KR20130069574A - 경화성 조성물 - Google Patents
경화성 조성물 Download PDFInfo
- Publication number
- KR20130069574A KR20130069574A KR1020127027198A KR20127027198A KR20130069574A KR 20130069574 A KR20130069574 A KR 20130069574A KR 1020127027198 A KR1020127027198 A KR 1020127027198A KR 20127027198 A KR20127027198 A KR 20127027198A KR 20130069574 A KR20130069574 A KR 20130069574A
- Authority
- KR
- South Korea
- Prior art keywords
- component
- groups
- light
- curable composition
- cycloaliphatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/50—Improvements relating to the production of bulk chemicals
- Y02P20/582—Recycling of unreacted starting or intermediate materials
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Epoxy Resins (AREA)
- Polyethers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
- Polymerisation Methods In General (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP10161452 | 2010-04-29 | ||
| EP10161452.7 | 2010-04-29 | ||
| PCT/EP2011/051907 WO2011134686A1 (en) | 2010-04-29 | 2011-02-09 | Curable composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20130069574A true KR20130069574A (ko) | 2013-06-26 |
Family
ID=42226468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020127027198A Withdrawn KR20130069574A (ko) | 2010-04-29 | 2011-02-09 | 경화성 조성물 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US20130203882A1 (https=) |
| EP (1) | EP2563862A1 (https=) |
| JP (1) | JP5736033B2 (https=) |
| KR (1) | KR20130069574A (https=) |
| CN (1) | CN102971382B (https=) |
| CA (1) | CA2796076A1 (https=) |
| MA (1) | MA34165B1 (https=) |
| SG (1) | SG185053A1 (https=) |
| TW (1) | TWI509025B (https=) |
| WO (1) | WO2011134686A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017039159A1 (ko) * | 2015-08-31 | 2017-03-09 | 삼성에스디아이 주식회사 | 저온 경화 조성물, 그로부터 형성된 경화막, 및 상기 경화막을 갖는 전자 장치 |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2383817A1 (en) * | 2010-04-29 | 2011-11-02 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Light-emitting device and method for manufacturing the same |
| US9617449B2 (en) * | 2012-06-12 | 2017-04-11 | Korea Advanced Institute Of Science And Technology | Siloxane hard coating resin |
| US10858539B2 (en) | 2012-06-12 | 2020-12-08 | Korea Advanced Institute Of Science And Technology | Siloxane hard-coating resin composition |
| US20140057115A1 (en) * | 2012-08-22 | 2014-02-27 | The Walman Optical Company | Coating composition and method |
| KR101405532B1 (ko) * | 2013-10-29 | 2014-06-20 | 주식회사 네패스신소재 | 에폭시 수지 조성물 및 이를 포함하는 광반도체 장치 |
| EP3486286B1 (en) * | 2013-12-26 | 2020-05-13 | Daicel Corporation | Curable composition for lens, lens and optical device |
| EP3112389B1 (en) * | 2014-02-28 | 2019-06-05 | Daicel Corporation | Curable composition, cured product thereof, and wafer level lens |
| CN114479010A (zh) * | 2014-08-08 | 2022-05-13 | 株式会社大赛璐 | 具有特殊形状的环氧树脂成型物、以及具备该成型物的光学装置 |
| US11198795B2 (en) | 2015-02-17 | 2021-12-14 | The Walman Optical Company | Glycidyl ether based optical coating compositions |
| JP6200591B2 (ja) * | 2015-04-17 | 2017-09-20 | 積水化学工業株式会社 | インクジェット塗布用電子デバイス用封止剤及び電子デバイスの製造方法 |
| KR101934266B1 (ko) * | 2015-07-29 | 2019-01-03 | 삼성에스디아이 주식회사 | 윈도우 필름용 조성물, 이로부터 형성된 플렉시블 윈도우 필름 및 이를 포함하는 플렉시블 디스플레이 장치 |
| TWI575016B (zh) * | 2015-12-03 | 2017-03-21 | 財團法人工業技術研究院 | 環氧樹脂組成物及包含該組成物之熱介面材料 |
| KR102658947B1 (ko) * | 2017-06-07 | 2024-04-18 | 세키스이가가쿠 고교가부시키가이샤 | 유기 el 표시 소자용 봉지제 |
| EP3460959A1 (de) * | 2017-09-20 | 2019-03-27 | Siemens Aktiengesellschaft | Elektrisches isolationsmaterial und/oder imprägnierharz für die wickelbandisolierung einer mittel- und/oder hochspannungsmaschine sowie ein isolationssystem daraus |
| CN107955581B (zh) * | 2017-11-21 | 2020-08-14 | 黑龙江省科学院石油化学研究院 | 一种环氧有机硅改性光固化led封装胶及其制备方法 |
| KR102657208B1 (ko) * | 2017-12-15 | 2024-04-12 | 세키스이가가쿠 고교가부시키가이샤 | 전자 디바이스용 봉지제 및 유기 el 표시 소자용 봉지제 |
| CN111567143B (zh) * | 2017-12-15 | 2023-11-07 | 积水化学工业株式会社 | 电子设备用密封剂及有机el显示元件用密封剂 |
| JP6904245B2 (ja) * | 2017-12-27 | 2021-07-14 | 信越化学工業株式会社 | 感光性樹脂組成物、パターン形成方法、及び光半導体素子の製造方法 |
| US12583975B2 (en) | 2019-10-03 | 2026-03-24 | Dow Toray Co., Ltd. | UV-curable organopolysiloxane composition and use thereof |
| JP7774044B2 (ja) | 2020-09-25 | 2025-11-20 | ダウ シリコーンズ コーポレーション | 硬化性シリコーン組成物及びその硬化物 |
| TWI819546B (zh) * | 2022-03-29 | 2023-10-21 | 國立高雄科技大學 | 矽氧烷官能團環氧樹脂光固化物之抗腐蝕塗層製備方法 |
