CN104552625A - Processing device - Google Patents
Processing device Download PDFInfo
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- CN104552625A CN104552625A CN201410573497.6A CN201410573497A CN104552625A CN 104552625 A CN104552625 A CN 104552625A CN 201410573497 A CN201410573497 A CN 201410573497A CN 104552625 A CN104552625 A CN 104552625A
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- machined object
- processing
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- storage part
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/20—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring workpiece characteristics, e.g. contour, dimension, hardness
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
- B23Q17/2409—Arrangements for indirect observation of the working space using image recording means, e.g. a camera
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
- B23Q17/2452—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves for measuring features or for detecting a condition of machine parts, tools or workpieces
- B23Q17/2471—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves for measuring features or for detecting a condition of machine parts, tools or workpieces of workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Laser Beam Processing (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Dicing (AREA)
Abstract
The invention provides a processing device, which can measure the processed area without taking out a processed article from the processing device after processing. The processing device comprises a measuring member which can measure the processed area of a processed article after processing. The measuring member is characterized by comprising a three-dimensional measuring member, which can measure a processed article in the X axis direction, the Y axis direction, and the Z axis direction and obtains shape information, wherein the X axis, Y axis, and Z axis are perpendicular to each other; and a processing member, which can process the information obtained by the three-dimensional measuring member and generates image information. The processing member comprises an image information generating part, which generates image information according to the Z coordinate stored in the Z coordinate storage part and the X-Y coordinates stored in the X-Y coordinate storage part; and a calculating part which can calculate the measure value of a processed article according to the generated image information. Through the processing device, a processed article can be measured without being taken out of the processing device.
Description
Technical field
The present invention relates to the processing unit (plant) such as laser processing device, topping machanism.
Background technology
Utilize segmentation preset lines to carry out dividing and the wafer such as silicon wafer, sapphire wafer being formed with multiple device such as IC (Integrated Circuit: integrated circuit), LSI (large Scale Integration: large scale integrated circuit), LED is from the teeth outwards divided into device one by one by processing unit (plant), divided go out device be widely used in the various electronic equipment such as mobile phone, computer.
In the segmentation of wafer, be widely used the cutting method using and be called as the topping machanism of scribing machine.In cutting method, make cutting tool while with the High Rotation Speed of about 30000rpm while cut wafer, cutting wafer, is device one by one by wafer separation, and described cutting tool is fixed by the abrasive particle of diamond etc. by metal or resin and be formed as thickness about 30 μm.
On the other hand, in recent years, propose there is such method: by having the pulse laser beam of absorbefacient wavelength to wafer to wafer illumination, wafer forms laser processing groove, and wafer breakage is divided into device one by one by breaker along this laser processing groove.
About utilizing laser processing device to form laser processing groove, compared with using the cutting method of scribing machine, can process velocity be accelerated, and, even the wafer be made up of the material that the hardness such as sapphire or SiC is high, also can process with comparalive ease.
In addition, due to working groove can be made to be formed as such as 10 μm such as the following narrower width, therefore there is such advantage: carry out the situation of processing with respect to cutting method, the device fabrication surplus of every 1 wafer can be increased.
In cutter sweep, laser processing device, utilize the imaging member possessing the camera such as microscope and CCD camera to make a video recording to the state of cutting slot or the state of laser processing groove, and carry out controlling that processing conditions is adjusted to optimal value.
Patent document 1: Japanese Unexamined Patent Publication 5-326700 publication
But, the image taken by imaging member possessing microscope and camera is utilized to be two dimensional image, can only rough measure based on cutting or Laser Processing and the width of working groove that formed or the degree of depth, the height of chip or width, the cross sectional shape of working groove and the volume of chip cannot be detected in device.
Therefore, after utilizing cutter sweep or laser processing device to process machined object, need machined object to be transferred to another measurement mechanism, implement separately to measure operation.Then, processing conditions is adjusted based on the measurement result at the machining state measuring the three-dimensional obtained in operation.In grinding attachment, be also identical situation to the measurement of the concavo-convex state of grinding vestige.
Summary of the invention
The present invention completes in view of the above problems, its object is to provide a kind of and machined object after processing is not taken out the processing unit (plant) can measured machining area from processing unit (plant).
