WO2016085206A1

WO2016085206A1 - Test handler

Info

Publication number: WO2016085206A1
Application number: PCT/KR2015/012565
Authority: WO
Inventors: Yun Sung Na; Jong Ki Noh
Original assignee: Techwing Co., Ltd.
Priority date: 2014-11-28
Filing date: 2015-11-20
Publication date: 2016-06-02
Also published as: KR20160064722A; CN107003350B; KR102187839B1; CN107003350A; TW201619624A; CN111375570B; CN111375570A; TWI589896B

Abstract

Disclosed herein is a test handler. In accordance with an embodiment of the present invention, the test handler comprises: a loading device configured to load electronic components into a test tray; a test chamber including a tester configured to make close contact with each of the electronic components to conduct a test of each of the electronic components; a pushing device configured to push each of the electronic components mounted on the test tray toward the tester; and an unloading device configured to unload each of the electronic components tested in the test chamber from the test tray, wherein the pushing device includes a pressing plate configured to deliver a pressing force to the electronic components, a first rail disposed in a central portion of the pressing plate so as to extend in a horizontal direction, an upper match plate having a lower end portion configured to make contact with the first rail, a lower match plate having an upper end portion configured to make contact with the first rail, and a plurality of pushers provided in the upper match plate and the lower match plate so as to make contact with the electronic components.

Description

TEST HANDLER

The invention relates to a test handler.

A test handler is a device which supports a test of electronic components such as semiconductor devices or the like manufactured through a predetermined manufacturing process, classifies the electronic components on a grade-by-grade basis according to a test result and mounts the electronic components on a customer tray.

Figs. 1 and 2 are a perspective view and a plan view showing a typical test handler. Referring to Figs. 1 and 2, the test handler 1 may include a loading device 10, a soak chamber 20, a test chamber 30, a de-soak chamber 40 and an unloading device 50.

A plurality of inserts in which electronic components can be seated is provided in

test trays

3a and 3b. The

test trays

3a and 3b may be circulated along a predetermined closed route by a plurality of conveying devices (not illustrated).

The loading device 10 is capable of loading untested electronic components mounted on a customer tray 2a into the

test trays

3a and 3b located in a loading position.

Since the electronic components may be used under different temperature environments, it may be necessary to determine whether the electronic components are well operated under a specific temperature environment. Prior to being tested, the electronic components mounted on the

test trays

3a and 3b may be preheated or precooled in the soak chamber 20.

The electronic components conveyed to a test position via the soak chamber 20 and mounted on the

test trays

3a and 3b may be tested in the test chamber 30. Specifically, the electronic component mounted on the

test trays

3a and 3b may be pushed toward a tester 70 by a pushing device 60. The electronic component and the tester 70 may be electrically connected to each other by the contact or engagement thereof. In this state, a test for the electronic component may be performed.

The pushing device 60 may include match plates matched with the

test trays

3a and 3b and configurations for moving the match plates toward the

test trays

3a and 3b. A plurality of pushers is provided in each of the match plates in a matrix pattern. The individual pushers are in one-to-one correspondence to the individual inserts of the

test trays

3a and 3b and are capable of pressing the electronic components positioned in the inserts against the tester 70.

In the meantime, a heating medium for setting a temperature environment with respect to the electronic components may be supplied to the test chamber 30. For the sake of accurate temperature setting, heating medium flow paths may be formed in the individual pushers. The heating medium may be supplied to the individual electronic components through the heating medium flow paths.

The

test trays

3a and 3b carrying tested electronic components may be conveyed to the de-soak chamber 40 where the electronic components may be heated or cooled to a temperature (e.g., a room temperature) at which no unloading problem arises.

The unloading device 50 may classify the electronic components on a grade-by-grade basis according to a test result and may unload the electronic components from the

test trays

3a and 3b into an empty customer tray 2b.

As set forth above, different temperature environments may be set within the test handler 1. Thus, thermal deformation (thermal expansion or contraction) may be generated in the match plates. If the thermal deformation is generated in the match plates, the positions of the individual pushers provided in the match plates may be changed. Consequently, the pushers may be incapable of normally pressing the electronic components mounted on the

test trays

3a and 3b. As a result, the test for the electronic components may not be normally performed and the reliability of the test result may not be guaranteed. This may lead to a decrease in test throughput. In addition, the electronic components and/or the tester may be deformed or damaged.

Patent Document 1: Korean Patent No. KR 10-0709114

Embodiments of the present disclosure provide a test handler capable of enabling a test of an electronic component to be smoothly performed even when thermal deformation is generated in a match plate.

In view of the foregoing problems, the present disclosure provides a test handler, comprising: a loading device configured to load electronic components into a test tray; a test chamber including a tester configured to make close contact with each of the electronic components to conduct a test of each of the electronic components; a pushing device configured to push each of the electronic components mounted on the test tray toward the tester; and an unloading device configured to unload each of the electronic components tested in the test chamber from the test tray, wherein the pushing device includes a pressing plate configured to deliver a pressing force to the electronic components, a first rail disposed in a central portion of the pressing plate so as to extend in a horizontal direction, an upper match plate having a lower end portion configured to make contact with the first rail, a lower match plate having an upper end portion configured to make contact with the first rail, and a plurality of pushers provided in the upper match plate and the lower match plate so as to make contact with the electronic components.

Further, the present disclosure also provides the test handler further comprising: a second rail provided in a lower end portion of the pressing plate and spaced apart downward from a lower end portion of the lower match plate; and a third rail provided in an upper end portion of the pressing plate spaced apart upward from an upper end portion of the upper match plate.

