchplate.

The test handler according to the present invention as described above comprises a test tray for circulating a constant circulation path leading back to the loading position through a loading position, a test position and an unloading position, and a test tray on which semiconductor elements can be seated; A loading device for loading semiconductor elements into a test tray when the test tray is in a loading position; A soak chamber provided for preheating or precooling the semiconductor devices transferred to the test tray by the loading of the loading apparatus; A test chamber configured to receive M test trays transferred from the soak chamber and to electrically contact semiconductor devices mounted on the M test trays to a tester; A pushing device provided to bring the M test trays into close contact with the tester side to electrically contact the semiconductor devices mounted on the M test trays with the tester side; A desock chamber provided to return the semiconductor devices mounted on the test tray transferred from the test chamber to room temperature; And an unloading device for unloading semiconductor elements from the test tray transferred from the disc chamber to the unloading position. The pushing device includes N (N = a XM, a, wherein the semiconductor elements mounted in the M test trays accommodated in the test chamber are provided in a tester side direction to support electrical contact with a tester. Is a natural number greater than 1); A support member which supports the N matchplates together so that the N matchplates can be advanced in a tester side direction, and is provided to be able to advance and retract in the tester side direction with the N matchplates; And a driving source providing a driving force for advancing and supporting the supporting member in a tester side direction. .

At least one match plate of the N match plates may include: a plurality of pushing units supporting a semiconductor device; And a mounting plate having a plurality of mounting holes for installing the plurality of pushing units in a matrix form. Includes, each of the plurality of pushing unit, a pusher for supporting a semiconductor element; A front end of which is in contact with the pusher and a rear end of which is caught by an installation hole of the mounting plate (a tester side direction is defined as a forward direction and an opposite direction as a rear direction); A plurality of coupling members coupling the pusher and the installation member and provided in parallel with each other; An elastic member elastically supporting the pusher with respect to the mounting plate; And a rear end of the installation members of the pushing units in the row adjacent to the neighboring match plate among the plurality of pushing units installed in the matrix form on the mounting plate in one direction from the rear end of the installation members of the pushing units in the remaining rows. This narrow one is preferable.

The direction in which the plurality of coupling members of the pushing units in the row adjacent to the neighboring match plates among the plurality of pushing units installed in the mounting plate in a matrix form and the direction in which the plurality of coupling members in the remaining rows of the pushing units are arranged are different from each other. It is preferable.

The direction in which the plurality of coupling members of the pushing units in the row adjacent to the neighboring match plate of the plurality of pushing units is arranged and the direction in which the plurality of coupling members in the remaining rows of the pushing units are arranged may be perpendicular to each other.

At least one match plate of the N match plates may include: a plurality of pushing units supporting a semiconductor device; And a mounting plate having a plurality of mounting holes for installing the plurality of pushing units in a matrix form. Includes, each of the plurality of pushing unit, a pusher for supporting a semiconductor element; A front end of which is in contact with the pusher and a rear end of which is caught by an installation hole of the mounting plate (a tester side direction is defined as a forward direction and an opposite direction as a rear direction); A plurality of coupling members coupling the pusher and the installation member and provided in parallel with each other; An elastic member elastically supporting the pusher with respect to the mounting plate; And a part of the pushers configured in the pushing units of a row adjacent to a neighboring match plate among the plurality of pushing units installed in a matrix form on the mounting plate to the neighboring match plate side out of the mounting plate in plan view. It is preferable to protrude.

At least one match plate of the N match plates may include: a plurality of pushing units supporting a semiconductor device; And a mounting plate having a plurality of mounting holes for installing the plurality of pushing units in a matrix form. Includes, each of the plurality of pushing unit, a pusher for supporting a semiconductor element; A front end of which is in contact with the pusher and a rear end of which is caught by an installation hole of the mounting plate (a tester side direction is defined as a forward direction and an opposite direction as a rear direction); A plurality of coupling members coupling the pusher and the installation member and provided in parallel with each other; An elastic member elastically supporting the pusher with respect to the mounting plate; It includes, it is preferable that the mounting holes of the rows adjacent to the adjacent match plate of the plurality of mounting holes formed in a matrix form on the mounting plate has a smaller area in plan view than the mounting holes of the remaining rows.

