KR20120101090A - 코팅 조성물 - Google Patents
코팅 조성물 Download PDFInfo
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- KR20120101090A KR20120101090A KR1020127016669A KR20127016669A KR20120101090A KR 20120101090 A KR20120101090 A KR 20120101090A KR 1020127016669 A KR1020127016669 A KR 1020127016669A KR 20127016669 A KR20127016669 A KR 20127016669A KR 20120101090 A KR20120101090 A KR 20120101090A
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- KR
- South Korea
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- resin
- formula
- Prior art date
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- 238000010521 absorption reaction Methods 0.000 claims abstract description 7
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- 239000011347 resin Substances 0.000 claims description 104
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 91
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- SXVPOSFURRDKBO-UHFFFAOYSA-N Cyclododecanone Chemical compound O=C1CCCCCCCCCCC1 SXVPOSFURRDKBO-UHFFFAOYSA-N 0.000 claims description 48
- 239000003054 catalyst Substances 0.000 claims description 37
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 27
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 23
- 229930185605 Bisphenol Natural products 0.000 claims description 22
- -1 cycloalkane compound Chemical class 0.000 claims description 19
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 14
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 13
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- 125000003710 aryl alkyl group Chemical group 0.000 claims description 8
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- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
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- SXOZDDAFVJANJP-UHFFFAOYSA-N cyclodecanone Chemical compound O=C1CCCCCCCCC1 SXOZDDAFVJANJP-UHFFFAOYSA-N 0.000 claims description 2
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- IIRFCWANHMSDCG-UHFFFAOYSA-N cyclooctanone Chemical compound O=C1CCCCCCC1 IIRFCWANHMSDCG-UHFFFAOYSA-N 0.000 claims description 2
- 239000012948 isocyanate Substances 0.000 claims description 2
- 150000002513 isocyanates Chemical class 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
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- 229940106691 bisphenol a Drugs 0.000 description 31
- 229920003986 novolac Polymers 0.000 description 30
- 230000000052 comparative effect Effects 0.000 description 29
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 29
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- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
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- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
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- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
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- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 5
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 5
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- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 5
- 229910052794 bromium Inorganic materials 0.000 description 5
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- 229910052698 phosphorus Inorganic materials 0.000 description 5
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- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 4
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical class NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 4
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 4
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 4
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- 229910052782 aluminium Inorganic materials 0.000 description 4
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- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 3
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
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- 150000001491 aromatic compounds Chemical class 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
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- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/03—Powdery paints
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Paints Or Removers (AREA)
- Epoxy Resins (AREA)
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| US26580609P | 2009-12-02 | 2009-12-02 | |
| US61/265,806 | 2009-12-02 |
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| KR20120101090A true KR20120101090A (ko) | 2012-09-12 |
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| TW (1) | TWI487724B (OSRAM) |
| WO (1) | WO2011068645A1 (OSRAM) |
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| KR20150037568A (ko) * | 2013-09-30 | 2015-04-08 | 주식회사 엘지화학 | 반도체 패키지용 열경화성 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 |
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| KR20120101096A (ko) * | 2009-12-02 | 2012-09-12 | 다우 글로벌 테크놀로지스 엘엘씨 | 에폭시 수지 조성물 |