Invention according to technical scheme 1, provides a kind of processing unit (plant), and described processing unit (plant) possesses: retaining member, and it keeps machined object; Tool member, it is processed the machined object be held on this retaining member according to the processing conditions of setting; Processing feeding component, it makes this retaining member and this tool member relatively carry out processing feeding; Measure component, it is measured the machining area of machined object after utilizing this tool member to process; And output link, it exports the result measured by this measurement component, the feature of described processing unit (plant) is, this measurement component possesses: three-dimensional measurement component, and it dimensionally measures machined object and obtains shape information in mutually orthogonal X-direction, Y direction and Z-direction; With process component, it processes the information synthetic image information that are obtained by this three-dimensional measurement component, and this three-dimensional measurement component comprises: imaging apparatus portion, in this imaging apparatus portion, be arranged with multiple pixel along X-direction and Y direction; Interference objective unit, it possesses the object lens opposed with machined object; Illumination part, it makes light expose to machined object by this interference objective unit; And Z axis moving part, it makes this interference objective unit move in the Z-axis direction and generate Z coordinate, this process component comprises: XY coordinate storage part, and it stores the X-coordinate of the pixel in this imaging apparatus portion of the interference light (interference signal) captured by the generation of this interference objective unit and Y-coordinate; Z coordinate storage part, its X-coordinate with this pixel and Y-coordinate store the Z coordinate generated by this Z axis moving part accordingly; Image information generation unit, it is according to the Z coordinate that stores in this Z coordinate storage part, is three-dimensionally combined in the pixel of the XY coordinate stored in this XY coordinate storage part and synthetic image information; And calculating part, it calculates the measured value of the measuring object of machined object according to the image information generated, this measuring object of machined object comprises the Arbitrary Term in following object: the width of the working groove utilizing this tool member to be formed on machined object, the degree of depth, shape and position, be deposited in the chip near this working groove width, highly, the width of the breach of the edge part of volume and shape and this working groove, the degree of depth and shape, the machined object after processing is not taken out from processing unit (plant) and just can measure machining area.
Invention according to technical scheme 2, provides a kind of processing unit (plant), and described processing unit (plant) possesses: retaining member, and it keeps machined object; Tool member, it is processed the machined object be held on this retaining member according to the processing conditions of setting; Processing feeding component, it makes this retaining member and this tool member relatively carry out processing feeding; Measure component, it is measured the machining area of machined object after utilizing this tool member to process; And output link, it exports the result measured by this measurement component, the feature of described processing unit (plant) is, this processing unit (plant) possesses: three-dimensional measurement component, it possesses confocal microscope, and described confocal microscope is dimensionally measured machined object and obtains shape information in mutually orthogonal X-direction, Y direction and Z-direction; With process component, it processes the information synthetic image information that are obtained by this three-dimensional measurement component, and this three-dimensional measurement component comprises: imaging apparatus portion, in this imaging apparatus portion, be arranged with multiple pixel along X-direction and Y direction; Concentrator, it possesses the object lens opposed with machined object; Illumination part, it makes light expose to machined object by this concentrator; And Z axis moving part, it makes this concentrator move in the Z-axis direction and generates Z coordinate, and this process component comprises: photographed images storage part, and it stores multiple photographed images of being taken by this imaging apparatus portion; Z coordinate storage part, this photographed images of itself and each stores the Z coordinate generated by this Z axis moving part accordingly; Image information generation unit, it three-dimensionally combines the plurality of photographed images and synthetic image information according to the Z coordinate that stores in this Z coordinate storage part; And calculating part, it calculates the measured value of the measuring object of machined object according to the image information generated, this measuring object of machined object comprises the Arbitrary Term in following object: the width of the working groove utilizing this tool member to be formed on machined object, the degree of depth, shape and position, be deposited in the chip near this working groove width, highly, the width of the breach of the edge part of volume and shape and this working groove, the degree of depth and shape, the machined object after processing is not taken out from processing unit (plant) and just can measure machining area.
Invention according to technical scheme 3, provides a kind of processing unit (plant), and described processing unit (plant) possesses: retaining member, and it keeps machined object; Tool member, it is processed the machined object be held on this retaining member according to the processing conditions of setting; Processing feeding component, it makes this retaining member and this tool member relatively carry out processing feeding; Measure component, it is measured the machining area of machined object after utilizing this tool member to process; Output link, it exports the result measured by this measurement component; And process component, it carries out process and synthetic image information to the information obtained by this measurement component, the feature of described processing unit (plant) is, this measurement component is made up of laser displacement gauge, this process component comprises: three dimensional local information storage part, and it stores the three dimensional local information generated by this laser displacement gauge; Image information generation unit, it is three-dimensionally combined in the three dimensional local information and synthetic image information that store in this three dimensional local information storage part; And calculating part, it calculates the measured value of the measuring object of machined object according to this image information generated, this measuring object of machined object comprises the Arbitrary Term in following object: the width of the working groove utilizing this tool member to be formed on machined object, the degree of depth, shape and position, be deposited in the chip near this working groove width, highly, the width of the breach of the edge part of volume and shape and this working groove, the degree of depth and shape, the machined object after processing is not taken out from processing unit (plant) and just can measure machining area.
