KR20120046143A - Assembly of holding a substrate for forming pattern and apparatus of organic thin film deposition having the same - Google Patents

Abstract

PURPOSE: An assembly for holding a substrate for forming a pattern and an apparatus for depositing an organic thin film including the same are provided to prevent a substrate from being sagged by evenly arranging a magnetic force supply part in a surrounding area and a center area around a entire area of a substrate. CONSTITUTION: A pattern forming part(10) includes a mask(10a) and a first frame(10b). A pattern to be transcribed on one side of a substrate(G) is designed on the mask. The first frame is included to surround the mask. A substrate adsorption part(12) includes an electrostatic chuck(12a) and a second frame(12b). The electrostatic chuck adsorbs the other side of the substrate with an electrostatic force. The second frame is included to surround the electrostatic chuck.

Description

Assembly holding substrate for forming pattern and apparatus of organic thin film deposition having the same}

The present invention relates to a substrate holding assembly for pattern formation and an organic thin film deposition apparatus having the same. More specifically, the substrate holding pattern for forming a pattern to form a pattern such as a thin film on the substrate by holding and transferring the substrate and the mask together An assembly and an organic thin film deposition apparatus having the same.

In general, in the deposition of an organic thin film, an organic thin film pattern is formed on a substrate by holding and transferring the substrate and the mask together. In particular, the substrate and the mask are held on the deposition chamber to form a pattern such as an organic thin film on the substrate. At this time, the substrate mentioned is mainly held by using the adhesive force. An example of an assembly for holding a substrate using the aforementioned adhesive force is disclosed in Korean Patent Application No. 2008-75433.

However, in the holding of the substrate using the adhesive force, the adhesive force is weakened by continuous adhesion, and as a result, the flatness may occur as the substrate is struck down. In addition, staining may occur in a portion where adhesion is performed, thereby reducing product reliability, and contamination may be generated by adsorbing foreign substances, thereby lowering process reliability. In addition, the physical force is applied when the substrate is separated from the assembly holding the substrate, which also includes the risk of breaking the substrate.

An object of the present invention is to provide a substrate holding assembly for forming a pattern and an organic thin film deposition apparatus having the same that can be separated while holding the substrate and mask more stably.

According to one or more exemplary embodiments, a substrate holding assembly for pattern formation includes: a mask having a pattern designed for transferring to one surface of a substrate; And a pattern forming part disposed on one surface of the substrate and having a first frame formed to surround the mask. An electrostatic chuck that adsorbs the other surface of the substrate by an electrostatic force; And a second frame formed to surround the electrostatic chuck so as to correspond to the first frame and disposed on the other surface of the substrate; A magnetic force providing unit provided in any one of the first frame and the second frame to provide magnetic force; And a magnetic force adhesion part provided in the other frame to be in close contact with the magnetic force, and the pattern forming part and the substrate adsorption part are in close contact with the first frame and the second frame by the magnetic force, The substrate may be interposed between the pattern forming unit and the substrate adsorption unit.

In the pattern forming substrate holding assembly according to the embodiment of the present invention, each of the magnetic force providing unit and the magnetic force contacting unit may be provided to be repeatedly disposed at each part of each of the one frame and the other one frame. At least one of the magnetic force providing part and the magnetic force contacting part may further include a variable part capable of varying the position between every part and every other part except the part, wherein the magnetic force is controlled by the variable part. When the magnetic force providing part and the magnetic force contacting part are disposed to correspond to each other as at least one of the provision part and the magnetic force contacting part is variable, the pattern forming part and the substrate adsorption part may be in close contact, and the magnetic force providing part and the When the magnetic force contact portions are arranged so as not to correspond to each other, the pattern forming portion and Group may be added substrate separated from one another adsorption.

