KR20140091797A - Insert for test handler - Google Patents

Abstract

The present invention relates to an insert for a test handler. The present invention discloses a technology capable of aligning a semiconductor device in a seating area of the insert while maintaining the manufacturing costs and imposing little installation conditions by including an X-axis pressing boy and a Y-axis pressing boy with self-elasticity.

Description

INSERT FOR TEST HANDLER}

The present invention relates to an insert of a test tray capable of loading semiconductor elements in a test handler.

The test handler moves semiconductor devices manufactured through a predetermined manufacturing process from a customer tray to a test tray and then tests the semiconductor devices loaded on the test tray by a tester at the same time TEST), and it is a device that moves test trays from the test tray to the customer tray by classifying the semiconductor devices according to the test result, and is already disclosed through a plurality of public documents.

In the test tray, as shown in Korean Patent No. 10-0801927, inserts (INSERT) having a seating space capable of being seated in the form of inserting semiconductor elements are provided. The semiconductor device seated in the seating space of the insert is supported by an injection molded supporting part integrally with the body of the insert, Quot;) is supported by a separately provided film.

Here, the seating space of the insert must be designed to be larger than the maximum tolerance of the outer size of the semiconductor element for proper seating of the semiconductor element.

On the other hand, when semiconductor devices in a wafer state are packaged due to development of integration technology, the number of terminals of semiconductor elements connected to external terminals is increased.

In addition, various packaging technologies such as POP (Package On Package) for making a plurality of semiconductor devices into one package and MCP (Multi Chip Package) for making a plurality of semiconductor devices in a wafer state into one package are being developed .

For this reason, the number of terminals of one packaged semiconductor element is increasing.

Therefore, semiconductor manufacturers try to reduce the size of the terminals and the spacing between the terminals in order to accommodate a large number of terminals within a limited area. As a result, products with a terminal gap of 0.5mm ~ 0.40mm and 0.35mm ~ 0.30mm have been developed and are expected to decrease further in the future. Of course, as the distance between the terminals decreases, the size of the terminals must of course also be reduced. For example, in the BGA type, when the interval between the balls is 0.50 mm, the diameter of the terminal is 0.33 mm, but when the distance between the terminals is 0.35 mm, the diameter of the terminal becomes as small as 0.23 mm.

In addition, the outer size (size) of the packaged semiconductor device is more finely managed. If the distance between the terminals is 0.50 mm, the outer size is managed as 0.10 mm, but if the distance between the terminals is 0.35 mm, the outer size is managed as 0.05 mm ~ 0.10 mm depending on the package type.

Recently, the distance between the terminals is reduced to 0.30 mm, the diameter of the terminal is reduced to 0.20 mm or less, and the outer size tolerance of the semiconductor device is controlled to be less than 0.05 mm.

As described above, the size of the terminals and the interval between the terminals are reduced, and the outer tolerances are closely controlled. Therefore, it is more urgently required to make the electrical contact between the semiconductor element and the socket of the tester be precise.

If the terminal of the semiconductor device and the terminal of the socket of the tester are not precisely matched, there is a problem that the support frame of the socket may damage the terminal or cause a short. However, as mentioned, since the seating space of the insert is formed to be larger than the maximum tolerance of the outer size of the semiconductor element, it is necessary to align the semiconductor element in the seating space of the insert in order to ensure accurate electrical contact between the semiconductor element and the tester will be.

With respect to aligning a semiconductor device in a seating space of an insert, a method of aligning a semiconductor device with an insert seat is disclosed in Korean Patent Laid-Open No. 10-2008-0062970 (entitled " Prior Art 1 " 2008-0062984 (entitled " Test Module using a Test Handler and Test Handler, hereinafter referred to as Prior Art 2).

Incidentally, the variable unit or alignment unit in the prior arts 1 and 2 has a problem in that the structure is complicated and the installation property is deteriorated and the production unit cost is increased.

It is an object of the present invention to provide a technique by which a semiconductor device can be aligned in a seating space of an insert through a simple structure.