Preferably, process component also comprises baseline measurements storage part, the baseline measurements becoming benchmark stores as processing result by this baseline measurements storage part, calculating part has to generate and compares the comparison data generating section of data, and the described data that compare are made up of the measured value of the machining area of the baseline measurements stored in baseline measurements storage part and the machined object after implementing processing by tool member.
Preferably, process component comprises detection unit, the measured value of described detection unit to a reference value and the machining area that implemented the machined object after processing by tool member is compared, and determines whether the processing that stops to utilize tool member to implement or change processing conditions.
According to processing unit (plant) of the present invention, can after just processing according to cutting slot, laser processing groove, collapse broken, chip or grinding vestige etc. 3-D view, cross-sectional image, in processing unit (plant), obtain the data of their width, height or volume immediately, check machining state.
Accompanying drawing explanation
Fig. 1 is the stereogram of the laser processing device of the three-dimensional measurement component possessing the 1st embodiment.
In Fig. 2, (A) is the exploded perspective view of the three-dimensional measurement component of the 1st embodiment, and (B) is its stereogram.
Fig. 3 is the block diagram of the process component of the 1st embodiment.
In Fig. 4, (A) is to wafer illumination laser beam to form the schematic sectional view of laser processing groove, and (B) illustrates the laser processing groove of formation and the schematic sectional view of chip.
Fig. 5 is the figure of the example illustrated in the measurement result as the laser processing groove that the display monitor of output link demonstrates.
In Fig. 6, (A) is schematic top view that the state of the working groove formed by cutting is shown, wafer, and (B) shows its schematic sectional view.
Fig. 7 adopts laser displacement gauge as the block diagram of process component when three-dimensional measurement component.
In Fig. 8, (A) is the longitudinal section of the three-dimensional measurement component of the 3rd embodiment, and (B) is the schematic key diagram of interference objective unit.
Fig. 9 is the curve map that the relation between voltage and elongation apply piezoelectric element is shown.
Figure 10 is figure that the pixel in the imaging apparatus portion capturing the high light generated by interference objective unit is shown, the XY coordinate of Z axis coordinate when being in Z1 ~ Z3 position.
The block diagram of process component when Figure 11 is the three-dimensional measurement component of employing the 3rd embodiment.
Label declaration
2: laser processing device;
28: chuck table;
34: laser beam irradiation unit;
38: concentrator (laser head);
48,48A: three-dimensional measurement unit;
54: microscope unit;
56: camera (imaging apparatus portion);
62: display monitor;
64: photographed images storage part;
66:Z coordinate storage part;
68,68A, 68B: image information generation unit;
70: calculating part;
74: baseline measurements storage part;
76: detection unit;
78: processing conditions configuration part;
86: semiconductor wafer;
88: device;
90: segmentation preset lines;
91: laser beam;
92: laser processing groove;
94: chip;
95: 3-D view;
96: measured value;
98: compare data;
100: cutting processing groove;
102: collapse broken (breach);
104: laser displacement gauge;
106: three dimensional local information storage part;
112: interference objective unit;
122: object lens;
126: reference mirror;
128: half-reflecting mirror;
130:XY coordinate storage part.
Detailed description of the invention
Below, with reference to accompanying drawing, embodiments of the present invention are described in detail.With reference to Fig. 1, show the stereogram of the laser processing device of the three-dimensional measurement component possessing the 1st embodiment.Laser processing device 2 comprises the 1st slide block the 6,1st slide block 6 can be equipped in stationary base 4 along the mode of Y direction movement.
1st slide block 6 moves along pair of guide rails 14 by the index feed mechanism 12 be made up of ball-screw 8 and impulse motor 10 on index feed direction, i.e. Y direction.
2nd slide block 16 is can be equipped on the 1st slide block 6 along the mode of X-direction movement.That is, the 2nd slide block 16 moves along pair of guide rails 24 by the processing feed mechanism 22 be made up of ball-screw 18 and impulse motor 20 in processing direction of feed, i.e. X-direction.