In the pattern forming substrate holding assembly according to the embodiment of the present invention, each of the magnetic force providing unit and the magnetic force contacting unit may be provided to be repeatedly disposed at each part of each of the one frame and the other one frame. At this time, the magnetic force blocking unit is repeatedly provided for each portion to block the magnetic force between the magnetic force providing portion and the magnetic force close portion; And a variable part capable of varying at least one of the magnetic force providing part, the magnetic force close part, and the magnetic force blocking part to a position between every part and every other part except the part, wherein the variable part When the at least one of the magnetic force providing part, the magnetic force contacting part, and the magnetic force blocking part is changed to correspond to each other, the pattern forming part and the substrate adsorption part may be in close contact with each other. And the magnetic force providing portion and the magnetic force contacting portion are disposed so as not to correspond to each other, or when the magnetic force is cut off between the magnetic force providing portion and the magnetic force contacting portion by the magnetic force blocking portion. The parts can be separated from each other.

In the pattern forming substrate holding assembly according to an embodiment of the present invention, any one of the magnetic force providing portion and the magnetic force contact portion is provided to be repeatedly disposed at a portion of the one frame, and the magnetic force providing portion And the other one of the magnetic close contact portion is provided with the other one of the frame itself, the magnetic force blocking portion is repeatedly provided for each part so as to block the magnetic force between the magnetic force providing portion and the magnetic close contact portion; And at least one of the magnetic force providing unit and the magnetic force contacting unit and at least one of the magnetic force blocking unit, which is provided to be repeatedly disposed at every one portion of the frame in each of the portions and every other portion except the portion. It may further include a variable portion that can be changed to a position, wherein the at least one of the one and the magnetic force blocking portion is provided to be repeatedly arranged in each one part of the frame by the variable portion as the variable When the magnetic force providing part and the magnetic force contacting part are disposed to correspond to each other, the pattern forming part and the substrate adsorption part may be in close contact with each other, and the magnetic force may be blocked between the magnetic force providing part and the magnetic force contacting part by the magnetic force blocking part. When the pattern forming portion and the substrate adsorption portion Can be separated from each other.

In the pattern holding substrate holding assembly according to the embodiment of the present invention, a battery electrically connected to the electrostatic chuck may be further provided to provide an electrostatic force to the electrostatic chuck.

According to another aspect of the present invention, there is provided a substrate holding assembly for pattern formation, comprising: a mask having a pattern designed for transferring to one surface of a substrate; And a pattern forming part disposed on one surface of the substrate, the first frame including a first frame formed to surround the mask and being in close contact with magnetic force. An electrostatic chuck that adsorbs the other surface of the substrate by an electrostatic force; And a second frame formed to surround the electrostatic chuck so as to correspond to the first frame and disposed on the other surface of the substrate; A magnetic force providing unit positioned in an internal space of the second frame and repeatedly disposed at a portion of the internal space of the second frame to provide a magnetic force; A magnetic force blocking unit repeatedly disposed at a portion of the second frame facing the first frame so as to block the magnetic force from being provided to the first frame; And a variable part connected to the magnetic force providing part so as to vary the bar structure of the magnetic force providing part by an operation of repeating contraction and expansion, and the magnetic force blocking part is not disposed between the magnetic force providing part and the first frame. When the magnetic force providing unit is variable by the variable unit, the pattern forming unit and the substrate adsorption unit may be in close contact with each other, and the magnetic block may be disposed between the magnetic force providing unit and the first frame. When the magnetic force providing unit is variable, the pattern forming unit and the substrate adsorption unit may be separated from each other.

In the pattern forming substrate holding assembly according to the embodiment of the present invention, the first frame may be made of stainless steel, the magnetic force providing portion may be made of a permanent magnet, and the magnetic force blocking portion may be made of a ferromagnetic material. .

In the substrate holding assembly for pattern formation according to the embodiment of the present invention mentioned above, the ferromagnetic material may include Mu metal.

In the substrate holding assembly for pattern formation according to the embodiment of the present invention mentioned above, the magnetic force providing portion is formed of a bar structure to be located in the inner space of the second frame, and the magnetic structure of the bar structure to provide the magnetic force. Each part may be repeatedly arranged.

In the pattern holding substrate holding assembly according to the embodiment of the present invention, a battery electrically connected to the electrostatic chuck may be further provided to provide an electrostatic force to the electrostatic chuck.

