KR20080044002A - Semiconductor device test system - Google Patents

Abstract

A semiconductor device test system is provided to reduce a test time of the semiconductor devices by performing tests on plural semiconductor devices at the same time. A handler(200) mounts a predetermined number of semiconductor devices on a test board, classifies the semiconductor devices according to test results, and stacks the tested semiconductor devices. A test room(400) heats up or cools down the semiconductor device to a predetermined test temperature, while the test boards are stacked. A test board elevator(300) receives the test boards, transfers the test boards with the semiconductor devices to the test room, and conveys the tested test boards to the handler. A test head(500) includes connector pieces and a tester. The connector pieces are mated with corresponding connector pieces of the test board. The testers are connected to the test boards one by one. The test is performed on the semiconductor device mounted on the test board.

Description

Semiconductor device test system

1 is a perspective view showing the overall configuration of a conventional semiconductor device test system,

Figure 2 is a perspective view showing the structure of a handler in a conventional semiconductor device test system,

3 is a plan view showing the structure of a handler in a semiconductor device test system of the present invention;

4 is a schematic cross-sectional view illustrating an individual semiconductor device soke structure of a test board in FIG. 3;

5 is a perspective view schematically showing the overall structure of a semiconductor device test system of the present invention;

6 is a plan view schematically showing the overall structure of a semiconductor device test system of the present invention;

7 is a perspective view schematically illustrating a structure of a test unit in the semiconductor device test system illustrated in FIG. 6;

8A and 8B are flowcharts illustrating an operation process of the semiconductor device test system of the present invention.

*** Explanation of symbols for the main parts of the drawing ***

10: high fix board, 20: test head,

110: handler body, 120: stacker,

120a: user tray, 121: user tray supply unit,

121a: auxiliary supply unit, 122: user tray shipping unit,

123: multi stacker, 128: secondary shipping unit,

131: loading side set plate, 132: unloading side set plate,

140: transfer arm, 141: first sensor,

142: second sensor, 150: test tray,

151: insert,

160: loading side tray alignment station, 161: first tray inverting unit,

162: inner chamber, 163: test chamber,

164: desequence chamber, 165: second tray inverting portion,

166: unloading side tray alignment station, 167: sorter table,

200: handler, 210: user tray loading unit,

211: inspection standby tray loading section, 212: good quality tray loading section,

214: defective tray stacker, 216: retest tray stacker,

218: ball tray loading section, 220: X-axis robot,

225: Y axis robot, 230L, 230R: DC tester,

240L, 240R: test board, 241: device socket,

241a: board | substrate part, 241b: board | substrate part terminal piece,

241c: socket wall, 241d: fixing bolt,

241e: release lever, 241f: bolt fastener,

300: test board lift / loader, 310, 320: test board loading section,

400: test room, 410L, 410R: temperature control unit,

420L, 420R: automatic door, 430L, 430R: test chamber,

500: test head, 510L, 510R: ventilator,

520L, 520R: Tester

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device test system, and in particular, the present invention employs a test board having a connector piece in which a plurality of test terminal pieces are arranged side by side, so that the test can be made in contact with the test board in the horizontal direction, and thus It relates to a semiconductor device test system that takes up space and allows a large number of semiconductor devices to be tested simultaneously.

As is well known, a semiconductor device (hereinafter, simply referred to as a device) manufactured through a predetermined assembly process in the manufacturing process of various semiconductor devices is finally subjected to a test process for checking whether a specific function is performed.