According to the present invention as described above, by matching a plurality of match plates to a single test tray, ultimately it is possible to reduce the weight of the match plate has the advantage that can be processed lighter during the exchange or change of match plates.

Figure 1 is a conceptual top view of a generic test handler.
2 is a schematic view of a test tray for a general test handler.
Figure 3 is a schematic diagram of a pushing device equipped with a conventional test handler.
4 is a plan view of a match plate applied to the pushing apparatus of FIG.
5 is a schematic diagram of a general tester.
6A and 6B are side cross-sectional views of a pushing unit applied to a conventional pushing device.
7 is a schematic diagram of a pushing apparatus according to the present invention.
8 is a plan view of a matchplate applied to the pushing apparatus of FIG.
9A-9D are reference diagrams for use in explaining the matchplate of FIG.
Figure 10 is a side view of a pushing unit according to another application of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. For simplicity of description, redundant description is omitted or compressed as much as possible.

The test handler according to the present embodiment includes a test tray, a loading device, a soak chamber, a test chamber, a pushing device, a desock chamber, an unloading device, and the like, as described in the background art.

Among the above configurations, the test tray, the loading apparatus, the soak chamber, the test chamber, the desock chamber and the unloading apparatus are the same as those of the general test handler described in the background, and thus description thereof is omitted.

As shown in Fig. 7, the pushing device 700 in the test handler according to the present invention is twice as many matches (two sheets) than the number (one sheet) of test trays 110 accommodated in the test chamber. A duct 720 which serves as a support member for supporting the plates 710A and 710B and the two matchplates 710A and 710B together to retract the two matchplates 710A and 710B to the tester side direction; And a drive source 730 that provides a driving force for advancing 720 to the tester side direction. That is, two match plates 710A and 710B are provided to electrically contact the semiconductor device loaded in one test tray 110 with the tester. If the number of test trays accommodated in the test chamber is two, the match plate will be provided with four sheets twice as many as the number of test trays. Of course, according to the implementation, three, four, or more match plates may be provided to electrically contact the semiconductor device loaded in one test tray with the tester. To this end, the match plates 710A and 710B applied to the test handler according to the present invention have a unique structure as described below. For reference, the match plate is denoted by reference numeral 710 below.

As shown in FIG. 8, the match plate 710 includes pushing units 711 and 712 and a mounting plate 713. For reference, FIG. 8 shows the present example only for the test tray and the match plate at the top for convenience of description, compared to the case of using the two test trays and the match plate at the top and bottom in FIG. The description is omitted.

The pushing units 711 and 712 support semiconductor elements in electrical contact with the tester, and the mounting plate 713 has mounting holes 713a and 713b for installing the pushing units 711 and 712 in a matrix form.

FIG. 9A is a plan view of the pushing units 711 and 712 and the mounting plate 713 separated from the match plate 710 of FIG. 8, and FIG. 9B shows the pushing unit 711 and the pushing unit 8 of FIG. 712 is a cross-sectional side view, and FIG. 9C is a conceptual plan view of the pushing units 711 and 712 of FIG. 9B in a plan view.

As shown in FIGS. 9A to 9C, the pushing units 711 and 712 in the seventh and eighth rows are provided with the pushers 711a and 712a, the mounting members 711b and 712b, and the two bolts 711c-1 and 711c-2, respectively. 712c-1, 712c-2 and two springs 711d-1, 711d-2.

The pushers 711a and 712a support the semiconductor device in electrical contact with the tester.

The mounting members 711b and 712b have a structure in which the front end is in contact with the pushers 711a and 712a and the rear end is engaged with the installation hole 713a of the mounting plate 712.

Two bolts 711c-1, 711c-2, 712c-1, 712c-2 are provided as coupling members for coupling the installation members 711b, 712b and the pushers 711a, 712a.

