WO2016080670A1

WO2016080670A1 - Test tray for test handler and interface board for tester

Info

Publication number: WO2016080670A1
Application number: PCT/KR2015/011433
Authority: WO
Inventors: 나윤성; 황정우; 최희준
Original assignee: (주)테크윙
Priority date: 2014-11-20
Filing date: 2015-10-28
Publication date: 2016-05-26
Also published as: TWI593978B; TW201619621A

Abstract

The present invention relates to a test tray for a test handler and an interface board for a tester. According to the present invention, a secondary calibration hole is additionally formed in an insert of a test tray, and a secondary calibration pin is provided in a socket guider of an interface board. In addition, an alignment hole is additionally formed in a test socket of an interface board, and an alignment pin is provided in the interface board. Accordingly, the position of an insert can be calibrated in divided steps. Furthermore, a wall surface forming a calibration hole of an insert body is cut, and an incision hole is formed around the calibration hole. According to the present invention, the position of an insert is calibrated sequentially in divided steps, thereby enabling very accurate calibration of the position of an insert. In addition, a calibration pin is prevented from being fitted into a calibration hole, thereby enabling formation of a smaller calibration hole and finer calibration of the position of an insert.

Description

Test tray for test handler and interface board for tester

The present invention relates to an interface board electrically connected to a semiconductor device in a test tray and a tester capable of loading a semiconductor device in a test handler.

The test handler moves semiconductor devices manufactured through a predetermined manufacturing process from a customer tray to a test tray, and then the semiconductor devices loaded in the test tray are simultaneously tested by a tester (TESTER). TEST), which is a device that moves semiconductor devices from test trays to customer trays by classifying semiconductor devices according to test results.

The test tray has a structure in which inserts (INSERTs) having a seating space in which a semiconductor device is inserted are formed in an installation frame.

The insert has a supporting portion for supporting the semiconductor element seated in the seating space.

The support portion may be injection molded integrally with the body of the insert as referred to in Republic of Korea Patent No. 10-0801927, etc., may be provided in a thin film form as in Republic of Korea Patent Publication No. 10-2010-0081131.

The semiconductor device is fixed in a state of being seated in the seating space of the insert. The semiconductor device is electrically connected to the test socket provided on the tester's interface board in the seating space of the insert. Therefore, there is a need to correct the position of the insert for accurate electrical connection between the semiconductor element in the insert and the test socket. The insert is thus more or less fluidly coupled to the mounting frame. The insert is formed with a calibration hole, and the interface board is provided with a socket guider having a calibration pin inserted into the calibration hole (see Korean Patent Publication No. 10-2013-0059485, etc., hereinafter referred to as 'prior art').

Meanwhile, due to the development of integrated technology, the number of terminals increases while the size of the semiconductor device is reduced. As a result, the spacing between the terminals of the ball type and the size of the terminals are also reduced, resulting in the necessity of more precise and stable electrical connection between the terminals of the semiconductor device and the tester.

However, in the prior art, manufacturing tolerances of the calibration pin and the calibration hole should be considered so that the calibration pin can be properly inserted into the calibration hole. It should also be taken into account that there is a manufacturing tolerance between the socket guider and the test socket. Therefore, by making the inner diameter of the calibration hole larger than the diameter of the calibration pin, the calibration pin can be inserted into the calibration hole even if the center of the calibration pin is slightly away from the center of the calibration hole. If manufacturing tolerances are not taken into consideration, a failure may occur in the insertion of the calibration pins into the calibration holes, resulting in malfunction or damage to the inserts, and proper electrical connection between the semiconductor device and the test socket may not be achieved. If the calibration pin is inserted into the calibration hole by interference fit, it may be difficult for the calibration pin to come out of the calibration hole later.

Therefore, the prior art has reached the limit of precisely correcting the position of the insert as much as the spacing between terminals that are miniaturized and the size of the terminals that decrease.

