KR20130058594A - Method and device for dividing brittle material substrate - Google Patents

Abstract

PURPOSE: A dividing method and dividing equipment of a brittle material substrate is provided to perform a break and a scribe during one process by forming a scribe line accompanying a vertical crack reaching to the other side of the substrate. CONSTITUTION: A dividing method and dividing equipment of a brittle material substrate comprise the following steps. Information related to a brittle material substrate(107) is inputted. A scribing wheel(115) corresponded to the information on the brittle material substrate is selected to hold a scribing wheel on the top of a scribe head(112). A scribe load is selected corresponded to the information on the brittle material substrate. The scribing wheel is pushed to the surface of the brittle material substrate to perform full cut by moving the scribe head and the brittle material substrate relatively. The scribe line formed on the step accompanies a vertical crack reaching to the other side of the brittle material substrate. Brittle material substrate dividing equipment(100) comprises a substrate support device, a scribe head, a transport means, and a controller.

Description

TECHNICAL AND DIVIDING BRITTLE MATERIAL SUBSTRATE}

The present invention relates to a method and apparatus for dividing a brittle material substrate for dividing a brittle material substrate.

Conventionally, in the manufacture of flat panel displays (FPDs) such as brittle material substrates such as glass plates, for example, panel substrates for liquid crystal displays, one mother substrate is divided so as to take out a plurality of panel substrates. It is. When dividing the brittle material substrate, a scribe line is formed in the scribing process so that the mother substrate becomes an individual panel of a predetermined size. In the scribing step, the scribing wheel is freely held on the lower end of the scribing head by the scribing apparatus shown in Patent Document 1, for example, and the scribing wheel is held on a brittle material substrate. The scribe is carried out by pressing and rolling. In the subsequent brake step, the brittle material substrate is braked along the scribe line, for example, by the brake device shown in Patent Document 2.

The scribing wheel used for the scribing apparatus, wherein the high-penetration type described in Patent Document 3 in order to be able to form a scribe line with a crack extended deep in the thickness direction of the brittle material substrate Scribing wheels are known.

Japanese Laid-Open Patent Publication No. 2000-119030 Japanese Laid-Open Patent Publication No. 2004-131341 Japanese Patent No. 3074143

By the way, such a conventional dividing method requires a scribe device and a brake device, and since there are a plurality of manufacturing processes, a large work place is required and the time required for manufacture also has a problem.

SUMMARY OF THE INVENTION The present invention has been made in view of the problems of the prior art, and by forming a scribe line with a vertical crack reaching the rear surface of the substrate by one operation, it is as if the scribe and the brake were simultaneously performed in one step. It is an object to be able to complete the division of a board | substrate.

In order to solve this problem, the method of dividing the brittle material substrate of the present invention uses a scribing wheel in which grooves having a predetermined depth are formed at predetermined pitches along the circumference of a disk-shaped blade tip having an outer circumference having a V shape. As a dividing method for dividing a brittle material substrate, a scribing wheel corresponding to information on the brittle material substrate is input by inputting information (for example, thickness, type, etc. of the brittle material substrate) to be divided. Is selected, the selected scribing wheel is supported at the leading end of the scribe head and lowered against the brittle material substrate on the table, so that the scribing wheel is placed on the brittle material substrate on the surface of the brittle material substrate. The scribe head and the brittle material substrate are relatively moved in a state of being pushed at a selected scribe load corresponding to the information about By forming a scribe line with a vertical crack reaching the back surface of the material material substrate, it is divided (also called a full cut) without requiring a brake process.

In order to solve this problem, the dividing device of the brittle material substrate of the present invention uses a scribing wheel in which grooves having a predetermined depth are formed at predetermined pitches along the circumference of a disk-shaped blade tip having an outer circumference as a V-shape. A dividing apparatus for dividing a brittle material substrate, comprising: a substrate supporting mechanism for supporting the brittle material substrate, and lifting and lowering freely formed so as to face a brittle material substrate supported by the substrate supporting mechanism, and to the brittle material substrate segmented at the tip thereof. A scribing head supporting the selected scribing wheel based on the information relating thereto, and moving means for relatively moving the scribe head and the brittle material substrate while pressing the scribing wheel against the surface of the brittle material substrate; And an input unit for inputting information about the brittle material substrate or data of a scribe line, and the brittle material A scribe load is selected based on a data storage unit for storing data of the scribe load according to the information on the substrate, the information on the brittle material substrate input to the input unit, and the data of the scribe load stored in the data storage unit. And a controller having a control unit for driving the scribe head and the moving unit to form a scribe line with a vertical crack reaching the rear surface of the brittle material substrate.

