JP6991668B2 - Processing equipment - Google Patents

Description

The present invention relates to a processing apparatus used when processing a plate-shaped workpiece.

For device chips to be incorporated in various electronic devices, the surface of the wafer as the base material is divided into multiple areas by a planned division line called a street, and devices such as integrated circuits are formed in each area, and then this wafer is placed. It is obtained by dividing along the planned division line. For dividing the wafer, for example, a cutting device that rotates a cutting blade to cut the wafer, or a processing device such as a laser processing device that can irradiate a high-power laser beam is used.

In a processing device such as a cutting device or a laser processing device, for example, a processing mark (groove, etc.) generated when processing a workpiece such as a wafer is imaged by an imaging unit, and the state of the processing mark is based on the obtained image. The processing conditions and the like are adjusted by confirming (see, for example, Patent Document 1). However, since a normal imaging unit can image an object only in a plane, there is a problem that the depth of processing marks, the shape of a cross section, the state of debris generated by processing, and the like cannot be sufficiently grasped.

In recent years, a processing apparatus capable of three-dimensionally verifying the state of processing marks generated on a workpiece has also been proposed (see, for example, Patent Document 2). In this processing device, an image pickup unit incorporating a Mirau-type interferometer is moved in the Z-axis direction (height direction) to image an workpiece, and a plurality of obtained images are superimposed in the Z-axis direction. Form a three-dimensional image.

Japanese Unexamined Patent Publication No. 5-326700 Japanese Unexamined Patent Publication No. 2015-38438

However, in the above-mentioned processing apparatus including an image pickup unit incorporating a Mirau-type interferometer, the image pickup unit must be moved in the Z-axis direction in order to form a three-dimensional image. There is a problem that it takes time. Therefore, there has been a demand for a processing device capable of acquiring a three-dimensional image in a shorter time.

The present invention has been made in view of such a problem, and an object of the present invention is to provide a processing apparatus capable of acquiring a three-dimensional image in a short time as compared with a conventional processing apparatus.

According to one aspect of the present invention, a holding means having a holding surface for holding a work piece, a processing means for processing a work piece held by the holding means, and the holding means are moved in the X-axis direction. A machining feed means, a measuring means for measuring the shape of the upper surface of the workpiece including a machining groove formed in the workpiece by the machining means, and an output means for outputting the result obtained by the measurement of the measuring means. The measuring means measures the position of the upper surface of the workpiece in the Z-axis direction perpendicular to the X-axis direction at a plurality of detected points along the Y-axis direction perpendicular to the X-axis direction and the Z-axis direction. The first measurement unit and each include a two-dimensional laser displacement sensor that detects at once and generates cross-sectional data corresponding to the shape of the cross section parallel to the Y-axis direction and the Z-axis direction of the workpiece including the machined groove. The processing is based on a plurality of cross-sectional data obtained by moving the holding means in the X-axis direction while detecting the position of the upper surface of the workpiece by the second measuring unit and the two-dimensional laser displacement sensor. The first measurement unit is arranged on one side of the processing means along the X-axis direction, including a three-dimensional image generation unit that generates a three-dimensional image showing the three-dimensional shape of the workpiece including the groove. The second measuring unit is arranged on the other side of the processing means along the X-axis direction, and the two-dimensional laser displacement sensor is a measuring laser beam used for measuring the position of the upper surface. A measuring laser beam oscillator that radiates toward the work piece, a cylindrical lens that shapes the shape of the measurement laser beam on the upper surface of the work piece into a long strip in the Y-axis direction, and a cylindrical lens that is reflected by the work piece. A detection unit that detects the reflected light of the measurement laser beam and generates the cross-sectional data, and a part of the processing means and the measuring means including the two-dimensional laser displacement sensor are the processing grooves. The front side in the direction in which the holding means is moved is arranged so as to be the processing means, and the rear side is arranged to be the part of the measuring means. A processing apparatus for measuring the shape of a workpiece including a processing groove by the measuring means is provided.

Further, in one aspect of the present invention, the processing means includes a processing laser beam oscillator that oscillates a processing laser beam used for processing a workpiece, and the processing laser oscillated by the processing laser beam oscillator. Includes a concentrator that collects the beam and a laser beam scanning unit that is provided between the processing laser beam oscillator and the concentrator and that scans the processing laser beam and guides it to the concentrator. The laser beam scanning unit includes an acoustic-optical deflector that changes the traveling direction of the processing laser beam oscillated from the processing laser beam oscillator, and the processing that the traveling direction is changed by the acoustic-optical deflector. A polygon scanner that further changes the traveling direction of the laser beam to guide the concentrator, and the change of the traveling direction of the processing laser beam by the acoustic optical deflector and the processing laser beam by the polygon scanner. It is preferable to scan the processing laser beam by changing the traveling direction and irradiate the work piece held by the holding means with the processing laser beam.

The processing apparatus according to one aspect of the present invention moves the holding means having a holding surface for holding the workpiece, the processing means for processing the workpiece held by the holding means, and the holding means in the X-axis direction. A machining feed means and a measuring means for measuring the shape of the upper surface of the workpiece including the machining groove formed in the workpiece by the machining means are provided, and the measuring means is in the Z-axis direction perpendicular to the X-axis direction. It includes a two-dimensional laser displacement sensor that detects the position of the upper surface of the workpiece at one time at a plurality of detected points along the Y-axis direction perpendicular to the X-axis direction and the Z-axis direction.

Further, the processing means and a part of the measuring means are arranged so that the front side in the direction in which the holding means is moved when forming the processing groove is the processing means and the rear side is a part of the measuring means. Therefore, the shape of the workpiece including the machined groove can be measured by the measuring means while forming the machined groove by the machined means. That is, according to the processing apparatus according to one aspect of the present invention, the formation of the processing groove and the measurement of the shape of the workpiece including the processing groove can be performed in parallel, so that the processing apparatus can be compared with the conventional processing apparatus. A three-dimensional image can be acquired in a short time.

It is a perspective view which shows the structural example of a laser processing apparatus schematically. It is a perspective view which shows the structural example of the workpiece schematically. It is a figure which shows the structural example of a laser irradiation unit schematically. FIG. 4A is a perspective view schematically showing a configuration example of a two-dimensional laser displacement sensor, and FIG. 4B is a partial cross-sectional side view schematically showing a configuration example of a two-dimensional laser displacement sensor. Is. FIG. 5A is an example of cross-sectional data, and FIG. 5B is an example of a three-dimensional image.

An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view schematically showing a configuration example of the laser processing apparatus 2 according to the present embodiment. In FIG. 1, some components of the laser processing apparatus 2 are shown by functional blocks. Further, the X-axis direction (machining feed direction), the Y-axis direction (indexing feed direction), and the Z-axis direction (height direction) used in the following description are perpendicular to each other.

As shown in FIG. 1, the laser processing apparatus 2 includes a base 4 that supports each component. A wall-shaped (or columnar) support structure 6 is provided at the rear end of the upper surface of the base 4. Further, a moving mechanism (machining feed means, index feed means) 8 is arranged on the center side of the upper surface of the base 4. The moving mechanism 8 includes a pair of Y-axis guide rails 10 fixed to the upper surface of the base 4 and substantially parallel to the Y-axis direction. A Y-axis moving table 12 is slidably attached to the Y-axis guide rail 10.

A nut portion (not shown) is provided on the lower surface side of the Y-axis moving table 12, and a Y-axis ball screw 14 substantially parallel to the Y-axis guide rail 12 is screwed into the nut portion. A Y-axis pulse motor 16 is connected to one end of the Y-axis ball screw 14. When the Y-axis ball screw 14 is rotated by the Y-axis pulse motor 16, the Y-axis moving table 12 moves in the Y-axis direction along the Y-axis guide rail 10.

A pair of X-axis guide rails 18 substantially parallel to the X-axis direction are provided on the upper surface of the Y-axis moving table 12. An X-axis moving table 20 is slidably attached to the X-axis guide rail 18.

A nut portion (not shown) is provided on the lower surface side of the X-axis moving table 20, and an X-axis ball screw 22 substantially parallel to the X-axis guide rail 18 is screwed into the nut portion. An X-axis pulse motor 24 is connected to one end of the X-axis ball screw 22. When the X-axis ball screw 22 is rotated by the X-axis pulse motor 24, the X-axis moving table 20 moves in the X-axis direction along the X-axis guide rail 18.

A chuck table (holding means) 26 for holding the workpiece 11 (see FIG. 2) is arranged on the upper surface side of the X-axis moving table 20. The chuck table 26 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis substantially parallel to the Z-axis direction. Further, the chuck table 26 moves in the X-axis direction and the Y-axis direction together with the X-axis moving table 20 by the moving mechanism 8 described above (machining feed and index feed).

FIG. 2 is a perspective view schematically showing a configuration example of the workpiece 11. As shown in FIG. 2, the workpiece 11 is a disk-shaped wafer made of a semiconductor material such as silicon. The surface 11a side of the workpiece 11 is divided into a plurality of regions by a plurality of scheduled division lines (streets) 13 intersecting each other, and a device 15 such as an IC (Integrated Circuit) is formed in each region. ing.

An adhesive tape (dicing tape) 21 having a diameter larger than that of the workpiece 11 is attached to the back surface 11b side of the workpiece 11. The outer peripheral portion of the adhesive tape 21 is fixed to the annular frame 23. That is, the workpiece 11 is supported by the frame 23 via the adhesive tape 21.

In the present embodiment, the disk-shaped wafer made of a semiconductor material such as silicon is used as the workpiece 11, but the material, shape, structure, size, etc. of the workpiece 11 are not limited. For example, a substrate or the like made of other semiconductors, ceramics, resins, metals, or the like can be used as the workpiece 11. Similarly, there are no restrictions on the type, quantity, shape, structure, size, arrangement, etc. of the device. A device may not be formed on the workpiece 11.

A part of the upper surface of the chuck table 26 is a holding surface 26a for holding the workpiece 11 (see FIG. 2). The holding surface 26a is formed substantially parallel to the X-axis direction and the Y-axis direction, and is connected to a suction source (not shown) via a suction path (not shown) formed inside the chuck table 26. There is. Further, around the chuck table 26, four clamps 28 for fixing the annular frame 23 supporting the workpiece 11 from all sides are provided.

A support plate 6a projecting forward is provided on the front surface side of the support structure 6. A laser irradiation unit (processing means) 30 that irradiates a processing laser beam downward is arranged on the front end side of the support plate 6a. A two-dimensional laser displacement sensor (first measurement) that measures the shape of the upper surface (surface 11a in this embodiment) of the workpiece 11 at a position adjacent to the laser irradiation unit 30 on one side in the X-axis direction. Unit, measuring means) 32a is arranged.

Further, at a position adjacent to the laser irradiation unit 30 on the other side in the X-axis direction, a two-dimensional laser displacement sensor (second measuring unit, measuring means) for measuring the shape of the upper surface (surface 11a) side of the workpiece 11. 32b is arranged. That is, the laser irradiation unit 30, the two-dimensional laser displacement sensor 32a, and the two-dimensional laser displacement sensor 32b are arranged along the X-axis direction. The laser irradiation unit 30 is arranged in the region between the two-dimensional laser displacement sensor 32a and the two-dimensional laser displacement sensor 32b.

Components such as the moving mechanism 8, the chuck table 26, the laser irradiation unit 30, the two-dimensional laser displacement sensor 32a, and the two-dimensional laser displacement sensor 32b are connected to the control unit (measuring means) 34, respectively. The control unit 34 is composed of, for example, an arithmetic unit such as a CPU (Central Processing Unit), a storage device such as a DRAM (Dynamic Random Access Memory), or the like.

The control unit 34 controls each of the above-mentioned components according to a series of steps required for machining the workpiece 11. Further, a touch panel type monitor (output means) 36 serving as a user interface is connected to the control unit 34. The monitor 36 is arranged, for example, on the upper surface of the support plate 6a.

FIG. 3 is a diagram schematically showing a configuration example of the laser irradiation unit 30. In FIG. 3, some components are shown by functional blocks. As shown in FIG. 3, the laser irradiation unit 30 includes a processing laser beam oscillator 38 that pulse-oscillates a processing laser beam L1 having a wavelength exhibiting absorption with respect to the workpiece 11. For example, when the workpiece 11 is a wafer made of a semiconductor material such as silicon, a processing laser beam oscillator 38 capable of oscillating a processing laser beam L1 having a wavelength of 355 nm by a laser medium such as Nd: YAG can be used. can.

An attenuator or other regulator 40 that adjusts the amount of light of the processing laser beam L1 radiated from the processing laser beam oscillator 38 is arranged at a position adjacent to the processing laser beam oscillator 38. The processing laser beam L1 whose light amount is adjusted by the regulator 40 is reflected by, for example, mirrors 42, 44, etc., and then incident on the acoustic optical deflector (laser beam scanning unit) 46. The acoustic-optical deflector 46 changes (deflects) the traveling direction of the processing laser beam L1 according to the frequency of the supplied high frequency voltage (RF voltage).

The processing laser beam L1 whose traveling direction is changed by the acoustic-optical deflector 46 is incident on a polygon mirror (laser beam scanning unit) 48 having a plurality of reflecting surfaces. The polygon mirror 48 is connected to a rotation drive source (not shown) such as a motor. By rotating the polygon mirror 48, the traveling direction of the processing laser beam L1 reflected by the reflection surface of the polygon mirror 48 is changed. The rotation speed of the polygon mirror 48 is, for example, about 5000 rpm to 30,000 rpm.

The processing laser beam L1 reflected by the polygon mirror 48 is focused on the upper surface (surface 11a) or the inside of the workpiece 11 by the condenser 50. The condenser 50 includes a telecentric fθ lens 52, and for example, the movement (change of the traveling direction) of the laser beam L1 due to the constant velocity rotational motion of the polygon mirror 48 is converted into the constant velocity linear motion on the focal plane. At the same time, the laser beam L1 is vertically incident on the upper surface (surface 11a) of the workpiece 11. The diameter of the processing laser beam L1 in the focal plane is, for example, about 1 μm to 10 μm.

In the laser irradiation unit 30 of the present embodiment, the traveling direction of the processing laser beam L1 irradiated to the workpiece 11 is changed along the Y-axis direction by the acoustic-optical deflector 46, and the X is X by the polygon mirror 48. It is changed along the axial direction. That is, in the laser irradiation unit 30 of the present embodiment, the processing is performed by combining the change of the traveling direction of the processing laser beam L1 by the acoustic-optical deflector 46 and the change of the traveling direction of the processing laser beam L1 by the polygon mirror 48. The laser beam L1 for scanning is scanned.

The range in which the processing laser beam L1 is scanned by the laser irradiation unit 30 is, for example, 5 mm to 10 mm in the X-axis direction, typically 8 mm, and 20 μm to 100 μm in the Y-axis direction, typically 50 μm. Is. However, there is no particular limitation on the range in which the processing laser beam L1 is scanned by the laser irradiation unit 30.

Therefore, by moving the chuck table 26 in the X-axis direction while irradiating the workpiece 11 held by the chuck table 26 with the laser beam L1 for processing from the laser irradiation unit 30, a predetermined width in the Y-axis direction. A machined groove (machined mark) 17 (see FIG. 4 (A) and the like) having a machine can be formed along the X-axis direction. The width of the processing groove 17 is substantially equal to the range in which the processing laser beam L1 is scanned in the Y-axis direction.

In this way, by relatively moving the workpiece 11 and the laser irradiation unit 30 while scanning the machining laser beam L1 within a predetermined range, the workpiece 11 has a machined groove 17 having a high bottom flatness. The bending strength of the device chip can be increased by forming the device chip. However, there are no particular restrictions on the configuration of the laser irradiation unit included in the laser processing device 2 according to the present embodiment. The laser processing apparatus 2 may include only a general laser irradiation unit that does not scan the processing laser beam L1.

FIG. 4A is a perspective view schematically showing a configuration example of the two-dimensional laser displacement sensors 32a and 32b, and FIG. 4B schematically shows a configuration example of the two-dimensional laser displacement sensors 32a and 32b. It is a partial cross-sectional side view shown. In addition, in FIG. 4A and FIG. 4B, some components are shown by functional blocks. As shown in FIGS. 4A and 4B, the two-dimensional laser displacement sensors 32a and 32b each have a measurement laser beam oscillator 54 that radiates a measurement laser beam L2 toward the workpiece 11. I have.

The measurement laser beam oscillator 54 needs to be able to oscillate at least the measurement laser beam L2 having a wavelength sufficiently reflected by the workpiece 11. As such a measurement laser beam oscillator 54, for example, a semiconductor laser capable of continuously oscillating a measurement laser beam L2 having a wavelength of 400 nm to 800 nm can be used.

At a position adjacent to the laser beam oscillator 54 for measurement, the laser beam L2 for measurement emitted from the laser beam oscillator 54 for measurement is shaped into a band shape with a cross section perpendicular to the traveling direction to form a workpiece 11. A cylindrical lens 56 to be irradiated is arranged. In the present embodiment, on the upper surface (surface 11a) of the workpiece 11 to be irradiated with the measurement laser beam L2, the shape of the measurement laser beam L2, that is, the shape of the irradiated region 11c of the workpiece 11 is the Y axis. The cylindrical lens 56 is arranged so as to form a long band in the direction.

The reflected light of the measurement laser beam L2 reflected in the irradiated region 11c of the workpiece 11 is incident on the detection unit 60 via the lens 58 or the like. The detection unit 60 includes, for example, a detection element such as a CMOS (Complementary Metal Oxide Semiconductor) image sensor, and an arithmetic unit such as a CPU.

The detection element of the detection unit 60 is configured to be able to detect the reflected light of the measurement laser beam L2 reflected at a plurality of positions (hereinafter, detected points) in the irradiated region 11c at once in the Y-axis direction. ing. Therefore, the detection unit 60 detects the reflected light of the measurement laser beam L2 reflected by the workpiece 11, and obtains cross-sectional data corresponding to the shape of the cross section parallel to the Y-axis direction and the Z-axis direction in a short time. Can be generated.

FIG. 5A is an example of cross-sectional data detected by the detection unit 60. As described above, in the two-dimensional laser displacement sensors 32a and 32b of the present embodiment, a plurality of heights (positions in the Z-axis direction) of the upper surface of the workpiece 11 including the machining groove 17 are detected along the Y-axis direction. Detect at a point at once. Therefore, by moving the chuck table 26 in the X-axis direction and acquiring a plurality of cross-sectional data while detecting the height of the upper surface of the workpiece 11 with the two-dimensional laser displacement sensors 32a and 32b, the machined groove 17 It becomes possible to generate a three-dimensional image showing the three-dimensional shape of the workpiece 11 including the above in a short time.

The interval (profile data interval) of the detected points measured at one time by the two-dimensional laser displacement sensors 32a and 32b in the Y-axis direction depends on conditions such as the width of the machined groove 17 and the time allowed for measurement. Is set. For example, when the width of the machined groove 17 is about 50 μm, it is preferable that the distance between the detected points is 5 μm or less.