Chuck table 28 is equipped on the 2nd slide block 16 via cylinder support unit 26, and chuck table 28 can move along Y direction and X-direction by index feed mechanism 12 and processing feed mechanism 22.
Chuck table 28 is provided with the fixture 30 for clamping ring-shaped frame, and described ring-shaped frame supports the absorption wafer be held on chuck table 28 via cutting belt.
Stationary base 4 is erect and is provided with column 32, this column 32 is provided with laser beam irradiation unit 34.Laser beam irradiation unit 34 is made up of following part: laser beam producing unit, and it is accommodated in housing 36; And concentrator (laser head) 38, it is installed in housing 36, by the laser beam irradiation that produces from laser beam producing unit on the machined object kept at chuck table 28.
As shown in (A) of Fig. 2, housing 36 is fixed with the rest pad 40 with recess 42, the impulse motor 46 this rest pad 40 being equipped with ball-screw 44 and linking with one end of ball-screw 44.
48 is three-dimensional measurement unit (three-dimensional measurement component) of first embodiment of the present invention, the fitting portion 50 of three-dimensional measurement unit 48 coordinates with the recess 42 of rest pad 40, ball-screw 44 is applied in and is formed in the through hole 52 of fitting portion 50, and ball-screw 44 screws togather with the nut being built in fitting portion 50.
Three-dimensional measurement unit 48 comprises: concentrator (image enlarging unit) 54, and it is accommodated with object lens and confocal microscope; Camera (imaging apparatus portion) 56, it has imaging apparatus such as the CCD made a video recording by the image after concentrator 54 amplification; And the illumination part 58 to be made up of White LED, it irradiates light via the concentrator 54 being accommodated with object lens and confocal microscope to machined object.
When driving pulse motor 46, ball-screw 44 rotates, and three-dimensional measurement unit 48 is moved along the vertical direction by the nut that screws togather with ball-screw 44.According to the concentrator 54 possessing confocal microscope, can obtain only the part of focusing being cut such enlarged image.
With reference to Fig. 3, show the information that the three-dimensional measurement unit 48 by the 1st embodiment is obtained carry out processing and synthetic image information, the block diagram of the process component of the 1st embodiment.As described above, according to the concentrator 54 being accommodated with confocal microscope, only make focusing position at aperture optically focused owing to utilizing confocal microscope, therefore, the light at non-focusing position can be cut off, obtain the image that contrast is good, simultaneously, half-reflecting mirror is made to carry out raster scanning along XY direction, and drive lens along Z-direction, can build 3-D view thus, driving pulse motor 46, with moving three dimension measuring unit 48 along the vertical direction, utilizes camera 56 to make a video recording to the image after being amplified by concentrator 54.
Make the distance that three-dimensional measurement unit 48 is periodically mobile very small along the vertical direction, utilize the enlarged image of camera 56 pairs of machined objects to make a video recording simultaneously, and utilize photographed images storage part 64 to store multiple photographed images.
Meanwhile, Z coordinate storage part 66 is utilized to store the height and position (Z coordinate) of the three-dimensional measurement unit 48 when taking each photographed images.As amplifying camera image, such as, can list the photographed images of laser processing groove.
In image information generation unit 68, according to the multiple photographed images stored by photographed images storage part 64 and by Z coordinate storage part 66 store obtain each photographed images time Z coordinate, three-dimensionally combine multiple photographed images and generate three-dimensional image information.
In calculating part 70, calculate the measured value of the measuring object of machined object according to the image information of the three-dimensional generated by image information generation unit 68.As measuring object, comprise the Arbitrary Term in following object: the width of the working groove formed on machined object by tool member (being laser beam irradiation unit 34 in the present embodiment), the degree of depth, shape and position, be deposited in the chip near working groove width, highly, width, the degree of depth, the shape of the breach of the edge part of volume and shape and working groove.
The a reference value of the determinating reference becoming measured value is stored in baseline measurements storage part 74.This reference value is the measured value utilizing tool member to implement the machining area of the machined object of appropriate processing.Calculating part 70 has and compares data generating section 72, this compares data generating section 72 and generates and compare data, and the described data that compare are made up of the baseline measurements stored in baseline measurements storage part 74 and the measured value that utilizes tool member to implement the machining area of the machined object of processing.
In detection unit 76, the baseline measurements stored in baseline measurements storage part 74 and the measured value utilizing tool member to implement the machining area of the machined object of processing that calculated by calculating part 70 are compared, and determines whether the processing that stops utilizing tool member to implement or change processing conditions.