The information on the brittle material substrate may be information on the thickness of the brittle material substrate.

The information on the brittle material substrate may be information on the type and thickness of the brittle material substrate.

Here, the brittle material substrate may be an alkali free glass substrate.

Here, the selected scribing wheel may increase the blade tip angle as the thickness of the brittle material substrate becomes thick, thereby increasing the depth of the groove toward the axial direction.

Here, the scribe load may be made larger as the thickness of the brittle material substrate becomes thicker.

The information about the brittle material substrate may be recorded in either the scribing wheel or the holder supporting the scribing wheel.

According to the present invention having such a feature, the scribing wheel is selected according to the information on the brittle material substrate such as the thickness and type of the brittle material substrate, and scribed using the scribing wheel. At this time, since a full cut can be performed without a brake process, the outstanding effect that a work process can be simplified is acquired.

BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view which shows the dividing apparatus which performs the dividing method by embodiment of this invention.
2 is a block diagram showing a controller of this dividing apparatus.
3 is a flowchart illustrating the operation of the dividing method according to the present embodiment.

(Mode for carrying out the invention)

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic perspective view which shows an example of the dividing apparatus which performs the dividing method by embodiment of this invention. In the dividing device 100, the movable table 101 is freely supported in the y-axis direction along the pair of guide rails 102a and 102b similarly to the conventional scribing apparatus. The ball screw 103 is screwed with the movable table 101. The ball screw 103 rotates by the drive of the motor 104, and moves the movable base 101 along the guide rails 102a and 102b in the y-axis direction. A motor 105 is provided on the upper surface of the movable base 101. The motor 105 rotates the table 106 in the xy plane to position at a predetermined angle. The brittle material substrate 107 is a glass plate or a bonded substrate. This board | substrate 107 is mounted on the table 106 which is a board | substrate support mechanism, and is supported by the vacuum suction means etc. which are not shown in figure.

In the dividing device 100, bridges 110 are hypothesized by struts 111a and 111b along the x-axis direction so as to span the movable table 101 and the upper table 106. The bridge 110 supports the scribe head 112 freely by the linear motor 113. The linear motor 113 drives the scribe head 112 linearly along the x-axis direction. A scribing wheel is attached to the front end of the scribe head 112 via the holder 114. The scribing head 112 electrically squeezes the scribing wheel 115 attached to the front end with an appropriate load on the surface of the brittle material substrate, forms a scribe line, and divides the substrate. CCD cameras 116a and 116b are attached to the upper portion of the table 106.

As the dividing apparatus, for example, a substrate supporting mechanism that replaces the table 106, and has a substrate supporting mechanism serving as a substrate moving means such as a belt conveyor, and the type of dividing the substrate disposed on the substrate supporting mechanism. The device can be used. In addition, a dividing device of the type which supports the substrate so that a part of the substrate (part of the line to be divided) protrudes from the substrate support mechanism and forms a scribe line on the lower surface of the protruding portion can be used. In addition, a dividing apparatus of the type which supports the substrate so that a part of the substrate (part of the line to be divided) is protruded from the substrate support mechanism, and forms a scribe line on each side (top and bottom) of the protruding portion. It is available. These dividing devices are shown, for example, in WO 2004/048057.

As the scribing wheel 115, a high penetrating scribing wheel shown in Japanese Patent No. 3074153 is used. The scribing wheel is provided with a plurality of grooves toward the axial direction of the wheel, almost coincident with the ridge line of the blade tip. Details of the scribing wheel will be described later. As the material of the scribing wheel, sintered diamond (PCD), cemented carbide or the like can be used, but from the viewpoint of the life of the scribing wheel, sintered diamond (PCD) is preferable.

