KR20120083854A - 조정 장치, 레이저 가공 장치 및 조정 방법 - Google Patents

조정 장치, 레이저 가공 장치 및 조정 방법 Download PDF

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Publication number
KR20120083854A
KR20120083854A KR1020120004842A KR20120004842A KR20120083854A KR 20120083854 A KR20120083854 A KR 20120083854A KR 1020120004842 A KR1020120004842 A KR 1020120004842A KR 20120004842 A KR20120004842 A KR 20120004842A KR 20120083854 A KR20120083854 A KR 20120083854A
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KR
South Korea
Prior art keywords
shape
workpiece
laser
pattern
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020120004842A
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English (en)
Korean (ko)
Inventor
류이찌 야마자끼
Original Assignee
올림푸스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 올림푸스 가부시키가이샤 filed Critical 올림푸스 가부시키가이샤
Publication of KR20120083854A publication Critical patent/KR20120083854A/ko
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
KR1020120004842A 2011-01-18 2012-01-16 조정 장치, 레이저 가공 장치 및 조정 방법 Withdrawn KR20120083854A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2011-008119 2011-01-18
JP2011008119A JP5791908B2 (ja) 2011-01-18 2011-01-18 調整装置、レーザ加工装置および調整方法

Publications (1)

Publication Number Publication Date
KR20120083854A true KR20120083854A (ko) 2012-07-26

Family

ID=46519495

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120004842A Withdrawn KR20120083854A (ko) 2011-01-18 2012-01-16 조정 장치, 레이저 가공 장치 및 조정 방법

Country Status (4)

Country Link
JP (1) JP5791908B2 (enrdf_load_stackoverflow)
KR (1) KR20120083854A (enrdf_load_stackoverflow)
CN (1) CN102601519A (enrdf_load_stackoverflow)
TW (1) TW201235140A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11069762B2 (en) 2018-03-09 2021-07-20 Samsung Display Co., Ltd. Display device
KR20220139622A (ko) * 2021-04-08 2022-10-17 주식회사휴비스 레이저 가공장치 보정 시스템 및 레이저 가공장치 보정방법

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102879905B (zh) * 2012-09-13 2015-10-28 北京国科世纪激光技术有限公司 一种用于观察光斑方位变换的装置和光束整形方法
CN102922133B (zh) * 2012-11-09 2015-09-16 武汉市楚源光电有限公司 一种自动光学检测激光焊接系统
CN103192165A (zh) * 2013-03-20 2013-07-10 黑龙江科技学院 基于视觉跟踪的六自由度焊接机器人
JP6305013B2 (ja) * 2013-10-28 2018-04-04 株式会社ディスコ 加工装置
CN103639599B (zh) * 2013-12-20 2016-07-06 大族激光科技产业集团股份有限公司 一种激光去毛刺系统及方法
JP6341731B2 (ja) * 2014-04-07 2018-06-13 三菱日立パワーシステムズ株式会社 肉盛溶接装置、エロージョンシールドの形成方法及び動翼製造方法
JP2016146403A (ja) * 2015-02-06 2016-08-12 株式会社ディスコ レーザー加工装置
JP6355580B2 (ja) * 2015-03-20 2018-07-11 株式会社キーエンス レーザマーキング装置、該レーザマーキング装置を用いて印字結果を確認する印字確認方法及びコンピュータプログラム
JP6831302B2 (ja) * 2017-06-21 2021-02-17 トヨタ自動車株式会社 レーザ加工品の製造方法および電池の製造方法
CN109027974B (zh) * 2018-06-20 2020-05-26 Oppo（重庆）智能科技有限公司 一种光源位置调整装置及调整方法
JP6904927B2 (ja) 2018-07-30 2021-07-21 ファナック株式会社 ロボットシステムおよびキャリブレーション方法
JP7180245B2 (ja) * 2018-09-27 2022-11-30 日本電産株式会社 加工機械用データ処理装置及び加工機械用データ管理システム
CN111872544B (zh) * 2020-07-31 2022-01-18 深圳市学而用科技有限公司 激光出光指示点的标定方法、装置和振镜同轴视觉系统
CN116754189B (zh) * 2023-06-21 2024-12-31 金华飞光科技有限公司 一种dmd的微镜偏转角度检测方法及装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5119728B2 (ja) * 2007-05-08 2013-01-16 ソニー株式会社 レーザ加工装置の較正方法及びレーザ加工装置
JP5090121B2 (ja) * 2007-10-01 2012-12-05 オリンパス株式会社 調整装置、レーザ加工装置、調整方法、および調整プログラム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11069762B2 (en) 2018-03-09 2021-07-20 Samsung Display Co., Ltd. Display device
KR20220139622A (ko) * 2021-04-08 2022-10-17 주식회사휴비스 레이저 가공장치 보정 시스템 및 레이저 가공장치 보정방법

Also Published As

Publication number Publication date
CN102601519A (zh) 2012-07-25
TW201235140A (en) 2012-09-01
JP5791908B2 (ja) 2015-10-07
JP2012148302A (ja) 2012-08-09

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PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20120116

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid