CN102601519A - Adjustment apparatus, laser machining apparatus, and adjustment method - Google Patents
Adjustment apparatus, laser machining apparatus, and adjustment method Download PDFInfo
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- CN102601519A CN102601519A CN2012100127855A CN201210012785A CN102601519A CN 102601519 A CN102601519 A CN 102601519A CN 2012100127855 A CN2012100127855 A CN 2012100127855A CN 201210012785 A CN201210012785 A CN 201210012785A CN 102601519 A CN102601519 A CN 102601519A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
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- Laser Beam Processing (AREA)
- Lasers (AREA)
Abstract
The invention provides an adjustment apparatus, a laser machining apparatus, and an adjustment method, wherein a laser mark are irradiated on a photoconductor according to a predetermined calibration pattern to perform laser calibration, so that the accuracy of laser machining is improved. For this purpose, the photoconductor is irradiated with the laser of a shape for any calibration pattern through a spatial modulation unit (DMD) and the above pattern for the photoconductor is shot. Then the deviation value between the shot shape of the laser mark and the above calibration pattern is calculated. According to the calculated deviation value, transformation parameters for calibration so as to enable the shape of the object to be machined to be consistent with the shape of an input pattern are calculated. According to the calculated transformation parameters, the laser irradiation on the object to be machined is adjusted according to the above input pattern.
Description
Technical field
The present invention relates to a kind of adjusting device, laser processing device and method of adjustment that the irradiation of being carried out the laser after the spatial modulation by the spatial modulation element is adjusted.
Background technology
In the past, used laser processing device through the machined object irradiating laser being come machined object is processed.As processing, reparation (repair) that the defective that in the manufacture process of the describing of literal or figure, exposure, substrate, produces is carried out etc. is arranged.In addition; As substrate, flat-panel monitor (FPD:Flat Panel Display), semiconductor wafer, range upon range of printed base plates etc. such as LCD (LCD:Liquid Crystal Display), plasma display panel (PDP:Plasma Display Panel), OLED display are arranged.
In such laser processing device, be provided with the mechanical device (mechanism) that is used for according to specified position, direction, shape irradiating laser.In this mechanical device, used slit (slit) etc.In recent years, as this mechanical device, also used spatial modulation element (DMD:Digital Micromirror Device (DMD)) that tiny mirror is arranged in array-like etc.This spatial modulation element also is called as spatial light modulator (SLM:spatial light modulator).
But specified sometimes position, direction, shape and the actual position of shining laser, direction, shape are different on the result.This is because have a plurality of opticses on the light path from the LASER Light Source to the machined object, and departing from etc. of the departing from of the distortion of these opticses, installation site, installation direction can exert an influence.
Therefore, need calibrate the radiation modality of adjusting laser, make specified position, direction, shape and the actual position of shining laser, direction, shape consistent.
As this adjustment technology; Following technology is for example disclosed: calculate the parameter that is used for the light-struck image of utilization guiding is transformed to the output pattern of the laser that is used to process, adjust the irradiation position (for example with reference to patent documentation 1) of laser according to this transformation parameter that calculates.
Patent documentation 1: the open communique of Japan Patent, TOHKEMY 2009-82966 communique
Summary of the invention
The problem that invention will solve
Through aforesaid laser processing device machined object is being added man-hour, in order whether to confirm in advance according to specified position, direction, shape, and the guiding light that constitutes by visible light to the machined object irradiation.
But, because wavelength different laser and guiding light is through identical light path, thus laser with guide small the departing from of meeting generation between the light.Therefore, if utilize guiding light to carry out calibration, then have following problem: the meeting generation departs between the position of confirming through guiding light that should process and the irradiation position of the laser of reality.
Particularly under the situation of the processing that requires higher precision, exist this to depart from the quality as the machined object of product is produced the problem of very big influence.
The present invention proposes in view of aforesaid present situation; Its purpose is to provide a kind of following adjusting device, laser processing device and method of adjustment: the laser vestige that shines photoreceptor through basis calibrating pattern is according to the rules carried out laser calibration, thereby can improve the precision of Laser Processing.
The scheme that is used to deal with problems
In order to solve the above problems, adjusting device of the present invention is controlled laser processing device, and this laser processing device possesses: optical system, and it is used for the laser aiming of penetrating from LASER Light Source to carrying the platform of having put machined object; The spatial modulation unit, it is set on the light path from above-mentioned LASER Light Source to above-mentioned machined object, is made up of with the input pattern according to hope the small moving element of a plurality of arrangements and shines above-mentioned laser to above-mentioned machined object; And illumination unit; It is to the above-mentioned laser of above-mentioned machined object irradiation through the above-mentioned spatial modulation unit forming shape that is above-mentioned input pattern; This adjusting device is characterised in that; Possess: the calibrating pattern illumination unit, it is to the photoreceptor irradiation above-mentioned laser through the above-mentioned spatial modulation unit forming shape that is calibrating pattern arbitrarily; The machined object image unit, it takes the image that has shone the above-mentioned photoreceptor of above-mentioned laser through above-mentioned calibrating pattern illumination unit; The deviation value computing unit, it calculates the deviation value between the shape of shape and above-mentioned calibrating pattern of laser vestige of the image that photographs through above-mentioned machined object image unit; The transformation parameter computing unit, it is according to the deviation value that is calculated by above-mentioned deviation value computing unit, and calculating is used to proofread and correct so that the shape of above-mentioned laser on the above-mentioned machined object transformation parameter consistent with the shape of above-mentioned input pattern; And adjustment unit, it adjusts the laser radiation of carrying out to above-mentioned machined object according to above-mentioned input pattern according to the transformation parameter that is calculated by above-mentioned transformation parameter computing unit.
The effect of invention
According to the present invention owing between laser that actual work in-process uses and spatial modulation element, carry out calibration, so with existing comparing with guiding the situation of calibrating between the light, can carry out high-precision Laser Processing.
In addition, according to the present invention,, can once just carry out calibration efficiently owing to can pass through spatial modulation projection of elements calibrating pattern arbitrarily.
In addition; According to the present invention; Because can be through the calibrating pattern of spatial modulation projection of elements arbitrary shape; Even, can come the spatial modulation element is set with the pattern arrangement as avoiding this works so in the irradiation object zone, exist under the situation of the such works of the warpage make calibrating pattern.
Description of drawings
Fig. 1 is the figure that expression is used to carry out the structure of laser processing device of the present invention.
Fig. 2 is the figure of the example of expression calibrating pattern.
Fig. 3 is the figure of expression from the input pattern to the version of output pattern.
Fig. 4 is the flow chart that expression calibrating pattern coordinate detects the flow process of handling.
Fig. 5 is the flow chart as the calculation procedure of the transformation matrix T of transformation parameter of expression in first embodiment.
Fig. 6 is the figure that is used to explain method of adjustment.
Fig. 7 is the figure that is used to explain second embodiment.
Fig. 8 is the figure of the structure of the laser processing device in expression the 3rd embodiment.