The scribing wheel used in the present invention is a scribing wheel in which grooves having a predetermined depth are formed at predetermined pitches along the circumference of a disk-shaped blade tip having a vertical cross-sectional shape of the outer circumference (V). 1) A rod-shaped pin is inserted into a through-hole formed along the direction of the central axis of a disc shape, and both ends of the pin are supported by a holder so as to be rotatably supported, and (2) on both sides along the central axis of the disc shape. There is a type in which the pins are formed integrally with each other and are rotatably supported by supporting the ends of the pins formed on both sides with a holder. The scribing wheel is attached to the end of the scribe head via the holder.

For example, the information about the scribing wheel (for example, the outer diameter, the blade tip angle, the depth and pitch of the grooves formed on the ridge of the blade tip, etc.) is the blade tip of the circumference of the scribing wheel (the outer circumference having a V shape). It may be recorded in a part other than the ridgeline of. By doing so, discrimination of the scribing wheel at the time of selecting the scribing wheel (when it is attached or replaced) can be facilitated, and the error can be prevented. The information about the scribing wheel can also be recorded in the holder. In this case, it is possible to take a recordable space wide, which facilitates recording. The information on the scribing wheel depends on the material of the scribing wheel, the holder, and the like, but can be recorded by laser marking, for example, as a symbol such as a one-dimensional bar code or a two-dimensional bar code. have.

In addition, the scribing wheel may be used as a holder structure in which the scribing wheel is integrated with the holder. In this case, when the scribing wheel is attached or replaced, the holder structure supporting the scribing wheel is integrally attached and replaced. This facilitates the selection operation of attaching or replacing the scribing wheel, and is particularly effective when recording information about the scribing wheel in the holder. As such a holder structure, the tip holder shown in WO 2007/063979 can be used.

Here, the linear base 113 which moves the movable base 101, the guide rails 102a and 102b or the table 106, the motors 104 and 105 which drive these, and the scribe head 112 is a scribe head and brittleness. It comprises a moving means for moving the material substrate relatively in a direction parallel to the scribed surface of the substrate.

Next, the structure of the controller of the dividing apparatus 100 by this embodiment is demonstrated using a block diagram. 2 is a block diagram of the controller 120 of the dividing apparatus 100. In this figure, the output from CCD camera 116a, 116b is given to the control part 122 through the image processing part 121 of the controller 120. In FIG. As described later, the input unit 123 inputs information (thickness, type, etc.) relating to a brittle material substrate or data of a scribe line. An X motor driver 124 is connected to the control unit 122, and a Y motor driver 125, a rotating motor driver 126, and a scribe head driver 127 are connected. The X motor driver 124 drives the linear motor 113. The Y motor driver 125 drives the motor 104. The rotary motor driver 126 drives the motor 105. The control unit 122 controls the position of the table 106 in the y-axis direction based on the data of the scribe line to control the rotation of the table 106. In addition, the controller 122 drives the scribe head in the x-axis direction through the scribe head driver 127, and the scribing wheel 115 moves on the surface of the brittle material substrate when the scribing wheel 115 is driven. It is driven to pressurize with proper load. In addition, the control unit 122 is connected to a monitor 128 and a data storage unit 129. The data storage unit 129 stores data such as a scribe load according to the thickness of the brittle material substrate.

Next, the dividing method by this embodiment is demonstrated using the flowchart of FIG. In the present embodiment, first, the input unit 123 inputs information about the brittle material substrate such as the thickness of the brittle material substrate 107 to be divided in step S1. In input of this thickness, you may select and input the thickness divided into several ranks, for example, less than 0.4 mm, 0.4 mm or more and less than 0.6 mm, 0.6 or more and less than 1.1 mm, 1.1 mm or more.

By the way, according to the thickness of the brittle material board | substrate 107 input by the input part 123 in this way, in step S2, an appropriate scribing wheel is selected and supported by the tip of a scribe head. An example of the thickness of the substrate and the scribing wheel to be selected when the brittle material substrate 107 is a glass plate, in particular an alkali free glass substrate, is shown below.

