CN102601519A - 调整装置、激光加工装置和调整方法 - Google Patents
调整装置、激光加工装置和调整方法 Download PDFInfo
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- CN102601519A CN102601519A CN2012100127855A CN201210012785A CN102601519A CN 102601519 A CN102601519 A CN 102601519A CN 2012100127855 A CN2012100127855 A CN 2012100127855A CN 201210012785 A CN201210012785 A CN 201210012785A CN 102601519 A CN102601519 A CN 102601519A
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- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000003754 machining Methods 0.000 title abstract description 5
- 230000009466 transformation Effects 0.000 claims abstract description 73
- 108091008695 photoreceptors Proteins 0.000 claims description 26
- 238000005286 illumination Methods 0.000 claims description 25
- 230000003287 optical effect Effects 0.000 claims description 15
- 230000005855 radiation Effects 0.000 claims description 14
- 230000003760 hair shine Effects 0.000 claims description 7
- 230000002950 deficient Effects 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000004364 calculation method Methods 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 description 42
- 230000008569 process Effects 0.000 description 21
- 238000006243 chemical reaction Methods 0.000 description 17
- 230000001678 irradiating effect Effects 0.000 description 16
- 230000005540 biological transmission Effects 0.000 description 9
- 238000003860 storage Methods 0.000 description 9
- PXFBZOLANLWPMH-UHFFFAOYSA-N 16-Epiaffinine Natural products C1C(C2=CC=CC=C2N2)=C2C(=O)CC2C(=CC)CN(C)C1C2CO PXFBZOLANLWPMH-UHFFFAOYSA-N 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 230000005484 gravity Effects 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 230000008439 repair process Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 206010070834 Sensitisation Diseases 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 230000008313 sensitization Effects 0.000 description 2
- 241001269238 Data Species 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000021615 conjugation Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011008119A JP5791908B2 (ja) | 2011-01-18 | 2011-01-18 | 調整装置、レーザ加工装置および調整方法 |
JP2011-008119 | 2011-01-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102601519A true CN102601519A (zh) | 2012-07-25 |
Family
ID=46519495
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2012100127855A Pending CN102601519A (zh) | 2011-01-18 | 2012-01-16 | 调整装置、激光加工装置和调整方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5791908B2 (enrdf_load_stackoverflow) |
KR (1) | KR20120083854A (enrdf_load_stackoverflow) |
CN (1) | CN102601519A (enrdf_load_stackoverflow) |
TW (1) | TW201235140A (enrdf_load_stackoverflow) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102879905A (zh) * | 2012-09-13 | 2013-01-16 | 北京国科世纪激光技术有限公司 | 一种用于观察光斑方位变换的装置和光束整形方法 |
CN103192165A (zh) * | 2013-03-20 | 2013-07-10 | 黑龙江科技学院 | 基于视觉跟踪的六自由度焊接机器人 |