Fig. 9 is the figure of calibration that is used for explaining guiding light and the laser of the 3rd embodiment.
Figure 10 is the figure that is used to explain the 5th embodiment.
Figure 11 is the figure that is used to explain the 6th embodiment.
Description of reference numerals
100,800: laser processing device; 101: platform; 102: machined object; 103: LASER Light Source; 105,121: speculum; 106:DMD (spatial modulation element); 107,109,802: semi-transparent semi-reflecting lens; 108: imaging len; 110: object lens; 111: illumination light source; 112: video camera; 113: control PC; 114: input part; 115: display part; 116: image processing part; 117: region setting part; 118: the platform control part; 119: storage part; 120: the transformation parameter calculating part; 122,123: lens; 310: irradiation pattern; 320,621:DMD transmits and uses data; 330,631: live (Live) image; 701: pattern; 702: the zone; The 801:LED light source; 1001: pattern; 1002 (1002A, 1002B, 1002C, 1002D): zone
The specific embodiment
Below, specify embodiment of the present invention with reference to accompanying drawing.
In addition, usually, " calibration " this word also is used to comprise the meaning of " adjustment " sometimes, does not comprise " adjustment " in " calibration " but in following explanation, establish.In addition, be located at that " adjustment " is meant under the situation that does not have to specify " adjustment of carrying out based on the result who calibrates ".
(first embodiment)
Fig. 1 is the figure of structure that expression is used for the laser processing device of embodiment of the present invention.
Being suitable for adjusting device of the present invention is the device of the laser processing device 100 of control that kind as shown in Figure 1.
If briefly explain this laser processing device 100, then this laser processing device 100 possesses: optical system, and it is used for the laser aiming of penetrating from LASER Light Source 103 to carrying the platform 101 of having put machined object 102; And spatial modulation cells D MD, it is set at from LASER Light Source 103 to machined object on 102 the light path, by the small moving element of a plurality of arrangements constitute with according to the input pattern of hope to machined object 102 irradiating lasers.And this laser processing device 100 possesses illumination unit, and this illumination unit is configured as the laser of the shape of input pattern through spatial modulation cells D MD to machined object 102 irradiations.
More specifically describe.
In Fig. 1, laser processing device 100 possesses: video camera 112, and it is made a video recording to carrying the surface of putting the machined object 102 on platform 101; Illumination light source 111, it is to the surface irradiation illumination light of machined object 102; LASER Light Source 103, it is to the surface irradiation laser of machined object 102; Spatial modulation element (DMD) 106, it makes the laser that penetrates from LASER Light Source 103 be deformed into spatial form arbitrarily; Control PC 113, it is used to control laser processing device 100 integral body; Platform control part 118, it is controlled Working position, makes it possible to carry out Laser Processing in position arbitrarily; Input part 114, it is used for control PC 113 is operated; Image processing part 116, it is handled the image that is photographed by video camera 112; Display part 115, the images on image after it will be handled by image processing part 116 or machined object 102 surfaces that photographed by video camera 112 are shown as live image; Region setting part 117, it can be adjusted into arbitrary shape with DMD 106; Transformation parameter calculating part 120, the transformation parameter that it is stated after calculating; Storage part 119, the transformation parameter that its storage is calculated by transformation parameter calculating part 120, calibrating pattern arbitrarily.
Laser processing device 100 is like lower device: utilization is eliminated to carry from the laser of the arbitrary shape of LASER Light Source 103 ejaculations and is put the defective on the machined object on the platform 101 102, and defective circuit pattern is processed as normal circuit pattern.At this, machined object 102 can be FPD substrate, semiconductor wafer, range upon range of printed base plate etc., also can be other common sample.
In such laser processing device 100, the laser that penetrates from LASER Light Source 103 is reflected mirror 105 reflections and incides DMD 106.
DMD 106 is according to the indication that comes Self Control PC 113, and the inclination angle of switching each tiny mirror independently is the state of each tiny mirror.For the indication of DMD 106 be for example by whether will represent should irradiating laser 2 Value Datas be arranged as the data representation of two-dimensional array shape, PC 113 sends this indication from control.
LASER Light Source 103, speculum 105 and DMD 106 are configured to: when the incident light that incides DMD 106 from speculum 105 was reflected the tiny mirror of ON state, catoptrical direction was a vertical.In addition; On the light path on the surface that is arrived machined object 102 by the tiny mirror of ON state reflection and be reflected mirror 121 and semi-transparent semi-reflecting lens 107 laser light reflected, dispose have imaging len 108, the projection optical system of semi-transparent semi-reflecting lens 109 and object lens 110.Promptly shone at the surface of machined object 102 by projection via this projection optical system by the tiny mirror laser light reflected of ON state.This projection optical system constitutes the position that the surface that makes machined object 102 and DMD 106 are in conjugation.
The inclination angle of the inclination angle of the OFF state of tiny mirror during with the ON state is different.Therefore, the incident light that incides DMD 106 from speculum 105 is reflected to the direction different with the direction that arrives speculum 121 the tiny mirror of OFF state, thereby is not irradiated on the machined object 102.In Fig. 1, the with dashed lines arrow is represented by the catoptrical light path of the tiny mirror of OFF state reflection.
Therefore, through each tiny mirror being controlled to be ON state or OFF state, whether can control with each tiny mirror with the position corresponding of laser radiation to the machined object 102.That is, through using DMD 106, can be according to position, direction, shape arbitrarily to machined object 102 irradiating lasers.
In addition, laser processing device 100 possesses illumination light source 111.
In the shooting of machined object 102, need under the situation of illumination light, from the illumination light of illumination light source 111 via lens 122 by semi-transparent semi-reflecting lens 109 reflections, and be irradiated to the surface of machined object 102 via object lens 110.In addition, also can replace video camera 112, and use CMOS (Complementary Metal-Oxide Semiconductor: camera head such as video camera CMOS complementary metal-oxide-semiconductor).
Laser and illumination light all incide the photo-electric conversion element of video camera 112 via the optical system with object lens 110, semi-transparent semi-reflecting lens 109, imaging len 108, semi-transparent semi-reflecting lens 107, lens 123 at the lip-deep reverberation of machined object 102.Thus, make a video recording in the surface of 112 pairs of machined objects 102 of video camera.
Control PC 113 control laser processing devices 100 integral body.Realize input part 114 by input equipments such as keyboard, indicating equipments.Be sent to control PC 113 from the indication of input part 114 inputs.
In addition, display part 115 is according to the indication that comes Self Control PC 113, display image, literal etc.Display part 115 for example roughly shows the image of the machined object 102 that is photographed by video camera 112 in real time.At this, also will be called " live image " by the image that video camera 112 is taken and is taken into by control PC113.
In this embodiment, control PC 113 both can be the general calculation machine, also can be special-purpose control device.Can be by any function that realizes controlling PC 113 in hardware, software, firmware and their combination.For example; Can by following PC (personal computer) Personal Computer: computer realization control such as PC113: this PC possess CPU (Central Processing Unit: CPU), ROM (Read Only Memory: read-only storage) etc. nonvolatile memory, random access memory), connecting interface between external memory such as hard disk unit and the external equipment (Random Access Memory:, and they are connected with each other through bus to be used as the RAM of workspace.CPU is loaded among the RAM and execution through the program that will be stored in hard disk unit or the computer-readable portable storage media etc., realizes controlling the function of PC 113.
Then, utilize following object lesson that the summary of action of the laser processing device 100 of first embodiment is described: machined object 102 is substrates, and laser processing device 100 is the laser repair apparatus that come repair-deficiency to the defective irradiating laser of substrate surface.
The corresponding of position relation between the pattern on obtaining the pattern that formed by above-mentioned DMD 106 and being formed on machined object 102 is exactly the calibration that is suitable in the present invention.
And aforesaid laser processing device 100 is carried out following the processing.
At first, be configured as the above-mentioned laser of the shape of calibrating pattern arbitrarily through above-mentioned DMD 106, use the image of the above-mentioned photoreceptor that video camera 112 takes above-mentioned laser illuminated to the irradiation of photoreceptor arbitrarily.Then, extract taken calibrating pattern image by image processing part 116, and detect each pattern position.
Fig. 2 is the figure of the example of expression calibrating pattern.
As shown in Figure 2, calibrating pattern is made up of the figure of the different a plurality of points of area.For example, the example of the calibrating pattern shown in Fig. 2 (1) is made up of 4 circle.
In addition, as the photoreceptor that collimating marks is carried out sensitization, for example under the situation of laser that with the high energy radiation wavelength is 1.355nm, can use raw glass (plain ガ ラ ス).In addition, be under the situation of laser of 2.266nm at wavelength, through shining, can carry out sensitization to collimating marks to the glass that has been coated with resist equably.
The laser processing device 100 that photographs the image of photoreceptor is carried out calibration.Promptly; Calculate the deviation value between the shape of shape and above-mentioned calibrating pattern of laser vestige of the above-mentioned image that photographs through transformation parameter calculating part 120; According to this deviation value that calculates, calculating is used to proofread and correct so that the shape of above-mentioned laser on the above-mentioned machined object transformation parameter consistent with the shape of above-mentioned input pattern.Then, according to the transformation parameter that aforementioned calculation goes out, the laser radiation that adjustment is carried out to above-mentioned machined object 102 according to above-mentioned input pattern.
At this, the object of calibration is described.
Fig. 3 is that expression is from the figure of input pattern to the version of output pattern.
For the ease of explanation, the reference axis of the transverse direction of the image that below will be photographed by video camera 112 is called the x axle, and the reference axis of longitudinal direction is called the y axle.In addition, the size of image is arbitrarily, but in this embodiment, supposing has 640 pixels on the x direction, 480 pixels are arranged on the y direction.In addition, this size is expressed as " 640 * 480 pixel ".(x y) comes each locations of pixels in the presentation video to group through x coordinate and y coordinate.That is, the coordinate in the upper left corner of the irradiation pattern among Fig. 3 310 and the lower right corner is respectively (0,0) and (639,479).
The irradiation pattern 310 of Fig. 3 is that expression should be to the pattern of which part irradiating laser of the image that is photographed by video camera 112.Therefore, (x y) representes the group that the positions in the irradiation pattern 310 also can be through x coordinate and y coordinate, and the size of irradiation pattern 310 and the image that is photographed by video camera 112 likewise are 640 * 480 pixels.In the example of Fig. 3, irradiation pattern 310 is expressed the laser that is equivalent to white cross shape that the black of the white cross shape that intersected by the thick line parallel with the x axle of the core that is positioned at image and the thick line parallel with the y axle to the part on the machined object 102 irradiation and background constitutes.
In this embodiment, as follows from input part 114 indication irradiation patterns 310.
At first, be used on the basis that the illumination light of illumination light source 111 is thrown light on, under the state of irradiating laser not, making a video recording by 112 pairs of machined objects 102 of video camera.Then, image processing part 116 is taken into taken image and outputs to display part 115.
Afterwards, the operator is seeing the image that outputs to display part 115, from input part 114 indication should irradiating laser scope.Via with input part 114 and the interface that is connected of control PC 113, the form with the data of the irradiation pattern 310 of the size of 640 * 480 pixels offers control PC 113 with this indication.
In addition, also can be from the data of external device (ED) to control PC 113 transmission irradiation patterns 310.For example, be under the situation of laser repair apparatus such as FPD substrate at laser processing device 100, the data that also can send irradiation patterns 310 to control PC 113 from flaw detection apparatus.Perhaps, also can be that the laser repair apparatus possesses image recognition portion, by the shape that image recognition portion comes defect recognition through image recognition processing, the data of the irradiation pattern 310 of the shape that the generation expression is identified also output to control PC 113.
The data of irradiation pattern 310 can both be provided to control PC 113 in either event.So control PC 113 generates according to irradiation pattern 310 and is used for transmitting with data 320 to the ON of each tiny mirror of DMD106 indication and the DMD of OFF.It is to represent to import the data of pattern that DMD transmits with data 320, is transmitted (promptly sending) to DMD 106.
In DMD 106, tiny mirror is aligned to the two-dimensional array shape, and (u v) representes the position of tiny mirror to group that can be through u coordinate and v coordinate.In addition, below for the purpose of simplifying the description, and the coordinate of the pixel of hypothesis in the image (x, y) (u v) has the relation of x=u and y=v with the coordinate of tiny mirror.As long as suitably dispose the initial point that tiny mirror is also suitably confirmed the uv coordinate system, this relation just can be set up, and therefore following explanation is loss of generality not.
At this, likewise supposing to represent irradiating laser and when representing not shine with black, DMD transmits also can show as black and white 2 value images with data 320 with white with irradiation pattern 310.In other words, can the DMD transmission be shown as following black and white 2 value images with data 320:, represent position (u, point v) with representing to make tiny mirror to become the white of ON state or representing to make tiny mirror to become the black of OFF state.
In this embodiment, suppose in DMD 106, to be arranged with 800 * 600 tiny mirror.That is, the number of tiny mirror is more than the pixel count of the image that is photographed by video camera 112.Therefore, expression DMD transmission is the images on every side that surround the image of expression irradiation pattern 310 with black edge (margin) with the image of data 320.Will be explained below the reason at such edge.
That is, (x, the color of y) locating (white or black) transmits with expression DMD that (u, the color of v) locating is equal with the u=x of the image of data 320, the position of v=y in the position of the image of expression irradiation pattern 310.And (u v) is under the situation in the scope of u＜0 or 640≤u or v＜0 or 480≤v, and expression DMD transmits position with the image of data 320, and (u, the color of v) locating is a black in the position.
In addition; In Fig. 3; The rectangular-shaped frame line of adularescent in DMD transmits with data 320, but this frame line is the scope that is used to express 640 * 480 pixels suitable with irradiation pattern 310 for the ease of explanation, does not represent to make the tiny mirror on the white box line to become the ON state.
In addition, in this embodiment, in DMD transmitted with data 320, the width at the edge of white box line top and the edge of bottom equated, and the width at the edge on the edge on the right and the left side also equates.But, confirm that suitably the width at edge gets final product.
Transmit with the aforesaid relation between the data 320 according to irradiation pattern 310 and DMD, control PC 113 generates the DMD transmission with data 320 according to the data of irradiation pattern 310.As stated, transmit with data 320 in order to generate DMD, control PC 113 is as long as append the edge of black simply around irradiation pattern 310.
Then, region setting part 117 is through transmitting with data 320 to DMD 106 output DMD, comes each tiny mirror in 800 * 600 tiny mirror that the indication of ON or OFF is provided.
At this, suppose not carry out adjustment, and the tiny mirror of DMD 106 itself becomes ON state or OFF state according to the DMD transmission that is provided with data 320 based on calibration, penetrate laser from LASER Light Source 103.
In this case, general, the pattern that shines the laser on the machined object 102 is different with desirable irradiation pattern 310.This is to depart from, be out of shape because in the optical system of laser processing device 100 and/or camera system, exist.
For example, might speculum, lens distortion, perhaps depart from the installation site of each structural element of laser processing device 100, perhaps exists setting angle to depart from and the parts installed after the original angle rotation.
The live image 330 of Fig. 3 is at the example that is irradiated onto the image that is photographed by video camera 112 under the situation on the machined object 102 like this with desirable irradiation pattern 310 different patterns.Therefore, the position on the live image 330 can represent that also the size of live image 330 is 640 * 480 pixels with the xy coordinate system.
In the live image 330 of Fig. 3, represented the actual illuminated part of laser with white, represent not have irradiated part with black.Live image 330 and irradiation pattern 310 are compared and can know, the cross shape of white moves to the positive direction of x axle, and then by being rotated counterclockwise about 15 degree.In fact is not so parallel mobile (displacement) and rotation from irradiation pattern 310 to the distortion of live image 330, comprises that also amplifying/dwindling is the distortion of shapes such as transformation of scale, detrusion.
Therefore,, need calibrate, adjust the irradiation of laser according to the result of calibration in order to prevent such distortion.
In this embodiment, will regard a kind of result of conversion because of the distortion that departs from, is out of shape the irradiation pattern as above-mentioned that causes that is present in laser processing device 100 as, on mathematics, modelling is carried out in this conversion.
Then, parameter and the processing of adjusting according to the parameter of being obtained of obtaining this modeled conversion on mathematics of expression through calibration is described.
At first, calibration steps is described.
The calibrating pattern that control PC 113 provides the figure by the different a plurality of points of area of that kind as shown in Figure 2 to constitute to region setting part 117.Because area is respectively different, make through image handle carry out, become easy to the calibrating pattern that region setting part 117 provides and the identification of burning between the figure at the lip-deep calibrating pattern of photoreceptor.Therefore, calibrating pattern be so long as can distinguish each point in 3 points, just can be the pattern of shape arbitrarily.
Then, burn lip-deep calibrating pattern through video camera 112 shootings at photoreceptor.Image processing part 116 detects the position of centre of gravity and the area of each figure from the image of the calibrating pattern that obtained.Likewise, image processing part 116 detects the position of centre of gravity and the area of each figure from the image of the calibrating pattern that offers region setting part 117.
Then, according to 3 points in the calibrating pattern that offers region setting part 117 and burn the position relation between 3 points in the lip-deep calibrating pattern of photoreceptor, make the transformation matrix of photosensitive surfaces from region setting part 117.
The following transformation matrix of making.
That is, will be made as the speculum coordinate figure, will be made as the irradiation coordinate figure through the position corresponding that LASER Light Source 103 burns on photosensitive surface with above-mentioned reflector position by the reflector position that region setting part 117 is made as ON.
Then, obtain transformation matrix through two following steps.
At first, as first step, obtain the irradiation coordinate figure of the speculum coordinate figure of a plurality of points and corresponding with it a plurality of points.
Through provide to region setting part 117 with DMD 106 on the 2 value images of two dimension of ON, regulation that OFF is corresponding one to one of whole tiny mirror, can adjust DMD 106.Therefore, be sent to region setting part 117, adjust the shape of the pattern that forms by DMD 106 through 2 value images with the figure that comprises position a plurality of points different of that kind as shown in Figure 2 with area.Then, through carry out the laser after the spatial modulation from LASER Light Source 103 irradiation, come photosensitive surface is carried out burning of the pattern corresponding with 2 value images.Take the image of the photosensitive surface that comprises the pattern that is burnt through video camera 112.2 value images that offer region setting part 117 and the image that burns the pattern on photosensitive surface are sent to image processing part 116, carry out the calibrating pattern coordinate and detect processing.
Fig. 4 is the flow chart that expression calibrating pattern coordinate detects the flow process of handling.
In step S401,116 pairs of image processing parts burn the image of the pattern on photosensitive surface and carry out white as pattern and with black binaryzation as a setting.As the method for binaryzation, the known method such as binary conversion treatment as long as employing is floated.Also can white be made the 2 value images that offer region setting part 117 as a setting as pattern and with black.
Then, in step S402,,, obtain the prospect binary image relevant with pattern implementing to implement expansion process after the shrink process to the image after the binaryzation.Shrink process is the processing that makes the regions contract of background, and through this shrink process, having eliminated line width is the part below the Rack.Then, to the zone of the remaining pattern of shrink process, revert to the zone of original size through expansion process.
In step S403, the isolated area of having implemented the binary image after expansion process and the shrink process is marked.The method of mark is arbitrarily, as long as be suitable for known method.
Then, in step S404, calculate the position of centre of gravity of each pattern, in step S405, calculate the area of each pattern.Then; In step S406; Size through according to the area that in step S405, calculates sorts, and the pattern of a plurality of points on the 2 value images that offer region setting part 117 and the pattern that burns a plurality of points on photosensitive surface are mapped respectively.For example, the area in the pattern of a plurality of points on the 2 value images that offer region setting part 117 is maximum pattern regards corresponding as with the maximum pattern of area in the pattern that burns a plurality of points on photosensitive surface.
Like this, obtain the pattern and the corresponding relation that burns the pattern of a plurality of points on photosensitive surface of a plurality of points on the 2 value images that offer region setting part 117.
Then, as second step,, obtain affine transformation matrix according to the irradiation coordinate figure of the speculum coordinate figure of a plurality of points and corresponding with it a plurality of points.
For example, in Fig. 3, DMD transmits with data 320 except the edge, and is identical with irradiation pattern 310.Therefore, we can say that in fact irradiation pattern 310 is exactly the input pattern to the DMD106 appointment.And live image 330 is not carry out any adjustment and producing the output pattern that in image, produces under the situation of the laser that is out of shape to irradiation on the machined object 102 accordingly with this input pattern.Therefore, can regard as from irradiation pattern 310 is owing to causing to the conversion of above-mentioned output pattern from above-mentioned input pattern to the distortion of live image 330.