(1) About a brittle material substrate whose thickness is less than 0.4 mm,

Blade tip outer diameter is 1-3mm,

A scribing wheel with a blade tip angle of 90 to 105 ° is used.

About the groove formed in the axial direction of the wheel in the ridge of the blade tip of the scribing wheel,

Groove depth 1 to 6 mu m,

The pitch is 7-45 micrometers.

(2) About the brittle material board | substrate whose thickness is 0.4 mm or more and less than 0.6 mm,

Blade tip outer diameter is 2-4mm,

A scribing wheel with a blade tip angle of 100 to 105 ° is used.

About the groove formed in the axial direction of the wheel in the ridge of the blade tip of the scribing wheel,

Groove depth 3-8 탆,

The pitch is set to 15 µm to 70 µm.

(3) About brittle material board | substrate whose thickness is 0.6 mm or more and less than 1.1 mm,

Blade tip outer diameter is 2-4mm,

A scribing wheel with a blade tip angle of 110 to 140 ° is used.

About the groove formed in the axial direction of the wheel in the ridge of the blade tip of the scribing wheel,

Groove depth 5-12 탆,

The pitch is set to 35 µm to 80 µm.

(4) About a brittle material substrate whose thickness is 1.1 mm or more,

Blade tip outer diameter is 2-5mm,

A scribing wheel with a blade tip angle of 125 to 160 ° is used.

About the groove formed in the axial direction of the wheel in the ridge of the blade tip of the scribing wheel,

Groove depth 7-150 μm,

The pitch is 40 µm to 300 µm.

Next, an appropriate scribe load is selected according to the information (thickness, type, etc.) regarding the brittle material substrate of the brittle material substrate 107 input in step S3. The value of the scribe load is selected by selecting a value at which the scribe penetrates deeply by the scribing operation and completes the brake. The scribe load is preliminarily tested and stored in the data storage unit 129 as data. In general, when the thickness of the brittle material substrate becomes thick, the scribe load is also increased accordingly. The scribe head is read out according to the information (thickness, type, etc.) relating to the input brittle material substrate to drive the scribe head. Then, the scribe head and the brittle material substrate are moved relatively along the line to be divided in step S4, and by one operation, the division (full cut, reaching the back surface of the substrate) corresponding to the two processes of the conventional scribe and brake is performed. Formation of a scribe line involving vertical cracks).

In general, when the blade tip angle increases, the scribe load can be increased, and the vertical cracks formed with the scribe can be deepened. In addition, the groove depth can be made large in correspondence with the outer diameter of the blade tip to form a scribe line with a deep vertical crack. From this point of view, the brittle material substrate 107 is placed on the table 106 using the selected scribing wheel, and a scribe line is formed at the selected scribe load.

In a brittle material substrate, for example, a glass plate, the outer surface and the rear surface solidify first at the time of manufacture, and then solidify the inside thereof, so that a stress to shrink inside occurs. Therefore, the glass plate can be divided into almost three layers by the internal stress. In the usual scribe using the high penetrating blade tip shown in Patent Literature 3, a scribe line with vertical cracks reaching a depth exceeding the high stress layer (compression layer) on the surface is formed, and the tip of the vertical crack in the substrate is formed. When this depth is exceeded, vertical cracks penetrate deeply at once and reach the high stress layer (compression layer) on the back side, but do not penetrate inside the high stress layer (compression layer). However, in the present invention, by selecting a load higher than usual in relation to information (thickness, type, etc.) regarding the brittle material substrate, a scribe line in which the vertical crack penetrates deeply to the back surface is formed. In this way, by selecting an appropriate load using the high penetrating blade tip and scribing in the same manner as in the conventional scribing apparatus, the brittle material substrate can be cut as it is, and the process up to the division can be completed. Therefore, it is not necessary to form a brake step after the scribing step, and the number of steps can be greatly simplified.

In addition, the numerical value of the scribing wheel described here is an example, It is not limited to this numerical value.

INDUSTRIAL APPLICABILITY The present invention can be widely used in a step of separating a brittle material substrate such as a glass substrate.

