CN104552625A - Processing device - Google Patents

Abstract

The invention provides a processing device, which can measure the processed area without taking out a processed article from the processing device after processing. The processing device comprises a measuring member which can measure the processed area of a processed article after processing. The measuring member is characterized by comprising a three-dimensional measuring member, which can measure a processed article in the X axis direction, the Y axis direction, and the Z axis direction and obtains shape information, wherein the X axis, Y axis, and Z axis are perpendicular to each other; and a processing member, which can process the information obtained by the three-dimensional measuring member and generates image information. The processing member comprises an image information generating part, which generates image information according to the Z coordinate stored in the Z coordinate storage part and the X-Y coordinates stored in the X-Y coordinate storage part; and a calculating part which can calculate the measure value of a processed article according to the generated image information. Through the processing device, a processed article can be measured without being taken out of the processing device.

Description

Processing device

technical field

The present invention relates to processing devices such as laser processing devices and cutting devices.

Background technique

Wafers such as silicon wafers, sapphire wafers, etc., which are divided by dividing lines and formed with IC (Integrated Circuit: Integrated Circuit), LSI (Large Scale Integration: Large Scale Integration) and LEDs on the surface, are divided by processing equipment The separated devices are widely used in various electronic devices such as mobile phones and computers.

For dividing wafers, a dicing method using a cutting device called a dicing machine is widely used. In the dicing method, the cutting blade is cut into the wafer while rotating at a high speed of about 30,000 rpm to cut the wafer, and the wafer is divided into individual devices. The cutting blade is fixed with abrasive grains such as diamond by metal or resin. Instead, it is formed to have a thickness of about 30 μm.

On the other hand, in recent years, a method has been proposed in which a laser-processed groove is formed on a wafer by irradiating the wafer with a pulsed laser beam having an absorbing wavelength, and the wafer is fractured along the laser-processed groove by a breaking device. Divided into individual devices.

Regarding the use of a laser processing device to form laser processing grooves, compared with the cutting method using a dicing machine, the processing speed can be increased, and even wafers made of high hardness materials such as sapphire or SiC can be processed relatively easily. processing.

In addition, since the processing groove can be formed to have a narrow width of, for example, 10 μm or less, there is an advantage that the device processing margin per wafer can be increased compared to the case of processing by dicing.

In the cutting device and the laser processing device, the state of the cutting groove or the state of the laser processing groove is imaged by an imaging device equipped with a camera such as a microscope and a CCD camera, and the processing conditions are controlled to be adjusted to optimum values.

Patent Document 1: Japanese Patent Application Laid-Open No. 5-326700

However, the image captured by the imaging device equipped with a microscope and a camera is a two-dimensional image, and the width or depth of the processing groove formed by cutting or laser processing, and the height or width of the chip can only be roughly measured, and it cannot be measured in the device. Detect the cross-sectional shape of the machining groove and the volume of chips.

Therefore, after the workpiece is processed by a cutting device or a laser processing device, it is necessary to transfer the workpiece to another measuring device and perform measurement work separately. Then, the machining conditions are adjusted based on the measurement results of the three-dimensional machining state obtained in the measurement work. The same applies to the measurement of the unevenness of grinding traces in the grinding device.

Contents of the invention

The present invention has been made in view of the above problems, and an object of the present invention is to provide a processing device capable of measuring a processing area without taking out a processed workpiece from the processing device.