Processing conditions configuration part 78 comprises processing conditions storage part 80, appropriate image information storage part 82 and processing conditions adjustment part 84.When being judged to change processing conditions by detection unit 76, by processing conditions adjustment part 84, processing conditions is adjusted to optimal value.
On the other hand, stopping the processing utilizing tool member to implement when being judged to be following situation: the measured value of the machining area of machined object significantly departs from baseline measurements, optimum processing cannot be realized by means of only change processing conditions.In the present embodiment, process component is formed by photographed images storage part 64, Z coordinate storage part 66, image information generation unit 68, calculating part 70, baseline measurements storage part 74 and detection unit 76.
Next, with reference to Fig. 4 and Fig. 5, the situation measuring method of the three-dimensional measurement component based on the 1st embodiment being applied to laser processing groove is described.As shown in (A) of Fig. 4, in the front of a kind of semiconductor wafer (following, sometimes only referred to as wafer) 86 as machined object, clip segmentation preset lines 90 and be formed with device 88.The front of wafer 86 is formed the diaphragm 87 be made up of water-soluble resins such as PVA (polyvinyl alcohol), PEG (polyethylene glycol).
Along segmentation preset lines 90 irradiate to wafer 86, there is the pulse laser beam 91 of absorbefacient wavelength (such as 355nm) time, formed the laser processing groove 92 shown in (B) of Fig. 4 by ablation.
, when to wafer 86 irradiated with pulse laser bundle 91, centralized heat energy produces chip 94 in the region of illuminated pulse laser beam 91, and this chip 94 is attached to diaphragm 87.
Measured by three-dimensional measurement unit 48 pairs of laser processing groove 92, and based on the multiple photographed images stored in photographed images storage part 64 and store in Z coordinate storage part 66 obtain each photographed images time Z coordinate, three-dimensionally combine each photographed images by image information generation unit 68 and generate three-dimensional image information.
Further, in calculating part 70, the measured value of the laser processing groove 92 of wafer 86 is calculated according to the three-dimensional image information generated.As this measured value, comprise the width W 1 of laser processing groove 92, degree of depth D1, the shape of laser processing groove 92 and position and be deposited in the chip 94 near laser processing groove 92 width, highly, volume and shape.
As shown in Figure 5, the three-dimensional image information 95 generated by image information generation unit 68 and the measured value 96 calculated by calculating part 70 are displayed on the display monitor 62 as output link.Meanwhile, indication example is gone back as the comparison data 98 of debris volume.This compares width, height etc. that data 98 also can be chips 94.
Next, with reference to Fig. 6, the working groove formed by cutting is described.(A) of Fig. 6 is the partial top view of wafer 86, and (B) of Fig. 6 is the partial sectional view of wafer 86.When by using the cutting of cutting tool to form cutting processing groove 100 along the segmentation preset lines 90 of wafer 86, can produce in the both sides of cutting processing groove 100 and collapse broken (breach) 102.
Therefore, measured by three-dimensional measurement unit 48 pairs of cutting processing grooves 100, multiple photographed images is stored in photographed images storage part 64, and Z coordinate when obtaining each photographed images is stored in Z coordinate storage part 66.
Z coordinate according to the multiple photographed images stored in photographed images storage part 64 and when obtaining each photographed images, three-dimensionally combines each photographed images by image information generation unit 68 and generates the three-dimensional image information of cutting processing groove 100.
In calculating part 70, calculate the measured value of the cutting processing groove 100 formed on wafer 86 according to the three-dimensional image information generated by image information generation unit 68.As measured value, the width of cutting processing groove 100, the degree of depth, shape can be listed and be formed at the width etc. of broken (breach) 102 of collapsing of edge part.
Identical with the situation of the Laser Processing shown in Fig. 5, the 3-D view of the cutting processing groove 100 generated by image information generation unit 68 and each measured value of cutting processing groove 100 calculated by calculating part 70 are presented on display monitor 62.
In the above-described embodiment, the structure utilizing confocal microscope as shown in Figure 2 as three-dimensional measurement unit 48 is illustrated, but in the 2nd embodiment, laser displacement gauge (laser measurer) also can be used as three-dimensional measurement component.
That is, as shown in Figure 7, by laser displacement gauge 104, such laser processing groove 92 (B) of the such as Fig. 4 as measuring object Suo Shi is scanned, and store the three dimensional local information of laser processing groove 92 by three dimensional local information storage part 106.
In this case, laser displacement gauge 104 is fixed on the housing 36 shown in Fig. 1, and moves chuck table 28 along X-direction and Y direction, obtain the three dimensional local information of laser processing groove 92.
