KR20130040129A - Socket for electric parts - Google Patents

Abstract

PURPOSE: A socket for electric components is provided to press the electric components with desired pressing force by installing a pressing surface selected by the thickness of the electric components in a frame body through reversing one of pressing surfaces. CONSTITUTION: A cover member(16) includes an opening and closing member(17) and a pressing member(20). The opening and closing member is rotatably installed in a socket body. The pressing member is detachably installed in the opening and closing member. A pair of pressing surfaces(21) pressing electronic components(11, 12) is formed on both sides of the pressing member. One of the pressing surfaces is installed in the electronic components.

Description

Socket for electric component {SOCKET FOR ELECTRIC PARTS}

The present invention relates to a socket for an electrical component, which is provided on a wiring board and which accommodates the electrical component for testing an electrical component such as a semiconductor device (hereinafter referred to as an "IC package").

Conventionally, as this kind of socket for electrical components, as described in patent document 1, there exists an IC socket which tests an IC package, etc., for example.

Patent Document 1 discloses that "an IC socket includes a socket main body having an accommodating part for accommodating an IC package, a plurality of contact pins provided in the socket main body and accessible and spaced apart from terminals of the IC package, and the socket main body. An IC that has a socket cover mounted to be rotatable and that the socket cover is closed so that the IC package housed in the housing portion is pressed to hold the terminal in contact with the contact pin. In the socket, a direction in which the socket cover approaches or is spaced apart from the socket main body when the socket cover is closed so that the socket can be pressed by a predetermined pressing force according to the thickness of the IC package and the number of terminals that are accommodated in the housing. The technical configuration of the present invention is disclosed.

And such a structure discloses the effect that "even if the thickness of an IC package and the number of terminals are different, a predetermined pressing force is enabled and it is applicable also to a high functional device with a large amount of heat dissipation."

Japanese Laid-Open Patent Publication No. 2009-99415

However, in such a conventional case, in order to enable the socket cover to be movable in a direction approaching or spaced from the socket main body when the socket cover is closed, the shaft supporting the socket cover to be rotatable is movable in that direction. Since a torsion spring is formed to form a long hole or pressurizes the shaft, the structure is complicated and it is difficult to control to a predetermined pressing force. It was difficult.

Then, an object of this invention is to provide the socket for electrical components which is simple in structure, does not require difficult adjustment, etc., and can respond easily to two types of electrical components in which thickness differs.

In order to achieve the above object, the present invention provides a socket main body for accommodating an electrical component provided with a terminal on a lower surface thereof, a contact pin provided on the socket main body and in contact with a terminal of the electrical component, and the socket. In the socket for an electrical component provided with the cover member which is provided in the main body so that opening and closing is possible, and has the pressing member which presses the electrical component accommodated in the closed state, The said cover member is the opening-and-closing body provided so that rotation was possible to the said socket main body. And a pressing member which is detachably attached to the opening and closing body, wherein the pressing member is provided with a pair of pressing surfaces for pressing the electrical components on surfaces opposite to each other. With respect to the pressing surface, one or the other side can be arbitrarily mounted toward the housed electrical component, and one pressing of the pressing member In the pressing state in which the electric component is pressed by the surface, the electric component is driven by the distance from the working point site where the force from the opening and closing body acts to the one pressing surface, and the pressing surface of the other pressing member. In the pressing state in which the pressure is pressed, the socket for an electrical component configured to be different from the action point portion where the force from the opening and closing body acts on the other pressing surface is characterized.

According to another feature of the present invention, the opening and closing member is rotatably provided in the socket body, and is located inside the outer frame member for transmitting the pressing force to the pressing member and the outer frame member. The inner frame member has an inner frame member having a lock claw portion to be engaged, and the inner frame member is made of a synthetic resin material which is elastically deformable, and swings on an inner surface of the outer frame member. ) Is supported by the shaft.

Another feature of the present invention resides in that the pressing member is integrally formed with a flange portion in contact with the lower side of the outer frame member.

According to the present invention, one or the other of the pair of pressing surfaces formed on the pressing member is inverted, selected according to the thickness of the electrical component, and mounted in the frame body, thereby closing the cover member. The two kinds of electrical parts having different thicknesses can be pressed at a desired pressing pressure. Therefore, the structure is simple and difficult adjustment of the pressing force is not necessary.