CN104552625A (zh) * | 2013-10-28 | 2015-04-29 | 株式会社迪思科 | 加工装置 |
CN109027974A (zh) * | 2018-06-20 | 2018-12-18 | Oppo(重庆)智能科技有限公司 | 一种光源位置调整装置及调整方法 |
CN110842351A (zh) * | 2018-07-30 | 2020-02-28 | 发那科株式会社 | 机器人系统和校准方法 |
CN110956175A (zh) * | 2018-09-27 | 2020-04-03 | 日本电产株式会社 | 加工机械用数据处理装置以及加工机械用数据管理系统 |
CN111872544A (zh) * | 2020-07-31 | 2020-11-03 | 深圳市学而用科技有限公司 | 激光出光指示点的标定方法、装置和振镜同轴视觉系统 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102922133B (zh) * | 2012-11-09 | 2015-09-16 | 武汉市楚源光电有限公司 | 一种自动光学检测激光焊接系统 |
CN103639599B (zh) * | 2013-12-20 | 2016-07-06 | 大族激光科技产业集团股份有限公司 | 一种激光去毛刺系统及方法 |
JP6341731B2 (ja) * | 2014-04-07 | 2018-06-13 | 三菱日立パワーシステムズ株式会社 | 肉盛溶接装置、エロージョンシールドの形成方法及び動翼製造方法 |
JP2016146403A (ja) * | 2015-02-06 | 2016-08-12 | 株式会社ディスコ | レーザー加工装置 |
JP6355580B2 (ja) * | 2015-03-20 | 2018-07-11 | 株式会社キーエンス | レーザマーキング装置、該レーザマーキング装置を用いて印字結果を確認する印字確認方法及びコンピュータプログラム |
JP6831302B2 (ja) * | 2017-06-21 | 2021-02-17 | トヨタ自動車株式会社 | レーザ加工品の製造方法および電池の製造方法 |
KR102511543B1 (ko) | 2018-03-09 | 2023-03-17 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102465812B1 (ko) * | 2021-04-08 | 2022-11-11 | 주식회사휴비스 | 레이저 가공장치 보정 시스템 및 레이저 가공장치 보정방법 |
CN116754189B (zh) * | 2023-06-21 | 2024-12-31 | 金华飞光科技有限公司 | 一种dmd的微镜偏转角度检测方法及装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5119728B2 (ja) * | 2007-05-08 | 2013-01-16 | ソニー株式会社 | レーザ加工装置の較正方法及びレーザ加工装置 |
JP5090121B2 (ja) * | 2007-10-01 | 2012-12-05 | オリンパス株式会社 | 調整装置、レーザ加工装置、調整方法、および調整プログラム |
-
2011
- 2011-01-18 JP JP2011008119A patent/JP5791908B2/ja not_active Expired - Fee Related
-
2012
- 2012-01-03 TW TW101100184A patent/TW201235140A/zh unknown
- 2012-01-16 KR KR1020120004842A patent/KR20120083854A/ko not_active Withdrawn
- 2012-01-16 CN CN2012100127855A patent/CN102601519A/zh active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102879905A (zh) * | 2012-09-13 | 2013-01-16 | 北京国科世纪激光技术有限公司 | 一种用于观察光斑方位变换的装置和光束整形方法 |
CN102879905B (zh) * | 2012-09-13 | 2015-10-28 | 北京国科世纪激光技术有限公司 | 一种用于观察光斑方位变换的装置和光束整形方法 |
CN103192165A (zh) * | 2013-03-20 | 2013-07-10 | 黑龙江科技学院 | 基于视觉跟踪的六自由度焊接机器人 |
CN104552625A (zh) * | 2013-10-28 | 2015-04-29 | 株式会社迪思科 | 加工装置 |
CN104552625B (zh) * | 2013-10-28 | 2018-02-16 | 株式会社迪思科 | 加工装置 |
CN109027974A (zh) * | 2018-06-20 | 2018-12-18 | Oppo(重庆)智能科技有限公司 | 一种光源位置调整装置及调整方法 |
CN110842351A (zh) * | 2018-07-30 | 2020-02-28 | 发那科株式会社 | 机器人系统和校准方法 |
CN110956175A (zh) * | 2018-09-27 | 2020-04-03 | 日本电产株式会社 | 加工机械用数据处理装置以及加工机械用数据管理系统 |
CN111872544A (zh) * | 2020-07-31 | 2020-11-03 | 深圳市学而用科技有限公司 | 激光出光指示点的标定方法、装置和振镜同轴视觉系统 |
CN111872544B (zh) * | 2020-07-31 | 2022-01-18 | 深圳市学而用科技有限公司 | 激光出光指示点的标定方法、装置和振镜同轴视觉系统 |
Also Published As
Publication number | Publication date |
---|---|
TW201235140A (en) | 2012-09-01 |
JP5791908B2 (ja) | 2015-10-07 |
KR20120083854A (ko) | 2012-07-26 |
JP2012148302A (ja) | 2012-08-09 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120725 |