Further, the present disclosure also provides the test handler, wherein when the electronic components are mounted on the test tray in a matrix form of M×N, each of the upper match plate and the lower match plate matches with the electronic components having a matrix form of M/2×N, where M is an even number of two or more and N is a natural number of one or more.

Further, the present disclosure also provides the test handler, wherein an engagement groove is formed in the first rail, and a projection inserted into the engagement groove to maintain a position of the lower match plate with respect to the first rail is provided in the upper end portion of the lower match plate.

Further, the present disclosure also provides the test handler further comprising: a first pin provided at one side of the pressing plate; a second pin provided at the other side of the pressing plate; a first bracket provided at one side of the lower match plate and configured to engage with the first pin; and a second bracket provided at the other side of the lower match plate and configured to engage with the second pin.

Further, the present disclosure also provides the test handler, wherein a first engagement groove into which the first pin is inserted to support the first bracket is formed in the first bracket, a second engagement groove into which the second pin is inserted to support the second bracket is formed in the second bracket, the first engagement groove includes a first guide portion configured to guide the lower match plate so that the first pin begins to be inserted into the first engagement groove along with movement of the lower match plate and so that the lower match plate moves up toward the first rail and approaches the first rail, and a first seat portion in which the first pin is positioned when the lower match plate makes contact with the first rail, and the second engagement groove includes a second guide portion configured to guide the lower match plate so that the second pin begins to be inserted into the second engagement groove along with movement of the lower match plate and so that the lower match plate moves up toward the first rail and approaches the first rail, and a second seat portion in which the second pin is positioned when the lower match plate makes contact with the first rail.

Further, the present disclosure also provides the test handler, wherein the first pin protrudes frontward beyond the pressing plate, the second pin does not protrude frontward beyond the pressing plate, the first bracket does not protrude rearward beyond the lower match plate, and the second bracket protrudes rearward beyond the lower match plate.

Further, the present disclosure also provides the test handler further comprising: a moving body configured to move toward the tester; and a plurality of shafts configured to interconnect the moving body and the pressing plate, wherein one of the shafts is connected to a central portion of the pressing plate and configured to suppress thermal deformation of the central portion of the pressing plate, and the remaining shafts are connected to the pressing plate so as to make relative movement with respect to the pressing plate and configured to permit thermal deformation of portions of the pressing plate other than the central portion.

Further, the present disclosure also provides the test handler further comprising: at least two ball plungers configured to press the upper match plate and the lower match plate frontward, wherein each of the ball plungers includes a ball having a front portion partially inserted into a slot extending in an up-down direction at a center of the lower end portion of the upper match plate or at a center of the upper end portion of the lower match plate, and an elastic member connected to the pressing plate at one end and to the ball at the other end and configured to elastically bias the ball frontward.

According to the embodiments of the present disclosure, it is possible to provide a test handler capable of enabling a test of an electronic component to be smoothly performed even when thermal deformation is generated in a match plate.

Fig. 1 is a perspective view illustrating a typical test handler.

Fig. 2 is a plan view of the test handler illustrated in Fig. 1.

Fig. 3 is a perspective view illustrating a pushing device of a test handler according to one embodiment, which is viewed from the front side.

Fig. 4 is a perspective view of the pushing device of the test handler according to one embodiment illustrated in Fig. 3, which is viewed from the rear side.

Fig. 5 is an exploded perspective view of the pushing device of the test handler according to one embodiment illustrated in Fig. 3.

Fig. 6 is a front view of the pushing device of the test handler according to one embodiment illustrated in Fig. 3.

Fig. 7 is a side view of the pushing device of the test handler according to one embodiment illustrated in Fig. 3.

Fig. 8 is an enlarged side view of the pushing device of the test handler according to one embodiment illustrated in Fig. 3.

Fig. 9 is a perspective view of a first bracket of the test handler according to one embodiment illustrated in Fig. 3, which is viewed from the rear side.

Fig. 10 is a perspective view of a second bracket of the test handler according to one embodiment illustrated in Fig. 3, which is viewed from the rear side.

Figs. 11A and 11B are views illustrating modifications of an engagement groove.

Fig. 12 is a view illustrating a ball plunger which is viewed from the front side.

Fig. 13 is a view schematically illustrating the ball plunger which is viewed from the lateral side.

Figs. 14 to 16 are views for explaining how to mount a lower match plate in the test handler according to one embodiment illustrated in Fig. 3.

Fig. 17 is a view illustrating a pressing plate of the test handler according to one embodiment illustrated in Fig. 3, which is viewed from the front side.

Fig. 18 is a view for explaining a connection structure of a shaft and a pressing plate in the test handler according to one embodiment illustrated in Fig. 3.

Fig. 19 is a side view of a pushing device of a test handler according to another embodiment.

Fig. 20 is a perspective view illustrating a locking module of the test handler according to another embodiment illustrated in Fig. 19.

Fig. 21 is a front view schematically illustrating a pushing device of a test handler according to a further embodiment.

The advantages and features of the present disclosure and the ways to achieve them will become apparent from the following description of exemplary embodiments given in conjunction with the accompanying drawings. The exemplary embodiments will be described in detail so that inventive concept may be readily implemented by those skilled in the art. However, it is to be noted that the exemplary embodiments are not intended to be anyway limiting and various modifications may be made without departing from the technical concept of the present disclosure. The scope of the inventive concept will be defined by the following claims rather than by the detailed description of the exemplary embodiments.

A loading device, a test chamber and an unloading device of a test handler according to the embodiments to be described below are the same as those described above with reference to Figs. 1 and 2. Therefore, descriptions on the aforementioned configurations will be omitted. A pushing device 100 will be described in detail.