In this embodiment, adopt following Mathematical Modeling: this conversion is the affine transformation of representing through transformation matrix T.That is, each element of transformation matrix T is the transformation parameter that in calibration, should calculate.
As stated, input pattern and output pattern can represent with the xy coordinate system, in addition, even regard the uv coordinate system as identical with the xy coordinate system according to u=x and v=y all the time, also is no problem for the calculating of transformation parameter.
Promptly; Mathematical Modeling in this embodiment is following: transmit with the coordinate (u in the data 320 with DMD; (x, y) the transformation matrix T through the expression affine transformation is transformed to speculum coordinate in the live image 330 (x ', y ') to irradiation coordinate in the irradiation pattern 310 that v) equates.
If it is be formulated this Mathematical Modeling, then following.
At this, be T if establish affine transformation matrix, then do
This affine transformation matrix T representes the conversion of the unique position of optional position on the laser radiation image from the DMD image.Therefore, through the DMD image being carried out linear transformation, can carry out and the laser radiation identical the picture shape arbitrarily of DMD image setting according to inverse-transform matrix T '.
Then, the processing that utilizes aforesaid calibrating pattern computational transformation matrix T is described.
Fig. 5 is the flow chart as the computational process of the transformation matrix T of transformation parameter of expression in first embodiment.
At first, in step S501, control PC 113 for example makes the calibrating pattern as Fig. 2 institute illustration and outputs to region setting part 117.In addition, control PC 113 also can read the calibrating pattern that is kept in advance in the storage part 119, to replace making calibrating pattern.
Then, in step S502, to DMD 106, the calibrating pattern that will in step S501, make is appointed as the input pattern.
Then, in step S503, control PC 113 obtains coordinate from the data of calibrating pattern.For example, under the situation of the calibrating pattern of Fig. 2 (1), control PC 113 image recognition processing through in image processing part 116, carrying out identify 4 circles from calibrating pattern, calculate and obtain the coordinate at the center (being center of gravity) of 4 circles that identified respectively.These 4 coordinates are made as coordinate a, b, c, d.
Then, in step S504, irradiating laser.That is, by region setting part 117 control DMD 106, feasible ON state and the OFF state that switches tiny mirror according to calibrating pattern.Thus, the laser that penetrates from LASER Light Source 103 is carried out spatial modulation, and this laser projection (i.e. irradiation) is arrived the surface of photoreceptor via DMD 106 according to calibrating pattern.
Then, in step S505, video camera 112 is taken photoreceptor, is taken into the data of (promptly catching) taken image from video camera 112 through control PC113.In this image, there be the output pattern corresponding with calibrating pattern.
Then, in step S506, control PC 113 obtains a ', b ', c ', this coordinate of 4 of d ' as follows from the output pattern of the image that among step S505, is taken into.
That is, control PC 113 at first is transformed to black and white 2 value images with the image that is taken into.For example, carry out this binaryzation based on the brightness value of each pixel and the comparison of threshold value.In the black and white 2 value images after conversion, the zone of white is the area part that has shone guiding light, and the zone of black is the zone of not shining guiding light.Then, control PC 113 utilizes the black and white 2 value images after the conversion, carries out following processing.
For example, under the situation of the calibrating pattern of (1) of using Fig. 2, control PC 113 is through image recognition processing, the existence and the position of identification and circle or oval approximate shape.Consequently identify 4 shapes.In the example of the calibrating pattern of Fig. 2 (1), suppose according to the area order from small to large of 4 circles corresponding with an a, b, c, d respectively.Therefore, control PC 113 calculates the area of 4 shapes that identified, and according to its area order from small to large shape and some a ', b ', c ', d ' is mapped.And then control PC 113 calculates the coordinate of 4 shapes center of gravity separately that is identified, and obtains these 4 coordinates and is used as a ', b ', c ', this coordinate of 4 of d '.
Then, in step S507, control PC 113 calculates aforesaid transformation matrix T.Then, the data with the transformation matrix T that makes are kept in the storage parts 119 such as RAM or hard disk.
Then, method of adjustment in first embodiment is described.
Fig. 6 is the figure that is used to explain method of adjustment.
In the first embodiment, the control PC 113 of Fig. 2 reads transformation matrix T and the inverse-transform matrix T ' that calculates and be kept in the storage part 119.In addition, as the inverse matrix (=T of transformation matrix T
-1) calculate inverse-transform matrix T '.That is, inverse-transform matrix T ' is the inverse transformation parameter that expression utilizes the inverse transformation of the conversion that the transformation matrix T as transformation parameter carries out.In addition, the data of inverse-transform matrix T ' also are stored in the storage part 119.
In addition, control PC 113 receives irradiation pattern 310 from input part 114, generates DMD and transmits with data 320.And then, utilize inverse-transform matrix T ' that the DMD transmission is carried out conversion with data 320 and generate the DMD transmission, and output to region setting part 117 with data 621.
Then, region setting part 117 transmits DMD and is appointed as the input pattern that sends to DMD 106 with data 621, controls DMD 106.That is, control PC 113 has following function: via region setting part 117, to DMD 106, the DMD transmission is appointed as the input pattern with data 621.
In example shown in Figure 6, with Fig. 3 likewise, transformation matrix T representes will be to the conversion of moving and synthesizing gained by the rotation of counterclockwise about 15 degree of the positive direction of x axle.Therefore, in Fig. 6, utilizing DMD that inverse-transform matrix T ' conversion obtains to transmit with data 621 is DMD to be transmitted with the pattern of data 320 about 15 spend and move the pattern of gained afterwards to the negative direction of x axle by turning clockwise.
Then, when for corrective pitting when LASER Light Source 103 has penetrated laser, this laser transmits with data 621 as the DMD106 that imports patterns via designated DMD, and shines on the machined object 102.In this embodiment, make a video recording by 112 pairs of machined objects 102 of video camera at this, and be taken into image from video camera 112.The image that is taken into like this is the live image 631 of Fig. 6.
As shown in Figure 6, appear in the output pattern in the live image 631 owing to cancel out each other, so become the pattern that equates with irradiation pattern 310 because of the distortion of inverse-transform matrix T ' generations with because of the distortion of transformation matrix T generation.
Like this; Output pattern on the live image 631 equates with irradiation pattern 310; This means: through by the adjustment carried out of control PC 113, according to the shape that should process to the correct position ground irradiating laser that should process, and with should correct irradiation shooting being live image 631.