It is a first object of the present invention to provide a technique capable of sequentially correcting the position of an insert in steps.

A second object of the present invention is to provide a technique capable of minimizing reflection of manufacturing tolerances.

The test tray for a test handler according to the first aspect of the present invention for achieving the above object, the insert is formed with a seating space on which the semiconductor device can be seated; And an installation frame in which the insert is installed to be movable. It includes, The insert, The seating body is formed body; A support part formed integrally with the main body or coupled to the main body to support the semiconductor device seated in the seating space; And a fixing device for fixing the semiconductor device to prevent detachment of the semiconductor device seated in the seating space, wherein the first calibration pin of the socket guider provided in the interface board of the tester is inserted into the main body. A first calibration hole and a second calibration hole into which the second calibration pin of the socket guider can be inserted are formed.

When the insert approaches the test socket provided on the interface board, the first calibration pin is first inserted into the first calibration hole and the second calibration pin is inserted later into the second calibration hole, thereby providing the first calibration hole. And the position of the insert is firstly corrected by the action of the first calibration pin and the position of the insert is secondarily precisely corrected by the action of the second calibration hole and the second calibration pin.

Since the first calibration pin has a higher height than the second calibration pin, the first calibration pin may be inserted into the first calibration hole, and then the second calibration pin may be inserted into the second calibration hole.

The second calibration hole is in the form of a long hole in one side direction.

The second calibration hole is in the form of a longer hole in a straight direction passing through the center of the second calibration hole and the center of the insert.

An interface board for a tester according to the first aspect of the present invention for achieving the above object, the test socket electrically connected to the semiconductor element in the insert of the test tray; A socket guider for calibrating the position of the insert for electrical connection between the test socket and the semiconductor device; And a mounting board on which the test socket and the socket guider are installed, wherein the socket guider includes: a first calibration pin inserted into a first calibration hole formed in the insert to primarily calibrate the position of the insert; And a second calibration pin inserted into a second calibration hole formed in the insert to secondly correct the position of the insert. It includes.

As the insert approaches the test socket, the first calibration pin is first inserted into the first calibration hole, thereby first calibrating the position of the insert and the second calibration pin is later inserted into the second calibration hole. The position of the insert is secondarily precisely calibrated.

An alignment hole is formed in the test socket, and the socket guider has an alignment pin that can be inserted into the alignment hole.

The second calibration pin and the alignment pin may be provided on the same axis.

The second calibration pin has an elliptic shape with a flat cross section long in one direction.

The test tray for the test handler according to the second aspect of the present invention for achieving the above object, the insert is formed with a seating space on which the semiconductor device can be seated; And an installation frame to which the insert is fixedly installed. It includes, The insert, The seating body is formed body; A support part formed integrally with the main body or coupled to the main body to support the semiconductor device seated in the seating space; And a fixing device for fixing the semiconductor device to prevent detachment of the semiconductor device seated in the seating space, wherein the body includes a calibration hole into which the calibration pin of the socket guider is inserted into the interface board of the tester. The wall surface forming the calibration hole is formed at least partially cut to reduce the contact portion with the calibration pin inserted into the calibration hole.

When the calibration pin is inserted into the calibration hole, the main body has a plurality of circumferential directions on the outer side of the calibration hole so that the portion of the wall that forms the calibration hole in contact with the calibration pin is retracted outward and then elastically restored. An incision hole is formed.

According to the present invention according to the first aspect, the following effects are obtained.

First, the position of the insert is roughly calibrated first, and then the position of the insert is finely calibrated later, so that precise insert position calibration can be made without causing damage to the insert.

Second, the assembly tolerances (manufacturing tolerances) generated in the process of assembling the test socket and the socket guider can be reduced as much as possible, thereby making the insert position more precise.

Third, precise position calibration can be achieved regardless of the thermal contraction or thermal expansion of the insert.

And according to the present invention according to the second aspect has the following effects.

First, even if the calibration pin is inserted into the calibration hole by force, the contact friction between the calibration pin and the wall forming the calibration hole is reduced so that the calibration pin can be easily escaped from the calibration hole later.

Secondly, since the wall surface constituting the calibration hole can be elastically resilient to flow, the calibration pin can be more easily exited from the calibration hole.

1 is a plan view of a test tray for a test handler according to a first embodiment of the present invention.

2 is a plan view of an interface board for a tester according to a first embodiment of the present invention.

FIG. 3 is a side view illustrating a coupled state of a test socket and a socket guider applied to the interface board of FIG. 2.

4 to 6 are exaggerated diagrams conceptually extracting main parts of the test tray of FIG. 1 and the interface board of FIG. 2 to explain the operation of the main parts of the first embodiment of the present invention.

FIG. 3 is a perspective view illustrating the mutual structure of an insert installed in the test tray of FIG. 1 and a socket guider and a test socket installed in the interface board of FIG.

4 to 6 is a schematic side view for explaining the operation of the main portion of the test tray and the interface board according to the present invention.

Fig. 7 is a reference diagram showing the formation positions of second calibration holes formed in various kinds of inserts.

8 is a plan view of a test tray for a test handler according to a second embodiment of the present invention.

9 is an enlarged perspective view of the main part of FIG. 8;

Hereinafter, a preferred embodiment according to the present invention as described above with reference to the accompanying drawings, for the sake of brevity of description overlapping description is omitted or compressed as possible.

<제1 실시예><First Embodiment>

1. Description of test tray for test handler

1 is a plan view of a test tray 100 for a test handler (hereinafter, abbreviated as 'test tray') according to a first embodiment of the present invention.

The test tray 100 according to the present embodiment includes a plurality of inserts 110 and the installation frame 120.

The insert 110 includes a main body 111, a support portion 112, and a fixture 113.

The main body 111 has a seating space SS on which the semiconductor device is mounted. In addition, two first calibration holes CH1 and four second calibration holes CH2 are formed in the main body 111.

The first calibration hole CH1 is formed to have an inner diameter in consideration of the manufacturing tolerances described in the section “Technology Background of the Invention”. The first calibration hole CH1 serves to primarily correct the position of the insert 110.

The second straightening hole CH2 is formed to more precisely and secondarily correct the position of the insert 110 that is primarily straightened by the action of the first straightening hole CH1. Therefore, after the position of the insert 110 is firstly corrected by the first calibration hole CH1, the position of the insert 110 is secondarily more precisely corrected by the second calibration hole CH2. The second calibration hole CH2 is formed on the crosshair CL based on the center O ₁ of the insert 110, and is formed of a longer hole having a longer shape in the crosshair CL direction. That is, when positioning the center of the crosshair CL in the center O ₁ of the insert, the second calibration hole CH2 on the X-axis line of the crosshair CL is a long hole in the X-axis direction, and the crosshair CL The second calibration hole CH2 on the Y-axis line of Fig. 3) is a long hole in the Y-axis direction. Here, the X axis and the Y axis are straight lines passing through the center of the second calibration hole CH2 and the center O ₁ of the insert 110. As such, the second calibration hole CH2 is formed as a long hole, so that the function may be maintained even when the insert 110 itself is thermally expanded or cooled down based on the center O ₁ of the insert 110.

A more detailed description with respect to the first calibration hole CH1 and the second calibration hole CH2 will be described later.

The support part 112 supports the semiconductor device seated in the seating space SS. The support portion 112 is provided with a thin film is coupled to the main body 111. In addition, the support part 112 is provided with exposure holes EH that induce proper seating of the semiconductor device and allow terminals of the semiconductor device to be exposed to the test socket side. Of course, depending on the implementation, the support portion 112 may be formed integrally with the main body 111.