1 is a perspective view showing the overall configuration of a conventional semiconductor device test system. As shown in FIG. 1, the overall configuration of a conventional semiconductor device test system is largely performed by carrying a test head 20 for testing a semiconductor device and a predetermined number of semiconductor devices so that the test is performed and the semiconductor devices according to the test results. A high resolution (HIFIX) board 10 interposed between the handler 110 and the test head 20 and the handler 110 for classifying and loading by grade to establish an electrical connection between the semiconductor device and the test head 20. It may be made, including. That is, a semiconductor device and a high resolution board seated in an insert on a test tray in a state where the high fix board 10 having the (m * n) matrix sockets is aligned with the test site of the handler 110. By the sockets on (10) contacting each other, (mxn) semiconductor devices are tested simultaneously. Therefore, it is common to determine the size of the test unit and the test tray in accordance with the standard of the high-fix board 10, and among the specifications of the test unit and the test tray, the size of the test unit in particular determines the maximum throughput per hour of the test handler 110. It is an important factor in determining.

2 is a perspective view illustrating a structure of a handler in a conventional semiconductor device test system. As shown in FIG. 2, the conventional test handler may include a handler body 110 and a stacker 120 installed at a front portion of the handler body 110. In this configuration, the stacker 120 includes a plurality of user trays 120a in which a plurality of user trays 120a containing devices to be tested are loaded, and a plurality of user trays 120 containing semiconductor devices that have been tested and sorted according to grades. It is divided into a multi-loading unit 123 capable of storing the user tray shipping unit 122 and various types of user trays 120a to be stored.

The auxiliary supply unit 121a is disposed under the user tray supply unit 121, and when the user tray 120a loaded in the user tray supply unit 121 is exhausted, the auxiliary supply unit 121a always supplies a new user tray 120a. It is possible to continue to supply the user tray without stopping the operation of the handler body 110. In addition, in the user tray shipping unit 122, the auxiliary shipping unit 128 is disposed in the lower portion in the same structure as the auxiliary supply unit 121a, and the user tray 120a, which is finished loading in the user tray shipping unit 122, is stored in the auxiliary shipping unit ( Descend to 128). The multi stacker 123 is provided on the side of the stacker 120. The multi stacker 123 includes seven types of user trays 120a in a space in which one kind of user tray 120a can be loaded. Multiple loading units are installed for storage.

On the other hand, the stacker 120, the upper side of the handler body 110 and a number of loading side set plate 131 which is a waiting place of the user tray (120a) containing the device to be tested and the ball for sorting the devices sorted by grade Several unloading side set plates 132, which are waiting places for trays, are arranged. Therefore, the user tray 120a containing the device to be tested in the user tray supply unit 121 is sequentially moved to the loading side set plate 131 by the transfer arm 140. That is, the transfer arm 140 descends to the user tray supply unit 121 and detects to what height the user tray 120a is loaded, and when detecting the approximate position by the first sensor 141 mounted on the side. Descends quickly. When the first sensor 141 senses it, the second sensor 142 installed on the upper surface of the first sensor 141 detects and picks the user tray 120a accurately and moves to the loading side set plate 131. In addition, when the device is filled in the empty tray located on the loading side set plate 131, the transfer arm 140 serves to move it to the loading portion of the user tray shipping portion 122.

The test handler is also provided with a plurality of test trays 150 arranged to move along the test operation direction of the handler body 110. The test tray 150 is initially located in the loading side tray alignment station 160 where it is transported and loaded with a plurality of devices to be tested. One test tray 150 accommodates a plurality of devices, for example 64 devices. On the other hand, the cartesian robot (not shown) for the loader is a user located on the loading side set plate 131 while continuously and repeatedly moving between the loading side set plate 131 and the loading side tray alignment station 160. The device is picked from the tray 120a and transferred to the test tray 150. The cartesian robot for the loader includes a hand (not shown) for picking a plurality of devices, for example, 16 devices in one operation. On the test operation direction of the handler body 110, the first tray inverting unit 161 and the soak chamber 162, the test chamber 163, the de-soak chamber 164 and the second A tray inverting portion 165, an unloading side tray alignment station 166, and a sorter table 167 are provided. The first tray inverting unit 161 is to vertically erect the test tray 150, which has been transported and loaded by the plurality of devices 156, from the loading side tray alignment station 160 to be supplied to the inner chamber 162.