For reference, in the drawings, the X and ?X directions may denote a horizontal direction, the Y and ?Y directions may denote a vertical direction, the Z direction may denote a frontward direction, and the ?Z direction may denote a rearward direction. Furthermore, the X and ?X directions may denote one side direction and the other side direction, respectively.

A pushing device 100 may push, frontward (in the Z direction), an electronic component mounted on a test tray positioned frontward of the pushing device 100 (positioned at a point spaced apart from the pushing device 100 in the Z direction), so that the electronic component makes close contact with a tester positioned frontward of the test tray.

Fig. 3 is a perspective view illustrating a pushing device 100 of a test handler according to one embodiment, which is viewed from the front side. Fig. 4 is a perspective view of the pushing device 100 of the test handler according to one embodiment illustrated in Fig. 3, which is viewed from the rear side. Fig. 5 is an exploded perspective view of the pushing device 100 of the test handler according to one embodiment illustrated in Fig. 3. Fig. 6 is a front view of the pushing device 100 of the test handler according to one embodiment illustrated in Fig. 3. Fig. 7 is a side view of the pushing device 100 of the test handler according to one embodiment illustrated in Fig. 3.

As illustrated in Figs. 3 to 7, a pressing plate 110 may be positioned rearward of

match plates

130 and 140 and pushers 150. The pressing plate 110 may deliver the pressing force received from the rear side to the

match plates

130 and 140 and/or the pushers 150 and may bring the pushers 150 into contact with the electronic component mounted on a test tray.

While not shown in the drawings, a moving body (e.g., an actuator) may be disposed at the rear side of the pressing plate 110. The moving body may be connected to the pressing plate 110 by a plurality of

shafts

160a and 160b. A pressing force may be generated by the forward movement of the moving body. The pressing plate 110 connected to the moving body may deliver the pressing force to the

match plates

130 and 140 and/or the pushers 150.

Assuming that electronic components having a matrix form of M×N are mounted on the test tray, the pressing plate 110 may have such a size as to cover all the electronic components having a matrix form of M×N as illustrated in Fig. 6.

As described earlier, a heating medium may be supplied to the electronic components in order to set a temperature environment for the electronic components to be tested. For this purpose, a plurality of through-holes 111 may be formed in the pressing plate 110 in a matrix form of M×N. The heating medium may be supplied from the rear side of the pressing plate 110 to the individual electronic components via the through-holes 111 and the heating medium flow paths 151 of the pushers 150. In this regard, while not shown in the drawings, a duct may be provided at the rear side of the pressing plate 110. The heating medium may be introduced into the duct and may be supplied to the front side of the pressing plate 110 through the through-holes 111. From this viewpoint, it may be understood that the pressing plate 110 is a portion of the duct.

At one side and the other side of the pressing plate 110, there may be provided

bases

116 and 119 having a first pin 115 and a second pin 118, respectively. The position of the lower match plate 140 may be maintained by the first pin 115 and the second pin 118. Descriptions will be made later on this point.

As described above, a plurality of

shafts

160a and 160b may be connected to the rear side of the pressing plate 110. In the present embodiment, there are provided nine shafts in total. Among them, the shaft 160a may be connected to the central portion of the rear surface of the pressing plate 110. The shaft 160a may be relatively immovably connected to the pressing plate 110, thereby suppressing thermal deformation of the central portion of the pressing plate 110. On the other hand, the remaining shafts 160b may be relatively movably connected to the pressing plate 110, thereby permitting thermal deformation of the portion of the pressing plate 110 other than the central portion.

First to

third rails

120, 121 and 122 may be provided at the front side of the pressing plate 110. The first rail 120 may horizontally extend in the central portion of the pressing plate 110. The second rail 121 may horizontally extend in the lower end portion of the pressing plate 110. The third rail 122 may horizontally extend in the upper end portion of the pressing plate 110. The

rails

120, 121 and 122 may basically guide the mounting of the

match plates

130 and 140. Furthermore, the

rails

120, 121 and 122 may support the

match plates

130 and 140 so as to maintain the positions of the

match plates

130 and 140.

As described earlier, the test of electronic components may be conducted under different temperature environments. In this process, thermal deformation (thermal expansion or contraction) may be generated in the

match plates

130 and 140. As can be noted from the following mathematical formula, the thermal deformation of a certain member is proportional to the initial length of the member: , where L is the length measured after thermal deformation, L0 is the initial length, α is the thermal deformation coefficient, and ΔT is the temperature change amount.

When electronic components having a matrix form of M×N are mounted on a test tray, a conventional match plate, which is formed of a single member, covers all the electronic components having a matrix form of M×N. Thus, the cumulative deformation amount may grow larger toward the end portion of the match plate. As a consequence, the pushers existing at the side of the end portion of the match plate are significantly out of alignment with the electronic components. For that reason, the pressing force may not be wholly delivered to the electronic components.

In the present embodiment, the

match plates

130 and 140 may be the ones obtained by bisecting a typical match plate. For example, as illustrated in Figs. 5 and 6, each of the upper match plate 130 and the lower match plate 140 may cover only the electronic components having a matrix form of M/2×N. Therefore, as compared with a conventional match plate, it is possible to sharply reduce the cumulative deformation amount in the upper end portion of the upper match plate 130 and the lower end portion of the lower match plate 140.