The fixing unit 113 may also be referred to as a latch or a holding device, and is coupled to the main body 111 to be operable. The fixture 113 fixes the semiconductor device supported by the support part 112 in a state of being seated in the seating space SS. For reference, the fixing of the semiconductor device by the fixing unit 113 is performed by a separate opening device (refer to Republic of Korea Patent Application Publication No. 10-2011-0121063).

The insert frame 110 is coupled to the installation frame 120 by a coupler (not provided with a bolt and a nut) so as to be able to flow somewhat.

2. For tester On interface board Description of

2 is a plan view of the tester interface board 200 (hereinafter, abbreviated as 'interface board') according to the first embodiment of the present invention.

The interface board 200 according to the present embodiment includes a plurality of test sockets 210, a socket guider 220, and an installation board 230.

The test socket 210 has a socket portion 211 electrically connected to a semiconductor device in the insert 110 of the test tray 100. In the test socket 210, four alignment holes AH are formed on the crosshair CL based on the bolt hole BH1 and the center O ₂ of the test socket 210.

The socket guider 220 corrects the position of the insert 110 for electrical connection between the test socket 210 and the semiconductor device. To this end, the socket guider 220 is provided with two first calibration pins CP1 at positions corresponding to two first calibration holes CH1, and positions corresponding to four second calibration holes CH2. Four second calibration pins CP2 are provided. In addition, four alignment pins AP are provided at positions corresponding to the four alignment holes AH as referred to in the conceptual side view of FIG. 3.

The first calibration pins CP1 are inserted into the first calibration holes CH1 to primarily correct the position of the insert 110.

As the second calibration pins CP2 are inserted into the second calibration holes CH2, the second calibration pins CP2 are secondarily calibrated more precisely. The second calibration pins CP2 have a shape corresponding to the second calibration hole CH2 having a long hole shape, and have a flat cross section having an elliptical shape.

The diameter of the short radius side of the second straightening pin CP2 in the cross section of the second straightening pin CP2 is substantially equal to the diameter of the short radius side of the second straightening hole CH2, and the diameter of the long radius side is the second straightening hole. It is rather shorter than the diameter of the long radius side of (CH2). This reason is taken into account the expansion of the insert 110 and the thermal expansion of the test socket 210 or the second calibration pin (CP2). That is, even if the second calibration pin CP2 expands or the second calibration pin CP2 does not expand due to thermal expansion, a free space must exist within the second calibration hole CH2 in consideration of movement in the thermal expansion direction. to be. By making the cross section elliptical in this way, the strength of the second calibration pin CP2, which is relatively thinner with respect to the first calibration pin CP1, may be reinforced.

In particular, as shown in FIG. 3, the protruding height H ₁ of the first straightening pins CP1 is higher than the height H ₂ from which the second straightening pins CP2 protrude. As a result, the first calibration pins CP1 are first inserted into the first calibration holes CH1 to align the position of the insert 110, and the second calibration pins CP2 are arranged to the second calibration holes CH2. As later inserted into the field it is possible to finely align the position of the insert (110). Of course, according to the embodiment, the first calibration pin and the second calibration pin have the same height while the first calibration pin is inserted into the first calibration hole first, and then the second calibration pin is inserted into the second calibration hole later. The shape of the structure may be changed.

Alignment pins AP are inserted into the alignment holes AH. The alignment pins AP and the alignment holes AH may be installed on the installation board 230 in a state where the socket guider 220 and the test socket 210 are precisely positioned. Here, as in this embodiment, the four second calibration pins CP2 and the four alignment pins AP are provided on the same axis SA ₁ , SA ₂ , SA _{3 in the} same form as shown in FIG. 3. Can be. Four second calibration pins CP2 and four alignment pins AP may be integrally formed or separately. Of course, according to the implementation it is also possible that the alignment pins are formed in a position different from the second calibration pins.

