KR20120083854A - Adjustment apparatus, laser machining apparatus, and adjustment method - Google Patents

Abstract

PURPOSE: An adjusting device, a laser processing device, and an adjusting method are provided to enable high-precision laser processing by performing calibration between a laser beam and a spatial modulation element. CONSTITUTION: An adjusting device is composed of a calibration pattern irradiation unit, an object photographing unit, a misorientation value calculation unit, a conversion parameter calculation unit(120), and an adjusting unit. The misorientation value calculation unit calculates a misorientation value of the laser mark shape of an image photographed from the object photographing unit and the shape of calibration patterns. The conversion parameter calculation unit calculates a conversion parameter for correcting the shape of an object based on the calculated misorientation value. The adjusting unit adjusts the irradiation of a laser beam based on the calculated conversion parameter.

Description

ADJUSTMENT APPARATUS, LASER MACHINING APPARATUS, AND ADJUSTMENT METHOD}

The present invention relates to an adjusting apparatus, a laser processing apparatus, and an adjusting method for adjusting irradiation of laser light spatially modulated by a spatial modulating element.

Conventionally, the laser processing apparatus which processes a to-be-processed object by irradiating a to-be-processed object with a laser beam is used. Examples of the processing include drawing of letters and pictures, exposure, repair (repair) of defects generated in the manufacturing process of the substrate, and the like. As the substrate, a liquid crystal display (LCD), a plasma display panel (PDP), a flat panel display (FPD: flat panel display) such as an organic EL display, a semiconductor wafer, a laminated printed circuit board, etc. may be used. have.

Such a laser processing apparatus is provided with a mechanism for irradiating a laser beam at a designated position, direction, and shape. Slits and the like are used for the mechanism. In recent years, as a mechanism, a spatial modulation element (DMD: Digital Micromirror Device) in which micromirrors are arranged in an array shape is also used. This spatial modulation element is also called a spatial light modulator (SLM).

By the way, the designated position, direction, and shape may actually differ from the position, direction, and shape to which the laser beam is irradiated. This is because a plurality of optical parts exist on the optical path from the laser light source to the workpiece, and distortion of these optical parts, shift in the attachment position, shift in the attachment direction, and the like affect.

Therefore, it is necessary to calibrate and adjust the method of irradiation of a laser beam so that the designated position, direction, and shape may match with the position, direction, and shape which a laser beam is actually irradiated.

As the adjustment technique, for example, a technique for calculating a parameter for converting the laser beam for processing into an output pattern from the image irradiated with the guide light, and adjusting the irradiation position of the laser light based on the calculated conversion parameter. This is disclosed (for example, refer patent document 1).

[Patent Document 1] Japanese Patent Laid-Open No. 2009-82966

At the time of processing the workpiece by the laser processing apparatus as described above, the workpiece is irradiated with guide light made of visible light in order to confirm in advance whether it is in a designated position, direction, or shape.

By the way, since the laser light and guide light of which wavelengths differ are passing through the same optical path, a subtle deviation is generated between the laser light and the guide light. Therefore, when calibration is performed using the guide light, there is a problem that a deviation occurs between the position to be processed and the actual irradiation position of the laser light identified by the guide light.

In particular, when higher precision machining is required, there is a problem that the deviation greatly affects the quality of the workpiece.

The present invention has been made in view of the above-described realities, and an adjustment apparatus, a laser processing apparatus, and an adjustment capable of improving the accuracy of laser processing by performing laser calibration based on a laser mark irradiated to the photosensitive member with a predetermined calibration pattern. It is an object to provide a method.

In order to solve the said subject, this invention employ | adopted the following structures.

That is, according to one aspect of the present invention, the adjusting apparatus of the present invention includes an optical system for guiding a laser light emitted from a laser light source onto a stage on which a workpiece is placed, and an optical path image from the laser light source to the workpiece. A space modulating means composed of a plurality of arranged small movable elements so as to irradiate the workpiece with the desired input pattern in a desired input pattern, and the laser light shaped into the shape of the input pattern by the space modulating means. It is an adjustment apparatus which controls the laser processing apparatus provided with the irradiation means which irradiates the to-be-processed object. And the adjustment apparatus of this invention is the calibration pattern irradiation means which irradiates the photosensitive member with the said laser beam shape | molded in the shape of the arbitrary calibration pattern by the said space modulation means, and the said laser beam is irradiated by the said calibration pattern irradiation means. Workpiece imaging means for imaging an image of the photoconductor that has been processed, misalignment value calculating means for calculating a misalignment value between a shape of a laser mark of the image captured by the workpiece imaging means and a shape of the calibration pattern, and the misalignment Conversion parameter calculation means for calculating conversion parameters for correcting the shape of the laser beam on the workpiece to match the shape of the input pattern based on the deviation value calculated by the value calculation means, and the parameter calculation means. On the basis of the conversion parameter calculated by It characterized in that it comprises adjusting means for adjusting the laser light irradiation of the work piece according to the pattern.

In addition, the adjustment device of the present invention, the calibration pattern irradiation means, the guide light irradiated to the workpiece through the optical system to confirm that the laser beam is irradiated to the workpiece in the shape of the input pattern, The spatial modulating means is shaped into the shape of the calibration pattern and irradiated to the photosensitive member. The workpiece imaging means captures an image of the photosensitive member irradiated with the guide light by the calibration pattern irradiating means, and shifts the image. The value calculating means calculates a deviation value between the shape of the guide light mark and the shape of the laser mark of the image picked up by the workpiece imaging means, and the conversion parameter calculating means determines the shape of the laser mark and the calibration. Deviation from the shape of the pattern and the shape of the guide light marks On the basis of the deviation value of the group with laser marking of the contour, it is preferable to calculate the conversion parameters.

Moreover, the adjustment apparatus of this invention is the information of the said surface so that the said laser beam irradiated by the said calibration pattern irradiation means may irradiate to parts other than the said circuit pattern part among the surfaces of the to-be-processed object in which the circuit pattern was formed as said photosensitive member. It is preferable to further provide a calibration pattern creation means for creating the calibration pattern based on.

Moreover, it is preferable that the adjustment apparatus of this invention produces | generates a calibration pattern so that the said calibration pattern preparation means may avoid a circuit pattern or a defect as the information of the said surface.

Moreover, the adjustment apparatus of this invention is further provided with display means which overlaps and displays the area | region to which the laser beam adjusted by the said adjustment means irradiated on the image of the to-be-photographed object by the said workpiece imaging means. desirable.

Moreover, according to one aspect of the present invention, the laser processing apparatus of the present invention includes an optical system for guiding a laser light emitted from a laser light source onto a stage on which a workpiece is placed, and an optical path from the laser light source to the workpiece. A space modulating means composed of a plurality of arranged small movable elements for irradiating the workpiece with the laser light in a desired input pattern, and the laser shaped into the shape of the input pattern by the space modulating means. A projection means for irradiating light to the photoconductor, a workpiece image pickup means for imaging an image of the photoconductor irradiated with the laser light by the preview means, and a shape of a laser mark of an image captured by the workpiece image pickup means; Shift value calculation means for calculating a shift value from the shape of the input pattern, and the shift value The conversion parameter calculating means for calculating a conversion parameter for correcting the shape of the laser beam on the workpiece to coincide with the shape of the input pattern based on the deviation value calculated by the extraction means, and by the parameter calculating means. And adjusting means for adjusting the irradiation of the laser beam to the workpiece according to the input pattern based on the calculated conversion parameter.

In addition, the laser processing apparatus of the present invention includes the guide light irradiated to the workpiece through the optical system in order to confirm that the projection means is irradiated to the workpiece in the shape of the input pattern. Shaped into the shape of the input pattern by a space modulating means and irradiating to the photosensitive member, the workpiece imaging means images an image of the photosensitive member to which the guide light is irradiated by the previewing means, and the deviation value calculating means. The deviation value between the shape of the guide light trace of the image picked up by the workpiece imaging means and the shape of the laser trace is calculated, and the conversion parameter calculating means determines the shape of the laser trace and the shape of the input pattern. On the basis of the deviation value from the deviation value between the shape of the guide light trace and the shape of the laser mark. Preferably, for calculating the transformation parameters.

Moreover, it is preferable that the laser processing apparatus of this invention is equipped with the irradiation means which adjusts by the said adjustment means, and irradiates the said to-be-processed object the said laser beam shape | molded to the shape of the said input pattern.

Moreover, according to one aspect of the present invention, the adjustment method of the present invention includes an optical system for guiding a laser light emitted from a laser light source onto a stage on which a workpiece is placed, and an optical path image from the laser light source to the workpiece. A space modulating means composed of a plurality of arranged small movable elements so as to irradiate the workpiece with the desired input pattern in a desired input pattern, and the laser light shaped into the shape of the input pattern by the space modulating means. The computer of the adjusting apparatus which controls the laser processing apparatus provided with the irradiation means which irradiates the to-be-processed object with the said photosensitive member irradiates the said laser beam shape | molded in the shape of arbitrary calibration patterns by the said space modulation means, An image of the photosensitive member to which light is irradiated is picked up, and a laser mark of the picked-up image Calculates a deviation value between the shape of the laser beam and the shape of the calibration pattern, and calculates a conversion parameter for correcting the shape of the laser beam on the workpiece to match the shape of the input pattern based on the calculated deviation value. And based on the calculated conversion parameter, the irradiation of the laser light to the workpiece according to the input pattern is adjusted.

According to the present invention, calibration is performed between the laser light actually used for processing and the spatial modulation element, so that laser processing with higher precision is possible as compared with calibration with conventional guide light.

Further, according to the present invention, since an arbitrary calibration pattern can be projected by the spatial modulation element, it is possible to perform calibration efficiently at one time.

In addition, according to the present invention, since a calibration pattern having an arbitrary shape can be projected by the spatial modulation element, even if there is a component that distorts the shape of the calibration pattern in the irradiation target area, the spatial modulation is performed by pattern arrangement to avoid it. It is possible to set in an element.

BRIEF DESCRIPTION OF THE DRAWINGS The figure which shows the structure of the laser processing apparatus for implementing this invention.
2 is a diagram illustrating an example of a calibration pattern.
3 is a diagram illustrating a modification example from an input pattern to an output pattern.
4 is a flowchart for explaining the flow of calibration pattern coordinate detection processing.
FIG. 5 is a flowchart for explaining a calculation procedure of the conversion matrix T as the conversion parameter in the first embodiment. FIG.
6 is a view for explaining an adjustment method.
7 is a diagram for explaining a second embodiment.
8 is a diagram illustrating a configuration of a laser machining apparatus in a third embodiment.
9 is a diagram for explaining calibration of a guide light and a laser light in a third embodiment.
10 is a diagram for explaining a fifth embodiment.
11 is a diagram for explaining a sixth embodiment;

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described in detail, referring drawings.

In addition, although the word "calibration" is normally used by the meaning containing "adjustment", in the following description, "calibration" shall not contain "adjustment". In addition, unless otherwise indicated, "adjustment" shall mean "adjustment based on the result of a calibration."

(1st embodiment)

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the structure of the laser processing apparatus for implementing this invention.

The adjustment apparatus to which this invention is applied is an apparatus which controls the laser processing apparatus 100 as shown in FIG.

The laser processing apparatus 100 will be described schematically with an optical system for guiding the laser light emitted from the laser light source 103 onto the stage 101 on which the workpiece 102 is placed, and from the laser light source 103. It is provided on the optical path to the to-be-processed object 102, and is provided with the space modulating means DMD which consists of a plurality of the micro movable elements arrange | positioned in order to irradiate the to-be-processed object 102 with a desired input pattern. And this laser processing apparatus 100 is equipped with the irradiation means which irradiates the to-be-processed object 102 with the laser beam shape | molded in the shape of an input pattern by the space modulation means DMD.

It demonstrates more concretely.

In FIG. 1, the laser processing apparatus 100 includes a camera 112 for imaging the surface of the workpiece 102 placed on the stage 101, and an illumination light source for irradiating illumination light onto the surface of the workpiece 102. (111), a laser light source 103 for irradiating a laser light to the surface of the workpiece 102, and a spatial modulation element (DMD) 106 for transforming the laser light emitted from the laser light source 103 into an arbitrary spatial shape. ), A control PC 113 for controlling the entire laser processing apparatus 100, a stage control unit 118 for controlling the machining position to enable laser processing at an arbitrary position, and an input unit for operating the control PC 113 ( 114, an image processing unit 116 for processing an image picked up from the camera 112, an image processed by the image processing unit 116, or an image of the surface of the workpiece 102 picked up by the camera 112 is live. Display unit 115 to display as an image, DMD 106 in an arbitrary shape ), An area setting unit 117 that is adjustable, a conversion parameter calculator 120 that calculates a conversion pattern parameter to be described later, and a storage unit that stores the conversion parameters calculated by the conversion parameter calculation unit 120 or an arbitrary calibration pattern ( 119).

The laser processing apparatus 100 removes the defect on the to-be-processed object 102 mounted on the stage 101 with the laser beam of arbitrary shape radiate | emitted from the laser light source 103, and normalizes the circuit pattern which has a defect The device is processed into a circuit pattern. Here, the workpiece 102 may be an FPD substrate, a semiconductor wafer, a laminated printed circuit board, or the like, or another general sample.

In such a laser processing apparatus 100, the laser light emitted from the laser light source 103 is reflected by the mirror 105 and enters the DMD 106.

The DMD 106 is a spatial modulation element in which micromirrors (micro movable elements) are arranged in a two-dimensional array shape. The tilt angle of the micromirror can be switched to at least two types. The states of the micromirrors when the inclination angles are the first and second angles are referred to below as "on state" and "off state", respectively.

The DMD 106 independently switches the inclination angles of the individual micromirrors, that is, the states of the individual micromirrors, based on the instructions from the control PC 113. The instruction to the DMD 106 is represented by data in which binary data indicating whether or not to irradiate a laser beam is arranged in a two-dimensional array shape, for example, and is transmitted from the control PC 113.

When the incident light incident on the DMD 106 from the mirror 105 is reflected by the on-line micromirror, the laser light source 103, the mirror 105, and the DMD 106 are arranged so that the direction of the reflected light is in the vertical direction. Is arranged. And the imaging lens 108 and the half mirror are reflected on the optical path reflected by the micromirror in the on state and reflected by the mirror 121 and the half mirror 107 to the surface of the workpiece 102. The projection optical system which has the 109 and the objective lens 110 is arrange | positioned. The laser light reflected by the micromirror in the on state is projected, that is, irradiated onto the surface of the workpiece 102 through this projection optical system. This projection optical system is comprised so that the surface of the to-be-processed object 102 and DMD 106 may be a conjugated position.

The micromirrors in the off state are different from when the tilt angle is in the on state. Therefore, incident light incident on the DMD 106 from the mirror 105 is reflected in a direction different from the direction reaching the mirror 121 in the off-state micromirror and is not irradiated onto the workpiece 102. In FIG. 1, the optical path of the reflected light by the micromirror of an off state is shown with the broken arrow.

Therefore, by controlling the individual micromirrors in the on state or the off state, it is possible to control whether or not the laser light is irradiated to a position on the workpiece 102 corresponding to each micromirror. That is, by using the DMD 106, the laser beam can be irradiated onto the workpiece 102 at any position, direction, and shape.

Moreover, the laser processing apparatus 100 is equipped with the light source 111 for illumination.

When illumination light is required for imaging the workpiece 102, the illumination light from the illumination light source 111 is reflected by the half mirror 109 through the lens 122, and the workpiece 102 through the objective lens 110. ) Is irradiated to the surface. Instead of the camera 112, an imaging device such as a CMOS (Complementary Metal-Oxide Semiconductor) camera may be used.

The reflected light on the surface of the workpiece 102 of the laser light and the illumination light has all the objective lens 110, the half mirror 109, the imaging lens 108, the half mirror 107, and the lens 123. Incident on the photoelectric conversion element of the camera 112 via an optical system. Thereby, the camera 112 image | photographs the surface of the to-be-processed object 102. FIG.

The control PC 113 controls the whole laser processing apparatus 100. The input unit 114 is realized by an input device such as a keyboard or a pointing device. The instruction input from the input unit 114 is sent to the control PC 113.

In addition, the display unit 115 displays an image, a character, or the like in accordance with an instruction from the control PC 113. The display part 115 displays the image of the to-be-processed object 102 imaged by the camera 112 in substantially real time, for example. Here, the image which the camera 112 image | photographed and the control PC 113 acquired may be called "live image."

In the present embodiment, the control PC 113 may be a general-purpose computer or a dedicated control device. The function of the control PC 113 may be realized by any one of hardware, software, firmware, or a combination thereof. For example, a nonvolatile memory such as a central processing unit (CPU), a read only memory (ROM), a random access memory (RAM) used as a working area, an external storage device such as a hard disk device, and an external device. The control PC 113 may be realized by a computer such as a personal computer (PC) provided with a connection interface with each other and connected to each other by a bus. The CPU realizes the function of the control PC 113 by loading and executing a program stored in a hard disk device or a computer-readable portable storage medium in a RAM.

Next, the workpiece 102 is a substrate, and the laser processing apparatus 100 uses a specific example of a laser repair apparatus that irradiates a laser beam to a defect on the surface of the substrate to repair the defect, thereby providing the structure of the first embodiment. The outline | summary of the operation | movement of the laser processing apparatus 100 is demonstrated.

The calibration applied in the present invention is to take the correspondence of the positional relationship between the pattern formed by the above-described DMD 106 and the pattern formed on the workpiece 102.

And the laser processing apparatus 100 as mentioned above performs the following process.

First, the laser light molded into the shape of an arbitrary calibration pattern by the DMD 106 is irradiated to an arbitrary photoconductor, and an image of the photoconductor to which the laser light is irradiated is photographed using the camera 112. Then, the captured calibration pattern image is extracted by the image processing unit 116 to detect each pattern position.

2 is a diagram illustrating an example of a calibration pattern.

As shown in Fig. 2, the calibration pattern is composed of figures of several points different in area. For example, the example of the calibration pattern shown to Fig.2 (1) is comprised by the circle | round | yen of four points.

In addition, as a photosensitive member which photosensitizes a calibration mark, a blank glass can be used, for example, when irradiating a laser beam with a wavelength of 1.355 nm with high energy. In the case of a laser light having a wavelength of 2.266 nm, the calibration mark can be exposed by irradiating the glass coated with the resist uniformly.

The laser processing apparatus 100 which picked up the image of the photosensitive member performs a calibration. In other words, the conversion parameter calculation unit 120 calculates a deviation value between the shape of the laser mark of the captured image and the shape of the calibration pattern, and based on the calculated deviation value, the workpiece of the laser beam. A conversion parameter for correcting the shape of the image to match the shape of the input pattern is calculated. Then, the irradiation of the laser light onto the workpiece 102 according to the input pattern is adjusted based on the calculated conversion parameter.

Here, the object of calibration is demonstrated.

3 is a diagram illustrating a modification example from an input pattern to an output pattern.

For convenience of explanation, hereinafter, the coordinate axis in the horizontal direction of the image captured by the camera 112 will be referred to as the x-axis, and the coordinate axis in the vertical direction is referred to as the y-axis. And although the size of an image is arbitrary, in this embodiment, it is assumed that it is 640 pixels in an x direction, and 480 pixels in a y direction. In addition, this size is described as "640 x 480 pixels." The position of each pixel in an image is represented by the combination (x, y) of x coordinate and y coordinate. That is, the coordinates of the upper left corner and the lower right corner of the irradiation pattern 310 in FIG. 3 are (0, 0) and (639, 479), respectively.

The irradiation pattern 310 of FIG. 3 is a pattern showing which part of the image should be irradiated with the laser beam with respect to the image picked up by the camera 112. Therefore, the position in the irradiation pattern 310 can also be represented by the combination (x, y) of the x coordinate and the y coordinate, and the size of the irradiation pattern 310 is the same as the image captured by the camera 112 at 640 ×. 480 pixels. In the example of FIG. 3, the irradiation pattern 310 is a cross-shaped white cross shape in which the Tae-tae parallel to the x-axis and the Tae-tae parallel to the y-axis cross | intersect at the center of an image, and the background black is black. The laser beam corresponding to the white cross shape is to be irradiated to the portion on the workpiece 102.

In this embodiment, the irradiation pattern 310 is instructed from the input unit 114 as follows.

First, under the illumination by the illumination light from the illumination light source 111, the camera 112 image | photographs the to-be-processed object 102, without the laser beam being irradiated. The image processing unit 116 then acquires the captured image and outputs it to the display unit 115.

After that, the operator looks at the image output to the display unit 115 and instructs the input unit 114 a range in which the laser light should be irradiated. The instruction is given to the control PC 113 in the form of data of the irradiation pattern 310 having a size of 640x480 pixels via an interface connecting the input unit 114 and the control PC 113.

In addition, the data of the irradiation pattern 310 may be sent to the control PC 113 from an external device. For example, when the laser processing apparatus 100 is a laser repair apparatus, such as an FPD board | substrate, the data of the irradiation pattern 310 may be sent to the control PC 113 from a defect inspection apparatus. Alternatively, even if the laser repair apparatus includes an image recognition unit, the image recognition unit recognizes the shape of the defect by the image recognition process, generates data of the irradiation pattern 310 representing the recognized shape, and outputs the data to the control PC 113. do.

Either way, the data of the irradiation pattern 310 is provided to the control PC 113. In doing so, the control PC 113 generates, from the irradiation pattern 310, DMD transmission data 320 for instructing the DMD 106 to turn on and off individual micromirrors. The DMD transmission data 320 is data representing an input pattern and is transmitted (that is, transmitted) to the DMD 106.

In the DMD 106, the micromirrors are arranged in a two-dimensional array shape, and the position of the micromirrors can be represented by the combination (u, v) of the u coordinate and the v coordinate. In the following description, for the sake of simplicity, it is assumed that the coordinates (x, y) of the pixels in the image and the coordinates (u, v) of the micromirrors have a relationship of x = u and y = v. Since only a small mirror is appropriately arranged and the origin of the uv coordinate system is appropriately determined, this relationship is established, and thus the generality of the following description is not lost.

Here, similarly to the irradiation pattern 310, when irradiating a laser beam is shown in white and not irradiating in black, the DMD transmission data 320 can also be expressed as a black and white binary image. In other words, the data for DMD transmission 320 is a black and white binary image which shows the point of position (u, v) by the white which shows the micromirror on, or the black which shows the micromirror off. Can be expressed.

In this embodiment, it is assumed that 800x600 micromirrors are arranged in the DMD 106. That is, the number of the micromirrors is larger than the number of pixels of the image picked up by the camera 112. Therefore, the image which shows the DMD transmission data 320 becomes an image which surrounded the black margin around the image which shows the irradiation pattern 310. As shown in FIG. The reason for such a margin will be described later.

That is, the color (white or black) at the position (x, y) of the image representing the irradiation pattern 310 and the position u of the image representing the DMD transmission data 320 (u = x, v = y) , v) have the same color. Then, when the position (u, v) is in the range of u <0 or 640≤u or v <0 or 480≤v, at the position (u, v) of the image representing the DMD data 320 The color is black.

In FIG. 3, the DMD transmission data 320 has a white square frame, but this frame represents a range of 640 x 480 pixels corresponding to the irradiation pattern 310 for convenience of explanation. It does not indicate that the micro mirror of the image is turned on.

In the present embodiment, in the DMD transmission data 320, the width of the margin above and below the white frame line is the same, and the width of the margin on the right and the margin on the left are also the same. However, the margin width may be appropriately determined.

Based on the above relationship between the irradiation pattern 310 and the DMD transmission data 320, the control PC 113 generates the DMD transmission data 320 from the data of the irradiation pattern 310. . As described above, in order to generate the DMD transmission data 320, the control PC 113 may simply add a black margin around the irradiation pattern 310.

Then, the area setting unit 117 in the control PC 113 outputs the DMD transmission data 320 to the DMD 106 to give an on or off instruction to each of the 800 × 600 micromirrors. do.

Here, the micromirror of the DMD 106 is turned on or off according to the supplied DMD transmission data 320 itself without performing adjustment based on the calibration, and the laser light is emitted from the laser oscillator 103. Assume that

In this case, generally, the pattern of the laser beam irradiated on the to-be-processed object 102 differs from the desired irradiation pattern 310. This is because the optical system and / or the imaging system of the laser processing apparatus 100 have shifts and distortions.

For example, the mirror or the lens may be distorted, or the attachment position of each component of the laser processing apparatus 100 may be shifted, or there may be a component that is rotated and attached from the original angle due to the attachment angle being shifted.

The live image 330 of FIG. 3 is an example of the image image | photographed by the camera 112, when the pattern different from the desired irradiation pattern 310 is irradiated on the to-be-processed object 102 as it is. Therefore, the position on the live image 330 can also be represented by the xy coordinate system, and the size of the live image 330 is 640x480 pixels.

In the live image 330 of FIG. 3, the part to which the laser beam was actually irradiated is shown in white, and the part which was not irradiated is displayed in black. When the live image 330 is compared with the irradiation pattern 310, the white cross shape moves in the positive direction of the x axis, and is rotated about 15 degrees in the counterclockwise direction. When the deformation from the irradiation pattern 310 to the live image 330 actually includes not only such parallel movement (shift) and rotation, but also distortion of shapes such as enlargement and reduction, that is, scale conversion and shear deformation, etc. There is also.

Therefore, in order to prevent such deformation | transformation, it is necessary to calibrate and adjust irradiation of a laser beam based on the result of a calibration.

In the present embodiment, the above-described deformation of the irradiation pattern caused by the deviation and distortion present in the laser processing apparatus 100 is regarded as a result of a kind of transformation, and the transformation is mathematically modeled.

Next, a description will be given of a process of acquiring a parameter indicating the mathematically modeled transformation by calibration and adjusting it based on the acquired parameter.

First, the calibration method will be described.

The control PC 113 provides the area setting unit 117 with a calibration pattern composed of figures of several points with different areas as shown in FIG. Since the areas are different from each other, identification between the calibration pattern provided to the area setting unit 117 by the image processing and the figures of the calibration pattern baked on the surface of the photoconductor is facilitated. Accordingly, the calibration pattern may be any shape pattern as long as the three points are distinguished from each other.

Next, the camera 112 image | photographs the calibration pattern baked on the surface of the photosensitive member. The image processing unit 116 detects the center of gravity position and area of each figure from the obtained calibration pattern image. Similarly, the image processing unit 116 detects the center of gravity position and area of each figure from the calibration pattern image provided to the area setting unit 117.

And based on the positional relationship of three points from the calibration pattern provided to the area | region setting part 117, and three points from the calibration pattern baked to the surface of the photosensitive member, the conversion matrix between the area | region setting part 117 and the photosensitive member surface is carried out. Write.

The conversion matrix is written as follows.

That is, the mirror position turned on by the area setting unit 117 is the mirror coordinate value, and the position corresponding to the mirror position baked on the photosensitive member surface by the laser light source 103 is used as the irradiation coordinate value.

Then, the conversion matrix is obtained in the following two steps.

First, as the first step, mirror coordinate values of several points and irradiation coordinate values of several points corresponding thereto are obtained.

The DMD 106 can be adjusted by providing the area setting unit 117 with a predetermined two-dimensional binary image corresponding one-to-one to ON and OFF of the entire micromirror on the DMD 106. Therefore, the shape of the pattern formed by the DMD 106 is adjusted by transferring the binary image including the figures of several points having different positions and areas as shown in FIG. 2 to the area setting unit 117. Then, by irradiating the spatially modulated laser light from the laser light source 103, the photosensitive member surface is burned out in a pattern corresponding to the binary image. An image of the surface of the photoconductor including the pattern baked by the camera 112 is picked up. The binary image provided to the area setting unit 117 and the pattern image baked on the surface of the photoconductor are transferred to the image processing unit 116, and the calibration pattern coordinate detection process is executed.

4 is a flowchart for explaining the flow of calibration pattern coordinate detection processing.

In step S401, the image processing unit 116 executes binarization with a white pattern and a black background on the pattern image baked on the photosensitive member surface. As a binarization method, well-known methods, such as a floating binarization process, may be used. The binary image provided to the area setting unit 117 is also created with a white pattern and a black background.

And in step S402, after performing a shrinkage process with respect to the binarized image, an expansion process is performed and a foreground binary image with respect to a pattern is obtained. Shrinkage processing is a process which shrinks the area | region of a background, and by this shrinkage process, the part whose line width is below a predetermined width is erased. Then, the area of the pattern remaining in the shrinkage process is returned to the area of the original size by the expansion process.

In step S403, the isolated area of the binarized image subjected to the expansion / contraction process is labeled. The labeling method is arbitrary, and a well-known method may be applied.

Next, the gravity center position of each pattern is calculated in step S404, and the area of each pattern is calculated in step S405. And in step S406, by sorting by the magnitude | size of the area computed by step S405, the pattern of several points of the binary image provided to the area | region setting part 117, and the pattern of several points baked on the photosensitive member surface are respectively match | corresponded. For example, the pattern having the largest area among the patterns of several points on the binary image provided to the area setting unit 117 and the pattern having the largest area among the patterns of several points burned on the photosensitive member surface are considered to correspond. do.

In this way, the correspondence between the pattern of several points on the binary image provided to the area setting unit 117 and the pattern of several points baked on the photosensitive member surface is obtained.

Next, as a 2nd step, an affine transformation matrix is calculated | required based on the mirror coordinate value of several points and the irradiation coordinate value of several points corresponding to it.

For example, in FIG. 3, the data for DMD transmission 320 is the same as the irradiation pattern 310 except for the margin. Therefore, the irradiation pattern 310 can be said to be an input pattern actually assigned to the DMD 106. And the live image 330 is an output pattern which arises in an image, when the laser beam which is not adjusted at all and is deformed is irradiated on the to-be-processed object 102 corresponding to the input pattern. Therefore, the deformation from the irradiation pattern 310 to the live image 330 can be regarded as a result of the conversion from the input pattern to the output pattern.

In this embodiment, this transformation adopts a mathematical model called an affine transformation represented by the transformation matrix T. That is, each element of the transformation matrix T is a transformation parameter to be calculated by calibration.

As described above, since both the input pattern and the output pattern can be represented by the xy coordinate system, and always u = x and v = y, even if the uv coordinate system and the xy coordinate system are identified, there is no problem in calculating the conversion parameter.

That is, in the mathematical model of the present embodiment, "the irradiation coordinate (x, y) in the irradiation pattern 310 which is the same as the coordinate (u, v) in the DMD data 320 is a transformation indicating an affine transformation. The matrix T is converted into mirror coordinates (x ', y') in the live image 330 ".

This mathematical model is expressed by the following equation.

Where the affine transformation matrix is T

.

This affine transformation matrix T represents a transformation from an arbitrary position on the DMD image to a unique position on the laser irradiation image. Therefore, once the DMD image is converted into an inverse transformation matrix T ', it is possible to perform laser irradiation similar to an arbitrary image shape set to the DMD image.

Next, a process of calculating the transformation matrix T using the above-described calibration pattern will be described.

FIG. 5 is a flowchart for explaining a calculation procedure of the conversion matrix T as the conversion parameter in the first embodiment.

First, in step S401, the control PC 113 creates a calibration pattern as illustrated in, for example, FIG. 2 and outputs it to the area setting unit 117. In addition, instead of creating a calibration pattern, the control PC 113 may read out the calibration pattern stored in the memory | storage part 119 previously.

In step S402, the calibration pattern created in step S401 is designated to the DMD 106 as an input pattern.

Next, in step S403, the control PC 113 acquires the coordinates from the data of the calibration pattern. For example, in the calibration pattern of FIG. 2 (1), the control PC 113 recognizes four circles from the calibration pattern by the image recognition process executed by the image processing unit 116, and recognizes the four circles. The coordinates of the centers (ie, the center of gravity) of the two circles are calculated and obtained, respectively. These four coordinates are referred to as coordinates a, b, c and d.

And a laser beam is irradiated in step S404. That is, the area setting unit 117 controls the DMD 106 so as to switch between the on state and the off state of the micromirror in accordance with the calibration pattern. Thereby, the laser light emitted from the laser light source 103 is spatially modulated in accordance with the calibration pattern, and is projected (ie irradiated) to the surface of the photosensitive member via the DMD 106.

Subsequently, in step S405, the camera 112 picks up the photosensitive member and acquires (ie, captures) the data of the image picked up by the control PC 113 from the camera 112. In this image, an output pattern corresponding to a calibration pattern exists.

Next, in step S406, the control PC 113 acquires the coordinates of four points a ', b', c ', d' from the output pattern of the image acquired in step S405 as follows.

That is, the control PC 113 first converts the acquired image into a black and white binary image. This binarization is performed based on the comparison of the luminance value and the threshold value of each pixel, for example. In the converted black and white binary image, the white area is the portion of the area to which the guide light is irradiated, and the black area is the area to which the guide light is not irradiated. Then, the control PC 113 performs the following processing using the converted monochrome binary image.

For example, when the calibration pattern of Fig. 2 (1) is used, the control PC 113 recognizes the presence and the position of a shape close to a circle or an ellipse by the image recognition process. As a result, four shapes are recognized. In the example of the calibration pattern of FIG. 2 (1), suppose that the area of four circles is corresponding to points a, b, c, and d in order from small to small. Therefore, the control PC 113 calculates the areas of the recognized four shapes and associates the shapes with the points a ', b', c ', and d' in the order of the smallest areas. In addition, the control PC 113 calculates the coordinates of the center of gravity of each of the four recognized shapes, and acquires these four coordinates as coordinates of four points a ', b', c ', and d'.

Subsequently, in step S407, control PC 113 calculates the conversion matrix T as described above. The data of the created conversion matrix T is stored in a storage unit 119 such as a RAM or a hard disk.

Next, the adjustment method in 1st Embodiment is demonstrated.

6 is a diagram for explaining an adjustment method.