In the meantime, the lower end portion of the upper match plate 130 and the upper end portion of the lower match plate 140 may make contact with the first rail 120. For example, the upper match plate 130 may be seated on the first rail 120. The lower match plate 140 may be engaged with the first rail 120 and may be suspended from the first rail 120. This may make it possible to suppress thermal deformation of the lower end portion of the upper match plate 130 and the upper end portion of the lower match plate 140. As a consequence, the thermal deformation of the

match plates

130 and 140 occurs in a vertical symmetry as a whole. Thus, as compared with the conventional match plate, it is possible to reduce positional deviations between the respective inserts of the test tray and the electronic components. For example, the conventional match plate is seated on a rail existing below a pressing plate. As the match plate is thermally deformed upward, the central portion of the match plate is also deformed. In the case of the present embodiment, the lower end portion of the upper match plate 130 and the upper end portion of the lower match plate 140 do not undergo deformation. Thus, no deformation occurs in the central portion when the

match plates

130 and 140 are viewed as a whole. Furthermore, the thermal deformation occurs uniformly in a vertical symmetry and the initial length is short. Therefore, as compared with the conventional match plate, it is possible to reduce the cumulative deformation amount in the end portions of the

match plates

130 and 140.

The upper match plate 130 and the lower match plate 140 may be mounted from the other end side toward one end side of the pressing plate 110. For example, referring to Figs. 3 to 6, the

match plates

130 and 140 may be mounted to the pressing plate 110 while being guided in the X direction by the

rails

120, 121 and 122. The mounting of the

match plates

130 and 140 will be described later.

In the meantime, as can be confirmed in Fig. 7, the upper end portion of the upper match plate 130 may be spaced apart from the third rail 122, and the lower end portion of the lower match plate 140 may be spaced apart from the second rail 121. Thus, a predetermined space 132 may be formed between the upper end portion of the upper match plate 130 and the third rail 122, and a predetermined space 142 may also be formed between the lower end portion of the lower match plate 140 and the second rail 121. This gives preliminary consideration to the vertical thermal expansion of the

respective match plates

130 and 140.

The first rail 120, the second rail 121 and the third rail 122 may include

flange portions

120a, 120b, 121a and 122a, respectively (see Fig. 7). This may prevent the

match plates

130 and 140 from being derailed frontward.

As illustrated in Fig. 5, a plurality of through-

holes

131 and 141 may be formed in the

match plates

130 and 140 in a matrix form. The pushers 150 for pushing frontward the electronic components mounted on the test tray positioned at a point spaced apart frontward from the

match plates

130 and 140 may be installed so as to protrude beyond the through-

holes

131 and 141. The through-holes 111 of the pressing plate 110 and the heating medium flow paths 151 of the pushers 150 communicate with each other. Thus, the heating medium may be supplied to the respective electronic components.

Fig. 8 is an enlarged side view of the pushing device 100 of the test handler according to one embodiment illustrated in Fig. 3. Fig. 9 is a perspective view of a first bracket 143 of the test handler according to one embodiment illustrated in Fig. 3, which is viewed from the rear side. Fig. 10 is a perspective view of a second bracket 145 of the test handler according to one embodiment illustrated in Fig. 3, which is viewed from the rear side. Hereinafter, one example of a structure for maintaining the position of the lower match plate 140 with respect to the first rail 120 will be described with reference to Figs. 3 to 10.

A first pin 115 may be provided at one side of the pressing plate 110, and a second pin 118 may be provided at the other side of the pressing plate 110. In a corresponding relationship with the

pins

115 and 118, a first bracket 143 may be provided at one side of the lower match plate 140, and a second bracket 145 may be provided at the other side of the lower match plate 140.

Engagement grooves

144 and 146 may be formed in the

brackets

143 and 145. The

pins

115 and 118 may be inserted into the

engagement grooves

144 and 146 to support the

brackets

143 and 145 in the up-down direction.

Specifically, a base 116 may be provided at one side of the pressing plate 110. The first pin 115 may protrude frontward from the base 116. A base 119 may also be provided at the other side of the pressing plate 110. The second pin 118 may protrude frontward from the base 119.

As illustrated in Fig. 8, the first pin 115 may protrude frontward beyond the pressing plate 110, and the second pin 118 may not protrude frontward beyond the pressing plate 110. As illustrated in Fig. 9, the first bracket 143 does not protrude rearward beyond the lower match plate 140. The first pin 115 may be inserted into the first engagement groove 144 of the first bracket 143. As illustrated in Fig. 10, the second bracket 145 protrudes rearward beyond the lower match plate 140. The second pin 118 may be inserted into the second engagement groove 146 of the second bracket 145. By employing this structure, an interference phenomenon does not occur when the lower match plate 140 is mounted while moving from one side toward the other side of the pressing plate 110 (in the X direction). That is to say, since the second pin 118 does not protrude frontward beyond the pressing plate 110 and the first bracket 143 does not protrude rearward beyond the lower match plate 140, the lower match plate 140 may move onto the front surface of the pressing plate 110. Since the first pin 115 protrudes frontward beyond the pressing plate 110, the first pin 115 may be inserted into the first engagement groove 144 of the first bracket 143. Since the second bracket 145 protrudes rearward beyond the lower match plate 140, the second pin 118 may be inserted into the second engagement groove 146 of the second bracket 145.

In the meantime, each of the

engagement grooves

144 and 146 may include a guide portion and a seat portion. The guide portion may refer to a portion into which the

115 or 118 begins to be inserted as the lower match plate 140 moves for a mounting purpose and which guides the lower match plate 140 as the lower match plate 140 approaches the first rail 120. The seat portion may refer to a portion in which the

115 or 118 is positioned when the lower match plate 140 approaches the first rail 120 and makes contact with the first rail 120.