The socket guide 220 has a bolt hole BH2 formed at a position corresponding to the bolt hole BH1 of the test socket 210. Therefore, the test socket 210 and the socket guider 220 are installed on the installation board 230 by the bolt not shown. For this purpose, the protruding height h ₁ of the alignment pins AP may be equal to or smaller than the depth h ₂ of the alignment hole AH of the test socket 210. Of course, the operator by inserting the alignment pin (AP) in the alignment hole (AH) in advance during the bolt coupling operation test socket 210 and the socket guider 220 in a state that the test socket coupled to the test socket ( 210 and the socket guider 220 is coupled to the installation board (230). However, if the test socket and the socket guider are installed on the installation board by the alignment pins by forming a screw thread on one side of the alignment pins (the part facing the installation board side), no additional bolt holes or bolts may be required.

3. Main Description of operation of the part

When the test tray 100 approaches the interface board 200 by the pushing unit provided in the test handler, the insert 110 installed in the test tray 100 approaches the test socket 210 installed in the interface board 200. (See Korean Patent Publication 10-).

4 to 7 are conceptual exaggerations extracting only the main parts of the present invention, with reference to them to explain the operation of the main parts.

4 (a) shows a state where the insert 110 and the test socket 210 are spaced apart from each other at a distance, and FIG. 4 (b) shows the insert 110 of the insert 110 in the state (a) of FIG. 1 Positional relationship between the calibration hole CH1 and the first calibration pin CP1 of the socket guider 220, the second calibration hole CH2 of the insert 110 and the second calibration hole CH2 of the socket guider 220. ) Shows the positional relationship between

When the pushing unit operates in the state of FIG. 4 to approach the test tray 100 toward the interface board 200, the first calibration pin CP1 is inserted into the first calibration hole CH1 as shown in FIG. While first inserted, the position of the insert 110 is primarily aligned as shown in FIG. Accordingly, in the state where the second calibration pin CP2 is greatly shifted from the second calibration hole CH2 as in FIG. 4B, the second calibration pin CP2 is second-calibrated as in FIG. 5B. It is corrected to a position that can be inserted into the hole CH2.

As the insert 110 continuously approaches the test socket 210 in the state of FIG. 5, the second calibration pin CP2 is inserted into the second calibration hole CH2 as shown in FIG. 6, and thus the position of the insert 110 is improved. Secondly finely calibrated.

As described above, the present invention precisely positions the insert 110 in two steps by the first calibration hole CH1 / first calibration pin CP1 and the second calibration hole CH2 / second calibration pin CP2. It is a technique to correct. However, the present invention extends to applications in which the position of the insert is precisely corrected in three steps using the third calibration hole / third calibration pin, or the position of the insert is precisely corrected in four or more steps. Can be.

4. References

In the insert 110 applied to the test tray 100 of FIG. 1, a second calibration hole CH2 is formed on the crosshair CL based on the center O ₁ of the insert 110. We are holding an example of a longer hole in the direction (CL).

However, as shown in FIGS. 7A, 7B, and 7C, the

inserts

110A, 110B, and 110C may have various types of shapes. Therefore, depending on the type of the

inserts

110A, 110B, and 110C, it may be difficult to arrange the second calibration holes CH2 on the crosshairs CL, and it may be difficult to form long holes having different lengths. Therefore, various modifications as shown in FIG. 7 may be followed.

According to Fig. 7A, two second calibration holes CH2-a of the second calibration holes CH2-a and CH2-b are formed at corner portions facing each other diagonally, and two The other second straightening hole CH2-b is formed on the center line C dividing the insert 110A bilaterally. And the calibration hole of the sign CH2-a is in the form of a long hole in the left and right direction, and the calibration hole of the sign CH2-b is in the form of a long hole in the front and rear direction on the drawing.

According to Fig. 7B, the second calibration hole CH2 is formed in both the front part and the rear part, divided on both sides of the center line C, which divides the insert 110B bilaterally. And all the second calibration holes (CH2) is in the form of a long hole in the front and rear direction on the drawing.

