CN102597311B - 气体供给系统 - Google Patents

气体供给系统 Download PDF

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Publication number
CN102597311B
CN102597311B CN201080039189.5A CN201080039189A CN102597311B CN 102597311 B CN102597311 B CN 102597311B CN 201080039189 A CN201080039189 A CN 201080039189A CN 102597311 B CN102597311 B CN 102597311B
Authority
CN
China
Prior art keywords
pipe arrangement
mentioned
gas
opening
fluorine gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080039189.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN102597311A (zh
Inventor
吉本修
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Tanso Co Ltd
Original Assignee
Toyo Tanso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Tanso Co Ltd filed Critical Toyo Tanso Co Ltd
Publication of CN102597311A publication Critical patent/CN102597311A/zh
Application granted granted Critical
Publication of CN102597311B publication Critical patent/CN102597311B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45561—Gas plumbing upstream of the reaction chamber
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C5/00—Methods or apparatus for filling containers with liquefied, solidified, or compressed gases under pressures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C5/00—Methods or apparatus for filling containers with liquefied, solidified, or compressed gases under pressures
    • F17C5/06—Methods or apparatus for filling containers with liquefied, solidified, or compressed gases under pressures for filling with compressed gases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2205/00—Vessel construction, in particular mounting arrangements, attachments or identifications means
    • F17C2205/01—Mounting arrangements
    • F17C2205/0123—Mounting arrangements characterised by number of vessels
    • F17C2205/013—Two or more vessels
    • F17C2205/0134—Two or more vessels characterised by the presence of fluid connection between vessels
    • F17C2205/0142—Two or more vessels characterised by the presence of fluid connection between vessels bundled in parallel
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2205/00—Vessel construction, in particular mounting arrangements, attachments or identifications means
    • F17C2205/03—Fluid connections, filters, valves, closure means or other attachments
    • F17C2205/0302—Fittings, valves, filters, or components in connection with the gas storage device
    • F17C2205/0323—Valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2221/00—Handled fluid, in particular type of fluid
    • F17C2221/01—Pure fluids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2250/00—Accessories; Control means; Indicating, measuring or monitoring of parameters
    • F17C2250/03—Control means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2250/00—Accessories; Control means; Indicating, measuring or monitoring of parameters
    • F17C2250/04—Indicating or measuring of parameters as input values
    • F17C2250/0404—Parameters indicated or measured
    • F17C2250/043—Pressure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/877—With flow control means for branched passages

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical Vapour Deposition (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
CN201080039189.5A 2009-09-04 2010-09-02 气体供给系统 Expired - Fee Related CN102597311B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009-205162 2009-09-04
JP2009205162A JP5438439B2 (ja) 2009-09-04 2009-09-04 気体供給システム
PCT/JP2010/005418 WO2011027565A1 (ja) 2009-09-04 2010-09-02 気体供給システム

Publications (2)

Publication Number Publication Date
CN102597311A CN102597311A (zh) 2012-07-18
CN102597311B true CN102597311B (zh) 2014-07-02

Family

ID=43649120

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080039189.5A Expired - Fee Related CN102597311B (zh) 2009-09-04 2010-09-02 气体供给系统

Country Status (6)

Country Link
US (1) US9109288B2 (enExample)
EP (1) EP2474644B1 (enExample)
JP (1) JP5438439B2 (enExample)
KR (1) KR20120062733A (enExample)
CN (1) CN102597311B (enExample)
WO (1) WO2011027565A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011045338A1 (en) * 2009-10-16 2011-04-21 Solvay Fluor Gmbh High-purity fluorine gas, the production and use thereof, and a method for monitoring impurities in a fluorine gas
JP5824372B2 (ja) * 2012-01-25 2015-11-25 東京エレクトロン株式会社 処理装置及びプロセス状態の確認方法
WO2015162868A1 (ja) * 2014-04-24 2015-10-29 東洋炭素株式会社 反応装置
JP2016134569A (ja) * 2015-01-21 2016-07-25 株式会社東芝 半導体製造装置
CN110176414B (zh) * 2019-04-16 2020-10-16 北京北方华创微电子装备有限公司 反应气体供应系统及其控制方法
CN110375197B (zh) * 2019-07-01 2021-04-20 厚普清洁能源股份有限公司 一种lng加注船的双冗余安全监控控制方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003257870A (ja) * 2002-02-28 2003-09-12 Nippon Sanso Corp 半導体装置の製造システム及びガス供給方法
CN101329998A (zh) * 2004-02-26 2008-12-24 东京毅力科创株式会社 半导体处理装置
CN101379592A (zh) * 2006-02-07 2009-03-04 东洋炭素株式会社 半导体制造设备

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100242982B1 (ko) * 1996-10-17 2000-02-01 김영환 반도체 장비의 가스 공급 장치
CN1307325C (zh) 2000-04-07 2007-03-28 东洋炭素株式会社 氟气发生装置
JP3645495B2 (ja) 2000-04-07 2005-05-11 東洋炭素株式会社 フッ素ガス発生装置
US6604555B2 (en) * 2000-08-04 2003-08-12 Arch Specialty Chemicals, Inc. Automatic refill system for ultra pure or contamination sensitive chemicals
JP2004011001A (ja) 2002-06-10 2004-01-15 Central Glass Co Ltd フッ素電解槽
US6779568B2 (en) * 2002-07-16 2004-08-24 General Hydrogen Corporation Gas distribution system
GB0216828D0 (en) 2002-07-19 2002-08-28 Boc Group Plc Apparatus and method for fluorine production
JP3617835B2 (ja) * 2002-09-20 2005-02-09 東洋炭素株式会社 フッ素ガス発生装置
US6955198B2 (en) 2003-09-09 2005-10-18 Advanced Technology Materials, Inc. Auto-switching system for switch-over of gas storage and dispensing vessels in a multi-vessel array
JP2005179709A (ja) 2003-12-17 2005-07-07 Toyo Tanso Kk ガス発生装置
US7562672B2 (en) * 2006-03-30 2009-07-21 Applied Materials, Inc. Chemical delivery apparatus for CVD or ALD
US20080173353A1 (en) 2007-01-22 2008-07-24 United Microelectronics Corp. Gas supply piping system and method for replacing purifier

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003257870A (ja) * 2002-02-28 2003-09-12 Nippon Sanso Corp 半導体装置の製造システム及びガス供給方法
CN101329998A (zh) * 2004-02-26 2008-12-24 东京毅力科创株式会社 半导体处理装置
CN101379592A (zh) * 2006-02-07 2009-03-04 东洋炭素株式会社 半导体制造设备

Also Published As

Publication number Publication date
US9109288B2 (en) 2015-08-18
JP5438439B2 (ja) 2014-03-12
US20120160358A1 (en) 2012-06-28
JP2011052314A (ja) 2011-03-17
KR20120062733A (ko) 2012-06-14
EP2474644B1 (en) 2015-02-25
WO2011027565A1 (ja) 2011-03-10
EP2474644A4 (en) 2013-05-22
EP2474644A1 (en) 2012-07-11
CN102597311A (zh) 2012-07-18

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140702

Termination date: 20160902