JP5791908B2 - 調整装置、レーザ加工装置および調整方法 - Google Patents
調整装置、レーザ加工装置および調整方法 Download PDFInfo
- Publication number
- JP5791908B2 JP5791908B2 JP2011008119A JP2011008119A JP5791908B2 JP 5791908 B2 JP5791908 B2 JP 5791908B2 JP 2011008119 A JP2011008119 A JP 2011008119A JP 2011008119 A JP2011008119 A JP 2011008119A JP 5791908 B2 JP5791908 B2 JP 5791908B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- workpiece
- laser beam
- laser
- conversion parameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012545 processing Methods 0.000 title claims description 98
- 238000000034 method Methods 0.000 title claims description 40
- 238000006243 chemical reaction Methods 0.000 claims description 65
- 238000012546 transfer Methods 0.000 claims description 52
- 239000011159 matrix material Substances 0.000 claims description 43
- 238000003384 imaging method Methods 0.000 claims description 26
- 230000003287 optical effect Effects 0.000 claims description 23
- 230000008569 process Effects 0.000 claims description 19
- 238000004364 calculation method Methods 0.000 claims description 11
- 230000001678 irradiating effect Effects 0.000 claims description 9
- 230000008602 contraction Effects 0.000 claims description 4
- 230000004048 modification Effects 0.000 claims description 4
- 238000012986 modification Methods 0.000 claims description 4
- 238000007493 shaping process Methods 0.000 claims description 3
- 230000009466 transformation Effects 0.000 description 46
- 238000005286 illumination Methods 0.000 description 11
- 230000007547 defect Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 10
- 238000003860 storage Methods 0.000 description 8
- PXFBZOLANLWPMH-UHFFFAOYSA-N 16-Epiaffinine Natural products C1C(C2=CC=CC=C2N2)=C2C(=O)CC2C(=CC)CN(C)C1C2CO PXFBZOLANLWPMH-UHFFFAOYSA-N 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 230000008439 repair process Effects 0.000 description 6
- 108091008695 photoreceptors Proteins 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 238000013178 mathematical model Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011008119A JP5791908B2 (ja) | 2011-01-18 | 2011-01-18 | 調整装置、レーザ加工装置および調整方法 |
TW101100184A TW201235140A (en) | 2011-01-18 | 2012-01-03 | Adjustment apparatus, laser machining apparatus, and adjustment method |
CN2012100127855A CN102601519A (zh) | 2011-01-18 | 2012-01-16 | 调整装置、激光加工装置和调整方法 |
KR1020120004842A KR20120083854A (ko) | 2011-01-18 | 2012-01-16 | 조정 장치, 레이저 가공 장치 및 조정 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011008119A JP5791908B2 (ja) | 2011-01-18 | 2011-01-18 | 調整装置、レーザ加工装置および調整方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012148302A JP2012148302A (ja) | 2012-08-09 |
JP2012148302A5 JP2012148302A5 (enrdf_load_stackoverflow) | 2014-02-27 |
JP5791908B2 true JP5791908B2 (ja) | 2015-10-07 |
Family
ID=46519495
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011008119A Expired - Fee Related JP5791908B2 (ja) | 2011-01-18 | 2011-01-18 | 調整装置、レーザ加工装置および調整方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5791908B2 (enrdf_load_stackoverflow) |
KR (1) | KR20120083854A (enrdf_load_stackoverflow) |
CN (1) | CN102601519A (enrdf_load_stackoverflow) |
TW (1) | TW201235140A (enrdf_load_stackoverflow) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102879905B (zh) * | 2012-09-13 | 2015-10-28 | 北京国科世纪激光技术有限公司 | 一种用于观察光斑方位变换的装置和光束整形方法 |
CN102922133B (zh) * | 2012-11-09 | 2015-09-16 | 武汉市楚源光电有限公司 | 一种自动光学检测激光焊接系统 |
CN103192165A (zh) * | 2013-03-20 | 2013-07-10 | 黑龙江科技学院 | 基于视觉跟踪的六自由度焊接机器人 |
JP6305013B2 (ja) * | 2013-10-28 | 2018-04-04 | 株式会社ディスコ | 加工装置 |
CN103639599B (zh) * | 2013-12-20 | 2016-07-06 | 大族激光科技产业集团股份有限公司 | 一种激光去毛刺系统及方法 |
JP6341731B2 (ja) * | 2014-04-07 | 2018-06-13 | 三菱日立パワーシステムズ株式会社 | 肉盛溶接装置、エロージョンシールドの形成方法及び動翼製造方法 |
JP2016146403A (ja) * | 2015-02-06 | 2016-08-12 | 株式会社ディスコ | レーザー加工装置 |
JP6355580B2 (ja) * | 2015-03-20 | 2018-07-11 | 株式会社キーエンス | レーザマーキング装置、該レーザマーキング装置を用いて印字結果を確認する印字確認方法及びコンピュータプログラム |
JP6831302B2 (ja) * | 2017-06-21 | 2021-02-17 | トヨタ自動車株式会社 | レーザ加工品の製造方法および電池の製造方法 |
KR102511543B1 (ko) | 2018-03-09 | 2023-03-17 | 삼성디스플레이 주식회사 | 표시 장치 |
CN109027974B (zh) * | 2018-06-20 | 2020-05-26 | Oppo(重庆)智能科技有限公司 | 一种光源位置调整装置及调整方法 |
JP6904927B2 (ja) | 2018-07-30 | 2021-07-21 | ファナック株式会社 | ロボットシステムおよびキャリブレーション方法 |
JP7180245B2 (ja) * | 2018-09-27 | 2022-11-30 | 日本電産株式会社 | 加工機械用データ処理装置及び加工機械用データ管理システム |
CN111872544B (zh) * | 2020-07-31 | 2022-01-18 | 深圳市学而用科技有限公司 | 激光出光指示点的标定方法、装置和振镜同轴视觉系统 |
KR102465812B1 (ko) * | 2021-04-08 | 2022-11-11 | 주식회사휴비스 | 레이저 가공장치 보정 시스템 및 레이저 가공장치 보정방법 |
CN116754189B (zh) * | 2023-06-21 | 2024-12-31 | 金华飞光科技有限公司 | 一种dmd的微镜偏转角度检测方法及装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5119728B2 (ja) * | 2007-05-08 | 2013-01-16 | ソニー株式会社 | レーザ加工装置の較正方法及びレーザ加工装置 |
JP5090121B2 (ja) * | 2007-10-01 | 2012-12-05 | オリンパス株式会社 | 調整装置、レーザ加工装置、調整方法、および調整プログラム |
-
2011
- 2011-01-18 JP JP2011008119A patent/JP5791908B2/ja not_active Expired - Fee Related
-
2012
- 2012-01-03 TW TW101100184A patent/TW201235140A/zh unknown
- 2012-01-16 KR KR1020120004842A patent/KR20120083854A/ko not_active Withdrawn
- 2012-01-16 CN CN2012100127855A patent/CN102601519A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
CN102601519A (zh) | 2012-07-25 |
TW201235140A (en) | 2012-09-01 |
KR20120083854A (ko) | 2012-07-26 |
JP2012148302A (ja) | 2012-08-09 |
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