Figs. 9 and 10 show one example of the

engagement grooves

144 and 146. Referring first to Fig. 9, the first engagement groove 144 may include a first guide portion 144-1 and a first seat portion 144-2. The first guide portion 144-1 may be inclined downward in the direction (e.g., the ?X direction) opposite to the moving direction of the lower match plate 140 (e.g., the X direction). If the lower match plate 140 moves, for example, in the X direction for a mounting purpose, the first pin 115 begins to be inserted into the first guide portion 144-1. The lower match plate 140 may be moved upward by the first guide portion 144-1 inclined downward in the direction (the ?X direction) opposite to the moving direction of the lower match plate 140 and may approach the first rail 120. As the lower match plate 140 continues to move, the lower match plate 140 and the first rail 120 may make contact with each other when the first pin 115 is positioned in the first seat portion 144-2.

Referring next to Fig. 10, the second engagement groove 146 may include a second guide portion 146-1 and a second seat portion 146-2. The second guide portion 146-1 may be inclined downward in the direction (e.g., the ?X direction) opposite to the moving direction of the lower match plate 140 (e.g., the X direction). If the lower match plate 140 moves, for example, in the X direction for a mounting purpose, the second pin 118 begins to be inserted into the second guide portion 146-1. The lower match plate 140 may be moved upward by the second guide portion 146-1 inclined downward in the direction (the ?X direction) opposite to the moving direction of the lower match plate 140 and may approach the first rail 120. As the lower match plate 140 continues to move, the lower match plate 140 and the first rail 120 may make contact with each other when the second pin 118 is positioned in the second seat portion 146-2.

Figs. 11A and 11B are views illustrating modifications of the

engagement grooves

144 and 146. The first engagement groove 144 and the second engagement groove 146 may have the same shape. Hereinafter, descriptions will be made on the basis of the first engagement groove 144.

First, in a modification illustrated in Fig. 11A, the first engagement groove 144 may include a first guide portion 144-1a and 144-1b and a first seat portion 144-2. The first guide portion 144-1a and 144-1b may include a first horizontal section 144-1a and a first slant section 144-1b. The present modification differs from the embodiment described above with reference to Fig. 9 in that the first horizontal section 144-1a is included in the first guide portion 144-1a. In the case of the embodiment described above with reference to Fig. 9, the first guide portion 144-1 is inclined it its entirety and, therefore, a sharp lower corner (having an acute angle) is formed. Thus, there is a risk that a worker may be injured. In the case of the present modification, the first horizontal section 144-1a extends in the horizontal direction and, therefore, the lower corner has a right angle. This makes it possible to reduce the risk of injury of a worker. The weight of the lower match plate 140 is as large as about several Kg. It is possible for a worker to hang the first horizontal section 144-1a on the first pin 115 and then to push the lower match plate 140. This helps enhance the ease of work.

Next, in another modification illustrated in Fig. 11B, the first engagement groove 144 may include a first guide portion 144-1a and 144-1b and a first seat portion 144-2. The first guide portion 144-1a and 144-1b may include a first horizontal section 144-1a and a first slant section 144-1b. The present modification differs from the modification described above with reference to Fig. 11A in that the first seat portion 144-2 is inclined. Specifically, as illustrated in Fig. 11B, the first seat portion 144-2 may be inclined in the direction opposite to the inclination direction of the first slant section 144-1b, namely upward in the direction opposite to the moving direction of the lower match plate 140. Thus, when the mounting of the lower match plate 140 is completed, the connection portion of the first slant section 144-1b and the first seat portion 144-2 may serve as one kind of stopper, thereby suppressing the relative movement between the first engagement groove 144 and the first pin 115. This makes it possible to prevent the lower match plate 140 from being removed from the first pin 115 by an external impact. Furthermore, in the case of the present modification, the entry portion of the first horizontal section 144-1a is rounded so as to further reduce the risk of injury of a worker.

In the case of the modification illustrated in Fig. 11B, as described above, the lower match plate 140 may not be removed from the first pin 115 even when an external impact is applied to the lower match plate 140. However, in the case of the embodiment described with reference to Fig. 9 or in the case of the modification illustrated in Fig. 11A, the first seat portion 144-2 extends in the horizontal direction. Thus, the lower match plate 140 may be removed from the first pin 115 when an external impact is applied to the lower match plate 140 (This holds true in the configuration related to the second bracket 145). Furthermore, the upper match plate 130 is placed on the first rail 120. Therefore, the upper match plate 130 may be tilted frontward or rearward and may be removed leftward or rightward. Accordingly, a ball plunger 180 may be provided in order to prevent removal of the

match plates

130 and 140.

Fig. 12 is a view illustrating a ball plunger 180 which is viewed from the front side. Fig. 13 is a view schematically illustrating the ball plunger 180 which is viewed from the lateral side (For the sake of simplicity, only the region around the upper match plate 130 is illustrated in Fig. 13). As illustrated in Figs. 12 and 13, the ball plunger 180 may include a ball 180a and an elastic member 180b. The elastic member 180b may be connected to the pressing plate 110 at one end and may be connected to the ball 180a at the other end. A front end portion of the ball 180a may be partially inserted into a

slot

137 or 147 formed in the

match plate

130 or 140. The elastic member 180b may elastically press the

match plate

130 or 140 against the first rail 120 existing at the front side. It is therefore possible to prevent the lower match plate 140 from being removed from the

pins

115 and 118. It is also possible to prevent the

match plates

130 and 140 from being removed in the left-right direction.

At least two ball plungers 180 may be provided in the upper match plate 130 and the lower match plate 140. Specifically, one of the ball plungers 180 may be provided in the lower end portion of the upper match plate 130 and the other ball plunger 180 may be provided in the upper end portion of the lower match plate 140. In addition, in view of the thermal deformation direction of the

match plates

130 and 140, the ball plungers 180 may be provided at the upper side and the lower side of the center C of the first rail 120. Each of the

slots

137 and 147 extends long in the up-down direction and may accommodate a portion of the ball 180a even when the

match plate

130 or 140 is thermally deformed.

If the

match plates

130 and 140 ate moved and mounted, for example, in the X direction, the balls 180a protruding frontward are retracted rearward as the

match plates

130 and 140 compress the elastic members 180b. At the moment when the balls 180a are matched with the

slots

137 and 147 of the

match plates

130 and 140, the balls 180a may protrude frontward and may partially come into the

slots

137 and 147. The ball plungers 180 press the

match plates

130 and 140 frontward while keeping the balls 180a partially inserted into the

slots

137 and 147. Thus, the

match plates

130 and 140 may be prevented from being removed frontward, leftward and the rightward.

Hereinafter, a mounting process of the lower match plate 140 will be described on the basis of the modification illustrated in Fig. 11A and with reference to Figs. 14 to 16.

Referring first to Fig. 14, the lower match plate 140 may be mounted on the front surface of the pressing plate 110 while being moved in the X direction. As the lower match plate 140 is moved in the X direction, the first pin 115 may begin to be inserted into the first guide portion 144-1 of the first engagement groove 144, and the second pin 118 may begin to be inserted into the second guide portion 146-1 of the second engagement groove 146. In this state, the lower match plate 140 may be spaced apart from the first rail 120 in the vertical direction.

Referring next to Fig. 15, as the lower match plate 140 continues to move in the X direction, the first pin 115 may be positioned in the first guide portion 144-1 of the first engagement groove 144, and the second pin 118 may be positioned in the second guide portion 146-1 of the second engagement groove 146. At this time, the lower match plate 140 may move gradually upward due to the X direction movement of the lower match plate 140 and the inclination of the guide portions 144-1 and 146-1, and may approach the first rail 120. Reference symbol “a” indicated in Fig. 15 designates the vertical position of the upper end of the lower match plate 140 in Fig. 14.

Referring finally to Fig. 16, as the lower match plate 140 continues to move in the X direction, the first pin 115 may be positioned in the first seat portion 144-2 of the first engagement groove 144, and the second pin 118 may be positioned in the second seat portion 146-2 of the second engagement groove 146. In this state, the upper end portion of the lower match plate 140 may make contact with the first rail 120. Thus, the thermal deformation of the upper end portion of the lower match plate 140 may be suppressed by the first rail 120. Reference symbol “b” indicated in Fig. 165 designates the vertical position of the upper end of the lower match plate 140 in Fig. 15.

Referring to Figs. 9 and 10, it can be noted that, in the present embodiment, the front side of the first engagement groove 144 is opened in the case of the first bracket 143 while the front side of the second engagement groove 146 is closed in the case of the second bracket 145. In another modification, the front side of the first engagement groove 144 of the first bracket 143 may be closed and the front side of the second engagement groove 146 of the second bracket 145 may be opened. Alternatively, all the

engagement grooves

144 and 146 may be opened, or all the

engagement grooves

144 and 146 may be closed. From the viewpoint of strength of a coupling portion, it may be advantageous that when the entry portions of the guide portions 144-a and 146-1 of the

engagement grooves

144 and 146 among the portions of the

brackets

143 and 145 are coupled to the lower match plate 140, the front side of the second engagement groove 146 is closed as illustrated in Fig. 10 so that the closed portion serves as one kind of reinforcing surface.

The foregoing descriptions have been made on the premise that the lower match plate 140 is mounted from the other side toward one side, namely in the X direction. However, in another modification, the lower match plate 140 may be mounted from one side toward the other side, namely in the ?X direction. In this case, contrary to Fig. 6, the first engagement groove 144 may be opened leftward and may communicate with the outside at the left side, and the second engagement groove 146 may be opened rightward and may communicate with the outside at the right side. In addition, the installation positions and protrusion degrees of the

brackets

143 and 145 and the protrusion degrees of the first and

second pins

115 and 118 may be opposite to those described above.

Fig. 17 is a view illustrating the pressing plate 110 of the test handler according to one embodiment illustrated in Fig. 3, which is viewed from the front side. Fig. 18 is a view for explaining a connection structure of the

shafts

160a and 160b and the pressing plate 110 in the test handler according to one embodiment illustrated in Fig. 3.

As illustrated in Figs. 17 and 18, a plurality of

coupling holes

180a and 180b may be formed in the pressing plate 110. The

shafts

160a and 160b may be positioned at the rear side of the pressing plate 110. The

shafts

160a and 160b may be coupled to coupling members 170 which are positioned at the front side of the pressing plate 110 and which are partially inserted into the

coupling holes

180a and 180b. In the present embodiment, bolts are illustrated as the coupling members 170.

Only the thermal deformation of the

match plates

130 and 140 has been described above. In reality, the pressing plate 110 may also be thermally deformed. In the present embodiment, the

match plates

130 and 140 are uniformly deformed in a vertical symmetry. Thus, the pressing plate 110 may also be uniformly deformed in a vertical symmetry. If the thermal deformation of the pressing plate 110 does not follow the thermal deformation of the

match plates

130 and 140, the through-holes 111 of the pressing plate 110 and the heating medium flow paths 151 of the pushers 150 may be misaligned with each other. Thus, the heating medium may not be smoothly supplied to the electronic components. Furthermore, the pressing plate 110 receives a pressing force from the rear side through the

shafts

160a and 160b. Therefore, if the thermal deformation of the pressing plate 110 is non-uniform, a warp may be generated in the pressing plate 110.