In image information generation unit 68A, in three dimensional local information storage part 106 store three dimensional local information three-dimensionally combine and generating three-dimensional figures as information.Calculating part 70, baseline measurements storage part 74, detection unit 76 are identical with the 1st embodiment shown in Fig. 3 with the effect of processing conditions configuration part 78, and therefore the description thereof will be omitted.
Like this, in the present embodiment, owing to using laser displacement gauge 104 as three-dimensional measurement component, therefore, it is possible to directly obtain the three-dimensional coordinate of measuring object thing, and this three dimensional local information is stored by three dimensional local information storage part 106.In the present embodiment, process component is formed by three dimensional local information storage part 106, image information generation unit 68A, calculating part 70, baseline measurements storage part 74 and detection unit 76.
Next, with reference to Fig. 8 to Figure 11, the 3rd embodiment of the present invention utilizing interference objective as three-dimensional measurement component is described.In the present embodiment, as shown in (B) of Fig. 2, three-dimensional measurement unit 48A is installed on rest pad 40 in the mode that can move up and down.
110 is housings of three-dimensional measurement unit 48A, and housing 110 is provided with interference objective unit 112 and imaging apparatus portion (camera) 56.The illumination part 118 and half-reflecting mirror 120 that are made up of White LED is also equipped in housing 110.
When driving pulse motor 46, ball-screw 44 rotates, and three-dimensional measurement unit 48A is moved along the vertical direction by the nut that screws togather with ball-screw 44.Therefore, when hope is measured machining area by three-dimensional measurement unit 48A, three-dimensional measurement unit 48A is positioned the measurement starting position above measured zone by driving pulse motor 46.
114 is piezoelectric elements, and its length is such as shifted (elongation) accordingly as illustrated in fig. 9 with the variable voltage supplied from power supply 116.Therefore, corresponding with the displacement of piezoelectric element 114, the height and position (Z coordinate) of interference objective unit 112 changes.
With reference to (B) of Fig. 8, show the schematic diagram of interference objective unit 112.Interference objective unit 112 has: object lens 122; Be disposed in the reference mirror 26 of glass plate 124; And half-reflecting mirror 128.
The position with the focal position symmetry of object lens 122 is disposed in relative to half-reflecting mirror 128 with reference to mirror 126.For the interference objective unit 112 formed like this, there are rice Lip river type interference objective unit and Michaelson etc.
Through exposing to machined object surface by interference objective unit 112 after being reflected from the white light of white light source 118 injection by half-reflecting mirror 120.When the reverberation from machined object surface interferes with the light reflected from reference mirror 126, both sides overlap in the position that the focus of object lens 122 is aimed at and produce distinct interference fringe, thus aim at position generation interference light (interference signal) of (focusing) in focus.
Therefore, when making the voltage applied piezoelectric element 114 change and utilize machined object surface, 56 pairs, imaging apparatus portion to make a video recording by interference objective unit 112, as shown in Figure 10, the position aimed in the focus of measuring object thing due to light interferes consumingly, therefore, it is possible to detect as point 11.
Make the height change of interference objective unit 112 be Z1 ~ Z3 as shown in (C) of (A) ~ Figure 10 of Figure 10, and take multiple image by imaging apparatus portion 56.Point 11, Z2 near the bottom that Z1 represents laser processing groove represents the point 11 near point 11, the Z3 presentation surface of the centre of laser processing groove.
As shown in figure 11, by XY coordinate storage part 130, the X-coordinate of pixel in imaging apparatus portion 56 and Y-coordinate capturing the interference light (interference signal) generated by three-dimensional measurement unit 48A is stored.Meanwhile, corresponding with the X-coordinate of pixel and Y-coordinate that capture interference light, curve map according to Fig. 9 tries to achieve the displacement of piezoelectric element 114, and tries to achieve the Z coordinate of interference objective unit 112 according to this displacement, is stored in Z coordinate storage part 66 by this Z coordinate.
In image information generation unit 68B, be three-dimensionally combined in the pixel stored in XY coordinate storage part 130 XY coordinate and store in Z coordinate storage part 66 obtain this pixel time Z coordinate, thus generating three-dimensional figures is as information.
In calculating part 70, calculate the measured value of the measuring object of machined object according to the three-dimensional image information generated.Further, calculating part 70, baseline measurements storage part 74, detection unit 76 are identical with the 1st embodiment shown in Fig. 3 with the effect of processing conditions configuration part 78, and therefore, the description thereof will be omitted.In the present embodiment, process component is formed by coordinate storage part 66, XY coordinate storage part 130, image information generation unit 68B, calculating part 72, baseline measurements storage part 74 and detection unit 76.