Meanwhile, the inner chamber 162 receives the test tray 150 which is vertically set up by the first tray inverting unit 161 and heats the device 156 to a test temperature condition while moving the device 156 to a predetermined step from the front to the back. Cool. To this end, a lower part of the inner chamber 162 is equipped with a heater for heating and a cooling device for cooling, and a conveying device made of a cylinder for horizontal movement. Since the transfer of the test tray 150 in the inner chamber 162 is provided with an insert (not shown) for supporting the device 156 in each receiving groove provided in the test tray 150, the test tray 150 is provided. Is vertically placed, the device 156 is not released from the test tray 150. On the other hand, the test tray 150 discharged from the inner chamber 162 is mounted on the guide bar (not shown) vertically arranged in two rows of upper and lower pushers coupled to the moving shaft (not shown) and the moving means (not shown). It moves to the test head 20 while pushing the upper and lower test trays 150 (not shown), and at the same time, has an indexing mechanism for discharging the test trays 150 which have been tested. The test chamber 163 maintains the test tray 150 supplied in the two rows of vertical arrangement as described above heated or cooled to the temperature of the test condition, and receives the test tray 150 in this state to receive the test. A plurality of, for example, 128 devices 156 and the test head 20 in the tray 150 are electrically connected to each other so that the test is performed. That is, the test head 20 and the test tray 150 are vertically docked so that, for example, 128 devices 156 may be simultaneously tested in one test operation.

The test chamber 163 has a rectangular enclosure shape, and is provided with a duct (not shown) formed with an inlet (not shown) through which air that is air-conditioned from an external air conditioning apparatus is introduced upwards, and installed in front of the duct. It is provided with the match plate (not shown) which became movable back and forth by the cylinder.

On the other hand, according to the conventional tester handler, because the test tray 150 is transferred in a vertical position, the test head 20 is installed outside the handler body 110, the handler in the conventional way the head docked horizontally By using the space occupied by the main body 110 as a space of the stacker 120, the auxiliary supply unit 121a and the auxiliary shipping unit 128 may be disposed. Subsequently, the de-chamber chamber 154 receives the test trays 150 supplied from the test equipment in a single row again, and transfers the test trays 150 to a predetermined step from the rear to the predetermined stages at room temperature. Reduce. In this case, the temperature is reduced by heating with a heater in the case of a cooled device and reduced by external air blowing in the case of a heated device. For this purpose, although not shown in the drawings, a heater and a fan are mounted therein. The second tray inverting unit 165 has the same configuration as the first tray inverting unit 161 and transfers the test tray 150 in a direction opposite to the first tray inverting unit 161. Therefore, the test tray 150 discharged from the desorption chamber 164 is horizontally laid again. Therefore, the test tray 150 horizontally divided by the second tray inverting unit 165 is transferred to the unloading side tray alignment station 166 and positioned. The sorter table 167 sorts and temporarily stores the devices on the test tray 150 located in the unloading side tray alignment station 166 according to their class. When the device is filled in the empty tray located on the unloading side set plate 132 by the above process, the corresponding empty tray is transferred to the tray stacking unit corresponding to the user tray shipping unit 122 by the transfer arm 140. Is moved. In addition, although not shown in the drawings in detail, the test handler includes a transfer mechanism for moving the test tray 150 to the loader region, the inner chamber 162, the test chamber 163, the descheduling chamber 164, and the tray alignment station. And a main controller in which a driving source thereof and a device for controlling the devices are embedded. Hereinafter, the configuration shown in FIG. 2 is described in detail in Korean Patent Registration No. 553992, and further description thereof will be omitted.

However, according to the conventional semiconductor device test system as described above, the test tray is in contact with the test head with the test tray in a vertical position. For this purpose, a test tray having a complicated structure for inverting the test tray in the horizontal state to the vertical state is inverted. There is a problem that not only a mechanism is required, but also a large space is required. Furthermore, since only two test trays can be tested at a time, the space utilization efficiency is notably low, and the time required for testing the same number of devices is relatively long.