In order to assure uniform thermal deformation of the pressing plate 110, there is a need to allow the pressing plate 110 to be thermally deformed in the radial direction on the basis of the central portion. For example, as illustrated in Fig. 17, one shaft 160a connected to the central portion of the pressing plate 110 cannot make relative movement with respect to the pressing plate 110. This makes it possible to suppress thermal deformation of the central portion of the pressing plate 110. This is because the diameter of the coupling hole 180a of the central portion of the pressing plate 110 is substantially equal to the diameter of the connection portion of the shaft 160a and the coupling member 170. On the other hand, the coupling holes 180b corresponding to the shafts 160b connected to the portions of the pressing plate 110 other than the central portion may be slots extending in the radial direction on the basis of the central portion of the pressing plate 110. This enables the pressing plate 110 and the shafts 160b to make relative movement. Thus, the thermal deformation of the portions of the pressing plate 110 other than the central portion is permitted and the direction of the thermal deformation may be radial on the basis of the central portion of the pressing plate 110. Specifically, in the case of the present embodiment, four shafts 160b may be connected to the pressing plate 110 so as to adjoin the median points of the sides of the pressing plate 110. In this case, the coupling holes 180b corresponding to the four shafts 160b may be slots extending in the vertical direction or the horizontal direction. This enables the pressing plate 110 to be thermally deformed in the up-down direction and the left-right direction. The remaining four shafts 160b may be connected to the pressing plate 110 so as to adjoin the corners of the pressing plate 110. In this case, the coupling holes 180b corresponding to the remaining four shafts 160b may be slots extending in the diagonal direction. This enables the pressing plate 110 to be thermally deformed in the diagonal direction.

Fig. 19 is a side view of a pushing device of a test handler according to another embodiment. Only the portions differing from those of the aforementioned embodiment will be described below. Descriptions on a pressing plate 210 and an upper match plate 130 will be omitted.

An engagement groove 229 may be formed on one surface (a lower surface in the present embodiment) of a first rail 220. In Fig. 19, the engagement groove 229 is illustrated as a T-shaped groove. A projection 249 to be inserted into the engagement groove 229 may be provided in the upper end portion of a lower match plate 240. The projection 249 may be complementary to the engagement groove 229. Thus, in the present embodiment, the projection 249 is also illustrated as a T-shaped projection. Similar to the embodiment described earlier, the lower match plate 240 may be mounted while being moved in the X direction. At this time, the projection 249 may be inserted into the engagement groove 229 from the beginning and may slide in the X direction along the engagement groove 229.

By employing the aforementioned structure, it is possible to maintain the position of the lower match plate 240 with respect to the first rail 220. Since the entire region of one surface (the upper surface in the present embodiment) of the projection 249 is supported by the inner surface of the engagement groove 229, it is possible to greatly enhance the effect of suppressing the thermal deformation of the upper end portion of the lower match plate 240.

In the case of the embodiment described earlier, the lower match plate 140 may be supported by the

pins

115 and 118 in the upper end portion thereof. This structure may be useful in the case where the overall size of the test handler is small too small to form the structure such as the engagement groove 229 in the first rail 120.

Fig. 20 is a perspective view illustrating a locking module 290 of the test handler according to another embodiment illustrated in Fig. 19. The

match plates

230 and 240 may be removed in the left-right direction by a vibration and/or an external impact. In the case where a test is conducted without pushing the

match plates

230 and 240 into the right position in the X direction, the electronic components may be damaged and the test throughput may be reduced. A locking module 290 may be provided in order to prevent the aforementioned problems. Specifically, the locking module 290 may include a body portion 291 coupled to one side of the pressing plate 210, a tab 293 positioned inside the body portion 291 and configured to partially protrude frontward, and a knob 292 connected to the tab 293 through a slot (not illustrated) extending long in the front-rear direction on the outer surface of the body portion 291. After the mounting of the

match plates

230 and 240 is completed, a worker may pull the knob 292 frontward, whereby the tab 293 may protrude frontward. In the case where the

match plates

230 and 240 have been normally mounted, the tab 293 may smoothly protrude frontward without interfering with the

match plates

230 and 240. However, if the

match plates

230 and 240 are not normally mounted, the

match plates

230 and 240 hinder the frontward protrusion of the tab 293. By way of this process, a worker may determine whether the

match plates

230 and 240 have been normally mounted. If a test is conducted in the state illustrated in Fig. 20, the removal of the

match plates

230 and 240 in the left-right direction can be prevented by the tab 293 in spite of a vibration and/or an external impact.

Unlike the configuration illustrated in Fig. 20, a plurality of locking modules 290 may be provided so that each of the locking modules 290 acts against the upper match plate 230 and the lower match plate 240.

Furthermore, the aforementioned content regarding the locking module 290 may be applied to the embodiments described with reference to Figs. 3 to 18. In this case, a plurality of locking modules may be provided so that each of the locking modules acts against the upper match plate 130 and the lower match plate 140, or a single locking module may be provided as illustrated in Fig. 20 so that the locking module simultaneously acts against the upper match plate 130 and the lower match plate 140. In the latter case, due to the existence of the

bases

116 and 119 and the

brackets

143 and 145, the locking module may have a shape differing from that of Fig. 20. For example, the body portion and the tab of the locking module may be bent in a substantially C-like shape and may be installed so as to surround the

bases

116 and 119 and the

brackets

143 and 145. In this state, the tab may protrude frontward with no interference of the

bases

116 and 119 and the

brackets

143 and 145.

Fig. 21 is a front view schematically illustrating a pushing device 300 of a test handler according to a further embodiment.