In the present embodiment, utilize interference objective unit 112 to form three-dimensional measurement unit 48A.Therefore, identical with the 2nd embodiment with the above-mentioned the 1st, the cutting slot after processing, laser processing groove can be obtained, collapse the 3-D view of the grinding vestige that broken, chip or grinding attachment formed etc., and can according to cross-sectional image obtain in processing unit (plant) immediately after just processing they width or height, volume data, check the machining state of machined object.
As mentioned above, three-dimensional measurement component comprises: the confocal microscope of the 1st embodiment, its by utilize microscope photographing to image in the height direction overlap carry out processing and generating three-dimensional figures picture; The laser displacement gauge 104 of the 2nd embodiment; And utilize the three-dimensional measurement unit of interference objective unit 112.
According to the processing unit (plant) of the present invention possessing three-dimensional measurement component, multiple different processing conditions can be implemented continuously, continuously machining state is measured respectively for each processing conditions, and its measurement result is compared, thus the selected of processing conditions can be carried out efficiently.
Below, can range of application summarily be described to above-mentioned processing unit (plant) of the present invention.The present invention is the quantitative measurment utilizing three-dimensional microscope to carry out, and range of application can be classified as following 6.
(1) input the measurement category of good processing, and judge quality within the scope of this.The processing conditions such as change Laser output, feed speed, lens defocus, laser frequency, beam shape judge to implement this quality.
(2) work in-process inputs good measurement category and judge quality within the scope of this.While change Laser output, the processing conditions such as feed speed, lens defocus, laser frequency, beam shape, implement this quality and judge.Under measurement result is judged as underproof situation, stop processing.
(3) input multiple processing conditions, show the variable quantity of processing result over the display.Such as, make the processing result curve graphing based on Parameters variation and show.
(4) measurement category of the good processing at the position of input regulation, and automatically explore optimum processing conditions.
(5) movement images (benchmark image) comprises talus accumulated amount, kerf width, chip height, working depth, cutting position etc. with the variable quantity of object images.Each variable quantity is included in depth direction and repeatedly implements the multipass cutting that working groove is formed and the multiple cut repeatedly implementing working groove formation in direction, face.
(6) based on the auto-focusing repeatedly cut making kerf width and working depth change.
Claims (7)
1. a processing unit (plant), this processing unit (plant) possesses: retaining member, and it keeps machined object; Tool member, it is processed the machined object be held on this retaining member according to the processing conditions of setting; Processing feeding component, it makes this retaining member and this tool member relatively carry out processing feeding; Measure component, it is measured the machining area of machined object after utilizing this tool member to process; And output link, it exports the result measured by this measurement component,
The feature of described processing unit (plant) is,
This measurement component possesses:
Three-dimensional measurement component, it dimensionally measures machined object and obtains shape information in mutually orthogonal X-direction, Y direction and Z-direction; With
Process component, it processes the information synthetic image information that are obtained by this three-dimensional measurement component,
This three-dimensional measurement component comprises:
Imaging apparatus portion, is arranged with multiple pixel along X-direction and Y direction in this imaging apparatus portion;
Interference objective unit, it possesses the object lens opposed with machined object;
Illumination part, it makes light expose to machined object by this interference objective unit; And
Z axis moving part, it makes this interference objective unit move in the Z-axis direction and generate Z coordinate,
This process component comprises:
XY coordinate storage part, it stores the X-coordinate of the pixel in this imaging apparatus portion of the interference light captured by the generation of this interference objective unit and Y-coordinate;
Z coordinate storage part, its X-coordinate with this pixel and Y-coordinate store the Z coordinate generated by this Z axis moving part accordingly;
Image information generation unit, it is according to the Z coordinate that stores in this Z coordinate storage part, is three-dimensionally combined in the pixel of the XY coordinate stored in this XY coordinate storage part and synthetic image information; And
Calculating part, it calculates the measured value of the measuring object of machined object according to the image information generated,
This measuring object of machined object comprises the Arbitrary Term in following object:
The width of the working groove utilizing this tool member to be formed on machined object, the degree of depth, shape and position, be deposited in the chip near this working groove width, highly, the width of the breach of the edge part of volume and shape and this working groove, the degree of depth and shape,
The machined object after processing is not taken out from processing unit (plant) and just can measure machining area.