| CN119708955B (zh) * | 2024-12-20 | 2025-09-09 | 广东汉石新材料科技有限公司 | 一种耐溶剂防锈防腐生物树脂涂料及其制备方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4058401A (en) | 1974-05-02 | 1977-11-15 | General Electric Company | Photocurable compositions containing group via aromatic onium salts |
| US4336363A (en) | 1979-02-12 | 1982-06-22 | General Electric Company | Heat curable compositions containing sulfonium salts |
| US4393185A (en) | 1981-06-02 | 1983-07-12 | Ciba-Geigy Corporation | Thermally polymerizable mixtures and processes for the thermally-initiated polymerization of cationically polymerizable compounds |
| EP0379464B1 (de) | 1989-01-16 | 1993-02-10 | Ciba-Geigy Ag | Araliphatische Sulfoniumsalze und deren Verwendung |
| CA2008848A1 (en) * | 1989-03-30 | 1990-09-30 | Karen D. Riding | Epoxysiloxane cure promoters and accelerators for cationic uv cure systems |
| FR2688790B1 (fr) | 1992-03-23 | 1994-05-13 | Rhone Poulenc Chimie | Compositions a base de polyorganosiloxanes a groupements fonctionnels reticulables et leur utilisation pour la realisation de revetements anti-adhesifs. |
| TW237466B (https=) | 1992-07-21 | 1995-01-01 | Giba Gerigy Ag | |
| DE59506324D1 (de) | 1994-03-16 | 1999-08-12 | Ciba Geigy Ag | Ein-Komponenten-Epoxidharz-Systeme für das Träufelverfahren und Heisstauchrollierverfahren |
| JP3465452B2 (ja) * | 1995-11-20 | 2003-11-10 | 東洋インキ製造株式会社 | 紫外線硬化型樹脂組成物およびこれを含む被覆剤 |
| FR2791995B1 (fr) * | 1999-04-06 | 2001-07-06 | Rhodia Chimie Sa | Composition silicone utile notamment pour la realisation de vernis anti-friction, procede d'application de ce vernis sur un support et support ainsi traite |
| US7012363B2 (en) | 2002-01-10 | 2006-03-14 | Universal Display Corporation | OLEDs having increased external electroluminescence quantum efficiencies |
| US7279260B2 (en) * | 2002-06-12 | 2007-10-09 | Ricoh Company, Ltd. | Electrophotographic photoconductor having a crosslinked resin layer and method of preparing an electrophotographic photoconductor |
| JP4350996B2 (ja) | 2002-11-26 | 2009-10-28 | 日東電工株式会社 | 有機エレクトロルミネッセンス素子、面光源および表示装置 |
| FR2849446B1 (fr) * | 2002-12-26 | 2006-07-28 | Rhodia Chimie Sa | Vernis anti-salissures, procede d'application de ce vernis sur un support silicone et support ainsi traite |
| WO2006085839A1 (en) * | 2005-01-31 | 2006-08-17 | Polyset Company, Inc. | Solventless, non-polluting radiation curable coatings |
| JP2007009086A (ja) * | 2005-06-30 | 2007-01-18 | Toagosei Co Ltd | カチオン硬化性組成物 |
| DE102007040246A1 (de) * | 2007-08-25 | 2009-02-26 | Evonik Degussa Gmbh | Strahlenhärtbare Formulierungen |
| JP4707729B2 (ja) * | 2008-03-31 | 2011-06-22 | 信越化学工業株式会社 | 剥離紙用低粘度紫外線硬化型シリコーン組成物 |
-
2011
- 2011-02-09 CN CN201180021346.4A patent/CN102971382B/zh not_active Expired - Fee Related
- 2011-02-09 SG SG2012079448A patent/SG185053A1/en unknown
- 2011-02-09 WO PCT/EP2011/051907 patent/WO2011134686A1/en not_active Ceased
- 2011-02-09 CA CA2796076A patent/CA2796076A1/en not_active Abandoned
- 2011-02-09 EP EP11702272A patent/EP2563862A1/en not_active Withdrawn
- 2011-02-09 MA MA35319A patent/MA34165B1/fr unknown
- 2011-02-09 JP JP2013506549A patent/JP5736033B2/ja not_active Expired - Fee Related
- 2011-02-09 US US13/643,560 patent/US20130203882A1/en not_active Abandoned
- 2011-02-09 KR KR1020127027198A patent/KR20130069574A/ko not_active Withdrawn
- 2011-04-27 TW TW100114611A patent/TWI509025B/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017039159A1 (ko) * | 2015-08-31 | 2017-03-09 | 삼성에스디아이 주식회사 | 저온 경화 조성물, 그로부터 형성된 경화막, 및 상기 경화막을 갖는 전자 장치 |
| US10822449B2 (en) | 2015-08-31 | 2020-11-03 | Samsung Sdi Co., Ltd. | Low temperature curing composition, cured film formed therefrom, and electronic device having cured film |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102971382A (zh) | 2013-03-13 |
| EP2563862A1 (en) | 2013-03-06 |
| JP2013525551A (ja) | 2013-06-20 |
| TW201211160A (en) | 2012-03-16 |
| CN102971382B (zh) | 2015-07-08 |
| JP5736033B2 (ja) | 2015-06-17 |
| SG185053A1 (en) | 2012-12-28 |
| US20130203882A1 (en) | 2013-08-08 |
| WO2011134686A1 (en) | 2011-11-03 |
| MA34165B1 (fr) | 2013-04-03 |
| TWI509025B (zh) | 2015-11-21 |
| CA2796076A1 (en) | 2011-11-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20121018 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |