CN112518423B - Synchronous measuring device for deformation field and temperature field of orthogonal cutting process - Google Patents
Synchronous measuring device for deformation field and temperature field of orthogonal cutting process Download PDFInfo
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- CN112518423B CN112518423B CN202011541842.XA CN202011541842A CN112518423B CN 112518423 B CN112518423 B CN 112518423B CN 202011541842 A CN202011541842 A CN 202011541842A CN 112518423 B CN112518423 B CN 112518423B
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Abstract
The invention belongs to the technical field related to precision cutting processing measurement, and discloses a synchronous measuring device for a deformation field and a temperature field in an orthogonal cutting process, which comprises: the combined lens system comprises an objective lens and a beam splitter connected with the objective lens, wherein the objective lens is aligned with an orthogonal cutting area, the beam splitter is used for transmitting infrared light and reflecting visible light, the combined lens system also comprises a first focusing lens and a first lens which are arranged on an infrared light path of the beam splitter, and a second focusing lens and a second lens which are arranged on a visible light path of the beam splitter, the first focusing lens and the second focusing lens are arranged in a telescopic sleeve, and a relay lens is arranged between the beam splitter and the second focusing lens; a medium wave thermal infrared imager; a visible light high-speed camera; a control device; and the processor processes and reconstructs the infrared image and the visible light image to obtain a deformation field and a temperature field in the cutting process. The application can realize the imaging collection of the temperature field and the deformation field on the microscale, and has high efficiency and high precision.
Description
Technical Field
The invention belongs to the technical field related to precision cutting and machining measurement, and particularly relates to a synchronous measuring device for a deformation field and a temperature field in an orthogonal cutting process.
Background
In recent years, with the increasing demand for miniaturization of products, micro-miniature elements are widely used in the fields of aerospace, medical instruments, optical communication and the like, wherein precision machining is one of the important processing technical means for actually producing the micro-miniature elements. In precision cutting machining, when the machining dimension is in the micron level, the thermal coupling effect between the tool and the workpiece in the machining process can affect the quality and the precision of the machined surface. In order to further improve the level of the manufacturing process and improve the machining accuracy, further analysis is required in combination with the deformation of the workpiece during machining and the development of the temperature distribution in the cutting area. At present, the analysis of a deformation field and a temperature field in a machining process is limited by adopting single cutting process analytic modeling and finite element simulation modeling, the model is assumed and simplified according to a traditional empirical formula, certain deviation exists between the model and the actual machining condition, especially when a novel material cutting machining mechanism is researched, the traditional empirical formula cannot be directly used, in addition, the finite element modeling simulation calculation amount of precision cutting is large, and therefore, data of the cutting machining process needs to be obtained by means of other technologies, and the machining mechanism research is developed.
At present, a non-contact measurement method is widely researched, wherein in-situ shooting is combined with a digital image processing method (DIC) to obtain a dynamic deformation process of an object and reproduce data such as cutting form change, tool nose cutting area displacement, strain distribution and the like in a cutting process. In addition, the influence of operations such as surface mounting, punching and the like on cutting processing in contact type temperature measurement can be effectively reduced by adopting the non-contact thermal infrared imager for temperature measurement. However, the two measurement methods are more respectively and independently used for the measurement of the cutting process, and the synchronous change rule of the deformation field and the temperature field cannot be obtained. In addition, the prior device and the method for synchronously measuring the deformation field in the temperature situation have the following defects: (1) the method is characterized in that a color CCD camera is used for shooting a speckle pattern, and operation is carried out based on a DIC method or a colorimetric method, the method is complex in post-operation processing, the accuracy of temperature field data obtained through calculation is not high, the requirement of precision cutting processing cannot be met, and the change condition of a temperature field in a cutting area cannot be directly seen in the shooting process; (2) by adopting the device for simultaneously shooting by the CCD camera and the thermal infrared imager, when the magnification reaches more than 20X, the micro-size cutting area cannot be simultaneously focused, and the object distance of the camera is less than 50mm, so that the calibration work before measurement is very difficult. Therefore, it is desirable to design a device that can measure the deformation field and the temperature field of the micro-scale cutting process synchronously.
Disclosure of Invention
Aiming at the defects or improvement requirements of the prior art, the invention provides a synchronous measurement device for a deformation field and a temperature field in an orthogonal cutting process, which realizes two-stage amplification of an infrared image through an objective lens, a first focusing lens and a first lens, and realizes two-stage amplification of a visible image through the objective lens, a second focusing lens and a second lens, so that imaging acquisition of the temperature field and the deformation field on a micro scale can be realized, synchronous acquisition of the temperature field and the deformation field can be realized through a control device, and further synchronous measurement of the temperature field and the deformation field can be realized, and the efficiency is high and the precision is high.
To achieve the above object, according to one aspect of the present invention, there is provided a synchronous measuring device for a deformation field and a temperature field of an orthogonal cutting process, the device including: the combined lens system comprises an objective lens and a beam splitter connected with the objective lens, wherein the objective lens is used for aligning with an orthogonal cutting area and amplifying the area, the beam splitter is used for transmitting infrared light and reflecting visible light, the combined lens system further comprises a first focusing lens and a first lens which are arranged on an infrared light path of the beam splitter, and a second focusing lens and a second lens which are arranged on a visible light path of the beam splitter, the first focusing lens and the second focusing lens are arranged in a telescopic sleeve, and a relay lens is arranged between the beam splitter and the second focusing lens; the medium wave thermal infrared imager is arranged on the optical path of the first lens and is used for acquiring an image which is magnified again on the image surface of the first lens; the visible light high-speed camera is arranged on the optical path of the second lens and is used for acquiring an image which is magnified again on the image surface of the second lens; the control device is connected with the medium wave thermal infrared imager and the visible light high-speed camera; and the processor is connected with the control device and used for processing and reconstructing images acquired by the medium-wave thermal infrared imager and the visible light high-speed camera to obtain a deformation field and a temperature field in a cutting process.
Preferably, the synchronous measuring device further comprises a micro-motion platform, slide rails parallel to the infrared light path and the visible light path are arranged on the micro-motion platform, and the medium-wave thermal infrared imager and the visible light high-speed camera are arranged on the slide rails respectively.
Preferably, the lower part of the micro-motion platform is provided with a micro-distance adjusting mechanism and a plurality of telescopic supporting shafts.
Preferably, a 50:50 beam splitter is arranged between the relay lens and the second focusing lens, a beam splitting lens in the 50:50 beam splitter is parallel to a cold mirror in the beam splitter, the combined lens system further includes a first light source, and the 50:50 beam splitter is used for reflecting part of light of the first light source to enter the relay lens, and then the reflected light is reflected by the beam splitter and illuminates the orthogonally cut area to realize coaxial supplementary lighting.
Preferably, the frame rates of the medium wave thermal infrared imager and the visible light high-speed camera are set to be the same or different by a multiple of 10.
Preferably, the first lens and the second lens have the same magnification.
Preferably, the combined lens system further comprises a second light source for directly illuminating the orthogonally cut region.
Preferably, the synchronous measuring device further comprises a fixing structure for fixing the position of the apparatus in the combined lens system.
In general, compared with the prior art, the above technical solutions conceived by the present invention have the following advantages:
1. the first-stage amplification is realized through the objective lens, the distance between the first focusing lens and the first lens is adjusted through the telescopic sleeve to realize the second-stage amplification of the infrared light image, the distance between the second focusing lens and the second lens is adjusted through the telescopic sleeve to realize the second-stage amplification of the visible light image, and further, the image acquisition in the micro-scale cutting process can be realized, so that the requirement of the precise cutting process can be met;
2. the control device can synchronously trigger the medium-wave thermal infrared imager and the visible light high-speed camera to synchronously acquire images, so that the synchronous acquisition of the infrared images and the visible light images can be realized, namely the synchronous acquisition of a deformation field and a temperature field is realized;
3. the fine adjustment movement of the focusing lens is realized through the telescopic sleeve, the front area of the tool nose to be processed is clearly imaged in the field depth range of the camera through the micro-motion platform, and the shot area is enlarged through the combined light path and then falls in an imaging plane through the telescopic sleeve and the micro-motion platform;
4. the light of the first light source is emitted from the objective lens to the shooting area to realize coaxial light supplement of the area to be observed, so that the lighting efficiency is improved, the brightness of the shooting area is conveniently improved, and further the image acquisition is facilitated;
5. the frame rates of the medium-wave thermal infrared imager and the visible light high-speed camera are set to be the same or the difference is a multiple of 10, so that the difference of imaging characteristics and performance of the two cameras is weakened conveniently, and the temperature and deformation images at corresponding moments are found conveniently;
6. the position of the equipment in the combined lens system is fixed by the fixing structure after the adjustment is finished, so that the influence of external factors such as cutting vibration on the adjusted combined lens is avoided, and the image acquisition is facilitated.