The irradiation pattern 310 and DMD transmission data 320 shown in FIG. 6 are the same as those shown in FIG. 6 is a figure explaining using the conversion matrix T similar to FIG.

In the first embodiment, the control PC 113 of FIG. 2 reads the transformation matrix T and the inverse transformation matrix T 'which have been calculated and stored in the storage unit 119. In addition, the inverse transformation matrix T 'is calculated as the inverse of the transformation matrix T (= T ^-1 ). That is, the inverse transformation matrix T 'is an inverse transformation parameter which shows the inverse transformation of the transformation by the transformation matrix T as a transformation parameter. In addition, the data of the inverse transformation matrix T 'is also stored in the storage unit 119.

In addition, the control PC 113 receives the irradiation pattern 310 from the input unit 114 to generate the DMD transmission data 320. In addition, the DMD transmission data 320 is converted by the inverse transformation matrix T 'to generate the DMD transmission data 621, and output to the area setting unit 117.

Then, the area setting unit 117 designates the DMD transmission data 621 as an input pattern to the DMD 106, and controls the DMD 106. That is, the control PC 113 has a function of designating the DMD transmission data 621 as an input pattern to the DMD 106 via the area setting unit 117.

In the example shown in FIG. 6, similarly to FIG. 3, the transformation matrix T represents a transformation obtained by combining the movement in the positive direction of the x-axis and the rotation of about 15 degrees in the counterclockwise direction. Therefore, in FIG. 6, the DMD transmission data 621 converted by the inverse transformation matrix T 'rotates the pattern of the DMD transmission data 320 clockwise by about 15 degrees and moves in the negative direction of the x-axis. to be.

Then, in order to correct the defect, when the laser light is emitted from the laser light source 103, the laser light is transmitted onto the workpiece 102 through the DMD 106 in which the DMD transmission data 621 is designated as an input pattern. Is investigated. In this embodiment, the camera 112 image | photographs the to-be-processed object 102 here, and acquires the image from the camera 112. FIG. The image acquired in this way is the live image 631 of FIG.

As shown in FIG. 6, the output pattern shown in the live image 631 becomes the same pattern as the irradiation pattern 310, since the distortion by the inverse transformation matrix T 'and the transformation by the transformation matrix T cancel each other.

As described above, the fact that the output pattern on the live image 631 is the same as the irradiation pattern 310 means that the laser beam is correctly irradiated into the shape to be processed at the position to be processed by the adjustment by the control PC 113. That is, the correct irradiation is imaged as the live image 631.

Further, as can be seen by comparing the DMD transmission data 320 and the DMD transmission data 621, the white portion indicating that the micromirror should be turned on as a result of the conversion by the inverse transformation matrix T ', In the DMD data 621, there is a possibility that it is outside the range of u <0 or 640≤u or v <0 or 480≤v. Therefore, in this embodiment, the DMD 106 provided with the micromirror more (for example, 800x600) than the number of pixels (for example, 640x480 pixels) of the image which shows the irradiation pattern 310 is used. do. In this case, as shown in FIG. 3 or FIG. 6, the image showing the DMD transmission data 320 which is the input pattern designated to the DMD 106 is black (that is, the periphery of the image showing the irradiation pattern 310). The image surrounded by margins, indicating not to irradiate light.

The above is description of 1st Embodiment which applied this invention.

According to this embodiment, since a calibration is performed between the laser beam actually used for a process and DMD106, laser processing of high precision is attained compared with the calibration with the conventional guide light.

Next, a second embodiment to which the present invention is applied will be described.

(Second Embodiment)

2nd Embodiment is embodiment which displays on the display part 115 the predetermined position of the laser beam irradiation used by the process for defect correction after the process performed by 1st Embodiment.

It is a figure for demonstrating 2nd Embodiment.

That is, before the irradiation of the laser beam adjusted as in the first embodiment, the surface of the workpiece 102 is imaged by the camera 112. And the display part 115 in the state which superimposed the area | region 702 to which a laser beam is irradiated on the image of the to-be-processed object 102 in which the pattern 701 was formed as shown in (1) of FIG. 7, for example. On the display. Here, the region 702 to be irradiated with the laser beam may be an outer frame as shown in Fig. 7 (2), may be painted as shown in (3), or may be superimposed as semitransparent as shown in (4).

In this way, since the area to be irradiated is displayed on the display unit 115, it is not necessary to add a light source for guide light as in the prior art to the configuration.

Next, a third embodiment to which the present invention is applied will be described.

(Third embodiment)

In 3rd Embodiment, the light source for using as a guide light is added to the structure of 1st Embodiment.

It is a figure which shows the structure of the laser processing apparatus in 3rd Embodiment.

The laser processing apparatus 800 further includes a guide LED (Light Emitting Diode) light source 801 in addition to the laser processing apparatus 100 described with reference to FIG. 1. Light irradiated from the LED light source 801 (hereinafter referred to as "guide light") is reflected by the half mirror 802 and enters the mirror 105. This guide light is used to indicate the laser processing position to the operator in advance.

Here, the laser light source 103, the half mirror 802, and the LED light source 801 are arranged such that the optical axis of the laser light transmitted through the half mirror 802 and the guide light reflected by the half mirror 802 coincide with each other. It is arranged. Therefore, the optical path of the guide light after being reflected by the half mirror 802 is the same as the optical path of the laser light from the laser light source 103, and the guide light is irradiated to the workpiece 102 similarly to the laser light.

When the guide light and the laser light pass through the same optical path but co-focusing adjustment is not performed, there is a subtle deviation on the surface of the workpiece 102. Therefore, if it processes with a laser beam after performing calibration with the conventional guide light as disclosed by patent document 1, it will subtly shift and process it.

In this embodiment, a high precision laser processing is performed by performing a calibration between guide light and a laser beam.

That is, in order to confirm that the laser beam is irradiated to the workpiece 102 in the form of an input pattern, the guide beam irradiated to the workpiece 102 through an optical system constituting the same optical path through which the guide beam and the laser beam pass. It is shape | molded to the shape of a calibration pattern, it irradiates to a photosensitive member, and the image of the photosensitive member by which guide light was irradiated is imaged. The deviation value between the shape of the guide light trace and the shape of the laser trace of the captured image is calculated, and the deviation value between the shape of the laser trace and the shape of the calibration pattern calculated in the same manner as in the first embodiment, and the guide light. The conversion parameter is calculated based on the deviation value between the shape of the mark and the shape of the laser mark.

9 is a diagram for explaining the calibration of the guide light and the laser light in the third embodiment.

First, in the state where the calibration pattern is adjusted with the DMD 106, images obtained by irradiating light onto the surface of the workpiece 102 with the guide light (white) and the laser light (black) are respectively obtained (FIG. 5 (5). )).

Next, with respect to the acquired image, the coordinates of each calibration pattern are acquired by the method used in the first embodiment ((1) and (2) in FIG. 9). By the obtained calibration pattern coordinates, the correspondence between the guide light and the laser light is obtained as the conversion matrix T2 (Fig. 9 (6)).