According to the invention described in claim 1, there is provided a processing device including: a holding member that holds a workpiece; and a processing member that performs processing on the workpiece held by the holding member according to set processing conditions the processing feed member, which causes the holding member to face the processing member to perform processing feed; the measuring member, which measures the processing area of the processed object processed by the processing member; and the output member, It outputs the result measured by the measuring member. The processing device is characterized in that the measuring member includes: a three-dimensional measuring member that three-dimensionally measures the measured and processing means for processing the information acquired by the three-dimensional measurement means to generate image information, the three-dimensional measurement means including: an imaging element part along the X-axis direction and the Y-axis direction in the imaging element part A plurality of pixels are arranged; an interference objective lens unit, which is provided with an objective lens facing the workpiece; a light irradiation unit, which irradiates light to the workpiece through the interference objective lens unit; and a Z-axis moving unit, which makes the interference objective lens The unit moves in the Z-axis direction and generates a Z coordinate, and the processing component includes: an XY coordinate storage unit that captures the X coordinate and The Y coordinate is stored; the Z coordinate storage unit stores the Z coordinate generated by the Z axis moving unit in correspondence with the X coordinate and the Y coordinate of the pixel; The Z coordinate of the XY coordinate stored in the XY coordinate storage unit is combined three-dimensionally to generate image information; and the calculation unit calculates the measurement value of the measurement object of the workpiece based on the generated image information, and the workpiece The measurement object includes any of the following objects: the width, depth, shape and position of the processing groove formed on the workpiece by the processing member, and the width, height, and volume of debris accumulated near the processing groove and shape, as well as the width, depth and shape of the notch at the edge of the processing groove, the processed area can be measured without taking the processed object out of the processing device.

According to the invention described in claim 2, there is provided a processing device including: a holding member that holds a workpiece; and a processing member that performs processing on the workpiece held by the holding member according to set processing conditions. the processing feed member, which causes the holding member to face the processing member to perform processing feed; the measuring member, which measures the processing area of the processed object processed by the processing member; and the output member, It outputs the result measured by the measuring member, and the processing device is characterized in that the processing device includes: a three-dimensional measuring member, which is equipped with a confocal microscope, and the confocal microscope is arranged in a mutually orthogonal X-axis direction, Y-axis Three-dimensionally measure the workpiece in the Z direction and the Z-axis direction to obtain shape information; and a processing unit that processes the information obtained by the three-dimensional measurement unit and generates image information, the three-dimensional measurement unit includes: an imaging element section, in which the imaging element A plurality of pixels are arranged in the X-axis direction and the Y-axis direction in the section; a light condenser is provided with an objective lens facing the workpiece; a light irradiation section irradiates light to the workpiece through the light condenser; and A Z-axis moving unit that moves the light collector in the Z-axis direction to generate Z coordinates, the processing means includes: a captured image storage unit that stores a plurality of captured images captured by the imaging element unit; a Z coordinate storage unit , which stores the Z coordinates generated by the Z-axis moving unit in correspondence with each of the captured images; the image information generating unit, which stereoscopically combines the plurality of captured images based on the Z coordinates stored in the Z coordinate storage unit to generate image information; and a calculation unit that calculates a measurement value of a measurement object of the workpiece based on the generated image information, the measurement object of the workpiece including any of the following objects: using the processing member on the workpiece The width, depth, shape, and position of the processing groove formed, the width, height, volume, and shape of debris accumulated near the processing groove, and the width, depth, and shape of the notch at the edge of the processing groove are not After the processed workpiece is taken out from the processing device, the processing area can be measured.

According to the invention described in claim 3, there is provided a processing device including: a holding member that holds a workpiece; and a processing member that performs processing on the workpiece held by the holding member according to set processing conditions the processing feed member, which makes the holding member and the processing member perform processing feeding; the measuring member, which measures the processing area of the processed object processed by the processing member; the output member, which outputting the results measured by the measuring means; and a processing means that processes the information acquired by the measuring means to generate image information, wherein the processing device is characterized in that the measuring means is composed of a laser displacement meter, and the processing means Including: a three-dimensional position information storage unit that stores three-dimensional position information generated by the laser displacement meter; an image information generation unit that three-dimensionally combines the three-dimensional position information stored in the three-dimensional position information storage unit to generate image information; and calculating A part, which calculates the measurement value of the measurement object of the workpiece based on the generated image information, and the measurement object of the workpiece includes any of the following objects: the processing groove formed on the workpiece by the processing member The width, depth, shape and position of the processing tank, the width, height, volume and shape of the debris accumulated near the processing tank, and the width, depth and shape of the notch at the edge of the processing tank, the processed processed The processing area can be measured as soon as the object is removed from the processing device.

Preferably, the processing means further includes a reference measurement value storage unit that stores a reference measurement value used as a reference as a processing result, and the calculation unit has a comparison data generation unit that generates comparison data, the comparison data is obtained by The reference measurement value stored in the reference measurement value storage unit is constituted by the measurement value of the processing area of the workpiece processed by the processing member.