According to another feature of the present invention, since the pressing member is held by the locking claw provided on the inner frame member, the pressing member can be easily attached and detached. Therefore, the pressing member does not need to separate the screw member or the shaft member, and can be easily reversed to be used for an electrical component having a different thickness, suppressing an increase in the number of components, and easily managing the components. have.

In addition, since the inner frame member is made of a synthetic resin material which is elastically deformable, and is axially supported on the inner side of the outer frame member so as to be able to swing, the pressing member is slightly movable at the initial stage of the pressing of the electrical component. Thereby, an unreasonable force does not act on an electrical component.

According to another feature of the present invention, since the flange member which abuts against the lower side of the outer frame member is integrally formed in the pressing member, a large force at the time of closing the cover member is received by the flange portion of the pressing member. It can effectively transmit the pressure to the electrical component.

BRIEF DESCRIPTION OF THE DRAWINGS The IC socket which concerns on embodiment of this invention, (a) is the top view which has a partial cross section, (b) is the front view from the arrow A direction of (a), (c) is (a) Is a side view from the arrow B direction.
Fig. 2 is an enlarged cross-sectional view of the IC socket according to the embodiment, showing a state where the IC package is not accommodated.
FIG. 3 is an enlarged cross-sectional view of the IC socket corresponding to FIG. 2 according to the embodiment, showing a state where the IC package is accommodated. FIG.
Fig. 4 is a diagram showing an IC socket according to the above embodiment, showing a state in which contact pins are installed.
5 is a perspective view showing a cover member of the IC socket according to the embodiment.
FIG. 6: shows the outer frame member among the cover members of the IC socket which concerns on the said embodiment, (a) is a perspective view which a press side turned downward, and (b) is a perspective view which a press side turned upward.
Fig. 7 shows an outer frame member of the cover member of the IC socket according to the above embodiment, wherein (a) is a plan view, (b) is a left side view of (a), and (c) is A-A of (a). (D) is a right side view of (a), (e) is a bottom view.
Fig. 8 shows an inner frame member of the cover member of the IC socket according to the above embodiment, wherein (a) is a perspective view of the locking claw facing downward, and (b) is a perspective view of the locking claw facing upward.
Fig. 9 shows an inner frame member of the cover member of the IC socket according to the above embodiment, wherein (a) is a plan view, (b) is a sectional view along the line B-B in (a), and (c) is (a). (D) is a bottom view.
Fig. 10 shows a pressing member among the cover members of the IC socket according to the above embodiment, wherein (a) is a plan view, (b) is a side view in the direction of the arrow A in (a), and (c) is D in (a). -It is sectional drawing along the D line.
11 is a perspective view illustrating a method of using the IC socket according to the embodiment and the like.
12 is an electric component according to the above embodiment, and shows an IC package having a relatively thin thickness, where (a) is a front view and (b) is a bottom view.
FIG. 13 is a front view showing an IC component having a thickness that is relatively thicker than that of the IC package shown in FIG.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described.

1 to 13 show an embodiment of the present invention.

First, when the configuration is described, reference numeral “10” in Fig. 1 is an IC socket as a “socket for electrical components”, and the IC socket 10 is provided on a wiring board (not shown). In order to perform burn-in testing of the IC packages 11 and 12, which are two types of "electrical components" as shown in FIG. 13, a plurality of "terminals" of these IC packages 11 and 12 are used. The electrical connection between the solder balls 11b and 12b and the wiring board is achieved.

As shown in Figs. 12 and 13, these IC packages 11 and 12 have a thicker thickness h2 of the other IC package 12 than the thickness h1 of one IC package 11 (h1 < h2). ) Is set.

In addition, these IC packages 11 and 12 have rectangular package bodies 11a and 12a in plan view, and a plurality of semicircular solder balls are provided on the lower surfaces of these package bodies 11a and 12a. (11b, 12b ...) are arranged in the vertical and horizontal direction at equal intervals.

On the other hand, the IC socket 10 is provided in the socket main body 13 which has the accommodating surface part 13a which accommodates the IC socket 10, and this socket main body 13, as shown to FIG. And the contact pins 14 for electrically connecting the solder balls 11b and 12b and the wiring boards of the IC packages 11 and 12 and the socket main body 13 so as to be rotatable, and the socket main body 13 The cover member 16 which presses the IC package 11 and 12 accommodated in the upper part from the upper part, and the latch member which are rotatably installed in this socket main body 13, and rotate back downward from the closed state of this cover member 16 again. (latch member) 15 is provided.