In addition, there is a problem in that the volume of the test handler becomes large because the inner chamber, the desock chamber, and the test chamber should be provided separately.

First of all, according to the conventional semiconductor device test system, when the number of pins or the spacing of the semiconductor device to be tested changes, as described above, the relatively expensive high fix board, the test tray, and the match plate need to be replaced all at once. And, in order to test the devices produced in small quantities in multiple varieties, there is a problem in that it takes a lot of costs because the above devices must be provided by type.

The present invention has been made to solve the above-described problems, by adopting a test board having a connector piece arranged in parallel with a plurality of test terminal pieces to be in contact with the test board in the horizontal direction, thereby allowing a small space It aims to provide a semiconductor device test system that can simultaneously test a large number of semiconductor devices.

Another object of the present invention is to reduce the cost by adopting a test board having a connector piece in which a plurality of test terminal pieces are arranged side by side in place of relatively expensive semiconductor device pickup, test tray, match plate and high fix board. To provide a semiconductor device test system.

The semiconductor device test system of the present invention for achieving the above object consists of a printed circuit board provided with a plurality of sockets arranged in a matrix form and the printed wiring connected to each terminal provided in each of the sockets of the printed circuit board The test board is configured by adopting the test board concentrated in the form exposed side by side in the connector part formed in place, and put a certain number of semiconductor devices in the test board to perform the test and classify the devices according to the test result. A handler for sorting and loading; A test room for cooling or heating the semiconductor device to a predetermined test temperature in a state in which a plurality of the test boards are horizontally stacked vertically; A test board lifter / loader for loading a plurality of the test boards, transferring the test boards containing semiconductor devices to the test room, and returning the test boards after the test is completed to the handlers, and connector pieces of the test boards. And a test head having a connector piece which is docked with the test board loaded in the test room and docked one-to-one with a test head for performing the present test on the semiconductor device contained in the test board.

In the above configuration, it is preferable that the handler, the test board lift / loader, the test room, and the test head are arranged in a plurality of rows so as to simultaneously process the test board by a plurality of left and right rows.

Furthermore, the test room preferably comprises a plurality of test zones, each of which is independently sealed and temperature controlled.

On the other hand, the handler is disposed in the front portion of the user tray stacking a plurality of user trays are stacked; A test board loading unit disposed in front of the user tray loading unit and configured to seat the test board; It may include an X-axis robot and a Y-axis robot to move the semiconductor device contained in the user tray to each socket of the test board or to move the semiconductor device contained in each socket of the test board to the user tray. In this configuration, the handler is installed adjacent to the test board loading portion and electrically connected to the terminals of each socket of the test board, the DC tester for performing a DC voltage test on the semiconductor device contained in the test board and the It is preferable to have a preheating function for preheating the test board loaded in the test board loading unit. The user tray stacking unit may include: an inspection standby tray stacking unit in which a user tray which is waiting for a test is loaded; A good quality tray mounting portion containing a semiconductor device judged as good quality; And a blank tray stacking portion in which a semiconductor device determined as defective is contained, and a blank tray stacking portion in which an empty user tray is loaded.

On the other hand, the test board lift / load is preferably equipped with a good quality test board loading unit for loading a good quality test board and a bad quality test board loading unit for loading a defective test board.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the semiconductor device test system of the present invention.

3 is a plan view showing the structure of a handler in a semiconductor device test system of the present invention. As shown in FIG. 3, in the semiconductor device test system of the present invention, the handler 200 is largely disposed at the front of the apparatus, and includes a user tray stacker 210 and a user tray stacker 210 in which a plurality of user trays are stacked. A test board loading part (the test board in the drawing) is disposed in front of the) and the test board (Test Board; newly adopted according to the present invention hereinafter referred to as 'TB') 240L and 240R is seated. Lower surface), adjacent to the test board loading unit, preferably disposed outside the DC tester 230L, 230R and the user tray to perform a DC voltage test of the test board 240L, 240R A two-axis robot, that is, an X-axis robot 220 and a Y-axis robot 225, which moves to each socket 241 or moves a device inserted into the socket 241 of the test boards 240L and 240R to the user tray. It can be made, including).