According to one or more exemplary embodiments, an organic thin film deposition apparatus includes: a mask having a pattern designed for transferring to one surface of a substrate; And a pattern forming part disposed on one surface of the substrate, the first frame including a first frame formed to surround the mask and being in close contact with magnetic force. An electrostatic chuck that adsorbs the other surface of the substrate by an electrostatic force; And a second frame formed to surround the electrostatic chuck so as to correspond to the first frame and disposed on the other surface of the substrate; A magnetic force providing unit positioned in an internal space of the second frame and repeatedly disposed at a portion of the internal space of the second frame to provide a magnetic force; A magnetic force blocking unit repeatedly disposed at a portion of the second frame facing the first frame so as to block the magnetic force from being provided to the first frame; And a variable part connected to the magnetic force providing part so as to vary the bar structure of the magnetic force providing part by an operation of repeating contraction and expansion, and the magnetic force blocking part is not disposed between the magnetic force providing part and the first frame. When the magnetic force providing unit is variable by the variable unit, the pattern forming unit and the substrate adsorption unit may be in close contact with each other, and the magnetic block may be disposed between the magnetic force providing unit and the first frame. When the magnetic force providing unit is variable, the pattern forming unit and the substrate absorbing unit may include a pattern forming substrate holding assembly which may be separated from each other.

According to the above-mentioned pattern forming substrate holding assembly and organic thin film deposition apparatus of the present invention, the pattern forming portion and the substrate adsorption portion can be brought into close contact with each other by holding the substrate by electrostatic force.

Thus, in the present invention, since the substrate is held by using electrostatic force, it can be seen that staining does not occur and foreign matter is not adsorbed. Therefore, when the substrate holding assembly for pattern formation of the present invention is used, it is expected to improve product reliability and process reliability.

In addition, in the present invention, when the substrate adsorption portion and the pattern formation portion are interposed between the substrate adsorption portion and the pattern formation portion by magnetic force, the magnetic force providing portion is disposed evenly on the entire region of the substrate so that the substrate sags. It is possible to form a highly reliable pattern on the substrate because it can be sufficiently prevented and the flatness can be kept constant. That is, by providing the magnetic force providing unit evenly disposed in the peripheral portion and the center portion with respect to the entire substrate area, it is possible to sufficiently prevent the situation that the substrate sag.

In addition, the present invention can stably separate the pattern forming portion and the substrate adsorption portion by appropriately varying the arrangement positions of the magnetic force providing portion, the magnetic force close portion, the magnetic force blocking portion, and the electrostatic force of the electrostatic chuck. As a result, the substrate can be easily separated without applying a physical force, thereby preventing the substrate from being damaged in advance.

1 is a schematic diagram illustrating a substrate holding assembly for pattern formation according to an embodiment of the present invention.
2 and 3 are views for explaining a situation in which the substrate is in close contact with and separated from each other using the magnetic force providing unit and the magnetic adhesion unit of the pattern-forming substrate holding assembly of FIG. 1.
4 and 5 are views for explaining a variable part for varying the magnetic force providing part of the pattern forming substrate holding assembly of FIG.
6 to 8 are diagrams for explaining examples of using the magnetic force providing portion, the magnetic contact portion and the magnetic shield of the pattern holding substrate holding assembly of the present invention.

As the inventive concept allows for various changes and numerous embodiments, the embodiments will be described in detail in the text. However, this is not intended to limit the present invention to a specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar components. Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "consist of" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described on the specification, but one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

Example

Hereinafter, with reference to the accompanying drawings, it will be described in detail a preferred embodiment of the present invention.

1 is a schematic configuration diagram showing a pattern holding substrate holding assembly according to an embodiment of the present invention, Figures 2 and 3 using the magnetic force providing portion and the magnetic adhesion of the pattern holding substrate for assembly of Figure 1 FIG. 4 is a diagram for describing a situation of adhering and detaching a substrate.