Preferably, the processing means includes a determination unit that compares a reference value with a measured value of a processed area of the workpiece processed by the processing means, and determines whether to suspend the processing by the processing means, Or change the processing conditions.

According to the processing device of the present invention, it is possible to acquire the width, height or Volume data to check the processing status.

Description of drawings

FIG. 1 is a perspective view of a laser processing apparatus including a three-dimensional measurement device according to a first embodiment.

In FIG. 2 , (A) is an exploded perspective view of the three-dimensional measurement member of the first embodiment, and (B) is a perspective view thereof.

Fig. 3 is a block diagram of a processing unit of the first embodiment.

In FIG. 4 , (A) is a schematic cross-sectional view in which laser beams are irradiated to form laser-processed grooves, and (B) is a schematic cross-sectional view showing the formed laser-processed grooves and chips.

FIG. 5 is a diagram showing an example of a measurement result of a laser-processed groove displayed on a display monitor as an output means.

In FIG. 6 , (A) is a schematic plan view of a wafer showing the state of processed grooves formed by dicing, and (B) is a schematic cross-sectional view thereof.

Fig. 7 is a block diagram of processing means in the case of employing a laser displacement meter as the three-dimensional measuring means.

In FIG. 8 , (A) is a vertical cross-sectional view of a three-dimensional measuring device according to a third embodiment, and (B) is a schematic explanatory view of an interference objective lens unit.

FIG. 9 is a graph showing the relationship between the voltage applied to the piezoelectric element and the elongation.

FIG. 10 is a diagram showing XY coordinates of pixels of an imaging element unit capturing strong light generated by an interference objective lens unit when Z-axis coordinates are at positions Z1 to Z3 .

Fig. 11 is a block diagram of a processing unit when the three-dimensional measurement unit of the third embodiment is used.

Label description

2: Laser processing device;

28: chuck table;

34: laser beam irradiation unit;

38: condenser (laser head);

48, 48A: three-dimensional measurement unit;

54: microscope unit;

56: camera (picture element unit);

62: display monitor;

64: camera image storage unit;

66: Z coordinate storage unit;

68, 68A, 68B: image information generation unit;

70: computing department;

74: reference measurement value storage unit;

76: Judgment Department;

78: Processing condition setting department;

86: semiconductor wafer;

88: device;

90: dividing the predetermined line;

91: laser beam;

92: laser processing groove;

94: debris;

95: three-dimensional image;

96: measured value;

98: compare data;

100: Cutting processing slot;

102: collapse (gap);

104: laser displacement meter;

106: three-dimensional position information storage unit;

112: interference objective lens unit;

122: objective lens;

126: reference mirror;

128: half mirror;

130: XY coordinate storage unit.

Detailed ways

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1 , there is shown a perspective view of a laser processing apparatus provided with a three-dimensional measurement member according to a first embodiment. The laser processing device 2 includes a first slider 6 mounted on the stationary base 4 so as to be movable in the Y-axis direction.

The first slider 6 moves along a pair of guide rails 14 in the indexing direction, that is, the Y-axis direction, via an indexing mechanism 12 composed of a ball screw 8 and a pulse motor 10 .

The second slider 16 is mounted on the first slider 6 so as to be movable in the X-axis direction. That is, the second slider 16 moves along a pair of guide rails 24 in the machining feed direction, that is, the X-axis direction, via the machining feed mechanism 22 constituted by the ball screw 18 and the pulse motor 20 .

The chuck table 28 is mounted on the second slider 16 via the cylindrical support member 26 , and the chuck table 28 is movable in the Y-axis direction and the X-axis direction via the index feed mechanism 12 and the machining feed mechanism 22 .

The chuck table 28 is provided with a jig 30 for clamping a ring-shaped frame that supports the wafer sucked and held on the chuck table 28 via a dicing tape.

A column 32 is erected on the stationary base 4 , and a laser beam irradiation unit 34 is mounted on the column 32 . Laser beam irradiation unit 34 is made up of following parts: laser beam generation unit, it is accommodated in the housing 36; The laser beam is irradiated onto the workpiece held on the chuck table 28 .