In the above-described configuration, the user tray stacking unit 210 includes an inspection standby tray stacking unit 211 in which a plurality of user trays containing devices to be tested are loaded, and devices which are determined to be good or defective, respectively, as a result of the test being completed. Good quality tray stacking unit 212, where a large number of user trays are stacked, a defective tray stacking unit, a retest tray stacking unit 216 on which a user tray containing devices to be retested are loaded, and empty user trays are stacked. It can be made by including a ball tray loading section 218. In this embodiment, three rows of the inspection standby tray stacking unit 211, the good quality tray stacking unit 212, the defective tray stacking unit 214, the retest tray stacking unit 216, and the empty tray stacking unit 218, respectively. The structure of allocating three columns, one column, one column, and one column is illustrated, and in each column, a plurality of user trays may be stacked with layers.

The DC testers 230L and 230R simply check for defects or incorrect insertion by applying a DC voltage to each device inserted into the test boards 240L and 240R before performing this test. Each test board 240L, 240R is in electrical contact with the DC testers 230L, 230R so that each test board 240L, 240R is seated in the test board loading section. DC voltage test can be performed. On the other hand, the test board loading unit and the DC tester (230L), (230R) 2 each on the left and right to increase the number of devices that can be tested at a time by reducing the transfer waiting time to the test board (240L, 240R) Can be arranged in rows.

The X-axis robot 220 and the Y-axis robot 225 picks a device from the user tray and transfers it to the test board while continuously and repeatedly moving between the user tray and the test board placed in the test board loading unit. The robot 220 and the Y-axis robot 225 may include a hand (not shown) that picks a plurality of devices, for example, 16 devices in one operation. In this case, it is preferable to transfer and load the same number of devices simultaneously to each of the test boards 240L and 240R placed on the left and right test board loading units. When the transfer of all the devices contained in the uppermost inspection waiting user tray 211 is completed in this manner, the user tray is transferred to another place, for example, the empty tray loading part 218, by a transfer mechanism not shown. , The user tray loaded on the lower floor is raised to the uppermost floor of the inspection-waiting user tray loading unit 211 by a lifting mechanism (not shown).

On the other hand, the test board according to the present invention may be made of a printed circuit board, the printed circuit board is provided with a plurality of sockets (241) arranged in a (m * n) matrix, each provided in each socket 241 The printed wirings connected to the terminals are concentrated in a form exposed side by side to the straight connector piece 242 which is formed in place on the printed circuit board, for example, at the top. Furthermore, the connector piece 242 is preferably formed thicker than the printed circuit board to ensure contact. Here, assuming that the number of sockets 241 is 32, for example, and 50 terminals are formed in each socket 241, the number of terminals arranged in the connector piece 242 will be 1,600 in total. . With this structure, the connector piece (which can function as a male connector) can be connected to the connector piece (which can be a female connector) of the test head without inverting the test boards 240L and 240R. This test can be performed by combining in the horizontal direction, thus taking up less space and simultaneously testing a relatively large number of test boards.

4 is a schematic cross-sectional view illustrating an individual semiconductor device socket structure of a test board in FIG. 3. As shown in FIG. 4, the socket 241 structure of each semiconductor device of the test board of the present invention is a terminal piece exposed from the device, for example, a terminal piece of a BGA (Ball Grid Array) type (hereinafter referred to as a device). Insertion of the device around the terminal piece 241b of the substrate portion 241a of the printed circuit board provided with a terminal piece (hereinafter referred to as a “board portion terminal piece”) contacted in one-to-one correspondence with the side terminal piece " The socket wall 241c for guiding and fixing the bolt is fixed by the bolt 241d.