The cross-section data generated by the two-dimensional laser displacement sensors 32a and 32b is sent to the control unit 34 of the laser processing apparatus 2. At the same time, information regarding the position of the chuck table 26 in the X-axis direction when the cross-sectional data is generated is sent to the control unit 34. The control unit 34 includes a three-dimensional image generation unit 34a that generates a three-dimensional image based on a plurality of cross-sectional data.

The three-dimensional image generation unit 34a superimposes a plurality of cross-sectional data according to information regarding the position of the chuck table 26 in the X-axis direction when each cross-sectional data is generated, and generates a three-dimensional image. The three-dimensional image generated by the three-dimensional image generation unit 34a is displayed on the monitor 36, for example. FIG. 5B is an example of a three-dimensional image generated by the three-dimensional image generation unit 34a.

There is no particular limitation on the distance between the plurality of cross-sectional data acquired by the two-dimensional laser displacement sensors 32a and 32b and superimposed by the three-dimensional image generation unit 34a in the X-axis direction. In the laser processing apparatus 2 of the present embodiment, as shown in FIG. 4B, it is assumed that the shape of the processing groove 17 is measured while forming the processing groove 17 by the laser irradiation unit 30.

In this way, when forming the machined groove 17 and measuring the shape in parallel, the moving speed of the chuck table 26 in the X-axis direction when forming the machined groove 17 and the two-dimensional laser displacement sensor The distance between the plurality of cross-sectional data in the X-axis direction is determined by the relationship between the time required for the measurement of 32a and 32b. However, if the distance between the plurality of cross-sectional data in the X-axis direction becomes too large, an appropriate three-dimensional image cannot be obtained. Therefore, the distance in the X-axis direction is preferably 500 μm or less.

An example of a procedure (machining method) for machining the workpiece 11 using the laser machining apparatus 2 described above will be described. First, the adhesive tape 21 attached to the workpiece 11 is brought into contact with the holding surface 26a of the chuck table 26, and the negative pressure of the suction source is applied. At the same time, the frame 23 is fixed by the clamp 28. As a result, the workpiece 11 is held by the chuck table 26 and the clamp 28 with the surface 11a side exposed upward.

Next, the chuck table 26 is rotated to align, for example, the scheduled division line 13 (longitudinal direction of the scheduled division line 13) to be machined with the X-axis direction. Further, the chuck table 26 is moved to align the position of the laser irradiation unit 30 above the extension line of the target division scheduled line 13.

Then, the chuck table 26 is moved in the X-axis direction while irradiating the processing laser beam L1 from the laser irradiation unit 30 toward the upper surface (surface 11a) of the workpiece 11. As a result, the laser beam L1 for processing can be irradiated along the scheduled division line 13 to be processed, and the processing groove 17 along the scheduled division line 13 can be formed on the upper surface (surface 11a) side of the workpiece 11.

In the laser machining apparatus 2 of the present embodiment, in parallel with the formation of the machined groove 17, the shape of the upper surface of the workpiece 11 including the machined groove 17 immediately after being formed is measured. Specifically, the laser irradiation unit 30 is formed by using any of the two-dimensional laser displacement sensors 32a and 32b arranged on the rear side in the direction in which the chuck table 26 is moved when the machined groove 17 is formed. The shape of the upper surface of the workpiece 11 including the machined groove 17 immediately after the work is measured is measured.

That is, the measurement laser beam L2 is emitted from the measurement laser beam oscillator 54 provided in any of the two-dimensional laser displacement sensors 32a and 32b, and the reflected light reflected on the upper surface of the workpiece 11 is the same two-dimensional laser displacement. It is detected by the detection unit 60 in the sensors 32a and 32b. This makes it possible to measure the shape of the upper surface of the workpiece 11 including the machining groove 17 while forming the machining groove 17 with respect to the workpiece 11.