As shown in FIG. 2(A), a support block 40 having a concave portion 42 is fixed to the housing 36, and a ball screw 44 and a pulse motor connected to one end of the ball screw 44 are arranged on the support block 40. 46.

Reference numeral 48 denotes a three-dimensional measuring unit (three-dimensional measuring member) according to the first embodiment of the present invention. The fitting portion 50 of the three-dimensional measuring unit 48 fits into the concave portion 42 of the support block 40, and the ball screw 44 penetrates through the hole formed in the fitting portion 50. In the hole 52 , the ball screw 44 is screwed to a nut built in the fitting portion 50 .

The three-dimensional measurement unit 48 includes: a condenser (image enlarging unit) 54 that accommodates an objective lens and a confocal microscope; a camera (imaging device unit) 56 that has a CCD that captures an image enlarged by the condenser 54, etc. an imaging element; and a light irradiation unit 58 composed of white LEDs for irradiating light to the workpiece via a condenser 54 housing an objective lens and a confocal microscope.

When the pulse motor 46 is driven, the ball screw 44 rotates, and the three-dimensional measuring unit 48 moves in the vertical direction by a nut screwed with the ball screw 44 . According to the condenser 54 provided with the confocal microscope, an enlarged image in which only the in-focus portion is cut out can be obtained.

Referring to FIG. 3 , there is shown a block diagram of processing means of the first embodiment for processing information obtained by the three-dimensional measuring unit 48 of the first embodiment to generate image information. As described above, according to the condenser 54 that accommodates the confocal microscope, since only the in-focus portion is condensed in the pinhole by the confocal microscope, it is possible to cut off the light at the non-focus portion and obtain an image with good contrast. The half mirror performs raster scanning along the XY direction, and drives the lens along the Z direction, thereby building a three-dimensional image, driving the pulse motor 46 to move the three-dimensional measuring unit 48 in the up and down direction, and using the camera 56 to measure the image enlarged by the condenser 54. The image is captured.

The camera 56 captures an enlarged image of the workpiece while moving the three-dimensional measuring unit 48 vertically by a very small distance, and the captured image storage unit 64 stores a plurality of captured images.

At the same time, the height position (Z coordinate) of the three-dimensional measuring unit 48 at the time of capturing each captured image is stored in the Z coordinate storage unit 66 . As an enlarged captured image, for example, a captured image of a laser-processed groove can be cited.

In the image information generation unit 68, a plurality of captured images are stereoscopically combined based on the plurality of captured images stored in the captured image storage unit 64 and the Z coordinates at the time of acquiring each captured image stored in the Z coordinate storage unit 66 to generate a three-dimensional image information.

In the calculation unit 70 , the measurement value of the measurement target of the workpiece is calculated based on the three-dimensional image information generated by the image information generation unit 68 . The measurement object includes any of the following objects: the width, depth, shape, and position of the processing groove formed on the workpiece by the processing member (in this embodiment, the laser beam irradiation unit 34), and the accumulation on the processing surface. The width, height, volume, and shape of chips near the groove, and the width, depth, and shape of the notch at the edge of the processed groove.

A reference value serving as a criterion for judging the measured value is stored in the reference measured value storage unit 74 . The reference value is a measured value of the processing area of the workpiece that has been properly processed by the processing member. The calculation unit 70 has a comparison data generation unit 72 for generating comparison data composed of the reference measurement value stored in the reference measurement value storage unit 74 and the workpiece processed by the processing member. The measured value of the processing area constitutes.

In the determination unit 76, the reference measurement value stored in the reference measurement value storage unit 74 is compared with the measurement value of the processing area of the workpiece processed by the processing member calculated by the calculation unit 70, and it is determined whether Terminate the processing performed by the processing member, or change the processing conditions.

The processing condition setting unit 78 includes a processing condition storage unit 80 , an appropriate image information storage unit 82 , and a processing condition adjustment unit 84 . When it is determined by the determination unit 76 that the processing conditions should be changed, the processing conditions are adjusted to optimal values by the processing condition adjustment unit 84 .