In the above-described configuration, a detachable lever 241e is provided on the upper end of the socket wall 241c to press the inserted device so that the device side terminal piece is in electrical contact with the board portion terminal piece 241b. On the other hand, as described above, the board portion terminal piece 241b is arranged side by side with the connector piece 242 while being connected by the internal printed wiring of the printed circuit board. In the figure, 241f represents a nut hole to which the bolt 241d is fastened. With this structure, when the device is inserted into all the sockets 241 of one test board, all the detachable levers 241e provided in the sockets 241 one-to-one are simultaneously closed by a detachment mechanism (not shown), and the device side terminal piece and The test is performed in a state in which the board portion terminal piece 241b is electrically contacted.

5 is a perspective view schematically showing the overall structure of the semiconductor device test system of the present invention, FIG. 6 is a plan view schematically showing the overall structure of the semiconductor device test system of the present invention, and FIG. 7 is a semiconductor device test system shown in FIG. Is a perspective view schematically showing the structure of a test unit.

As shown in FIGS. 5 to 7, the overall structure of the semiconductor device test system of the present invention includes a test head 500 for performing the present test on a semiconductor device, a predetermined number of devices on a test board 240L, and 240R. ) Is placed in front of the handler 200, the handler 200 for classifying and loading the devices according to the grade according to the test results, and a plurality of test boards 240L and 240R are stacked. The test board lifts the test boards 240L and 240R containing the device to a test room 400 which will be described later, and returns the test board, which has been completed, to the test board loading unit of the handler 200. Diva in the state of loading the test boards 240L, 240R, which are disposed in front of the loading / unloading machine 300 and the test board lifting / loading machine 300, and are transferred through the test board lifting / loading machine 300. Connector pieces of a plurality of test boards 240L and 240R disposed in front of the test room 400 and the test room 400 that cool or heat the teeth to a predetermined test temperature and loaded in the test room 400 ( And a test head 500 docked at 242 to perform this test.

In the above-described configuration, the test board lift / loader 300 may also be configured in two rows for the purpose of setting the test board loading portion of the handler 200 in two rows, for example, a test board at the beginning of each row outside the row. After the role of the supply unit and the initial test board supply is terminated, it will serve as a bad test board stockpile. The test board lift / loader 300 transfers the test boards 240L and 240R to the test board loading unit of the handler 200 as described above, and again transfers the test boards 240L and 240R containing the device. The test board loading unit sequentially transfers to the predetermined slot of the test room 400 (to be described later), and transfers the test boards 240L and 240R, which are completed in the test room 400, to the test board loading unit. The function may be automatically performed by a control mechanism not shown.

The test room 400 is largely attached to the plurality of test chambers 430L and 430R and the test chambers 430L and 430R in which the present test is performed, and thus the internal temperature of the test chambers 430L and 430R is determined. Temperature control unit 410L, 410R to maintain a desired test temperature can be made. In the above-described configuration, the test chambers 430L and 430R may also be divided into two rows by the partition wall in the sense that the test board loading portion of the handler 200 is two rows, each test chamber 430L, In the 430R, a plurality of slots in which each of the test boards 240L and 240R are disposed are spaced apart so that the test boards 240L and 240R may be stacked in the horizontal direction. In addition, each row of test chambers 430L, 430R is also partitioned into an upper test chamber and a lower test chamber by a partition so that predetermined small units, for example 12 test boards, can be tested independently of other test boards. (Hereinafter, each of the small partition spaces thus partitioned may be referred to as a 'test zone'). In the embodiment of FIG. 5, a test room 400 having four test zones functioning independently is illustrated. . On the other hand, the heating control part and cooling fan which are not shown in figure are provided in each temperature control part 410L, 410R. In the drawings, reference numerals 420L and 420R denote automatic doors for automatically opening and closing the respective test chambers 430L and 430R.