In addition; Transmission compares and can know with data 621 with DMD with data 320 through DMD is transmitted; The result who utilizes inverse-transform matrix T ' to carry out conversion is; In DMD transmitted with data 621, the white portion that expression should make tiny mirror become the ON state might exceed the scope of u＜0 or 640≤u or v＜0 or 480≤v.Therefore, in this embodiment, used the DMD 106 of the tiny mirror of (for example 800 * 600) more than the pixel count (for example 640 * 480 pixels) of image that possesses expression irradiation pattern 310.In this case, like Fig. 3, shown in Figure 6, the input pattern of DMD 106 appointments is represented that promptly the image that DMD transmits with data 320 is the image on every side that surrounds the image of expression irradiation pattern 310 with the edge of black (promptly representing not irradiates light).
More than, explained to be suitable for first embodiment of the present invention.
According to this embodiment, between laser that actual work in-process uses and DMD 106, carry out calibration, therefore, comparing, can carry out high-precision Laser Processing with guiding the calibration of carrying out between the light with existing.
Then, explain and be suitable for second embodiment of the present invention.
(second embodiment)
Second embodiment is following embodiment: after the processing of carrying out in the first embodiment, the precalculated position of the laser radiation that will use in the processing that is used for corrective pitting is presented at display part 115.
Fig. 7 is the figure that is used to explain second embodiment.
That is, irradiation is carried out adjusted laser as first embodiment before, take the surface of machined object 102 through video camera 112.Then, overlap onto the state on the image of the machined object 102 that for example as Fig. 7 (1), has formed pattern 701 with zone 702, be presented on the display part 115 illuminated laser.At this, the zone 702 of predetermined irradiating laser can be a housing as Fig. 7 (2), also can as (3), fill, can also be overlapping translucently as (4).
Because will shine presumptive area like this is presented on the display part 115, so need in structure, not append the light source that the such guiding light of prior art is used.
Then, explain and be suitable for the 3rd embodiment of the present invention.
(the 3rd embodiment)
The 3rd embodiment has appended in the structure of first embodiment and has been used for as guiding light and the light source that utilizes.
Fig. 8 is the figure of the structure of the laser processing device in expression the 3rd embodiment.
Laser processing device 800 also possesses the LED (light emitting diode: light source 801 Light Emitting Diode) of guiding usefulness on the basis of the laser processing device 100 that uses Fig. 1 explanation.Incided speculum 105 from the light of led light source 801 irradiation (below be called " guiding light ") by semi-transparent semi-reflecting lens 802 reflections.This guiding light is used to show the Laser Processing position to the operator in advance.
At this, LASER Light Source 103, semi-transparent semi-reflecting lens 802 and led light source 801 are configured to make the optical axis of the laser that has seen through semi-transparent semi-reflecting lens 802 with consistent by the optical axis of the guiding light of semi-transparent semi-reflecting lens 802 reflections.Therefore, identical by the light path of the guiding light after semi-transparent semi-reflecting lens 802 reflection with light path from the laser of LASER Light Source 103, guide light also likewise to shine machined object 102 with laser.
This guiding light has identical light path with laser, but under the situation of not carrying out the parfocalization adjustment, small departing from is arranged on the surface of machined object 102.Therefore, if carry out as the calibration of the patent documentation 1 existing utilization guiding light disclosed after utilize laser to process, process with then can producing small deviation.
In this embodiment,, carry out high-precision Laser Processing through between guiding light and laser, carrying out calibration.
Promptly; Shine photoreceptor after making the shape that guides light to be configured as calibrating pattern; Take the image of the photoreceptor of illuminated guiding light; Wherein, whether shine on the machined object 102 according to the shape of input pattern in order to confirm laser, and with above-mentioned guiding light via the irradiation optical system that has constituted the identical light path that guiding light and laser had to machined object 102.Then; Calculate the deviation value between the shape of shape and laser vestige of guiding light vestige of captured image; According to and the shape of the shape of the laser vestige that likewise calculates of first embodiment and calibrating pattern between the shape of shape and laser vestige of deviation value, guiding light vestige between deviation value, the computational transformation parameter.
Fig. 9 is used for explaining the guiding light of the 3rd embodiment and the figure of the calibration between the laser.
At first, adjusting under the state of calibrating pattern, obtaining respectively with the resulting image of surface irradiation light (Fig. 9 (5)) that guides light (white) and laser (black) to machined object 102 to DMD 106.
Then, to the image that is obtained, utilize the method for using in the first embodiment to obtain the coordinate ((1) of Fig. 9, (2)) of each calibrating pattern.According to this calibrating pattern coordinate that is obtained, the corresponding relation that obtains between guiding light and the laser is used as transformation matrix T2 (Fig. 9 (6)).
Then, the method for utilizing first embodiment to put down in writing, the corresponding relation that obtains between DMD 106 and the guiding light is used as transformation matrix T 1 ((3) of Fig. 9, (4)).Through the mask images (Fig. 9 (8)) to DMD 106 adjustment multiply by transformation matrix T1, can carry out emulation (Fig. 9 (9)) to the state that guides illumination to be mapped to machined surface thus.And then, through multiply by transformation matrix T2, can carry out emulation (Fig. 9 (10)) to the state of machined surface to laser radiation.
Then, be used as transformation matrix T through calculating the state that transformation matrix T1 multiply by transformation matrix T2, thus irradiating laser and only carry out the calibration between DMD 106 and the laser not through guiding light.
In addition, also can utilize laser to come analog designation light with on the contrary above-mentioned.
Then, explain and be suitable for the 4th embodiment of the present invention.
(the 4th embodiment)
The 4th embodiment is to carry out through the laser processing device of the structure identical with above-mentioned the 3rd embodiment.
Under the situation of the structure that as above-mentioned the 3rd embodiment, is to use guiding light, because the influence of the angle of diffraction on the DMD 106 produces position deviation between guiding light and Laser Processing shape.Therefore, when the operator confirms Working position through display part 115 grades, observe guiding light sometimes and depart from from the Working position of reality.
Therefore, in this 4th embodiment, before processing, DMD 106 is set the mask pattern that the guiding light are used, DMD 106 is set processing use mask pattern being about to first being processed.Thus, can eliminate visible the departing from that guides between light and the Laser Processing position.
That is,, machined object 102 is moved to Working position, made a video recording in the surface of machined object 102 afterwards through controlling carrying the platform 101 of having put machined object 102 according to indication from platform control part 118.Then, handle, but make the mask images that the part beyond the machining area is covered through the image of carrying out by image processing part 116.Then, according to the transformation matrix that utilizes guiding light and Laser Processing vestige to produce, make guiding light and use mask with mask and processing.
Then, use mask to the guiding light of DMD 106 adjustment mades.So,, therefore, make the guiding light representations under the state that does not depart from the display part 115 go out the Working position of machined object 102 because the mask that guiding light is used is adjusted.
Then, when the emission of laser was ready to complete, mask was used in 106 adjustment processing to DMD, behind irradiating laser, DMD 106 adjustment guiding light was used mask, thus, can also confirm the precision of Working position.
Then, explain and be suitable for the 5th embodiment of the present invention.
(the 5th embodiment)
Figure 10 is the figure that is used to explain the 5th embodiment.