Drawings
FIG. 1 schematically shows an oblique view of a simultaneous measurement device of a deformation field and a temperature field for orthogonal cutting process in this embodiment;
FIG. 2 schematically shows a top view of a simultaneous measurement device of deformation field and temperature field for orthogonal cutting process in this embodiment;
fig. 3 schematically shows a structural diagram of the combined lens system in the present embodiment;
fig. 4 schematically shows an optical path diagram of the combined lens system in the present embodiment;
FIG. 5 is a schematic diagram showing the structure of the micro motion platform in this embodiment.
The same reference numbers will be used throughout the drawings to refer to the same or like elements or structures, wherein:
100-combined lens system:
110-objective lens, 120-beam splitter, 130-first focusing lens, 140-first lens, 150-second focusing lens, 160-second lens, 170-relay lens, 180-50: 50 beam splitter, 181-beam splitting lens, 182-coaxial light source interface, 121-cold mirror, 190-first light source, 190' -second light source;
200-medium wave thermal infrared imager;
300-visible light high speed camera;
400-micro-motion platform:
410-a micro-distance adjusting mechanism, 420-a telescopic supporting shaft and 430-a sliding rail;
500-a control device;
600-a processor.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Referring to fig. 1 and 2, the present invention provides a synchronous measurement device for a deformation field and a temperature field of an orthogonal cutting process, the device includes a combined lens system 100, a medium wave infrared thermal imager 200, a visible light high speed camera 300, a control device 500, a processor 600 and a micro-motion platform 400.
The combined lens system 100 includes an objective lens 110, and a beam splitter 120 connected to the objective lens 110, wherein the objective lens 110 is aligned with an orthogonally cut region as a main lens, the objective lens 110 is preferably a reflective objective lens capable of transmitting visible light and medium wave infrared light simultaneously, and the beam splitter 120 is configured to transmit infrared light and reflect visible light.
The combined lens system 100 further includes a first focusing lens 130 and a first lens 140 disposed on the infrared light path of the beam splitter 120, and a second focusing lens 150 and a second lens 160 disposed on the visible light path of the beam splitter 120, where the first focusing lens 130 and the second focusing lens 150 are disposed in the telescopic sleeve, and move along with the telescopic adjustment of the telescopic sleeve, so as to respectively realize the adjustment of the imaging focus of the infrared light imaging part and the adjustment of the imaging focus of the visible light imaging part.
The objective lens 110 is used for first-stage magnification, the distance between the first focusing lens 130 and the first lens 140 is adjusted to realize second-stage magnification of infrared light imaging, the distance between the second focusing lens 150 and the second lens 160 is adjusted to realize second-stage magnification of visible light imaging, and then the microscopic magnification function of the whole combined lens is realized. The first lens 140 and the second lens 160 are preferably magnifying lenses, and the scale of the second stage magnification can be further adjusted. The first focusing lens 130 and the first lens 140 are further configured to implement focused imaging and second-stage magnified imaging of the infrared light after first-stage magnification, and the second focusing lens 150 and the second lens 160 are further configured to implement focused imaging and second-stage magnified imaging of the visible light after first-stage magnification, respectively. The second-order magnification of the visible light image is preferably the same as the second-order magnification of the infrared light image.
A relay lens 170 is disposed between the beam splitter 120 and the second focusing lens 150. A 50:50 beam splitter 180 is arranged between the relay lens 170 and the second focusing lens 150, and a beam splitting lens 181 in the 50:50 beam splitter 180 is parallel to the cold mirror 121 in the beam splitter 120. In this embodiment, the inclination angles of the beam splitter 181 and the cold mirror 121 are preferably 45 °.
The combined lens system 100 further includes a first light source 190, and the 50:50 beam splitter 180 is configured to reflect a light portion of the first light source 190 into the relay mirror 170, and then irradiate the orthogonally cut region after being reflected by the beam splitter 120, so as to implement coaxial light supplement for the region. In this embodiment, the first light source 190 is preferably an LED cold light source, and is configured with an optical fiber light guide beam, the coaxial light source interface 182 is disposed on the outer surface of the 50:50 beam splitter 180, and the light focused by the condenser lens is irradiated onto the beam splitting mirror 181 through the coaxial light source interface 182.