Next, by the method described in the first embodiment, the correspondence relation between the DMD 106 and the guide light is obtained as the conversion matrix T1 (FIG. 9 (3), (4)). By multiplying the transformation matrix T1 with respect to the mask image adjusted by the DMD 106 (Fig. 9 (8)), it is possible to simulate the state in which the guide light is irradiated to the workpiece surface (Fig. 9 (9) )). In addition, by multiplying the transformation matrix T2, it is possible to simulate a state in which the laser beam is irradiated to the workpiece surface (Fig. 9 (10)).

Then, by calculating the state obtained by multiplying the transformation matrix T1 by the transformation matrix T2 as the transformation matrix T, it becomes possible to perform calibration between the DMD 106 and the laser light only with the guide light without irradiating the laser light.

In addition, contrary to the above, the guide light may be simulated from the laser light.

Next, a fourth embodiment to which the present invention is applied will be described.

(Fourth Embodiment)

4th Embodiment is performed by the laser processing apparatus of the same structure as 3rd Embodiment mentioned above.

As in the above-described third embodiment, in the case of the configuration using the guide light, positional displacement occurs in the guide light and the laser processing shape due to the influence of the diffraction angle on the DMD 106. Therefore, when the operator confirms the machining position on the display unit 115 or the like, the guide light may be shifted from the actual machining position.

Therefore, in the fourth embodiment, the mask pattern for the guide light is set in the DMD 106 before processing, and the mask pattern for processing is set in the DMD 106 immediately before processing. Thereby, it becomes possible to eliminate the deviation of the external appearance of a guide light and a laser processing position.

That is, by controlling the stage 101 on which the workpiece 102 is placed by the instruction from the stage control unit 118, after moving the workpiece 102 to the machining position, the surface of the workpiece 102 is imaged. do. And the mask image which masks other than a processable area | region is created by the image process performed by the image processing part 116. FIG. Next, the guide light mask and the processing mask are created by the conversion matrix created by the guide light and the laser processing marks.

Then, the created guide light mask is adjusted by the DMD 106. In that case, since the mask for guide lights is adjusted, the guide light in the state without a shift | deviation on the display part 115 will show the processing position of the to-be-processed object 102. FIG.

And when the preparation for laser beam launching becomes OK, it is also possible to confirm the precision of a process position by adjusting the processing mask by DMD106, and adjusting the guide light mask by DMD106 after laser irradiation.

Next, a fifth embodiment to which the present invention is applied will be described.

(Fifth Embodiment)

10 is a diagram for explaining a fifth embodiment.

In each of the above-described embodiments, in order to perform the calibration with high accuracy, there is no obstacle that distorts the irradiation shape such as the pattern 1001 in the region 1002 (FIG. 10 (1)) to which the calibration pattern is irradiated. desirable. When the laser beam is irradiated onto a three-dimensional object such as the pattern 1001 (Fig. 10 (2)), the processing state of the calibration pattern image picked up by the camera 112 becomes a non-uniform and distorted state.

Since such a calibration pattern is in a nonuniform and distorted calibration pattern, the calibration pattern position and center of gravity measured in the image processing by the image processing unit 116 have errors in units of pixels, which makes it difficult to accurately perform calibration. Become.

Therefore, in order to perform the calibration with high accuracy, it is necessary to prepare a substrate on which the pattern 1001 is not formed, or to prepare the regions 1002A, 1002B, 1002C, and 1002D on which the pattern 1001 is not formed ((3) of FIG. 10). ), It is necessary to examine the calibration pattern.

In the fifth embodiment, the following processing is executed.

First, the background portion is detected by means for detecting the background. The means for detecting the background means that the background image (FIG. 10 (4)) in which the pattern 1001 has been erased by the Bosch filter is differentiated from the captured image (FIG. 10 (5)). A method of detecting an area other than the pattern 1001 (four rectangular areas in black in FIG. 10 (6)) may be mentioned.

And the calibration pattern is arrange | positioned in the position which enters in a background part as having performed in each embodiment mentioned above (FIG. 10 (7)).

That is, based on the information of the surface obtained from a captured image so that the said laser beam irradiated from the laser light source 103 may irradiate parts other than the said circuit pattern part among the surfaces of the to-be-processed object 102 in which the circuit pattern was formed as the said photosensitive member. To create the calibration pattern. For example, a calibration pattern is created so as to avoid a circuit pattern or a defect as the information on the surface.

Next, a sixth embodiment to which the present invention is applied will be described.

(6th Embodiment)

The sixth embodiment to which the present invention is applied is an embodiment in which calibration is performed again after the calibration is performed. Or after carrying out calibration with a guide light, calibration is performed with a laser.

FIG. 11 is a diagram for explaining a sixth embodiment. FIG.

When the uniformity of the light quantity distribution of the laser beam is lost, when the mirror beam of the DMD 106 is entirely turned on with respect to the workpiece 102 in the state where all of the mirrors are turned on (Fig. 11 (1)), the workpiece 102 Processing irregularity occurs on the surface of the () (Fig. 11 (2)).

If calibration is performed in the state where such processing nonuniformity exists (FIG. 11 (3)), nonuniformity such as gradation will occur in the calibration pattern after processing (FIG. 11 (4)), and the calibration pattern by binarization When the detection is performed, it becomes difficult to accurately detect the calibration pattern shape (Fig. 11 (5)).

Therefore, by specifying a portion where non-uniformity occurs in advance (FIG. 11 (6)) and arranging a calibration pattern to avoid non-uniformity (FIG. 11 (7)), it is possible to create a calibration pattern without non-uniformity (FIG. 11). (8)), the calibration pattern shape can be detected accurately (Fig. 11 (9)).

As a specific process, first, the difference image is created by taking the difference between the image before processing and after processing. Since only the part changed by processing is detected in the created difference image, it is possible to acquire the whole surface irradiation shape of a laser beam.

Next, by performing the binarization process on the difference image, the favorable process part and the process part affected by the nonuniformity are isolate | separated. It is preferable that a calibration pattern is arrange | positioned in the area | region where the laser beam with constant light quantity distribution is processed favorably. Therefore, the position of the calibration pattern is shifted so as to be disposed on the well-processed region detected by the binarization process. Specifically, the difference between the calibration pattern and the region where the light quantity distribution of the laser light is constant decreases, so that the calibration pattern is moved in a direction not approaching the center of the circle. When the difference between the calibration pattern and the light quantity distribution of the laser beam is not constant, it is completed.

By arranging the pattern so as to avoid nonuniformity in this way, a good laser processing result can be obtained (Fig. 11 (8)), and it becomes possible to detect the calibration pattern shape satisfactorily (Fig. 11 (9)).

Next, a seventh embodiment to which the present invention is applied will be described.