On the other hand, the processing by the processing member is stopped when it is determined that the measured value of the processed area of the workpiece deviates greatly from the reference measured value, and optimum processing cannot be achieved only by changing the processing conditions. In this embodiment, the processing means is constituted by the captured image storage unit 64 , the Z coordinate storage unit 66 , the image information generation unit 68 , the calculation unit 70 , the reference measurement value storage unit 74 , and the determination unit 76 .

Next, a case where the measurement method of the three-dimensional measurement member according to the first embodiment is applied to a laser-machined groove will be described with reference to FIGS. 4 and 5 . As shown in (A) of FIG. 4 , devices 88 are formed on the front surface of a semiconductor wafer (hereinafter, sometimes simply referred to as a wafer) 86 , which is a type of workpiece, with dividing lines 90 interposed therebetween. A protective film 87 made of a water-soluble resin such as PVA (polyvinyl alcohol) or PEG (polyethylene glycol) is formed on the front surface of the wafer 86 .

Laser processing grooves 92 shown in FIG.

However, when the pulsed laser beam 91 is irradiated to the wafer 86 , heat energy is concentrated in the region irradiated with the pulsed laser beam 91 to generate debris 94 , and the debris 94 adheres to the protective film 87 .

The laser processing groove 92 is measured by the three-dimensional measuring unit 48, and based on the plurality of captured images stored in the captured image storage unit 64 and the Z coordinates when each captured image is stored in the Z coordinate storage unit 66, through the image information The generator 68 stereoscopically combines the captured images to generate three-dimensional image information.

Then, the calculation unit 70 calculates the measurement value of the laser-processed groove 92 of the wafer 86 based on the generated three-dimensional image information. The measured values include the width W1 and depth D1 of the laser-processed groove 92 , the shape and position of the laser-processed groove 92 , and the width, height, volume, and shape of debris 94 accumulated near the laser-processed groove 92 .

As shown in FIG. 5 , the three-dimensional image information 95 generated by the image information generation unit 68 and the measurement value 96 calculated by the calculation unit 70 are displayed on the display monitor 62 as output means. At the same time, comparative data 98 such as debris volume are also displayed. The comparison data 98 can also be the width, height, etc. of the chips 94 .

Next, processing grooves formed by dicing will be described with reference to FIG. 6 . (A) of FIG. 6 is a partial plan view of the wafer 86 , and (B) of FIG. 6 is a partial cross-sectional view of the wafer 86 . When the dicing groove 100 is formed along the planned dividing line 90 of the wafer 86 by dicing using a cutting tool, chips (notches) 102 are generated on both sides of the dicing groove 100 .

Therefore, the cutting groove 100 is measured by the three-dimensional measuring unit 48 , a plurality of captured images are stored in the captured image storage unit 64 , and the Z coordinates at the time of acquiring each captured image are stored in the Z coordinate storage unit 66 .

Based on the plurality of captured images stored in the captured image storage unit 64 and the Z coordinates when each captured image was acquired, the image information generating unit 68 combines the captured images stereoscopically to generate three-dimensional image information of the cutting groove 100 .

The calculation unit 70 calculates the measurement value of the dicing groove 100 formed on the wafer 86 based on the three-dimensional image information generated by the image information generation unit 68 . The measured values include the width, depth, and shape of the cutting groove 100, the width of the chipping (notch) 102 formed in the edge, and the like.

As in the case of laser processing shown in FIG. 5 , the three-dimensional image of the cut groove 100 generated by the image information generation unit 68 and the respective measurement values of the cut groove 100 calculated by the calculation unit 70 are displayed on the display monitor 62 . .

In the above-mentioned embodiment, the configuration of the three-dimensional measurement unit 48 using a confocal microscope as shown in FIG. Measure components.

That is, as shown in FIG. 7 , the laser-processed groove 92 shown in (B) of FIG. 3D location information.

In this case, the laser displacement gauge 104 is fixed to the housing 36 shown in FIG. 1 , and the chuck table 28 is moved in the X-axis direction and the Y-axis direction to obtain three-dimensional position information of the laser-processed groove 92 .