| CN102666638B (zh) * | 2009-12-02 | 2015-01-14 | 陶氏环球技术有限责任公司 | 复合材料组合物 |
| US8937114B2 (en) | 2009-12-02 | 2015-01-20 | Dow Global Technologies Llc | Coating compositions |
| EP2563754A1 (en) | 2010-04-29 | 2013-03-06 | Dow Global Technologies LLC | Polycyclopentadiene polyphenol and polycyanate polycyclopentadiene polyphenol compounds |
| WO2011136845A1 (en) | 2010-04-29 | 2011-11-03 | Dow Global Technologies Llc | Vinylbenzyl ethers of polycyclopentadiene polyphenol |
| US8519066B2 (en) | 2010-04-29 | 2013-08-27 | Dow Global Technologies Llc | Poly(allyl ethers) of polycyclopentadiene polyphenol |
| BR112014018939B1 (pt) | 2012-02-24 | 2021-02-23 | Dow Global Technologies Llc | Poliglicidil éteres, métodos para preparar os compostos, composiçõescuradas e adutos |
| EP2791193B1 (en) | 2012-02-24 | 2016-01-13 | Dow Global Technologies LLC | Polycyanates of cyclododecane polyphenols and thermosets thereof |
| JP2014034629A (ja) * | 2012-08-08 | 2014-02-24 | Mitsubishi Chemicals Corp | エポキシ樹脂組成物、硬化物及び半導体封止材 |
| WO2016002911A1 (ja) * | 2014-07-04 | 2016-01-07 | 三菱化学株式会社 | 樹脂、感光性樹脂組成物、硬化物、カラーフィルタ及び画像表示装置 |
| EP3263628A1 (en) * | 2016-06-27 | 2018-01-03 | Hexcel Composites Limited | Particulate curing components |
| KR20230102201A (ko) * | 2021-12-30 | 2023-07-07 | 솔루스첨단소재 주식회사 | 고온안정성 에폭시 수지 조성물 및 이를 포함하는 봉지재 |
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| US3018262A (en) | 1957-05-01 | 1962-01-23 | Shell Oil Co | Curing polyepoxides with certain metal salts of inorganic acids |
| DE1495841A1 (de) * | 1964-10-27 | 1969-04-10 | Bayer Ag | Verfahren zur Herstellung hochmolekularer Polycarbonate |
| CH571511A5 (OSRAM) | 1972-04-21 | 1976-01-15 | Ciba Geigy Ag | |
| US4129488A (en) * | 1976-11-08 | 1978-12-12 | Scm Corporation | Ultraviolet curable epoxy-polyester powder paints |
| US4438241A (en) | 1982-12-27 | 1984-03-20 | General Electric Company | Heat resistant polyarylates |
| US4638027A (en) | 1982-12-27 | 1987-01-20 | General Electric Company | Polycarbonate exhibiting improved heat resistance from cycloalkylidene diphenol |
| US4707534A (en) | 1986-12-09 | 1987-11-17 | Minnesota Mining And Manufacturing Company | Glycidylethers of fluorene-containing bisphenols |
| US4925901A (en) | 1988-02-12 | 1990-05-15 | The Dow Chemical Company | Latent, curable, catalyzed mixtures of epoxy-containing and phenolic hydroxyl-containing compounds |
| NO170326C (no) | 1988-08-12 | 1992-10-07 | Bayer Ag | Dihydroksydifenylcykloalkaner |
| US5463091A (en) | 1989-01-17 | 1995-10-31 | The Dow Chemical Company | Diglycidyl ether of 4,4'-dihydroxy-α-methylstilbene |
| EP0384940B1 (de) | 1989-03-03 | 1994-06-22 | Siemens Aktiengesellschaft | Epoxidharzmischungen |
| ZA913801B (en) * | 1990-05-21 | 1993-01-27 | Dow Chemical Co | Latent catalysts,cure-inhibited epoxy resin compositions and laminates prepared therefrom |
| US5135993A (en) | 1990-09-11 | 1992-08-04 | Dow Corning Corporation | High modulus silicones as toughening agents for epoxy resins |
| US5369192A (en) * | 1993-06-28 | 1994-11-29 | Minnesota Mining And Manufacturing Company | Binder resin for resin transfer molding preforms |
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| GB9411367D0 (en) | 1994-06-07 | 1994-07-27 | Ici Composites Inc | Curable Composites |
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-
2010
- 2010-11-10 US US13/512,657 patent/US8937114B2/en not_active Expired - Fee Related
- 2010-11-10 KR KR1020127016669A patent/KR20120101090A/ko not_active Ceased
- 2010-11-10 CN CN201080054828.5A patent/CN102648247B/zh not_active Expired - Fee Related
- 2010-11-10 WO PCT/US2010/056105 patent/WO2011068645A1/en not_active Ceased
- 2010-11-10 JP JP2012542035A patent/JP5871326B2/ja not_active Expired - Fee Related
- 2010-11-10 SG SG2012040747A patent/SG181486A1/en unknown
- 2010-11-10 EP EP20100779885 patent/EP2507325B1/en not_active Not-in-force
- 2010-12-01 TW TW099141669A patent/TWI487724B/zh not_active IP Right Cessation
-
2014
- 2014-12-15 US US14/569,907 patent/US9340702B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150037568A (ko) * | 2013-09-30 | 2015-04-08 | 주식회사 엘지화학 | 반도체 패키지용 열경화성 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 |
| US11535750B2 (en) | 2013-09-30 | 2022-12-27 | Lg Chem, Ltd. | Thermosetting resin composition for semiconductor package and prepreg and metal clad laminate using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102648247B (zh) | 2015-10-14 |
| WO2011068645A1 (en) | 2011-06-09 |
| EP2507325B1 (en) | 2014-05-21 |
| US9340702B2 (en) | 2016-05-17 |
| US8937114B2 (en) | 2015-01-20 |
| CN102648247A (zh) | 2012-08-22 |
| US20150099831A1 (en) | 2015-04-09 |
| JP2013512989A (ja) | 2013-04-18 |
| SG181486A1 (en) | 2012-07-30 |
| EP2507325A1 (en) | 2012-10-10 |
| JP5871326B2 (ja) | 2016-03-01 |
| TWI487724B (zh) | 2015-06-11 |
| US20120238668A1 (en) | 2012-09-20 |
| TW201130875A (en) | 2011-09-16 |
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