The two springs 711d-1 and 711d-2 are provided as elastic members that elastically support the pushers 711a and 712a with respect to the mounting plate 713.

Of course, in this example as well, the number of bolts and springs corresponding to one pusher may be configured differently depending on how the pushing unit is configured.

In the mounting plate 713, mounting holes 713a and 712b for installing the pushing units 711 and 712 in a matrix form are formed in a matrix form.

The characteristic structure of the present invention is described in further detail below.

As shown in FIG. 9D showing the rear end portions of the mounting members 711b and 712b in the pushing units 711 and 712 in FIG. 9C, eight rows of mounting members adjacent to the neighboring match plates M are shown. The rear end of 712b is narrower in the Y-axis direction than the rear end of the seven-row installation members 711b. Accordingly, the two bolts 711c-1 and 711c-2 of the seven-row pushing unit 711 are arranged side by side in the X-axis direction, but the two bolts 712c-1 and 712c-2 of the eight-row pushing unit 712 are arranged side by side. Are arranged side by side in the Y axis direction perpendicular to the X axis direction. For this reason, in order to be able to apply two match plates 710 to one test tray 110 in a situation where the structure of the tester of the tester does not change, the rear end of the installation members 711b and 712b is provided with an installation hole 713a. This is because it is necessary to secure the area of the flesh (F) of the mounting plate 713 so as to have a structure to be hung on the 712b. Corresponding to such a structure, the eight mounting holes 712b of the mounting holes 713a and 712b of the mounting plate 713 are more planar than the mounting holes 713a of the remaining rows (1 to 7 rows). The area of is narrowly formed.

On the other hand, even if the width in the Y-axis direction of the rear end of the mounting member 712b installed in the eighth row is narrow, the area in which the front end of the pusher 712a supports the semiconductor element must be secured equally, so that the eighth pushing unit 712 has the same width. The pushers 712a configured to have the same structure as the pushers 712a configured in the pushing unit 711 in seven rows. Therefore, a part of the pushers 712a (the lower part in the drawing of Fig. 8A) configured in the eighth row protrudes toward the neighboring match plate M side.

For reference, the pushing units in the first to sixth rows have the same structure as the pushing unit 711 in the seventh row.

The above description describes a case where the middle portion of the existing one match plate having 16 rows of pushing units in the X-axis direction is divided into two. That is, compared to the existing match plate, it is classified into a match plate having 1 to 8 rows of pushing units from the top and a match plate having 9 to 16 rows of pushing units from the top. In the case of dividing on the basis of the standard, it is obvious that the present invention is equally applied.

On the other hand, the present invention can be appropriately applied in the form as shown in Figure 10, even if the configuration of the two rows of pushing units are integrally coupled as shown in Figure 7a of Patent Registration No. 10-0709114.

Although the present invention has been fully described by way of example only with reference to the accompanying drawings, it is to be understood that the present invention is not limited thereto. It is to be understood that the scope of the invention is to be construed as being limited only by the following claims and their equivalents.

100: test handler
110: test tray
120: loading device
130: soak chamber
140: test chamber
160: Desock Chamber
170: unloading device
700: Pushing device
710: matchplate
711, 712: Pushing unit
711a, 712a: pusher
711b, 712b: mounting member
711c-1, 711c-2, 712c-1, 712c-2: Bolt
711d-1, 711d-2, 712d-1, 712d-2: spring
713: mounting plate
713a: mounting hole
F: flesh
720: duct
730: drive source

Claims (6)