The socket main body 13 is made of synthetic resin having insulation, as shown in Figs. 1 to 4, and includes a main plate 24 formed in a frame shape, an upper plate 25 provided inside the frame shape, and It has the lower plate 26, and these plates 25 and 26 are provided with the some contact pin 14, as shown to FIG. 2 thru | or FIG.

In addition, as shown in FIG. 4, above the upper plate 25, a floating plate 27 is provided to be pressed upward by a spring (not shown) so as to be movable upward and downward. The upper surface of this floating plate 27 is the accommodating surface part 13a which accommodates IC packages 11 and 12. As shown in FIG. Guide portions 13b and 13b for guiding the IC package 12 when projecting are formed at four corners around the accommodation surface portion 13a so as to protrude (see FIG. 1 and the like).

In addition, the contact pin 14, as shown in Fig. 4, the upper contact portion 14a in contact with the solder balls 11b, 12b of the IC package 11, 12 and the lower contact portion 14b in contact with the wiring board. ) Is provided and is urged in opposite directions by the coil spring 14c provided between the upper contact portion 14a and the lower contact portion 14b.

Moreover, the cover member 16 has the frame 17 as a "opening and closing body" provided so that rotation to the socket main body 13 was possible, as shown in FIG. 2, FIG. 3, FIG. 5, FIG. 6, FIG. have.

As shown in FIG. 5, FIG. 6, FIG. 7, etc., the said frame 17 forms the square frame shape in plan view, and the outer frame member 18 which transmits a press force to the press member 20 is shown. ) And an inner frame member 19 which is located inside the inner surface 18a of the outer frame member 18 and forms a rectangular frame shape as shown in FIGS. 8 and 9.

The outer frame member 18 is formed with shaft holes 18b and 18b through which shaft members 16a rotatable in the vertical direction to the socket body 13 penetrate. On the sides facing each other, a pair of through holes 18c for supporting the inner frame member 19 in a rotatable manner are formed.

The inner frame member 19 is made of a synthetic resin material that can be elastically deformed, and is formed into a frame shape and has a pair of through holes 19c facing the pair of through holes 18c of the outer frame member 18. Is formed. The pin member 28 is inserted through these through holes 18c and 19c, so that the inner frame member 19 is supported by the outer frame member 18 so as to be able to swing.

8 and 9, a pair of catching claws 19a protrude downward from the sides facing each other, and are attached to and detached from the inner frame member 19 by these catching claws 19a. The pressing member 20 is possibly supported.

As shown in FIG. 11, FIG. 12, etc., this press member 20 is provided with the pair of press surfaces 21 and 22 which press each IC package 11 and 12 in each side surface on the opposite side, and One pressing surface 21 or the other pressing surface 22 can be mounted toward the housed IC package 11 or IC package 12.

That is, by the pair of elastically deformable locking claws 19a and 19a of the inner frame member 19 of the frame body 17, the engaging portion protruding integrally from the side surface portion of the pressing member 20 ( 20a and 20a are caught and supported (prevention of falling off) (refer FIG. 2, FIG. 3).

Moreover, as shown in FIG. 10, in this press member 20, a pair of flat flange part 23, 23 extends toward the circumference. These flange portions 23, 23 are formed on the side different from the side on which the caught portions 20a, 20a are formed, and on the lower side portions 18d, 18d on the opposite surface side of the outer frame member 18, respectively. , Each is in contact.

Thereby, the pressurization pressure from the said frame body 17 is transmitted to the flange parts 23 and 23, and the IC package 11 or the one by the press surface 21 or the other press surface 22 is carried out. The IC package 12 is pressed down.

Accordingly, the pressing member 20 is restricted from the downward movement (falling) by the caught parts 20a and 20a in the attached state to the frame body 17 and by the flanges 23 and 23. The upward movement is regulated so as to be maintained without deviating from the frame body 17.

In addition, in this embodiment, as shown to FIG. 10, FIG. 11 etc., the floating plate 27 is provided in the outer peripheral edge of each bottom surface part 21a, 22a which has the rectangular plane of each pressing surface 21, 22. As shown in FIG. Pressing projections 21b,... And pressing projections 22b,.