As described above, the laser processing apparatus 2 according to the present embodiment processes the chuck table (holding means) 26 having the holding surface 26a for holding the workpiece 11 and the workpiece 11 held by the chuck table 26. A workpiece including a laser irradiation unit (machining means) 30, a moving mechanism (machining feed means) 8 for moving the chuck table 26 in the X-axis direction, and a machining groove 17 formed in the workpiece 11 by the moving mechanism 8. It includes two-dimensional laser displacement sensors (measuring means) 32a and 32b for measuring the shape of the upper surface of the eleven, and a control unit (measuring means) 34.

The two-dimensional laser displacement sensors 32a and 32b position the upper surface of the workpiece 11 in the Z-axis direction perpendicular to the X-axis direction, along the X-axis direction and the Y-axis direction perpendicular to the Z-axis direction. Detect all at once at the detection point. Further, the laser irradiation unit 30 and the two-dimensional laser displacement sensors 32a and 32b have the laser irradiation unit 30 on the front side in the direction of moving the chuck table 26 when forming the machined groove 17, and the two-dimensional laser displacement sensor 32a on the rear side. It is arranged so as to be 32b.

Therefore, the shape of the workpiece 11 including the machined groove 17 can be measured by the two-dimensional laser displacement sensors 32a and 32b while the machined groove 17 is formed by the laser irradiation unit 30. That is, according to the laser machining apparatus 2 according to the present embodiment, the formation of the machining groove 17 and the measurement of the shape of the workpiece 11 including the machining groove 17 can be performed in parallel, so that the conventional machining apparatus A three-dimensional image can be acquired in a short time as compared with the above.

The present invention is not limited to the description of the above embodiment, and can be modified in various ways. For example, in the above embodiment, the two-dimensional laser displacement sensor (first measuring unit, measuring means) 32a adjacent to the laser irradiation unit 30 on one side in the X-axis direction and the laser irradiation unit 30 on the other side in the X-axis direction. Although the laser processing apparatus 2 including the adjacent two-dimensional laser displacement sensor (second measurement unit, measuring means) 32b is described, the two-dimensional laser displacement sensor (measurement unit, measurement) included in the laser processing apparatus of the present invention is described. Means) may be one set.

In this case, for example, the positional relationship between the laser irradiation unit 30 and the two-dimensional laser displacement sensor in the X-axis direction can be exchanged according to the direction in which the chuck table 26 is moved when forming the machined groove 17. Configure to. This makes it possible to measure the shape of the workpiece 11 including the machined groove 17 by the two-dimensional laser displacement sensor while forming the machined groove 17 by the laser irradiation unit 30 as in the above embodiment.

Further, in the above embodiment, the laser processing device 2 provided with the laser irradiation unit 30 is described, but the processing device of the present invention may also be a cutting device provided with a cutting unit (machining means) on which a cutting blade is mounted. good.

Further, in the above embodiment, the processing laser beam L1 and the measurement laser beam L2 are irradiated from the front surface 11a side of the workpiece 11, but the processing laser beam L1 and the measurement are performed from the back surface 11a side of the workpiece 11. The laser beam L2 may be irradiated. In this case, the adhesive tape 21 is attached to the front surface 11a side of the workpiece 11, and the front surface 11a side is held by the chuck table 26 to expose the back surface 11b upward.

In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented as long as they do not deviate from the scope of the object of the present invention.