The combined lens system 100 further includes a second light source 190' for directly irradiating the orthogonal cutting region, where the light source is an LED cold light source, and an optical fiber light guiding bundle is configured, where an external light source is aligned with the blade tip region to perform external light supplement.
The medium-wave thermal infrared imager 200 is arranged on a light path of the first lens 140 and is used for acquiring an image formed by the first lens 140; the visible light high-speed camera 300 is arranged on the light path of the second lens 160 and is used for acquiring an image formed by the second lens 160; the thermal infrared imager 200 and the thermal imagerThe frame rate settings of the high-speed camera 300 for visible light are preferably the same or differ by a multiple of 10. Before the orthogonal cutting experiment, the consistency calibration of the amplification specifications of the visible light high-speed camera 300 and the medium wave thermal infrared imager 200, the image distortion calibration and the thermal infrared imager temperature measurement calibration are carried out. The strain rate of the cutting area is high in the cutting process, and can reach 2 multiplied by 105s-1Therefore, the frame rates of the medium wave infrared imager 200 and the visible light high-speed camera 300 need to be set to be higher values, and in addition, because the imaging characteristics and the performance of the two cameras are different, the frame rates of the medium wave infrared imager 200 and the visible light high-speed camera 300 are set to be the same or different by multiples of 10, so that the temperature and the deformation image at the corresponding moment can be conveniently found.
The micro-motion platform 400 is provided with slide rails 430 which are parallel to the infrared light path and the visible light path respectively, and the medium wave thermal infrared imager 200 and the visible light high-speed camera 300 are arranged on the slide rails 430 respectively to form a primary adjusting structure. The lower part of the micro-motion platform 400 is provided with a micro-distance adjusting mechanism 410 and a plurality of telescopic supporting shafts 420 to form a secondary adjusting structure, and the combined lens system 100, the medium wave thermal infrared imager 200 and the visible light high-speed camera 300 are integrally moved before cutting according to the depth of field of the camera and the set processing parameters, so that the region in front of the tool nose to be processed can be clearly imaged in the depth of field range of the camera.
The fine motion platform 400 is preferably L-shaped, the micro-distance adjusting mechanism 410 is arranged at the corner of the fine motion platform 400 and can be matched with a plurality of telescopic supporting shafts 420 to realize the whole adjustment of the electric platform, the inner structure of the adjusting device in the X and Y directions is a ball screw, the adjusting precision reaches 0.01mm, and the Z direction is a scissor type lifting structure.
The telescopic sleeve and the micro-motion platform 400 are combined and adjusted, so that the object to be shot can fall on the imaging plane of the camera after the light path is split and amplified by the combined lens system 100.
The synchronous measuring device further includes a fixing structure for fixing the position of the device in the combined lens system 100. The fixation structure is preferably a cage structure. And after the light path adjustment is finished, respectively locking the medium-wave thermal infrared imager 200 and the visible light high-speed camera 300 on the slide rails.
In the installation of the combined lens system 100, the cage type collimating tool is used to calibrate the light path, and the main lens is used to calibrate the standard optical calibration plate, and the object to be photographed is ensured to fall on the imaging plane after being amplified through the combined light path by the matching of the high-precision telescopic sleeve and the sliding guide rail of the micro-motion platform 400.
When the micro speckle measuring device is used, firstly, the surface of a workpiece to be observed is subjected to grinding and polishing treatment, then the micro speckle is manufactured, the quality of the speckle is evaluated, and the verticality of the surface of the workpiece to be observed needs to be ensured in workpiece clamping. Aligning a main lens of the combined lens system 100 to a region to be machined in front of a tool tip, fixing a tool in the machining process, enabling a workpiece to move relative to the tool, adjusting the tool to a set cutting depth according to machining parameters, moving the tool to the front of the workpiece to be machined, illuminating through a first light source and a second light source, and rotating a knob of a micro-distance adjusting mechanism 410 of a micro-motion platform 400 to complete three-dimensional micro-distance adjustment, so that speckles of the tool and the workpiece can be clearly imaged on a camera; the programming of a processing G code is completed on a numerical control system of the machine tool, a pulse signal is given and transmitted to a synchronous trigger of a control device 500 when the machine tool is about to start processing, so that the synchronous shooting of the medium wave thermal infrared imager 200 and the visible light high-speed camera 300 is further ensured, a computer display screen reproduces the chip forming process and the temperature of a cutting area in real time, relevant data are stored after the shooting is completed, a gray level image shot by the visible light high-speed camera 300 is subjected to fast Fourier transform, the data of displacement, strain and the like of the cutting area are calculated, a shooting result image at the same moment is found according to the image time difference between the frame rate calculation and the medium wave thermal infrared imager 200, and the reconstruction of a deformation field and a temperature field in the processing is completed through the analysis of the synchronously shot data.