In the image information generation unit 68A, the three-dimensional position information stored in the three-dimensional position information storage unit 106 is combined stereoscopically to generate three-dimensional image information. The functions of the calculation unit 70 , the reference measurement value storage unit 74 , the determination unit 76 , and the processing condition setting unit 78 are the same as those in the first embodiment shown in FIG. 3 , and therefore description thereof will be omitted.

Thus, in this embodiment, since the laser displacement gauge 104 is used as the three-dimensional measuring means, the three-dimensional coordinates of the object to be measured can be obtained directly, and the three-dimensional position information can be stored in the three-dimensional position information storage unit 106 . In the present embodiment, the processing means is constituted by the three-dimensional position information storage unit 106 , the image information generation unit 68A, the calculation unit 70 , the reference measurement value storage unit 74 , and the determination unit 76 .

Next, a third embodiment of the present invention using an interference objective lens as a three-dimensional measurement means will be described with reference to FIGS. 8 to 11 . In the present embodiment, as shown in FIG. 2(B) , a three-dimensional measurement unit 48A is attached to the support block 40 so as to be movable up and down.

110 is a casing of the three-dimensional measurement unit 48A, and the interference objective lens unit 112 and the imaging element unit (camera) 56 are attached to the casing 110 . A light irradiation unit 118 made of white LEDs and a half mirror 120 are also arranged in the casing 110 .

When the pulse motor 46 is driven, the ball screw 44 rotates, and the three-dimensional measuring unit 48A moves in the vertical direction by a nut screwed to the ball screw 44 . Therefore, when it is desired to measure the processing area by the three-dimensional measurement unit 48A, the pulse motor 46 is driven to position the three-dimensional measurement unit 48A at the measurement start position above the measurement area.

114 is a piezoelectric element whose length is displaced (elongated) as shown in FIG. 9 , for example, in accordance with a variable voltage supplied from a power source 116 . Therefore, the height position (Z coordinate) of the interference objective lens unit 112 changes according to the displacement amount of the piezoelectric element 114 .

Referring to (B) of FIG. 8 , a schematic diagram of the interference objective lens unit 112 is shown. The interference objective lens unit 112 has: an objective lens 122 ; a reference mirror 26 arranged on a glass plate 124 ; and a half mirror 128 .

The reference mirror 126 is disposed at a position symmetrical to the focal position of the objective lens 122 with respect to the half mirror 128 . For the interference objective lens unit 112 configured in this way, there are a Milo type interference objective lens unit, a Michelson type, and the like.

The white light emitted from the white light source 118 is reflected by the half mirror 120 and is irradiated onto the surface of the workpiece through the interference objective lens unit 112 . When the reflected light from the surface of the workpiece interferes with the light reflected from the reference mirror 126, both of them overlap at the in-focus position of the objective lens 122 to generate sharp interference fringes, and thus produce Interfering light (interfering signal).

Therefore, when the voltage applied to the piezoelectric element 114 is changed and the surface of the workpiece is imaged by the imaging element unit 56 through the interference objective lens unit 112, as shown in FIG. The position of is strongly interfered, so it can be detected as point 11.

The height of the interference objective lens unit 112 is changed from Z1 to Z3 as shown in FIGS. Z1 represents a point 11 near the bottom of the laser-processed groove, Z2 represents a point 11 in the middle of the laser-processed groove, and Z3 represents a point 11 near the surface.

As shown in FIG. 11 , the X-coordinates and Y-coordinates of the pixels of the image sensor unit 56 that capture the interference light (interference signal) generated by the three-dimensional measurement unit 48A are stored in the XY coordinate storage unit 130 . At the same time, corresponding to the X-coordinate and Y-coordinate of the pixel capturing the interference light, the displacement of the piezoelectric element 114 is obtained according to the graph shown in FIG. 9 , and the displacement of the interference objective lens unit 112 is obtained according to the displacement. The Z coordinate is stored in the Z coordinate storage unit 66 .

In the image information generation unit 68B, the XY coordinates of the pixel stored in the XY coordinate storage unit 130 and the Z coordinate at the time of acquisition of the pixel stored in the Z coordinate storage unit 66 are combined stereoscopically to generate three-dimensional image information.

