KR20120062733A - 기체 공급 시스템 - Google Patents

기체 공급 시스템 Download PDF

Info

Publication number
KR20120062733A
KR20120062733A KR20127005251A KR20127005251A KR20120062733A KR 20120062733 A KR20120062733 A KR 20120062733A KR 20127005251 A KR20127005251 A KR 20127005251A KR 20127005251 A KR20127005251 A KR 20127005251A KR 20120062733 A KR20120062733 A KR 20120062733A
Authority
KR
South Korea
Prior art keywords
gas
opening
supply system
fluorine gas
closing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR20127005251A
Other languages
English (en)
Korean (ko)
Inventor
오사무 요시모토
Original Assignee
도요탄소 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도요탄소 가부시키가이샤 filed Critical 도요탄소 가부시키가이샤
Publication of KR20120062733A publication Critical patent/KR20120062733A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45561—Gas plumbing upstream of the reaction chamber
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C5/00—Methods or apparatus for filling containers with liquefied, solidified, or compressed gases under pressures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C5/00—Methods or apparatus for filling containers with liquefied, solidified, or compressed gases under pressures
    • F17C5/06—Methods or apparatus for filling containers with liquefied, solidified, or compressed gases under pressures for filling with compressed gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2205/00—Vessel construction, in particular mounting arrangements, attachments or identifications means
    • F17C2205/01—Mounting arrangements
    • F17C2205/0123—Mounting arrangements characterised by number of vessels
    • F17C2205/013—Two or more vessels
    • F17C2205/0134—Two or more vessels characterised by the presence of fluid connection between vessels
    • F17C2205/0142—Two or more vessels characterised by the presence of fluid connection between vessels bundled in parallel
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2205/00—Vessel construction, in particular mounting arrangements, attachments or identifications means
    • F17C2205/03—Fluid connections, filters, valves, closure means or other attachments
    • F17C2205/0302—Fittings, valves, filters, or components in connection with the gas storage device
    • F17C2205/0323—Valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2221/00—Handled fluid, in particular type of fluid
    • F17C2221/01—Pure fluids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2250/00—Accessories; Control means; Indicating, measuring or monitoring of parameters
    • F17C2250/03—Control means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2250/00—Accessories; Control means; Indicating, measuring or monitoring of parameters
    • F17C2250/04—Indicating or measuring of parameters as input values
    • F17C2250/0404—Parameters indicated or measured
    • F17C2250/043—Pressure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/877—With flow control means for branched passages

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Vapour Deposition (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
KR20127005251A 2009-09-04 2010-09-02 기체 공급 시스템 Ceased KR20120062733A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2009-205162 2009-09-04
JP2009205162A JP5438439B2 (ja) 2009-09-04 2009-09-04 気体供給システム

Publications (1)

Publication Number Publication Date
KR20120062733A true KR20120062733A (ko) 2012-06-14

Family

ID=43649120

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20127005251A Ceased KR20120062733A (ko) 2009-09-04 2010-09-02 기체 공급 시스템

Country Status (6)