100: dividing device
101: moving table
102a, 102b: guide rail
103: Ball Screw
104, 105: motor
106: table
107 brittle material substrate
110: the bridge
111a and 111b
112: scribe head
113: linear motor
114: holder
115: Scribing Wheel
116a, 116b: CCD camera
120: controller
121: image processing unit
122:
123: input unit
124: X motor drive unit
125: Y motor drive unit
126: motor drive unit for rotation
127: scribe head drive unit
128: monitor
129: data preservation unit

Claims (13)

As a dividing method of dividing a brittle material substrate using the scribing wheel which formed the groove of predetermined depth along the circumference of the disk-shaped blade tip which made the outer periphery into V shape, at predetermined pitch,
Input information about the brittle material substrate to be divided,
Select a scribing wheel corresponding to the information about the brittle material substrate,
Holding the selected scribing wheel at the leading end of the scribe head,
The scribe head and the brittle material are lowered with respect to the brittle material substrate on the table, and the scribing wheel is pushed on the surface of the brittle material substrate with a scribe load selected corresponding to the information about the brittle material substrate. By moving the substrate relatively,
A method of dividing a brittle material substrate, wherein the brittle material substrate is divided by forming a scribe line with vertical cracks reaching the back surface. The method of claim 1,
And the information relating to the brittle material substrate is a thickness of the brittle material substrate. The method of claim 1,
A method of dividing a brittle material substrate, wherein the information about the brittle material substrate is a kind and a thickness of the brittle material substrate. 4. The method according to any one of claims 1 to 3,
A method of dividing a brittle material substrate, wherein the brittle material substrate is an alkali free glass substrate. 4. The method according to any one of claims 1 to 3,
The selected scribing wheel is a segmentation method of a brittle material substrate in which the blade tip angle is increased as the thickness of the brittle material substrate becomes thick, and the depth of the groove toward the axial direction is increased. 4. The method according to any one of claims 1 to 3,
The scribe load is a method of dividing a brittle material substrate in which the scribe load is increased as the thickness of the brittle material substrate becomes thick. A dividing apparatus for dividing a brittle material substrate using a scribing wheel in which grooves having a predetermined depth are formed at a predetermined pitch along the circumference of a disk-shaped blade tip having an outer circumference as a V-shape,
A substrate support mechanism for supporting the brittle material substrate;
A scribing head which freely moves up and down so as to face a brittle material substrate supported by the substrate support mechanism, and supports the selected scribing wheel based on information about the brittle material substrate segmented at its tip;
Moving means for relatively moving the scribe head and the brittle material substrate while pressing the scribing wheel against the surface of the brittle material substrate;
An input unit for inputting information on the brittle material substrate or data of a scribe line, a data storage unit for storing data of a scribe load according to the information on the brittle material substrate, information on the brittle material substrate input to the input unit; Based on the data of the scribe load stored in the data storage section, a scribe load is selected, and the scribe line is driven to drive the scribe head and the moving means to form a scribe line with vertical cracks reaching the rear surface of the brittle material substrate. A dividing device for a brittle material substrate, comprising a controller having a control unit to make the control unit. The method of claim 7, wherein
Separation apparatus of a brittle material substrate, wherein the information about the brittle material substrate is the thickness of the brittle material substrate. The method of claim 7, wherein
A device for dividing a brittle material substrate, wherein the information about the brittle material substrate is a kind and a thickness of the brittle material substrate. 10. The method according to any one of claims 7 to 9,
A device for dividing a brittle material substrate, wherein the brittle material substrate is an alkali free glass substrate. 10. The method according to any one of claims 7 to 9,
And said selected scribing wheel divides the brittle material substrate as the thickness of the brittle material substrate increases, thereby increasing the blade tip angle and increasing the depth of the groove toward the axial direction. 10. The method according to any one of claims 7 to 9,
The said scribe load is the division | segmentation apparatus of the brittle material board | substrate which enlarged the scribe load as the thickness of the said brittle material board | substrate became thick. The method of claim 7, wherein
The information regarding the brittle material substrate is recorded in any one of the scribing wheel and the holder supporting the scribing wheel.

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