According to an aspect of the present invention, there is provided an insert for a test handler, comprising: a body having a seating space in which a semiconductor device is seated, An X-axis pressing body that presses the semiconductor element placed in the seating space of the body in the X-axis direction on the seating surface in the X-Y plane; And a lever device for holding the semiconductor device in the seating space; Wherein the X-axis pressurizing body includes: a stationary end fixed to the body; And a contact end integrally formed with the fixed end, the contact end protruding toward the seating space so as to be in contact with the semiconductor element inserted in the seating space; The contact end is movable by elastic deformation, and presses the semiconductor element with its own elastic force.

A Y-axis pressing body for pressing a semiconductor element placed in a seating space of the body in a Y-axis direction on a seating surface in an X-Y plane; Wherein the Y-axis pressing body includes: a fixed end fixed to the body; And a contact end integrally formed with the fixed end, the contact end protruding toward the seating space so as to be in contact with the semiconductor element inserted in the seating space; The contact end is movable by elastic deformation, and presses the semiconductor element with its own elastic force.

At least one of the X-axis pressing body and the Y-axis pressing body is integrally injection molded into the body.

According to the present invention, since the pressing body can be integrally injection-molded on the body, it is possible to align the semiconductor elements in the seating space of the insert without concern about the installation property or the increase in the production cost.

1 is a schematic plan view of an insert for a test handler according to an embodiment of the present invention.
Fig. 2 is a side elevational view of the insert for the test handler of Fig. 1 viewed from the line AA. Fig.
Fig. 3 is a side elevational view of the insert for the test handler of Fig. 2 viewed from the BB line. Fig.
Fig. 4 is a reference diagram for explaining the operation states of the X-axis pressurizing body and the Y-axis pressurizing body in the insert for the test handler of Fig. 1;

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. For simplicity of description, redundant description is omitted or compressed as much as possible.

For reference, the drawings attached hereto are exaggerated for clarity.

1 is a schematic plan view of an insert 100 (hereinafter abbreviated as an insert) for a test handler according to an embodiment of the present invention.

The insert according to the present embodiment includes a body 110, four X-axis pressing bodies 121 to 124, four Y-axis pressing bodies 131 to 134, and a lever device 141, 142.

The body 110 is formed with a seating space 111 opened in the Z axis direction and a supporting step 112 for supporting the semiconductor device mounted in the seating space 111 at the lower end of the seating space 111 is formed . Of course, it is also preferable that a separate film-like support member is applied instead of the support jaw 112 as in the prior art 2. [

Semiconductor devices (not shown) are inserted and seated in the seating space 111 from the upper side to the lower side and open in the vertical direction.

The four X-axis pressing bodies 121 to 124 press the semiconductor elements seated in the seating space 111 in the X-axis direction (the right direction in FIG. 1) on the seating surface in the X-Y plane. To this end, the X-axis pressurizing members 121 to 124 are integrally injection-molded into the body 110, as shown in FIG. 3, which is seen from A-A in FIG. 1 and B-B in FIG. These X-axis pressing bodies 121 to 124 can be divided into a fixed end FE and a contact end TE fixed to the body 110 side. The fixed end FE is fixed to the body 110 and the contact end TE extends integrally from the fixed end FE and protrudes toward the seating space 111 side. The X-axis pressing bodies 121 to 124 are made of the same plastic material as the body 110, but are thin and therefore have a self-elasticity. Therefore, the movement by the elastic deformation is possible, and the contact end TE can be moved in the X-axis direction. Since the X-axis pressing bodies 121 to 124, which are characteristic structures of the present invention, have a very simple structure that is injection-molded integrally with the body 110, a plurality of X-axis pressing bodies 121 to 124 are balanced on one side wall of the seating space 111 As shown in FIG. Accordingly, when the semiconductor device is seated in the seating space 111 or taken out from the seating space 111 by the picker, it is necessary to generate an elastic force such that the seating and withdrawing operations can be appropriately performed. It is possible to adjust the number of the pressure members 121 to 124 (the number of the pressure members can be adjusted at the time of manufacturing the mold).

Of course, it is ideal to make the distance d from the vertical plane to the reference plane at the contact edge TE in contact with the semiconductor element to be a distance equal to the minimum tolerance of the outer edge length of the semiconductor element, The diameter of the device terminal, and the allowable tolerance of the outer size of the semiconductor device.