1 to 3, the pattern holding substrate holding assembly 100 includes a pattern forming unit 10, a substrate adsorption unit 12, a magnetic force providing unit 20, a magnetic force adhesion unit 22, and a variable unit ( 40, a magnetic shield 24, a battery 25 and the like.

The pattern forming unit 10 includes a mask 10a and a first frame 10b. The mask 10a is designed to have a pattern for transferring to one surface of the substrate G. For example, a part of the mask 10a is designed to pass through a deposition material for forming a thin film pattern, and the other part does not pass through the deposition material mentioned. It is designed not to. The first frame 10b is provided to surround the mask 10a. Thus, the pattern forming unit 10 may be disposed on one surface of the substrate G for forming the pattern. Moreover, a large glass substrate etc. are mentioned as an example of the board | substrate G mentioned. Therefore, in the case of the pattern forming part 10, a plurality of masks 10a may be disposed on the same plane so as to correspond to the substrate G such as the large glass substrate mentioned above. Thus, the first frame 10b may also be provided to surround the plurality of masks 10a.

The board | substrate adsorption part 12 is equipped with the electrostatic chuck 12a and the 2nd frame 12b. The electrostatic chuck 12a adsorbs the other surface of the substrate G by the electrostatic force. That is, since the pattern forming portion 10 mentioned above is disposed on one surface of the substrate G, the electrostatic chuck 12a is to suck the other surface of the substrate G. The second frame 12b is provided to surround the electrostatic chuck 12a. In particular, the second frame 12b has a structure corresponding to the first frame 10b. Accordingly, the second frame 12b is provided to surround the electrostatic chuck 12a to correspond to the first frame 12a. Therefore, as mentioned above, when the pattern forming unit 10 is provided such that a plurality of masks 10a are disposed on the same plane, and the first frame 10b is provided to surround the plurality of masks 10a, substrate adsorption is performed. The part 12 also includes a plurality of electrostatic chucks 12a corresponding to the plurality of masks 10a, and the second frame 12b includes a plurality of electrostatic chucks 12a corresponding to the first frame 10b. It is provided to surround.

And a battery 25 electrically connected to the electrostatic chuck 12a to provide an electrostatic force to the electrostatic chuck 12a of the substrate adsorption portion 12 mentioned above. Here, the battery 25 may be a wireless rechargeable battery that can be wirelessly charged as a rechargeable battery. This is because the battery 25 mentioned above may interfere with the transfer of the pattern holding substrate holding assembly 100 when connected by a cable.

The magnetic force providing unit 20 may be provided in any one of the frames 10b and 12b of the first frame 10b or the second frame 12b mentioned above. It is provided. That is, the magnetic force providing unit 20 provides the magnetic force to the magnetic force close-up part 22 which will be described later, and is provided in the second frame 12b of the substrate adsorption part 12 in the present invention. Here, the mentioned magnetic force providing unit 20 may be mainly provided with a permanent magnet. In addition, the magnetic force providing unit 20 may be repeatedly provided for each portion. Thus, in the present invention, the magnetic force providing unit 20 may be repeatedly provided for each part of the bar structure 20a. Accordingly, the magnetic force providing unit 20 may be divided into a magnetic force providing portion and a magnetic force not providing portion. That is, the repeated portion for each of the mentioned portions may correspond to the magnetic force providing portion, and the repeated portion for every portion except the repeated portion for each portion may correspond to the non-magnetic portion providing portion.

In addition, when the aforementioned magnetic force providing unit 20 is repeatedly provided for a portion of the bar structure 20a, the magnetic force providing unit 20 may be disposed in the inner space of the second frame 12b. That is, in the present invention, the magnetic force providing unit 20 is located in the internal space of the second frame 12b and is repeatedly disposed in a portion of the internal space of the second frame 12b to provide magnetic force. The bar structure 20a is formed to be located in the internal space of the second magnetic frame 12b as described above, and may be repeatedly disposed at a portion of the bar structure 20a to provide magnetic force.