Finally, the test head 500 is provided with a number corresponding to the total number of slots in the test room 400 is docked one to one for each test board (240L, 240R) to perform a plurality of testers (Board) 520L, 520R and the testers 520L, 520R may be made to include a ventilator 510L, 510R for ventilating the interior space is installed, each tester (520L), ( 520R is provided with as many terminal pins as the number of terminal pins provided on the connector pieces 242 of the test boards 240L and 240R. In this test, the connector pieces 242 of the test boards 240L and 240R are provided. The connector piece (not shown) which is docked at and disconnected from this test when this test is complete | finished is provided. Finally, reference numeral 600 denotes a computer that receives test results from the testers 520L and 520R, performs various types of analysis, and informs the user of the results.

8A and 8B are flowcharts illustrating an operation process of the semiconductor device test system of the present invention. As shown in FIG. 8, in step S2, the TB loaded on the test board lift / loader 300 is transferred to the test board loading unit. Next, in step S4, the X-axis robot 220 and the Y-axis robot 225 are driven to insert an appropriate number, for example, four or eight devices into the TB socket 242 at a time from the user tray. Later, DC test is performed by applying DC voltage to the device.

Next, in step S8, as a result of the DC test performed in this way, it is determined whether there is a bad device. If there is, the process proceeds to step S9 to remove the bad device, replaces and transfers the new device, and then returns to step S6. If not, the flow advances to step S10 to determine whether device loading is terminated in all sockets 242 (32, 64, 128, etc.) of the TB. As a result of the determination in step S10, when the stacking of all devices is finished, the process proceeds to step S12 again, and the TB where the device stacking is completed is inserted into the predetermined slot of the test room 400 through the test board lift / loader 300. In step S14, the inserted TB is directly subjected to a DC test and a predetermined pretest to check whether there is a problem in the process of inserting the TB into the slot. As a result of the determination in step S10, when the stacking of all devices is not finished, the process returns to step S4.

Next, in step S16, it is determined whether the loading of TB has ended for all slots in any test zone. If it is not finished, the process returns to step S4, in which case, the process proceeds to step S18 to determine whether a bad device exists. To judge. As a result of the determination in step S18, if there is a bad device, the process proceeds to step S20 to return the TB to the test board loading unit and replaces the bad device with a new device, and then returns to step S4 while the bad device exists. If not, the process proceeds to step S22 to seal the finished test zone by the automatic doors 420L and 420R, and then operates the temperature controllers 410L and 410R to maintain the room temperature at the test temperature. Let's do it.

Next, in step S24 and step S26, various main tests are performed while the connector piece 242 of TB is docked to the connector pieces of the testers 520L and 520R. In step S28, it is determined whether the main test is completed. . As a result of the determination in step S28, if the present test is not finished, the process returns to step 26. If the test ends, the process proceeds to step S30. The connector piece 242 of TB is replaced with the connector pieces of the testers 520L and 520R. And the temperature control section 410L, 410R is operated again to reduce the test zone to room temperature. In this way, the TB reduced to room temperature in the test zone is sequentially transferred to the test board loading unit in step S34. Next, in step S36, it is determined whether the device is defective according to the test result, and each device is classified into a good or bad device and then transferred to the corresponding user tray loading unit.

On the other hand, in step S38, it is determined based on the test cumulative information whether the corresponding socket 242 of the TB is continuous failure and whether the number of sockets determined as continuous failure is equal to or greater than a predetermined reference value. As a result of the determination in step S38, when there is a socket determined to be continuous failure, mask information is recorded so as not to use the socket afterwards, and when TB in which the number of defective sockets exceeds the reference value exists, step S40. The TB is transferred to the defective TB stack of the test board lift / loader and then loaded with a new TB.

Next, in step S42, it is determined whether all the TBs have been exhausted. In the case of exhaustion, the TB loaded on the good TB loading part of the test board lifter / loader is transferred to the loading part to prepare for a new test. Next, in step S46, it is determined whether or not this test has been completed. If not, the process returns to step S4, whereas in case of completion, the empty TB is transferred to a designated slot of the test zone to prepare for the next test. Will end. As described above, in the semiconductor device test system of the present invention, the TB is not transferred from the test board lift / loader at the start of the next lot, but the TB is waiting in the corresponding slot of the test zone to start a new procedure from step S6. As described above, according to the semiconductor device test system of the present invention, since the test room is partitioned into a plurality of test zones, independent testing of each test zone is possible, thereby greatly improving the operating efficiency of the test system. .