The calculation unit 70 calculates the measurement value of the measurement target of the workpiece based on the generated three-dimensional image information. Also, the functions of the calculation unit 70 , the reference measurement value storage unit 74 , the determination unit 76 , and the processing condition setting unit 78 are the same as those of the first embodiment shown in FIG. 3 , and thus description thereof will be omitted. In the present embodiment, the processing means is constituted by the coordinate storage unit 66 , the XY coordinate storage unit 130 , the image information generation unit 68B, the calculation unit 72 , the reference measurement value storage unit 74 , and the determination unit 76 .

In the present embodiment, the three-dimensional measurement unit 48A is constituted by the interference objective lens unit 112 . Therefore, similar to the above-mentioned first and second embodiments, it is possible to obtain three-dimensional images of processed cutting grooves, laser processing grooves, chipping, chipping, or grinding marks formed by grinding equipment, and can Immediately after the images are processed, their width, height, and volume data are obtained in the processing device to check the processing state of the processed object.

As described above, the three-dimensional measurement means includes: the confocal microscope of the first embodiment, which superimposes and processes images captured by the microscope in the height direction to generate a three-dimensional image; the laser displacement meter 104 of the second embodiment; A three-dimensional measurement unit using the interference objective lens unit 112 .

According to the processing device of the present invention equipped with the three-dimensional measuring means, a plurality of different processing conditions can be continuously implemented, and the processing state can be continuously measured for each processing condition, and the measurement results can be compared, so that the processing conditions can be efficiently determined. selected.

Next, the applicable range of the above-mentioned processing apparatus of the present invention will be briefly described. The present invention is quantitative measurement using a three-dimensional microscope, and its applicable range is classified into the following six items.

(1) Input the measurement range of good processing, and judge good or bad within this range. This quality judgment is performed by changing processing conditions such as laser output, feed speed, lens defocus, laser frequency, and beam shape.

(2) Input a good measurement range during processing and judge whether it is good or bad within this range. This good/bad judgment is performed while changing processing conditions such as laser output, feed speed, lens defocus, laser frequency, and beam shape. In the case where the measurement result is judged to be unacceptable, the processing is stopped.

(3) Input a plurality of processing conditions, and display the variation of processing results on the display. For example, graph and display machining results based on parameter changes.

(4) Input the measurement range of the good processing of the specified part, and automatically search for the optimal processing condition.

(5) The amount of change between the comparison image (reference image) and the target image includes chip accumulation, incision width, chip height, processing depth, cutting position, etc. Each variation includes multi-pass cutting in which groove formation is performed multiple times in the depth direction and multi-cut cutting in which groove formation is performed multiple times in the surface direction.

(6) Autofocus based on multiple cuts that vary the incision width and machining depth.

Claims (7)