In above-mentioned each embodiment, in order to carry out calibration accurately, expectation be the barrier that in the zone 1002 (Figure 10 (1)) of irradiation calibrating pattern, does not have the shot shape distortion that makes pattern 1001 grades.If irradiating laser (Figure 10 (2)) on pattern 1001 three-dimensional bodies such as grade, the machining state of the image of the calibrating pattern of then being taken by video camera 112 becomes the state of distortion unevenly.
Such image is in the state that calibrating pattern has been out of shape unevenly, and therefore, handling through the image of image processing part 116 that calibrating pattern position, the center of gravity measured have with the pixel is the error of unit, therefore is difficult to carry out accurately calibration.
Therefore,, need to prepare not form the substrate of pattern 1001, perhaps shine calibrating pattern to the regional 1002A that does not form pattern 1001,1002B, 1002C, 1002D (Figure 10 (3)) in order to carry out calibration accurately.
In this 5th embodiment, carry out as follows and handle.
At first, through the unit of detection background, the detection background part.Following method for example can be enumerated in the unit of this detection background: through to the background image (Figure 10 (4)) of having eliminated pattern 1001 through diffusion filter (Pot か Off イ Le タ one) with catch image (Figure 10 (5)) and carry out calculus of differences, detect institute and appear pattern 1001 zone (4 rectangular areas of the black of Figure 10 (6)) in addition that in one's mind.
Then, as carrying out in above-mentioned each embodiment, with the position (Figure 10 (7)) of calibration pattern arrangement in converging on background parts.
Promptly; According to making above-mentioned calibrating pattern from the information of catching the resulting surface of image, the part except that the foregoing circuit pattern part making from the above-mentioned laser radiation of LASER Light Source 103 irradiations to the surface of the machined object 102 that has formed circuit pattern as above-mentioned photoreceptor.For example, circuit pattern or the defective of avoiding above-mentioned information as the surface are made calibrating pattern.
Then, explain and be suitable for the 6th embodiment of the present invention.
(the 6th embodiment)
Being suitable for the 6th embodiment of the present invention is the embodiment of after carrying out primary calibration, carrying out calibration once more.Perhaps, be after utilizing guiding light to carry out calibration, to utilize laser to carry out the embodiment of calibration.
Figure 11 is the figure that is used to explain the 6th embodiment.
If the uniformity of the light quantity distribution of laser forfeiture; Then the speculum that makes DMD 106 all be under the state of ON under the situation of the whole surface irradiation laser of machined object 102 (Figure 11 (1)), can produce processing uneven (Figure 11 (2)) on the surface of machined object 102.
If there is execution calibration (Figure 11 (3)) under the uneven state of such processing; Then can produce the such inequality (Figure 11 (4)) of deep or light gradual change in the calibrating pattern after the processing; When carrying out the detection of calibrating pattern, be difficult to correctly detect the shape (Figure 11 (5)) of calibrating pattern through binaryzation.
Therefore; Through confirming the uneven part (Figure 11 (6)) that is produced in advance; Avoid disposing unevenly calibrating pattern (Figure 11 (7)), do not have uneven calibrating pattern (Figure 11 (8)), can correctly detect the shape (Figure 11 (9)) of calibrating pattern thereby can make.
As concrete processing, at first through obtain before the processing with process after image between difference, make difference image.In the difference image of made, only detect the part that has changed owing to processing, therefore can obtain the shot shape of laser on whole.
Then, through difference image is carried out binary conversion treatment, separate good processing part and the processing part that receives uneven influence.What expect is will calibrate pattern arrangement in the zone that is processed well by the fixing laser of light quantity distribution.Therefore, the position of calibrating pattern is moved so that it is configured on the zone that processes well through the detected quilt of binary conversion treatment.Specifically, the difference of calibrating pattern between the fixing zone of the light quantity distribution of calibrating pattern and laser tailed off and the direction of keeping off round center moves.If eliminated the difference between the fixing zone of the light quantity distribution of calibrating pattern and laser, then finished.
Through avoiding disposing unevenly pattern like this, can access good Laser Processing result (Figure 11 (8)), can detect the shape (Figure 11 (9)) of calibrating pattern well.
Then, explain and be suitable for the 7th embodiment of the present invention.
(the 7th embodiment)
As above-mentioned first embodiment～the 6th embodiment, counting of the figure that constitutes calibrating pattern is made as at 4 is illustrated, but also can not be made as 4 points, obtain transformation matrix and be made as at 2.In addition, generally being made as the N point obtains affine transformation matrix, intends affine transformation matrix, projective transformation matrix.
That kind as described above; According to being suitable for each embodiment of the present invention, process execution calibration between employed laser and the spatial modulation element in reality, therefore; Comparing, can carry out Laser Processing with existing accurately with guiding the calibration of carrying out between the light.
In addition, owing to can come projection calibrating pattern arbitrarily, can once just carry out calibration efficiently through the spatial modulation element.
In addition; Because can be through the calibrating pattern of spatial modulation projection of elements arbitrary shape; Even, also can come the spatial modulation element is set with the pattern arrangement as avoiding this works so in the irradiation object zone, exist under the situation of the such works of the warpage make calibrating pattern.
In addition, the present invention is not limited to the embodiment of above explanation etc., in the scope that does not break away from aim of the present invention, can take various structures or shape.
Claims (9)
1. an adjusting device is controlled laser processing device, and this laser processing device possesses: optical system, and it is used for the laser aiming of penetrating from LASER Light Source to carrying the platform of having put machined object; The spatial modulation unit, it is set on the light path from above-mentioned LASER Light Source to above-mentioned machined object, is made up of with the input pattern according to hope the small moving element of a plurality of arrangements and shines above-mentioned laser to above-mentioned machined object; And illumination unit, it is to the above-mentioned laser of above-mentioned machined object irradiation through the above-mentioned spatial modulation unit forming shape that is above-mentioned input pattern, and this adjusting device is characterised in that to possess:
The calibrating pattern illumination unit, it is to the photoreceptor irradiation above-mentioned laser through the above-mentioned spatial modulation unit forming shape that is calibrating pattern arbitrarily;
The machined object image unit, it takes the image that has shone the above-mentioned photoreceptor of above-mentioned laser through above-mentioned calibrating pattern illumination unit;
The deviation value computing unit, it calculates the deviation value between the shape of shape and above-mentioned calibrating pattern of laser vestige of the image that photographs through above-mentioned machined object image unit;
The transformation parameter computing unit, it is according to the deviation value that is calculated by above-mentioned deviation value computing unit, and calculating is used to proofread and correct so that the shape of above-mentioned laser on the above-mentioned machined object transformation parameter consistent with the shape of above-mentioned input pattern; And
Adjustment unit, it adjusts the laser radiation of carrying out to above-mentioned machined object according to above-mentioned input pattern according to the transformation parameter that is calculated by above-mentioned transformation parameter computing unit.