According to FIG. 7C, the second calibration hole CH2 is formed at the left side and the right side divided into both sides of the center line C dividing the insert 110C bilaterally. And all the second calibration holes (CH2) is in the form of a long hole in the left and right directions on the drawing.

That is, the second calibration holes CH2 may have various arrangements according to the shapes of the

inserts

100, 110A, 110B, and 110C.

Of course, the second calibration pins of the interface board should also be provided to correspond to the arrangement of the second calibration holes CH2-a, CH2-b, and CH2 according to various shapes of the

inserts

110A, 110B, and 110C of FIG. 7. .

<제2 <Second 실시예Example >>

8 is a plan view of a test tray 700 (hereinafter, abbreviated as 'test tray') for a test handler according to a second embodiment of the present invention.

The test tray 700 according to the present embodiment includes a plurality of inserts 710 and an installation frame 720.

The insert 710 includes a body 711, a support portion 712 and a fixture 713. Here, since the support part 712 and the fixing device 713 are the same as in the first embodiment, description thereof will be omitted.

The main body 711 has a mounting space SS on which a semiconductor device may be mounted. In addition, the main body 711 is provided with the calibration hole CH and the cutting hole IH.

Since the calibration pin (same as the first calibration pin in the first embodiment) of the interface board is inserted into the calibration hole CH, the position of the insert 710 is thereby corrected. Here, as shown in the perspective view of FIG. 9, the wall surface W constituting the calibration hole CH has an incision portion IP to reduce the contact portion with the calibration pin inserted into the calibration hole CH.

The incision hole IH functions to allow a portion of the wall surface W constituting the calibration hole CH to be retracted outward when the calibration pin is inserted into the calibration hole CH. In addition, when the calibration pin exits the calibration hole CH, the wall surface W, which has been retracted by the elastic force of the material constituting the main body 711 of the insert 710, is restored and elastically advanced. That is, in the present embodiment, the inner diameter of the calibration hole CH before the calibration pin is inserted may be equal to or smaller than the diameter of the calibration pin by the elastic force. However, since the wall (W) constituting the calibration hole (CH) is retracted to the outside in the process of the calibration pin is inserted, the calibration hole (CH) is gradually opened to become large enough to insert the calibration pin sufficiently. In addition, since the phenomenon of being pinched in the state in which the calibration pins are inserted into the calibration holes CH is prevented, a malfunction of the calibration pins that do not escape from the calibration holes CH is eliminated.

According to the present embodiment as described above, since the inner diameter of the calibration hole CH can be made smaller than the conventional one in consideration of the manufacturing tolerance to a minimum, more precise position correction of the insert 710 can be made.

In addition, the technique of forming the cutout hole IH on the outer side of the correction hole CH and having the cutout portion IP on the wall constituting the straightening hole CH according to the present embodiment has been described above in the first embodiment. It may be applied only to the first calibration hole CH1 which is present, or may be applied only to the second calibration hole CH2, and may be applied to both the first calibration hole CH1 and the second calibration hole CH2.

On the other hand, the above-described embodiments are described separately from each other for convenience of description, but according to the implementation, the first embodiment and the second embodiment may be implemented together in the product, or may be separately applied to the product.

As described above, the detailed description of the present invention has been made by the embodiments with reference to the accompanying drawings. However, since the above-described embodiments have only been described with reference to the preferred examples of the present invention, the present invention has been described above. It should not be understood to be limited only to the scope of the present invention will be understood by the claims and equivalent concepts described below.