2 Laser machining equipment 4 Base 6 Support structure 6a Support plate 8 Moving mechanism (machining feed means, index feed means)
10 Y-axis guide rail 12 Y-axis moving table 14 Y-axis ball screw 16 Y-axis pulse motor 18 X-axis guide rail 20 X-axis moving table 22 X-axis ball screw 24 X-axis pulse motor 26 Chuck table (holding means)
26a Holding surface 28 Clamp 30 Laser irradiation unit (processing means)
32a 2D laser displacement sensor (1st measurement unit, measuring means)
32b 2D laser displacement sensor (second measuring unit, measuring means)
34 Control unit (measuring means)
34a 3D image generator 36 Monitor (output means)
38 Laser beam oscillator for processing 40 Regulator 42, 44 Mirror 46 Acoustic optical deflector (laser beam scanning unit)
48 Polygon mirror (laser beam scanning unit)
50 Condenser 52 Telecentric fθ lens 54 Laser beam oscillator for measurement 56 Cylindrical lens 58 Lens 60 Detection unit 11 Work piece 11a Front surface 11b Back surface 13 Scheduled division line (street)
15 Device 17 Machined groove (machined mark)
21 Adhesive tape (dicing tape)
23 Frame L1 Laser beam for processing L2 Laser beam for measurement

Claims (2)

A holding means having a holding surface for holding the work piece,
A processing means for processing the workpiece held by the holding means, and a processing means.
A processing feed means for moving the holding means in the X-axis direction, and a processing feeding means.
A measuring means for measuring the shape of the upper surface of the workpiece including the machining groove formed in the workpiece by the machining means, and a measuring means.
An output means for outputting the result obtained by the measurement of the measuring means is provided.
The measuring means is
The position of the upper surface of the workpiece in the Z-axis direction perpendicular to the X-axis direction is detected at a plurality of detected points along the Y-axis direction perpendicular to the X-axis direction and the Z-axis direction, and the machining is performed. The first measurement unit and the second measurement unit, each of which includes a two-dimensional laser displacement sensor that generates cross-sectional data corresponding to the shape of the cross section parallel to the Y-axis direction and the Z-axis direction of the workpiece including the groove, and the second measurement unit.
Based on the plurality of cross-sectional data obtained by moving the holding means in the X-axis direction while detecting the position of the upper surface of the workpiece with the two-dimensional laser displacement sensor, the workpiece including the machining groove. Includes a 3D image generator that generates a 3D image showing the 3D shape of
The first measuring unit is arranged on one side of the processing means along the X-axis direction.
The second measuring unit is arranged on the other side of the processing means along the X-axis direction.
The two-dimensional laser displacement sensor is
A measurement laser beam oscillator that radiates a measurement laser beam used to measure the position of the upper surface toward the workpiece, and a measurement laser beam oscillator.
A cylindrical lens that shapes the shape of the laser beam for measurement into a long strip in the Y-axis direction on the upper surface of the work piece.
Includes a detection unit that detects the reflected light of the measurement laser beam reflected by the workpiece and generates the cross-sectional data.
The processing means and a part of the measuring means including the two-dimensional laser displacement sensor are such that the front side in the direction in which the holding means is moved when forming the processing groove is the processing means, and the rear side is the measuring means. Arranged to be part of
A processing apparatus characterized in that the shape of a workpiece including the processing groove is measured by the measuring means while forming the processing groove by the processing means. The processing means is
A processing laser beam oscillator that oscillates a processing laser beam used for processing a workpiece,
A condenser that condenses the processing laser beam oscillated by the processing laser beam oscillator, and
A laser beam scanning unit provided between the processing laser beam oscillator and the condenser, which scans the processing laser beam and guides the processing laser beam to the condenser, is included.
The laser beam scanning unit is
An acoustic-optical deflector that changes the traveling direction of the processing laser beam oscillated from the processing laser beam oscillator.
A polygon scanner, which further changes the traveling direction of the processing laser beam whose traveling direction is changed by the acoustic-optical deflector and guides the concentrator, is included.
The processing laser beam is scanned by the change of the traveling direction of the processing laser beam by the acoustic-optical deflector and the traveling direction of the processing laser beam by the polygon scanner, and is held by the holding means. The processing apparatus according to claim 1, wherein the processed material is irradiated with the processing laser beam.

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