(Seventh Embodiment)

In the above-described first to sixth embodiments, the number of points of the figure constituting the calibration pattern has been described as four points. However, the conversion matrix may be obtained using two points instead of four points. In general, as an N point, an affine transformation matrix, a pseudo affine transformation matrix, or a projection transformation matrix may be obtained.

As described above, according to each embodiment to which the present invention is applied, since the calibration is performed between the laser beam actually used for processing and the spatial modulation element, the laser processing with higher precision is compared with the calibration with the conventional guide light. It becomes possible.

In addition, since an arbitrary calibration pattern can be projected by the spatial modulation element, it is possible to perform calibration efficiently at one time.

In addition, since the calibration pattern of arbitrary shape can be projected by a space modulation element, even if there exists a structure which distorts the shape of a calibration pattern in an irradiation object area | region, setting to a space modulation element with a pattern arrangement to avoid it is preferable. It is possible.

In addition, this invention is not limited to embodiment described above, etc., It can take a various structure or shape within the range which does not deviate from the summary of this invention.

100, 800: laser processing device
101: stage
102: workpiece
103: laser light source
105, 121: mirror
106: DMD (Spatial Modulation Element)
107, 109, 802: half mirror
108: imaging lens
110: objective lens
111: light source for illumination
112: camera
113: control PC
114: input unit
115: display unit
116: image processing unit
117: area setting unit
118: stage control unit
119: memory
120: conversion parameter calculation unit
122, 123: Lens
310: irradiation pattern
320, 621: data for DMD transmission
330, 631: Live picture
701: pattern
702: area
801: LED Light Source
1001: Pattern
1002 (1002A, 1002B, 1002C, 1002D): area

Claims (9)

An optical system for guiding the laser light emitted from the laser light source onto the stage on which the workpiece is placed, and on the optical path from the laser light source to the workpiece, irradiating the workpiece with a desired input pattern To control the laser processing apparatus comprising: a spatial modulating means composed of a plurality of arranged small movable elements; and irradiation means for irradiating the workpiece with the laser beam shaped into the shape of the input pattern by the spatial modulating means. As an adjustment device to say,
Calibration pattern irradiating means for irradiating a photosensitive member with the laser beam shaped into a shape of an arbitrary calibration pattern by the spatial modulation means;
Workpiece imaging means for imaging an image of the photosensitive member to which the laser light is irradiated by the calibration pattern irradiation means;
Misalignment value calculating means for calculating a misalignment value between the shape of the laser mark of the image picked up by the workpiece imaging means and the shape of the calibration pattern;
Conversion parameter calculation means for calculating conversion parameters for correcting the shape of the laser beam on the workpiece to match the shape of the input pattern based on the deviation value calculated by the deviation value calculation means;
Adjusting means for adjusting the irradiation of the laser light onto the workpiece according to the input pattern based on the conversion parameter calculated by the parameter calculating means
Adjusting apparatus comprising a. The method of claim 1,
The calibration pattern irradiating means includes a guide light irradiated to the workpiece through the optical system to confirm that the laser light is irradiated to the workpiece in the shape of the input pattern. Molded into the shape of and irradiated to the photosensitive member,
The workpiece imaging means images an image of the photosensitive member to which the guide light is irradiated by the calibration pattern irradiation means,
The shift value calculating means calculates a shift value between the shape of the guide light trace and the shape of the laser mark of the image picked up by the workpiece imaging means,
The conversion parameter calculating means calculates the conversion parameter based on a deviation value between the shape of the laser mark and the shape of the calibration pattern and a deviation value of the shape of the guide light mark and the shape of the laser mark. Features adjusting device. The method according to claim 1 or 2,
The said calibration pattern is created based on the information of the said surface so that the said laser beam irradiated by the said calibration pattern irradiation means may irradiate to the part other than the said circuit pattern part among the surfaces of the to-be-processed object in which the circuit pattern was formed as the said photosensitive member. And a calibration pattern creating means. The method of claim 3,
And the calibration pattern creating means creates a calibration pattern so as to avoid a circuit pattern or a defect as information on the surface. The method according to claim 1 or 2,
And the display means which superimposes and displays the area | region to which the laser beam adjusted by the said adjustment means was irradiated to the image of the to-be-photographed object image | photographed by the said to-be-photographed object means. An optical system for guiding the laser light emitted from the laser light source onto the stage on which the workpiece is placed;
A spatial modulating means provided on the optical path from the laser light source to the workpiece, the spatial modulating means comprising a plurality of arranged micro movable elements for irradiating the workpiece with the desired laser beam in a desired input pattern;
Suggesting means for irradiating a photosensitive member with the laser beam formed into the shape of the input pattern by the spatial modulating means;
Workpiece imaging means for imaging an image of the photosensitive member to which the laser light is irradiated by the preview means;
Misalignment value calculating means for calculating a misalignment value between the shape of the laser mark of the image picked up by the workpiece imaging means and the shape of the input pattern;
Conversion parameter calculation means for calculating conversion parameters for correcting the shape of the laser beam on the workpiece to match the shape of the input pattern based on the deviation value calculated by the deviation value calculation means;
Adjusting means for adjusting the irradiation of the laser light onto the workpiece according to the input pattern based on the conversion parameter calculated by the parameter calculating means
Laser processing apparatus comprising a. The method of claim 6,
The said suggesting means is a guide light irradiated to the workpiece through the optical system in order to confirm that the laser beam is irradiated to the workpiece in the shape of the input pattern, the shape of the input pattern by the spatial modulating means. Molding to irradiate the photosensitive member,
The workpiece imaging means captures an image of the photosensitive member irradiated with the guide light by the preview means,
The shift value calculating means calculates a shift value between the shape of the guide light trace and the shape of the laser mark of the image picked up by the workpiece imaging means,
The conversion parameter calculating means calculates the conversion parameter based on a deviation value between the shape of the laser mark and the shape of the input pattern, and a deviation value of the shape of the guide light mark and the shape of the laser mark. Laser processing device characterized in that. The method according to claim 6 or 7,
And an irradiation means which is adjusted by the adjustment means and irradiates the workpiece with the laser beam shaped into the shape of the input pattern. An optical system for guiding the laser light emitted from the laser light source onto the stage on which the workpiece is placed, and on the optical path from the laser light source to the workpiece, irradiating the workpiece with a desired input pattern To control the laser processing apparatus comprising: a spatial modulating means composed of a plurality of arranged small movable elements; and irradiation means for irradiating the workpiece with the laser beam shaped into the shape of the input pattern by the spatial modulating means. Computer of adjustment device,
Irradiating the photosensitive member with the laser beam formed into a shape of an arbitrary calibration pattern by the spatial modulation means;
An image of the photosensitive member irradiated with the laser light,
A deviation value between a shape of a laser mark of the captured image and a shape of the calibration pattern is calculated,
Based on the calculated misalignment value, a conversion parameter for correcting the shape of the laser beam on the workpiece to match the shape of the input pattern is calculated,
And the irradiation of the laser beam onto the workpiece according to the input pattern is adjusted based on the calculated conversion parameter.

Images