A test tray which circulates through a constant circulation path leading back to the loading position through the loading position, the test position and the unloading position, and on which the semiconductor elements can be seated;
A loading device for loading semiconductor elements into a test tray when the test tray is in a loading position;
A soak chamber provided for preheating or precooling the semiconductor devices transferred to the test tray by the loading of the loading apparatus;
A test chamber configured to receive M test trays transferred from the soak chamber and to electrically contact semiconductor devices mounted on the M test trays to a tester;
A pushing device provided to bring the M test trays into close contact with the tester side to electrically contact the semiconductor devices mounted on the M test trays with the tester side;
A desock chamber provided to return the semiconductor devices mounted on the test tray transferred from the test chamber to room temperature; And
An unloading device for unloading semiconductor elements from the test tray transferred from the disc chamber to an unloading position; Including;
The pushing device,
N (N = a XM, where a is a natural number greater than 1) match plates provided in the test chamber so as to support the semiconductor devices seated in the M test trays in electrical contact with the tester. ;
A support member which supports the N matchplates together so that the N matchplates can be advanced in a tester side direction, and is provided to be able to advance and retract in the tester side direction with the N matchplates; And
A driving source providing a driving force for advancing and supporting the supporting member in a tester side direction; ≪ RTI ID = 0.0 >
Test handler. The method of claim 1,
At least one matchplate of the N matchplates,
A plurality of pushing unit for supporting the semiconductor device; And
A mounting plate having a plurality of mounting holes for installing the plurality of pushing units in a matrix form; / RTI >
Each of the plurality of pushing units,
A pusher for supporting a semiconductor element;
A front end of which is in contact with the pusher and a rear end of which is caught by an installation hole of the mounting plate (a tester side direction is defined as a forward direction and an opposite direction as a rear direction);
A plurality of coupling members coupling the pusher and the installation member and provided in parallel with each other; And
An elastic member elastically supporting the pusher with respect to the mounting plate; Lt; / RTI >
The rear end of the mounting members of the pushing units of the row adjacent to the neighboring match plate of the plurality of pushing units installed in a matrix form on the mounting plate is narrower in one direction than the rear end of the mounting members of the pushing units of the remaining rows. By
Test handler. The method of claim 2,
The direction in which the plurality of coupling members of the pushing units in the row adjacent to the neighboring match plates among the plurality of pushing units installed in the mounting plate in a matrix form and the direction in which the plurality of coupling members in the remaining rows of the pushing units are arranged are different from each other. Characterized by
Test handler. The method of claim 3,
The direction in which the plurality of coupling members of the pushing units in the row adjacent to the adjacent match plate of the plurality of pushing units is arranged and the direction in which the plurality of coupling members of the pushing units in the remaining rows are arranged perpendicular to each other
Test handler. The method of claim 1,
At least one matchplate of the N matchplates,
A plurality of pushing unit for supporting the semiconductor device; And
A mounting plate having a plurality of mounting holes for installing the plurality of pushing units in a matrix form; / RTI >
Each of the plurality of pushing units,
A pusher for supporting a semiconductor element;
A front end of which is in contact with the pusher and a rear end of which is caught by an installation hole of the mounting plate (a tester side direction is defined as a forward direction and an opposite direction as a rear direction);
A plurality of coupling members coupling the pusher and the installation member and provided in parallel with each other; And
An elastic member elastically supporting the pusher with respect to the mounting plate; Lt; / RTI >
Some of the pushers configured in the pushing units of the row adjacent to the neighboring matchplates of the plurality of pushing units installed in a matrix form on the mounting plate protrude out of the mounting plate and face toward the neighboring matchplate in plan view. Characterized
Test handler. The method of claim 1,
At least one matchplate of the N matchplates,
A plurality of pushing unit for supporting the semiconductor device; And
A mounting plate having a plurality of mounting holes for installing the plurality of pushing units in a matrix form; / RTI >
Each of the plurality of pushing units,
A pusher for supporting a semiconductor element;
A front end of which is in contact with the pusher and a rear end of which is caught by an installation hole of the mounting plate (a tester side direction is defined as a forward direction and an opposite direction as a rear direction);
A plurality of coupling members coupling the pusher and the installation member and provided in parallel with each other; And
An elastic member elastically supporting the pusher with respect to the mounting plate; Lt; / RTI >
Characterized in that the mounting holes of the rows adjacent to the adjacent match plate of the plurality of mounting holes formed in a matrix form on the mounting plate is narrower in plan view than the other mounting holes in the other rows.
Test handler.

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