1. A processing device comprising: a holding member that holds a workpiece; a processing member that processes the workpiece held on the holding member according to set processing conditions; a processing feed member that It causes the holding member to face the processing member to perform processing feed; the measuring member measures the processing area of the workpiece processed by the processing member; and the output member outputs the measured value measured by the measuring member. result, The processing device is characterized in that, The measurement component has: a three-dimensional measuring member that three-dimensionally measures the workpiece in mutually orthogonal X-axis directions, Y-axis directions, and Z-axis directions to obtain shape information; and processing means for processing information acquired by the three-dimensional measuring means and generating image information, The three-dimensional measurement components include: an imaging element section in which a plurality of pixels are arranged along the X-axis direction and the Y-axis direction; An interference objective lens unit having an objective lens opposite to the object to be processed; a light irradiation section that irradiates light to the workpiece through the interference objective lens unit; and a Z-axis moving part that moves the interference objective lens unit in the Z-axis direction and generates a Z coordinate, The processing components include: an XY coordinate storage unit, which stores the X coordinate and Y coordinate of the pixel of the imaging element unit that captures the interference light generated by the interference objective lens unit; a Z-coordinate storage unit that stores the Z-coordinate generated by the Z-axis moving unit in correspondence with the X-coordinate and Y-coordinate of the pixel; an image information generation unit that stereoscopically combines pixels of XY coordinates stored in the XY coordinate storage unit based on the Z coordinates stored in the Z coordinate storage unit to generate image information; and a calculation unit that calculates a measurement value of a measurement object of the workpiece based on the generated image information, The measurement object of the processed object includes any of the following objects: The width, depth, shape, and position of the processing groove formed on the workpiece by the processing member, the width, height, volume, and shape of chips accumulated near the processing groove, and the gaps at the edge of the processing groove width, depth and shape, The processed area can be measured without taking out the processed workpiece from the processing device. 2. A processing device comprising: a holding member for holding a workpiece; a processing member for processing the workpiece held on the holding member according to set processing conditions; a processing feed member for making the workpiece The holding member performs machining feed in opposition to the machining member; the measuring means measures the processing area of the workpiece processed by the machining means; and the output means outputs the result measured by the measuring means, The processing device is characterized in that, The processing device has: a three-dimensional measuring means having a confocal microscope for three-dimensionally measuring a workpiece in mutually orthogonal X-axis directions, Y-axis directions, and Z-axis directions to obtain shape information; and processing means for processing information acquired by the three-dimensional measuring means and generating image information, The three-dimensional measurement components include: an imaging element section in which a plurality of pixels are arranged along the X-axis direction and the Y-axis direction; A light collector having an objective lens facing the object to be processed; a light irradiation section that irradiates light to the workpiece through the concentrator; and a Z-axis moving section that moves the light collector in the Z-axis direction and generates a Z coordinate, The processing components include: a captured image storage unit storing a plurality of captured images captured by the imaging element unit; a Z-coordinate storage unit that stores the Z-coordinates generated by the Z-axis moving unit corresponding to each of the captured images; an image information generation unit that stereoscopically combines the plurality of captured images based on Z coordinates stored in the Z coordinate storage unit to generate image information; and a calculation unit that calculates a measurement value of a measurement object of the workpiece based on the generated image information, The measurement object of the processed object includes any of the following objects: The width, depth, shape, and position of the processing groove formed on the workpiece by the processing member, the width, height, volume, and shape of chips accumulated near the processing groove, and the gaps at the edge of the processing groove width, depth and shape, The processed area can be measured without taking out the processed workpiece from the processing device. 3. A processing device comprising: a holding member that holds a workpiece; a processing member that processes the workpiece held on the holding member according to set processing conditions; and a processing feed member that enables The holding member performs processing feed opposite to the processing member; the measuring member measures the processing area of the workpiece processed by the processing member; the output member outputs the result measured by the measuring member; processing means for processing the information acquired by the measuring means to generate image information, The processing device is characterized in that, The measuring member consists of a laser displacement meter, The processing components include: a three-dimensional position information storage unit, which stores the three-dimensional position information generated by the laser displacement meter; an image information generation unit that stereoscopically combines the three-dimensional position information stored in the three-dimensional position information storage unit to generate image information; and a calculation unit that calculates a measurement value of a measurement object of the workpiece based on the generated image information, The measurement object of the processed object includes any of the following objects: The width, depth, shape, and position of the processing groove formed on the workpiece by the processing member, the width, height, volume, and shape of chips accumulated near the processing groove, and the gaps at the edge of the processing groove width, depth and shape, The processed area can be measured without taking out the processed workpiece from the processing device. 4. The processing device according to any one of claims 1 to 3, characterized in that, The processing means further includes a reference measurement value storage unit that stores a reference measurement value as a processing result, The calculation unit has a comparison data generation unit that generates comparison data based on the reference measurement value stored in the reference measurement value storage unit and the reference measurement value of the workpiece processed by the processing member. The measured value composition of the processing area. 5. The processing device according to claim 4, characterized in that, The reference measurement value storage unit stores the reference measurement value of the workpiece that has been properly processed by the processing member. 6. The processing device according to any one of claims 1 to 3, characterized in that, The processing unit further includes a determination unit for measuring the reference value stored in the reference measurement value storage unit and the processing region of the workpiece processed by the processing member. Values are compared, and it is determined whether to suspend the processing performed by the processing component or to change the processing conditions. 7. The processing device according to any one of claims 1 to 3, characterized in that, The processing means is constituted by a laser beam irradiation means for irradiating a laser beam.