And this press member 20 acts by the force from the frame 17 in the press state which presses the IC package 11 by the press surface 21 of the press member 20. As shown in FIG. The distance d1 from the other input surface 23a (acting point site) of the flange portion 23 to the bottom surface portion 21a of one pressing surface 21 and the other pressing surface of the pressing member 20 ( 22, in the pressing state where the IC package 12 is pressed, the pressure of the other side from one input surface 23b (acting point site) of the flange portion 23 on which the force from the frame body 17 acts. It is comprised so that the distance d2 to the bottom surface part 22a of the pressure surface 22 may differ (refer FIG. 10 (b)).

In this embodiment, the distance d1 is set larger than the distance d2 (d1 <d2) in accordance with the thicknesses h1 and h2 (h1 <h2) of the IC packages 11 and 12.

1 to 3, the latch member 15 is rotatably provided to the socket main body 13 via the rotation shaft 15c, and is rotated with the lever portion 15e. . In the state in which the lever part 15e is inclined, as shown in FIGS. 2 and 3, the hook portion 15d is caught by the hooked portion 16b of the cover member 16 to cover it. The closed state of the member 16 is maintained.

Next, a method of using the IC socket 10 will be described.

The case where the two types of IC packages 11 and 12 are accommodated in the IC socket 10 and inspected in the state where the IC socket 10 is fixed on the wiring board in advance is described.

First, in the case of accommodating and inspecting the thin IC package 11 of thickness h1, the pressing surface 22 is pressed against the frame 17 with the cover member 16 open. The caught portion 20a is fastened to the engaging claw portion 19a of the inner frame member 19 so as to be in the pressing direction of the IC package 11.

Thereafter, the IC package 11 is guided to the predetermined position by the guide portion 13b, accommodated on the upper surface of the floating plate 27, and the cover member 16 is closed.

Then, one input surface 23b of the flange portion 23 of the pressing member 20 abuts against the lower side portion 18d of the outer frame member 18 of the frame 17, so that the pressing member 20 It is pressed downward, and the press protrusion 22b of this press member 20 pushes down the floating plate 27 downward by resisting the pressing force of a coil spring. As the floating plate 27 descends, the upper contact portion 14a of the contact pin 14 comes into contact with the solder ball 11b of the IC package 11, and the bottom surface portion 22a of the pressing member 20. The upper surface of the IC package 11 abuts.

Then, the hook portion 15d is pulled onto the hooked portion 16b of the cover member 16 and latched by falling down the lever portion 15e of the latch member 15, so that the closed state of the cover member 16 is maintained. The contact pins 14 and the solder balls 11b of the IC package 11 come into contact with the predetermined contact pressure.

That is, corresponding to the thin IC package 11 of thickness h1, since the long bottom surface part 22a of the distance d2 of the pressing member 20 is applied from one input surface 23b, predetermined contact pressure can be obtained. have.

On the other hand, in the case of accommodating and inspecting the IC package 12 having a thickness h2 thicker than that of the IC package 11, the pressing member 20 with respect to the frame body 17 is opened with the cover member 16 open. The hooked portion 20a is fastened to the locking claw portion 19a of the inner frame member 19 in the reverse direction as described above so that the pressing surface 21 is in the direction of pressing the IC package 12.

Thereafter, the IC package 12 is guided to the predetermined position by the guide portion 13b and accommodated on the upper surface of the floating plate 27, and the cover member 16 is closed.

Then, the other input surface 23a of the flange part 23 of the press member 20 abuts against the lower side portion 18d of the outer frame member 18 of the frame body 17, and the press member 20 Is pressed downward, and the pressing projection 21b of this pressing member 20 pushes down the floating plate 27 downward against the pressing force of the coil spring. As the floating plate 27 descends, the upper contact member 14a of the contact pin 14 abuts against the solder ball 12b of the IC package 12, and the bottom surface portion 21a of the pressing member 20 is brought into contact with the solder ball 12b. The upper surface of the IC package 12 abuts.

Then, the hook portion 15d is caught by the hooked portion 16b of the cover member 16 by overturning the lever portion 15e of the latch member 15, so that the closed state of the cover member 16 is maintained. The contact pins 14 and the solder balls 12b of the IC package 12 come into contact with a predetermined contact pressure.