The semiconductor device test system of the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea of the present invention. For example, the handler, test board lift / loader, and test room shown separately in the above-described embodiments are merely functional divisions, and all of them are installed integrally in the handler body or only the test board lift / loader and the test room are integrated with each other. Could be

According to the semiconductor device test system of the present invention as described above, by adopting a test board having a connector piece in which a plurality of test terminal pieces are arranged side by side, it is possible to test by contacting the test board in the horizontal direction, It can take up space and test a large number of semiconductor devices simultaneously.

Furthermore, cost reduction can be achieved by adopting a test board having a connector piece in which a plurality of test terminal pieces are arranged side by side in place of relatively expensive semiconductor device pickup, test tray, match plate, and high fix board.

In addition, since the test room is partitioned into a plurality of test zones, independent testing is possible for each test zone, thereby greatly improving the operational efficiency of the test system.

Claims (8)

It consists of a printed circuit board provided with a plurality of sockets arranged in a matrix form, and the printed wiring connected to each terminal provided in each of the sockets is concentrated in a form exposed side by side to the connector formed in place on the printed circuit board. Adopt and configure the test board, A handler for placing a predetermined number of semiconductor devices on the test board to perform the test and classifying and classifying the devices according to the test results according to the test results; A test room for cooling or heating the semiconductor device to a predetermined test temperature in a state in which a plurality of the test boards are horizontally stacked vertically; A test board lift / loader for loading a plurality of the test boards, transferring the test boards containing semiconductor devices to the test room, and returning the test boards after the test is completed to the handler; A test head having a connector piece docked with a connector piece of the test board and a tester docked one-to-one with the test board loaded in the test room to perform the test on the semiconductor device contained in the test board. Semiconductor device test system comprising a. The method of claim 1, And the handler, the test board lifter / loader, the test room, and the test head are arranged in a plurality of rows so as to simultaneously process the test boards by a plurality of left and right rows. The method of claim 2, And said test room comprises a plurality of test zones each of which is independently sealed and temperature controlled. The method according to any one of claims 1 to 3, The handler is disposed in the front portion of the user tray stacking a plurality of user trays; A test board loading unit disposed in front of the user tray loading unit and configured to seat the test board; And a X-axis robot and a Y-axis robot for moving the semiconductor device contained in the user tray to each socket of the test board or the semiconductor device contained in each socket of the test board to the user tray. Semiconductor device test system. The DC circuit of claim 4, wherein the handler is installed adjacent to the test board loading unit and electrically connected to a terminal of each socket of the test board to perform a DC voltage test on the semiconductor device contained in the test board. A semiconductor device test system, further comprising a tester. The method of claim 4, wherein the test accumulate information to determine whether the corresponding socket of the test board is a continuous failure, if the continuous failure to record the mask information of the socket to prevent the subsequent use, When the continuous failure exceeds a predetermined threshold value, the test board is transferred to the test board lift / loader's defective test board stockpile, and the test board that lacks the test board is generated and the test board lift / loader's loading test board Semiconductor device test system, characterized in that the loading and use in the stockpile. The apparatus of claim 4, wherein the user tray stacking unit comprises: an inspection standby tray stacking unit in which a user tray in a test waiting state is loaded; A good quality tray mounting portion containing a semiconductor device judged as good quality; A defective tray stacking portion containing a semiconductor device judged as defective; A semiconductor device test system comprising an empty tray stacking unit on which an empty user tray is stacked. The semiconductor device test system according to claim 4, wherein the test board lifter / loader comprises a good quality test board loading part for loading a good quality test board and a bad quality test board loading part for loading a defective product test board.

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