Country Link
US (1) US9109288B2 (enExample)
EP (1) EP2474644B1 (enExample)
JP (1) JP5438439B2 (enExample)
KR (1) KR20120062733A (enExample)
CN (1) CN102597311B (enExample)
WO (1) WO2011027565A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120098683A (ko) * 2009-10-16 2012-09-05 솔베이 플루오르 게엠베하 고순도 불소가스, 그 제조 방법 및 용도, 및 불소가스 내의 불순물 모니터링 방법
JP5824372B2 (ja) * 2012-01-25 2015-11-25 東京エレクトロン株式会社 処理装置及びプロセス状態の確認方法
WO2015162868A1 (ja) * 2014-04-24 2015-10-29 東洋炭素株式会社 反応装置
JP2016134569A (ja) * 2015-01-21 2016-07-25 株式会社東芝 半導体製造装置
CN110176414B (zh) 2019-04-16 2020-10-16 北京北方华创微电子装备有限公司 反应气体供应系统及其控制方法
CN110375197B (zh) * 2019-07-01 2021-04-20 厚普清洁能源股份有限公司 一种lng加注船的双冗余安全监控控制方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100242982B1 (ko) * 1996-10-17 2000-02-01 김영환 반도체 장비의 가스 공급 장치
US6818105B2 (en) 2000-04-07 2004-11-16 Toyo Tanso Co., Ltd. Apparatus for generating fluorine gas
JP3645495B2 (ja) 2000-04-07 2005-05-11 東洋炭素株式会社 フッ素ガス発生装置
US6604555B2 (en) * 2000-08-04 2003-08-12 Arch Specialty Chemicals, Inc. Automatic refill system for ultra pure or contamination sensitive chemicals
JP2003257870A (ja) * 2002-02-28 2003-09-12 Nippon Sanso Corp 半導体装置の製造システム及びガス供給方法
JP2004011001A (ja) 2002-06-10 2004-01-15 Central Glass Co Ltd フッ素電解槽
US6779568B2 (en) * 2002-07-16 2004-08-24 General Hydrogen Corporation Gas distribution system
GB0216828D0 (en) 2002-07-19 2002-08-28 Boc Group Plc Apparatus and method for fluorine production
JP3617835B2 (ja) * 2002-09-20 2005-02-09 東洋炭素株式会社 フッ素ガス発生装置
US6955198B2 (en) 2003-09-09 2005-10-18 Advanced Technology Materials, Inc. Auto-switching system for switch-over of gas storage and dispensing vessels in a multi-vessel array
JP2005179709A (ja) 2003-12-17 2005-07-07 Toyo Tanso Kk ガス発生装置
JP4818589B2 (ja) * 2004-02-26 2011-11-16 東京エレクトロン株式会社 処理装置
JP4018726B2 (ja) * 2006-02-07 2007-12-05 東洋炭素株式会社 半導体製造プラント
US7562672B2 (en) * 2006-03-30 2009-07-21 Applied Materials, Inc. Chemical delivery apparatus for CVD or ALD
US20080173353A1 (en) * 2007-01-22 2008-07-24 United Microelectronics Corp. Gas supply piping system and method for replacing purifier

Also Published As

Publication number Publication date
EP2474644A1 (en) 2012-07-11
JP5438439B2 (ja) 2014-03-12
EP2474644A4 (en) 2013-05-22
WO2011027565A1 (ja) 2011-03-10
US20120160358A1 (en) 2012-06-28
EP2474644B1 (en) 2015-02-25
JP2011052314A (ja) 2011-03-17
CN102597311B (zh) 2014-07-02
CN102597311A (zh) 2012-07-18
US9109288B2 (en) 2015-08-18

Similar Documents

Publication Publication Date Title
KR20120062733A (ko) 기체 공급 시스템
JP5521372B2 (ja) フッ素ガスのｉｎ−ｓｉｔｕガス混合および希釈システム
JP5528374B2 (ja) ガス減圧供給装置、これを備えるシリンダキャビネット、バルブボックス、及び基板処理装置
JP5816842B2 (ja) 燃料電池システム用ガス漏れ検知システム
US20110108128A1 (en) Vacuum treatment apparatus and gas supply method
JP5919103B2 (ja) 高圧ガスシステム
US8381756B2 (en) Method for supplying gas
CN101379592B (zh) 半导体制造设备
WO2019245592A1 (en) Purge system for gas supply equipment capable of high-temperature high-pressure purging
KR20130071366A (ko) 액화가스 공급장치 및 방법
KR20210019200A (ko) 반도체 제조 장비의 에어 밸브 누설 감지 시스템
JP5193722B2 (ja) 燃料電池発電システムおよびその故障原因推定方法
CN114992984A (zh) 一种空分装置监测方法、系统、设备、存储介质
US8028726B2 (en) Automatic venting of refillable bulk liquid canisters
CN102466133B (zh) 液化气体供给方法
US12455046B2 (en) Gas supply system for filling hydrogen into tank
JP6751070B2 (ja) ガス供給装置及びガス供給方法
JP7742762B2 (ja) 制御システムおよび水処理システムの制御系切り替え方法
KR20010028263A (ko) 케미컬 공급시스템
US20080173353A1 (en) Gas supply piping system and method for replacing purifier
US20250079488A1 (en) Fuel cell system
KR101135706B1 (ko) 가스차압 조절장치 및 복합형 가스차압 조절장치
KR101135708B1 (ko) 가스차압 조절장치
JP2020084308A (ja) 流体供給システム
KR20060100546A (ko) 반도체 제조설비의 개스 역류방지장치

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20120228

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20150511

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20160415

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20160628

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20160415

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I