2. a processing unit (plant), it possesses: retaining member, and it keeps machined object; Tool member, it is processed the machined object be held on this retaining member according to the processing conditions of setting; Processing feeding component, it makes this retaining member and this tool member relatively carry out processing feeding; Measure component, it is measured the machining area of machined object after utilizing this tool member to process; And output link, it exports the result measured by this measurement component,
The feature of described processing unit (plant) is,
This processing unit (plant) possesses:
Three-dimensional measurement component, it possesses confocal microscope, and described confocal microscope is dimensionally measured machined object and obtains shape information in mutually orthogonal X-direction, Y direction and Z-direction; With
Process component, it processes the information synthetic image information that are obtained by this three-dimensional measurement component,
This three-dimensional measurement component comprises:
Imaging apparatus portion, is arranged with multiple pixel along X-direction and Y direction in this imaging apparatus portion;
Concentrator, it possesses the object lens opposed with machined object;
Illumination part, it makes light expose to machined object by this concentrator; And
Z axis moving part, it makes this concentrator move in the Z-axis direction and generates Z coordinate,
This process component comprises:
Photographed images storage part, it stores multiple photographed images of being taken by this imaging apparatus portion;
Z coordinate storage part, this photographed images of itself and each stores the Z coordinate generated by this Z axis moving part accordingly;
Image information generation unit, it three-dimensionally combines the plurality of photographed images and synthetic image information according to the Z coordinate that stores in this Z coordinate storage part; And
Calculating part, it calculates the measured value of the measuring object of machined object according to the image information generated,
This measuring object of machined object comprises the Arbitrary Term in following object:
The width of the working groove utilizing this tool member to be formed on machined object, the degree of depth, shape and position, be deposited in the chip near this working groove width, highly, the width of the breach of the edge part of volume and shape and this working groove, the degree of depth and shape,
The machined object after processing is not taken out from processing unit (plant) and just can measure machining area.
3. a processing unit (plant), it possesses: retaining member, and it keeps machined object; Tool member, it is processed the machined object be held on this retaining member according to the processing conditions of setting; Processing feeding component, it makes this retaining member and this tool member relatively carry out processing feeding; Measure component, it is measured the machining area of machined object after utilizing this tool member to process; Output link, it exports the result measured by this measurement component; And process component, it carries out process and synthetic image information to the information obtained by this measurement component,
The feature of described processing unit (plant) is,
This measurement component is made up of laser displacement gauge,
This process component comprises:
Three dimensional local information storage part, it stores the three dimensional local information generated by this laser displacement gauge;
Image information generation unit, it is three-dimensionally combined in the three dimensional local information and synthetic image information that store in this three dimensional local information storage part; And
Calculating part, it calculates the measured value of the measuring object of machined object according to this image information generated,
This measuring object of machined object comprises the Arbitrary Term in following object:
The width of the working groove utilizing this tool member to be formed on machined object, the degree of depth, shape and position, be deposited in the chip near this working groove width, highly, the width of the breach of the edge part of volume and shape and this working groove, the degree of depth and shape,
The machined object after processing is not taken out from processing unit (plant) and just can measure machining area.
4. the processing unit (plant) according to any one in claims 1 to 3, is characterized in that,
Described process component also comprises baseline measurements storage part, and the measured value becoming benchmark stores as processing result by described baseline measurements storage part,
Described calculating part has to generate and compares the comparison data generating section of data, and the described data that compare are made up of the measured value of the described machining area of the baseline measurements stored in this baseline measurements storage part and the machined object after implementing processing by described tool member.
5. processing unit (plant) according to claim 4, is characterized in that,
Described baseline measurements storage part this baseline measurements to the machined object after implementing appropriate processing by described tool member stores.
6. the processing unit (plant) according to any one in claims 1 to 3, is characterized in that,
Described handling part also comprises detection unit, described detection unit this measured value to the described machining area of this reference value stored in this baseline measurements storage part and the machined object after implementing processing by described tool member compares, and determines whether the processing that stops to utilize this tool member to implement or change this processing conditions.
7. the processing unit (plant) according to any one in claims 1 to 3, is characterized in that,
Described tool member is made up of the laser beam irradiation component of illuminating laser beam.
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| JP6305013B2 (en) | 2018-04-04 |
| KR20150048627A (en) | 2015-05-07 |
| TWI629130B (en) | 2018-07-11 |
| KR102240331B1 (en) | 2021-04-13 |
| JP2015085397A (en) | 2015-05-07 |
| TW201518020A (en) | 2015-05-16 |
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