In the embodiments described above, two

match plates

130 and 140 are employed unlike the prior art. However, the present disclosure is not limited thereto. For example, when electronic components are mounted on a test tray in a matrix form of M×N, 2k pressing plates may be provided so as to deliver a pressing force to the electronic components having a matrix form of M/2k×N. Similarly, 2k first rails may be provided in the central portions of the respective pressing plates so as to extend in the horizontal direction. 2k upper match plates and 2k lower match plates may be provided so as to make contact with the first rails. In this regard, M may be an even number of two or more, and N and k may be a natural number of 1 or more.

Fig. 21 illustrates the pushing device 300 when k is equal to 1. As illustrated in Fig. 21, two

pressing plates

310a and 310b may be provided so as to deliver a pressing force to electronic components having a matrix form of M/2k×N. The

pressing plates

310a and 310b may be spaced apart from each other in the vertical direction (with a gap 312 left therebetween). This is because the

pressing plates

310a and 310b may be thermally deformed. Furthermore, two

first rails

320a and 320b may be provided in a corresponding relationship with the two

pressing plates

310a and 310b. In addition, two

upper match plates

330a and 330b and two

lower match plates

340a and 340b may be provided so as to make contact with the

first rails

320a and 320b, respectively. As a consequence, the two

upper match plates

330a and 330b may cover the electronic components having a matrix form of M/4×N and the two

lower match plates

340a and 340b may cover the electronic components having a matrix form of M/4×N.

Although exemplary embodiments of the present disclosure are described above with reference to the accompanying drawings, those skilled in the art will understand that the present disclosure may be implemented in various ways without changing the necessary features or the spirit of the present disclosure. Therefore, it should be understood that the exemplary embodiments described above are not limiting, but only an example in all respects. The scope of the present disclosure is expressed by claims below, not the detailed description, and it should be construed that all changes and modifications achieved from the meanings and scope of claims and equivalent concepts are included in the scope of the present disclosure.

Claims

A test handler, comprising:

a loading device configured to load electronic components into a test tray;

a test chamber including a tester configured to make close contact with each of the electronic components to conduct a test of each of the electronic components;

a pushing device configured to push each of the electronic components mounted on the test tray toward the tester; and

an unloading device configured to unload each of the electronic components tested in the test chamber from the test tray,

wherein the pushing device includes a pressing plate configured to deliver a pressing force to the electronic components, a first rail disposed in a central portion of the pressing plate so as to extend in a horizontal direction, an upper match plate having a lower end portion configured to make contact with the first rail, a lower match plate having an upper end portion configured to make contact with the first rail, and a plurality of pushers provided in the upper match plate and the lower match plate so as to make contact with the electronic components.
The test handler of claim 1, further comprising:

a second rail provided in a lower end portion of the pressing plate and spaced apart downward from a lower end portion of the lower match plate; and

a third rail provided in an upper end portion of the pressing plate spaced apart upward from an upper end portion of the upper match plate.
The test handler of claim 1, wherein when the electronic components are mounted on the test tray in a matrix form of M×N, each of the upper match plate and the lower match plate matches with the electronic components having a matrix form of M/2×N, where M is an even number of two or more and N is a natural number of one or more.
The test handler of claim 1, wherein an engagement groove is formed in the first rail, and a projection inserted into the engagement groove to maintain a position of the lower match plate with respect to the first rail is provided in the upper end portion of the lower match plate.
The test handler of claim 1, further comprising:

a first pin provided at one side of the pressing plate;

a second pin provided at the other side of the pressing plate;

a first bracket provided at one side of the lower match plate and configured to engage with the first pin; and

a second bracket provided at the other side of the lower match plate and configured to engage with the second pin.
The test handler of claim 5, wherein a first engagement groove into which the first pin is inserted to support the first bracket is formed in the first bracket,

a second engagement groove into which the second pin is inserted to support the second bracket is formed in the second bracket,

the first engagement groove includes a first guide portion configured to guide the lower match plate so that the first pin begins to be inserted into the first engagement groove along with movement of the lower match plate and so that the lower match plate moves up toward the first rail and approaches the first rail, and a first seat portion in which the first pin is positioned when the lower match plate makes contact with the first rail, and

the second engagement groove includes a second guide portion configured to guide the lower match plate so that the second pin begins to be inserted into the second engagement groove along with movement of the lower match plate and so that the lower match plate moves up toward the first rail and approaches the first rail, and a second seat portion in which the second pin is positioned when the lower match plate makes contact with the first rail.
The test handler of claim 5, wherein the first pin protrudes frontward beyond the pressing plate, the second pin does not protrude frontward beyond the pressing plate, the first bracket does not protrude rearward beyond the lower match plate, and the second bracket protrudes rearward beyond the lower match plate.
The test handler of claim 1, further comprising:

a moving body configured to move toward the tester; and

a plurality of shafts configured to interconnect the moving body and the pressing plate,

wherein one of the shafts is connected to a central portion of the pressing plate and configured to suppress thermal deformation of the central portion of the pressing plate, and the remaining shafts are connected to the pressing plate so as to make relative movement with respect to the pressing plate and configured to permit thermal deformation of portions of the pressing plate other than the central portion.
The test handler of claim 1, further comprising:

at least two ball plungers configured to press the upper match plate and the lower match plate frontward,

wherein each of the ball plungers includes a ball having a front portion partially inserted into a slot extending in an up-down direction at a center of the lower end portion of the upper match plate or at a center of the upper end portion of the lower match plate, and an elastic member connected to the pressing plate at one end and to the ball at the other end and configured to elastically bias the ball frontward.