2. adjusting device according to claim 1 is characterized in that,
Above-mentioned calibrating pattern illumination unit makes guiding light be configured as the shape of above-mentioned calibrating pattern and shine above-mentioned photoreceptor through above-mentioned spatial modulation unit; Wherein, For confirm above-mentioned laser whether shine above-mentioned machined object according to the shape of above-mentioned input pattern and should guide light via above-mentioned irradiation optical system to above-mentioned machined object
Above-mentioned machined object image unit is taken the image that has shone the above-mentioned photoreceptor of above-mentioned guiding light through above-mentioned calibrating pattern illumination unit,
Above-mentioned deviation value computing unit calculates the deviation value between the shape of shape and above-mentioned laser vestige of guiding light vestige of the image that photographs through above-mentioned machined object image unit,
Above-mentioned transformation parameter computing unit calculates above-mentioned transformation parameter according to the deviation value between the shape of the shape of deviation value between the shape of the shape of above-mentioned laser vestige and above-mentioned calibrating pattern and above-mentioned guiding light vestige and above-mentioned laser vestige.
3. adjusting device according to claim 1 is characterized in that,
Also comprise calibrating pattern making unit; This calibrating pattern is made the information issuing above-mentioned calibrating pattern of unit according to the surface of the machined object that has formed circuit pattern as above-mentioned photoreceptor, makes the above-mentioned laser radiation of shining through the above-mentioned calibrating pattern illumination unit part except that the foregoing circuit pattern part in the above-mentioned surface.
4. adjusting device according to claim 3 is characterized in that,
Above-mentioned calibrating pattern is made the unit to avoid making calibrating pattern as the circuit pattern of the information on above-mentioned surface or the mode of defective.
5. adjusting device according to claim 1 is characterized in that,
Also comprise display unit, this display unit shows illuminated region overlapping through the adjusted laser of above-mentioned adjustment unit to the image of the above-mentioned machined object that is photographed by above-mentioned machined object image unit.
6. laser processing device is characterized in that possessing:
Optical system, it is used for the laser aiming of penetrating from LASER Light Source to carrying the platform of having put machined object;
The spatial modulation unit, it is set on the light path from above-mentioned LASER Light Source to above-mentioned machined object, is made up of with the input pattern according to hope the small moving element of a plurality of arrangements and shines above-mentioned laser to above-mentioned machined object;
The trial fire unit, it is to the photoreceptor irradiation above-mentioned laser through the above-mentioned spatial modulation unit forming shape that is above-mentioned input pattern;
The machined object image unit, it takes the image that has shone the above-mentioned photoreceptor of above-mentioned laser through above-mentioned trial fire unit;
The deviation value computing unit, it calculates the deviation value between the shape of shape and above-mentioned input pattern of laser vestige of the image that photographs through above-mentioned machined object image unit;
The transformation parameter computing unit, it is according to the deviation value that is calculated by above-mentioned deviation value computing unit, and calculating is used to proofread and correct so that the shape of above-mentioned laser on the above-mentioned machined object transformation parameter consistent with the shape of above-mentioned input pattern; And
Adjustment unit, it adjusts the laser radiation of carrying out to above-mentioned machined object according to above-mentioned input pattern according to the transformation parameter that is calculated by above-mentioned transformation parameter computing unit.
7. laser processing device according to claim 6 is characterized in that,
Above-mentioned trial fire unit makes guiding light be configured as the shape of above-mentioned input pattern and shine above-mentioned photoreceptor through above-mentioned spatial modulation unit; Wherein, For confirm above-mentioned laser whether shine above-mentioned machined object according to the shape of above-mentioned input pattern and should guide light via above-mentioned irradiation optical system to above-mentioned machined object
Above-mentioned machined object image unit is taken the image that has shone the above-mentioned photoreceptor of above-mentioned guiding light through above-mentioned trial fire unit,
Above-mentioned deviation value computing unit calculates the deviation value between the shape of shape and above-mentioned laser vestige of guiding light vestige of the image that photographs through above-mentioned machined object image unit,
Above-mentioned transformation parameter computing unit calculates above-mentioned transformation parameter according to the deviation value between the shape of the shape of deviation value between the shape of the shape of above-mentioned laser vestige and above-mentioned input pattern and above-mentioned guiding light vestige and above-mentioned laser vestige.
8. laser processing device according to claim 6 is characterized in that,
Also comprise illumination unit, this illumination unit adjusts and is shaped as the above-mentioned laser of the shape of above-mentioned input pattern through above-mentioned adjustment unit to above-mentioned machined object irradiation.
9. a method of adjustment is carried out following step by the computer of the adjusting device that laser processing device is controlled, and this laser processing device possesses: optical system, and it is used for the laser aiming of penetrating from LASER Light Source to carrying the platform of having put machined object; The spatial modulation unit, it is set on the light path from above-mentioned LASER Light Source to above-mentioned machined object, is made up of with the input pattern according to hope the small moving element of a plurality of arrangements and shines above-mentioned laser to above-mentioned machined object; And illumination unit, it is to the above-mentioned laser of above-mentioned machined object irradiation through the above-mentioned spatial modulation unit forming shape that is above-mentioned input pattern,
Step below the aforementioned calculation machine is carried out:
To photoreceptor irradiation above-mentioned laser through the above-mentioned spatial modulation unit forming shape that is calibrating pattern arbitrarily;
The image of the above-mentioned photoreceptor of above-mentioned laser has been shone in shooting;
Calculate the deviation value between the shape of shape and above-mentioned calibrating pattern of laser vestige of taken above-mentioned image;
According to the above-mentioned deviation value that calculates, calculating is used to proofread and correct so that the shape of above-mentioned laser on the above-mentioned machined object transformation parameter consistent with the shape of above-mentioned input pattern; And
According to the above-mentioned transformation parameter that calculates, the laser radiation that adjustment is carried out to above-mentioned machined object according to above-mentioned input pattern.
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2011
- 2011-01-18 JP JP2011008119A patent/JP5791908B2/en not_active Expired - Fee Related
-
2012
- 2012-01-03 TW TW101100184A patent/TW201235140A/en unknown
- 2012-01-16 KR KR1020120004842A patent/KR20120083854A/en not_active Application Discontinuation
- 2012-01-16 CN CN2012100127855A patent/CN102601519A/en active Pending
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| CN110842351A (en) * | 2018-07-30 | 2020-02-28 | 发那科株式会社 | Robot system and calibration method |
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| CN111872544A (en) * | 2020-07-31 | 2020-11-03 | 深圳市学而用科技有限公司 | Calibration method and device for laser light-emitting indication point and galvanometer coaxial vision system |
| CN111872544B (en) * | 2020-07-31 | 2022-01-18 | 深圳市学而用科技有限公司 | Calibration method and device for laser light-emitting indication point and galvanometer coaxial vision system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012148302A (en) | 2012-08-09 |
| TW201235140A (en) | 2012-09-01 |
| JP5791908B2 (en) | 2015-10-07 |
| KR20120083854A (en) | 2012-07-26 |
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Application publication date: 20120725 |