KR20130040696A - 스크라이브 장치 - Google Patents

스크라이브 장치 Download PDF

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Publication number
KR20130040696A
KR20130040696A KR1020120078683A KR20120078683A KR20130040696A KR 20130040696 A KR20130040696 A KR 20130040696A KR 1020120078683 A KR1020120078683 A KR 1020120078683A KR 20120078683 A KR20120078683 A KR 20120078683A KR 20130040696 A KR20130040696 A KR 20130040696A
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KR
South Korea
Prior art keywords
scribing
scribe
laser
spot
cooling
Prior art date
Application number
KR1020120078683A
Other languages
English (en)
Korean (ko)
Inventor
위항 수
다케시 이케다
코지 야마모토
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20130040696A publication Critical patent/KR20130040696A/ko

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1020120078683A 2011-10-14 2012-07-19 스크라이브 장치 KR20130040696A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011227103A JP2013087001A (ja) 2011-10-14 2011-10-14 スクライブ装置
JPJP-P-2011-227103 2011-10-14

Publications (1)

Publication Number Publication Date
KR20130040696A true KR20130040696A (ko) 2013-04-24

Family

ID=48055576

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120078683A KR20130040696A (ko) 2011-10-14 2012-07-19 스크라이브 장치

Country Status (4)

Country Link
JP (1) JP2013087001A (zh)
KR (1) KR20130040696A (zh)
CN (1) CN103042610A (zh)
TW (1) TW201321322A (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6254876B2 (ja) * 2014-03-14 2017-12-27 三星ダイヤモンド工業株式会社 スクライブヘッドおよびスクライブ装置
JP2018150191A (ja) * 2017-03-13 2018-09-27 日本電気硝子株式会社 ガラス板の製造方法
CN111604604A (zh) * 2020-06-28 2020-09-01 安徽富信半导体科技有限公司 一种半导体元件加工用成型设备及其使用方法
CN114734153B (zh) * 2022-03-31 2023-02-14 武汉华日精密激光股份有限公司 一种用于激光器加工脆性材料的裂片方法及系统

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3370310B2 (ja) * 1999-06-18 2003-01-27 三星ダイヤモンド工業株式会社 レーザーを用いたスクライブ法
CN1284737C (zh) * 2000-12-01 2006-11-15 Lg电子株式会社 玻璃切割方法
US6812430B2 (en) * 2000-12-01 2004-11-02 Lg Electronics Inc. Glass cutting method and apparatus with controlled laser beam energy
DE102005027800A1 (de) * 2005-06-13 2006-12-14 Jenoptik Automatisierungstechnik Gmbh Vorrichtung zum mehrfachen Trennen eines flachen Werkstückes aus einem spröden Material mittels Laser
JP2008049375A (ja) * 2006-08-25 2008-03-06 Shibaura Mechatronics Corp 割断装置および割断方法
JP2008149348A (ja) * 2006-12-18 2008-07-03 Seiko Epson Corp レーザスクライブ装置、基板の分断方法及び電気光学装置の製造方法
JP2008229715A (ja) * 2007-03-23 2008-10-02 Toray Eng Co Ltd レーザスクライブ装置
KR100990519B1 (ko) * 2008-08-07 2010-10-29 (주)하드램 레이저를 이용한 기판 절단 장치 및 기판 절단 방법
JP2010150071A (ja) * 2008-12-25 2010-07-08 Japan Steel Works Ltd:The 被加工物の加工方法及びその装置
KR101130702B1 (ko) * 2009-08-17 2012-04-02 한양대학교 산학협력단 열응력을 이용한 유리판 절단장치 및 유리판 절단방법
JP2012131680A (ja) * 2010-12-24 2012-07-12 Leo:Kk ガラスのレーザ熱応力スクライブ方法並びに装置

Also Published As

Publication number Publication date
JP2013087001A (ja) 2013-05-13
CN103042610A (zh) 2013-04-17
TW201321322A (zh) 2013-06-01

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