That is, corresponding to the thin IC package 12 having a thickness h2, the short contact surface 21a of the distance d1 of the pressing member 20 is applied from the other input surface 23a, so that a predetermined contact pressure can be obtained. Can be.

As described above, in this embodiment, the IC package is changed only by changing the mounting direction of the one kind of pressing members 20 to the frame body 17 in accordance with the thickness h1 and h2 of the two types of IC packages 11 and 12. Even if the thickness of (11, 12) is changed, it can respond easily.

Moreover, since the mounting direction of this press member 20 is only made to be caught by the locking claw part 19a of the inner frame member 19, it can be attached or detached easily. Therefore, it is not necessary to separate the screw member or the shaft member, and the pressing member 20 can be easily reversed to correspond to the IC packages 11 and 12 having different thicknesses h1 and h2, thereby increasing the number of parts. It can suppress and manage components easily.

In addition, since the large force at the time of closing the cover member 16 is received by the flange part 23 of the press member 20, the force can be effectively transmitted to the IC package 11 and 12 as a press force. have.

In addition, when the inner frame member 19 made of a synthetic resin material that is elastically deformable is bent, the initial pressure of the IC packages 11 and 12 of the pressing member 20 supported by the inner frame member 19 is reduced. As a result, the pressing member 20 moves slightly, so that an excessive force does not act on the IC packages 11 and 12 and the floating plate 27. In addition, when pressing the IC packages 11 and 12 with a predetermined force with the pressing member 20, the force from the outer frame member 18 of the rigid body is applied to the flange portion of the pressing member 20. Since it acts on the IC packages 11, 12 and the like through 23, the IC packages 11, 12 and the like can be reliably pressed.

In addition, in the said embodiment, although this invention was applied to the IC socket 10 as a "socket for electrical components," it is a matter of course that it is not limited to this and can be applied also to another apparatus. In addition, a "opening / closing body" is not necessarily limited to a frame shape, and may be plate-shaped, and both the outer frame member 18 and the inner frame member 19 are not necessarily required. In addition, although the flange part 23 of the press member 20 is pressed by the frame body 17, if the distance from an acting point site | part to a positive press surface differs, the pressurizing structure in a working point site | part will be as mentioned above. It is not limited to the same flange portion 23.

10: IC socket (socket for electrical components)
11, 12: IC Package (Electrical Components)
13: socket body
13a: receiving surface
14: contact pin
16: cover member
17: frame body (opening and closing body)
18: outer frame member
19: inner frame member
19a: hang claw
20: pressing member
21: pressing surface on one side
22: pressing surface of the other side
23: flange
23a: other input surface (acting point site)
23b: one input surface (acting point site)

Claims (3)

A socket body accommodating electrical parts having terminals provided on the lower surface thereof;
A contact pin provided in the socket body and having a contact portion contacting the terminal of the electrical component;
Cover member which is provided in the said socket main body so that opening and closing is possible, and has the press member which presses the electrical component accommodated in the closed state.
In the socket for an electrical component comprising a,
The cover member has an opening and closing body rotatably provided in the socket body and a pressing member installed in the opening and closing body so as to be detachable. The pressing members are opposite to each other. A pair of pressing surfaces for pressing the electric parts are formed on the surface of the plate, and the pressing surface can be arbitrarily mounted on one side or the other toward the housed electrical component with respect to the opening and closing body.
In the pressing state in which the electric component is pressed by one pressing surface of the pressing member, the distance from the working point site where the force from the opening and closing body acts to the one pressing surface and the other side of the pressing member A socket for an electrical component, configured such that a distance from a working point site where a force from the opening and closing body acts to be different from the pressing surface on the other side in a pressing state in which the electrical component is pressed by the pressing surface. The method of claim 1,
The opening and closing body,
An outer frame member rotatably installed on the socket body and transmitting a pressing force to the pressing member;
It has an inner frame member which is located inside the outer frame member, and formed the lock claw portion which hangs and supports the said press member,
The said inner frame member is comprised from the synthetic resin material which can be elastically deformed, and the socket for electrical components is axially supported by the inner surface of the said outer frame member so that it can rock. The method according to claim 1 or 2,
The press member is formed with an integrally formed flange portion in contact with a lower side of the outer frame member. The socket for an electrical component.

Images