(Explanation of the sign)

100, 700: Insert

110: Insert

111: main body

CH1: first calibration hole CH2: second calibration hole

112: support portion

113: fixture

120: installation frame

200: interface board

210: test socket

AH: Alignment hole

220: Socket Guider

CP1: first calibration pin CP3: second calibration pin

AP: Alignment Pin

230: installation board

Claims

An insert having a seating space in which the semiconductor device may be seated; And

An installation frame in which the insert is installed to be movable; Including,

The insert is

A main body in which the seating space is formed;

A support part formed integrally with the main body or coupled to the main body to support the semiconductor device seated in the seating space; And

Fixing device for fixing the semiconductor device to prevent the separation of the semiconductor device seated in the seating space: includes;

The main body is provided with a first calibration hole into which the first calibration pin of the socket guider provided in the interface board of the tester and a second calibration hole into which the second calibration pin of the socket guider can be inserted. By

Test tray for test handler.
The method of claim 1,

When the insert approaches the test socket provided on the interface board, the first calibration pin is first inserted into the first calibration hole and the second calibration pin is inserted later into the second calibration hole, thereby providing the first calibration hole. And the position of the insert is primarily corrected by the action of the first calibration pin and the position of the insert is precisely secondarily corrected by the action of the second calibration hole and the second calibration pin. By

Test tray for test handler.
The method of claim 2,

The first calibration pin has a higher protruding height than the second calibration pin so that the second calibration pin can be inserted into the second calibration hole after the first calibration pin is inserted into the first calibration hole. Characterized

Test tray for test handler.
The method of claim 1,

The second calibration hole is characterized in that the long hole shape in one side direction

Test tray for test handle.
The method of claim 4, wherein

The second calibration hole is characterized in that the long hole shape in the straight direction passing through the center of the second calibration hole and the center of the insert

Test tray for test handler.
A test socket electrically connected to the semiconductor element in the insert of the test tray;

A socket guider for calibrating the position of the insert for electrical connection between the test socket and the semiconductor device; And

An installation board on which the test socket and the socket guider are installed; Including,

The socket guider,

A first calibration pin inserted into a first calibration hole formed in the insert to primarily correct the position of the insert; And

A second calibration pin inserted into a second calibration hole formed in the insert to secondly correct the position of the insert; Characterized in that it comprises

Interface board for tester.
The method of claim 6,

As the insert approaches the test socket, the first calibration pin is first inserted into the first calibration hole, thereby first calibrating the position of the insert and the second calibration pin is later inserted into the second calibration hole. Characterized in that the position of the insert is secondarily precisely calibrated

Interface board for tester.
The method of claim 7, wherein

The first calibration pin has a higher protruding height than the second calibration pin so that the second calibration pin can be inserted into the second calibration hole after the first calibration pin is inserted into the first calibration hole. Characterized

Test tray for test handler.
The method of claim 8,

The test socket is formed with an alignment hole,

The socket guider is provided with an alignment pin that can be inserted into the alignment hole

Test interface board.
The method of claim 9,

The second calibration pin and the alignment pin is characterized in that provided on the same axis

Test interface board.
The method of claim 6,

The second calibration pin is characterized in that the flat cross-section is an ellipse long form in one direction

Test interface board.
An insert having a seating space in which the semiconductor device may be seated; And

An installation frame in which the insert is fixedly movable; Including,

The insert is

A main body in which the seating space is formed;

A support part formed integrally with the main body or coupled to the main body to support the semiconductor device seated in the seating space; And

Fixing device for fixing the semiconductor device to prevent the separation of the semiconductor device seated in the seating space: includes;

The main body is provided with a calibration hole that can be inserted into the calibration pin of the socket guider provided in the interface board of the tester,

The wall surface constituting the calibration hole is characterized in that at least a portion is cut to reduce the contact portion with the calibration pin inserted into the calibration hole.

Insert for test handler.
The method of claim 12,

When the calibration pin is inserted into the calibration hole, the main body has a plurality of circumferential directions on the outer side of the calibration hole so that the portion of the wall that forms the calibration hole in contact with the calibration pin is retracted outward and then elastically restored. Characterized in that the incision hole is formed

Insert for test handler.