The four Y-axis pressing bodies 131 to 134 press the semiconductor element seated in the seating space 111 in the Y-axis direction (downward direction in FIG. 1) on the seating surface in the X-Y plane. The mechanical constructions of these Y-axis pressing bodies 131 to 134 are the same as those of the X-axis pressing bodies 121 to 124, and thus the description thereof will be omitted.

The gripper devices 141 and 142 are provided to hold the semiconductor elements in the seating space 111. [

The operating states of the X-axis pressing bodies 121 to 124 and the Y-axis pressing bodies 131 to 134 will be described by explaining the process of seating the semiconductor elements in the insert 100 having the above structure.

First, when the picker P holding the semiconductor element D comes downward, the left portion of the semiconductor element D is brought into contact with the X-axis pressing bodies 121 to 124 as shown in FIG. 4 (a) do. 4 (b) and 4 (c), when the picker P continuously descends downward, the X-axis pressing members 121 to 124 push the semiconductor element D in the rightward direction The semiconductor device D is aligned with the lower side of the right side wall of the seating space 111 as a reference point. Of course, the Y-axis pressing bodies 131 to 134 function similarly. At this time, since the attracting portion of the picker P is made of a soft elastic material, it is possible to move the semiconductor element D in the rightward direction while being pressed down on the X-axis pressing bodies 121 to 124 while descending downward . 4 (c), the picker P releases its gripping to complete the process of placing the semiconductor device.

In the above-mentioned example, the X-axis pressing bodies 121 to 124 and the Y-axis pressing bodies 131 to 134 are simultaneously provided. However, as described in the patent document 10-2005-45089, In the case of the vertical type handler docked with the tester in a state where the tray is vertically erected, it is also possible not to separately make the Y axis pressing members 131 to 134 because the semiconductor handler moves to the lower surface which is the reference surface of the insert due to the self weight of the semiconductor device. Although a plurality of X-axis pressing bodies 121 to 124 and Y-axis pressing bodies 131 to 134 are provided in this example, it is also possible to provide the X-axis pressing body and the Y-axis pressing body large in the X- It is possible.

In addition, although it has been described in the present embodiment that the pressurizing body is integrally injection-molded, it is also conceivable to separately manufacture and pressurize the pressurizing body with a thin metal piece or the like.

Although the present invention has been fully described by way of example only with reference to the accompanying drawings, it is to be understood that the present invention is not limited thereto. It is to be understood that the scope of the invention is to be construed as being limited only by the following claims and their equivalents.

100: Insert
110: Body
111: seat space
121 to 124: X-axis pressing body
FE: fixed end TE: contact end
131 to 134: Y-axis pressing body
141, 142:

Claims (4)

A body having a seating space in which a semiconductor element can be seated is formed so that at least one side thereof is opened in the Z-axis direction;
An X-axis pressing body for pressing a semiconductor element placed in a seating space of the body in an X-axis direction on a seating surface in an XY plane; And
A lapping device for holding a semiconductor element in the seating space; Lt; / RTI >
The X-
A fixed end fixed to the body; And
A contact end formed integrally with the fixed end and protruding toward the seating space so as to be in contact with the semiconductor element inserted in the seating space; / RTI >
Wherein the contact end is movable by elastic deformation and presses the semiconductor element with its own elastic force
Insert for test handler. The method of claim 1, wherein
A Y-axis pressing body which presses the semiconductor element placed in the seating space of the body in the Y-axis direction on the seating surface of the XY plane; Further comprising:
The Y-
A fixed end fixed to the body; And
A contact end formed integrally with the fixed end and protruding toward the seating space so as to be in contact with the semiconductor element inserted in the seating space; / RTI >
Wherein the contact end is movable by elastic deformation and presses the semiconductor element with its own elastic force
Insert for test handler. 3. The method of claim 2,
Wherein at least one of the X-axis pressing body and the Y-axis pressing body is integrally injection-molded on the body
Insert for test handler. The method according to claim 1,
Wherein the X-axis pressing body is integrally injection-molded on the body
Insert for test handler.

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