Here, although the above-described magnetic force providing unit 20 is provided in the second frame 12b, and repeatedly provided for each part of the bar structure 20a, the present invention is not limited thereto. That is, as described below, the magnetic force providing unit 20 may be provided in the first frame 10b and may be provided in any one of the first frame 10b or the second frame 12b.

The magnetic contact part 22 may be provided in the other one of the above-mentioned first frame 10b or the second frame 12b in the other frames 10b and 12b. In the present invention, since the magnetic force providing unit 20 is provided in the second frame 12b, the aforementioned magnetic force contacting unit 22 may be provided in the first frame 10b. In particular, the magnetic force close part 22 in the present invention may be provided as the first frame 10b itself. That is, in the present invention, by providing the first frame 10b itself with a material that is in close contact with the magnetic force, the first frame 10b can be provided as the magnetic force close part 22. In other words, when the first frame 10b is made of a material that can be in close contact with magnetic force, such as stainless steel, the first frame 10b may correspond to the magnetic force close part 22.

Here, although the magnetic contact part 22 mentioned above is provided in the 1st frame 10b itself, it is not limited to this. That is, as will be described later, the magnetic force contact part 22 may be provided in the second frame 12b, and may be repeatedly provided to a part of the bar structure 22a by using the bar structure 22a. Thus, even in the case of the magnetic force contact portion 22 mentioned above may be divided into a magnetic force adhesion portion and a magnetic force non-adherence portion when repeatedly provided for a portion of the bar structure (22a). In other words, the repeated portion for each of the mentioned portions may correspond to the magnetic adhesion portion, and the repeated portion for every portion except the repeated portion for each portion may correspond to the magnetic non-contact portion. In addition, when the above-mentioned magnetic force contact portion 22 is repeatedly provided at a portion of the bar structure 22a, the magnetic force contact portion 22 may be disposed in the inner space of the first frame 10b.

The magnetic force blocking part 24 is provided to block the magnetic force from being supplied to the magnetic force close part 22 of the first frame 10b by the magnetic force providing part 20. In particular, in the present invention, since the first frame 10b itself is provided as the magnetic force close part 22, the magnetic force blocking part 24 may be provided in the second frame 12b. In this case, the magnetic force blocking unit 24 may be provided to be repeatedly disposed at a portion of the second frame 12b facing the first frame 10b. Here, examples of the magnetic shield 24 may include a ferromagnetic material, and examples of the ferromagnetic materials mentioned above include a mu metal including nickel, iron, and copper. Inc.). And also in the case of the magnetic shield 24 is provided repeatedly arranged in a portion of the second frame 12b, the repeated portion for each of the mentioned portion may correspond to the magnetic shielding portion, the portion that is repeated for each portion Repeated portions except for the rest may correspond to the non-magnetic blocking portion.

Here, although the magnetic block 24 mentioned above is provided in the 2nd frame 12b, it is not limited to this. That is, as will be described later, the magnetic force blocking unit 24 may be repeatedly disposed at each portion of the first frame 10b, or may be repeatedly provided at a portion of the bar structure 24a using the bar structure 24a. It may be. In particular, the magnetic force blocking unit 24 may be disposed at any portion of the first frame 10b or the second frame 12b when disposed between the magnetic force providing unit 20 and the magnetic force contacting unit 22. In addition, when the magnetic shield 24 is repeatedly provided for a portion of the bar structure 24a, the magnetic shield 24 is disposed in the internal space of either the first frame 10b or the second frame 12b. Can be.

As described above, in the present invention, the magnetic force providing unit 20, the magnetic force contacting unit 22, and the magnetic force blocking unit 24 are provided to provide a pattern through the arrangement relationship between the magnetic force providing unit 20 and the magnetic force blocking unit 24. The formation unit 10 and the substrate adsorption unit 12 may be brought into close contact with and separated from each other. That is, when the magnetic force providing unit 20 is disposed in the magnetic force non-blocking portion as shown in FIG. 2, the magnetic force is provided to the magnetic close contact portion 22 so that the pattern forming portion 10 and the substrate adsorption portion 12 are mutually different. When the magnetic force providing portion 20 is disposed in the magnetic force blocking portion, which is the magnetic force blocking portion 24, as shown in FIG. 3, the pattern is formed by blocking the magnetic force provided to the magnetic force close portion 22. The portion 10 and the substrate adsorption portion 12 are separated from each other.