To sum up, this application realizes the two-stage of infrared image through objective and first focusing lens and first lens and enlargies, realizes the two-stage of visible light image through objective and second focusing lens and second lens and enlargies, combines the two-stage regulation of fine motion platform to can realize the formation of image collection to temperature field and deformation field on the microscale, realize the synchronous collection of the two and then can realize the synchronous measurement of temperature field and deformation field through controlling means, efficient high accuracy height.
It will be understood by those skilled in the art that the foregoing is only an exemplary embodiment of the present invention, and is not intended to limit the invention to the particular forms disclosed, since various modifications, substitutions and improvements within the spirit and scope of the invention are possible and within the scope of the appended claims.
Claims (4)
1. A simultaneous measurement device for a deformation field and a temperature field of an orthogonal cutting process, the device comprising:
a combination lens system (100) including an objective lens (110), a beam splitter (120) connected to the objective lens (110), the objective lens (110) aligning with and magnifying an orthogonally cut region, the beam splitter (120) being configured to transmit infrared light and reflect visible light, the combination lens system (100) further including a first focusing lens (130) and a first lens (140) disposed on an infrared optical path of the beam splitter (120) and a second focusing lens (150) and a second lens (160) disposed on a visible optical path of the beam splitter (120), the first focusing lens (130) and the second focusing lens (150) being disposed within a telescope tube, and a relay lens (170) being disposed between the beam splitter (120) and the second focusing lens (150); a 50:50 beam splitter (180) is arranged between the relay lens (170) and the second focusing lens (150), a beam splitting lens (181) in the 50:50 beam splitter (180) is parallel to a cold mirror (121) in the beam splitter (120), the combined lens system (100) further comprises a first light source (190), and the 50:50 beam splitter (180) is used for reflecting part of light of the first light source (190) to enter the relay lens (170), and then irradiating the orthogonal cutting area after being reflected by the beam splitter (120) to realize coaxial light supplement; the combined lens system (100) further comprises a second light source (190') for directly illuminating the orthogonally cut region;
the medium wave thermal infrared imager (200) is arranged on the optical path of the first lens (140) and is used for acquiring an image which is magnified again on the image surface of the first lens (140);
the visible light high-speed camera (300) is arranged on the optical path of the second lens (160) and is used for acquiring an image which is magnified again on the image surface of the second lens (160), and the magnification factors of the first lens (140) and the second lens (160) are the same; the frame rates of the medium-wave thermal infrared imager (200) and the visible light high-speed camera (300) are set to be the same or different by a multiple of 10;
the control device (500) is connected with the medium-wave thermal infrared imager (200) and the visible light high-speed camera (300);
and the processor (600) is connected with the control device (500), and the processor (600) is used for processing and reconstructing images collected by the medium wave thermal infrared imager (200) and the visible light high-speed camera (300) to obtain a temperature field and a deformation field of the cutting process.
2. The synchronous measuring device according to claim 1, further comprising a micro-motion platform (400), wherein the micro-motion platform (400) is provided with slide rails parallel to the infrared light path and the visible light path, respectively, and the medium wave thermal infrared imager (200) and the visible light high speed camera (300) are provided on the slide rails, respectively.
3. The synchronous measuring device according to claim 2, characterized in that the lower part of the micro-motion platform (400) is provided with a micro-distance adjusting mechanism (410) and a plurality of telescopic supporting shafts (420).
4. The synchronization measurement device according to claim 1, further comprising a fixing structure for fixing a position of an apparatus in the combined lens system (100).
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| CN114088641A (en) * | 2021-11-17 | 2022-02-25 | 山东大学 | Measuring device and method suitable for integration of micro-scale regional strain field and temperature field |
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| CN202780232U (en) * | 2012-05-23 | 2013-03-13 | 武汉凌云光电科技有限责任公司 | Coaxial temperature-measuring imaging laser focusing system |
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