Therefore, when the substrate holding assembly 100 for pattern formation according to the present invention is used, since the substrate G is held by the electrostatic force, it can be seen that staining does not occur and foreign substances are not adsorbed. In addition, when the substrate adsorption portion 12 and the pattern formation portion 10 are brought into close contact with each other by magnetic force in a state where the substrate G is interposed between the substrate adsorption portion 12 and the pattern formation portion 10, the magnetic force providing portion ( 20 and the magnetic force contact portion 22 can be provided to be evenly distributed over the entire region of the substrate G, thereby sufficiently preventing the substrate G from sagging and maintaining the flatness uniformly. In addition, the pattern forming portion 10 and the substrate adsorption portion 12 can be stably separated through the arrangement relationship of the magnetic force providing portion 20, the magnetic force fitting portion 22, the magnetic force blocking portion 24, and the like. Since the electrostatic force of the electrostatic chuck 12a can be turned on / off, it can be easily separated without applying a physical force to the substrate G.

4 and 5 are views for explaining a variable part for varying the magnetic force providing part of the pattern forming substrate holding assembly of FIG.

4 and 5, the variable part 40 is connected to the bar structure 20a of the magnetic force providing part 20 of FIGS. 2 and 3. In particular, the variable portion 40 is provided to vary the position of the bar structure 20a of the magnetic force providing portion 20 by repeating the contraction and expansion. Examples of the variable portion 40 mentioned above include a cylinder, a linear motor, and the like, which can repeatedly perform contraction and expansion. The variable portion 40 may be selectively connected to a portion in which the bar structure 20a of the magnetic force providing portion intersects in four directions, and a portion in which the bar structure 20a of the magnetic force providing portion intersects in both directions. It can be provided.

Accordingly, as shown in FIG. 4, the magnetic force providing unit 20 is disposed on the non-magnetic blocking portion by the contraction of the variable unit 40, so that the pattern forming unit 10 and the substrate adsorption unit 12 may be in close contact with each other. 5, the magnetic force providing portion 20 is disposed at the magnetic force blocking portion, which is the magnetic force blocking portion 24, as the variable portion 40 expands, as shown in FIG. 5. May have a configuration that is separated from each other.

Here, although the variable part 40 provided to vary the magnetic force provision part 20 is demonstrated, it is not limited to this. That is, as described below, the variable part 40 may be provided to vary the magnetic force close part 22, the magnetic force blocking part 24, etc. in addition to the magnetic force providing part 20.

As described above, in the present invention, the magnetic force providing unit 20 and the magnetic force blocking unit 24 are provided by the magnetic force providing unit 20, the magnetic force contacting unit 22, the magnetic force blocking unit 24, and the variable unit 40. Since the arrangement positions of the substrates can be varied, the pattern forming section 10 and the substrate adsorption section 12 can be brought into close contact with and separated from each other. That is, as shown in FIG. 4, when the magnetic force providing unit 20 is varied so as to be disposed at the non-magnetic blocking portion, the magnetic force is provided to the magnetic force contacting unit 22 so that the pattern forming unit 10 and the substrate adsorption unit 12 are provided. Will have a close contact with each other, and as shown in Figure 5 when the magnetic force providing unit 20 is changed to be arranged in the magnetic force blocking portion that is the magnetic force blocking portion 24 to block the magnetic force provided to the magnetic force close-up portion 22 By doing so, the pattern forming unit 10 and the substrate adsorption unit 12 will be separated from each other.

Therefore, as mentioned, when using the substrate-forming substrate holding assembly 100 of the present invention can prevent the occurrence of stains and foreign matter adsorption, and sufficiently prevent the situation that the substrate (G) sag to maintain a flatness constant In addition, it can be easily separated without applying a physical force to the substrate (G).

Hereinafter, various exemplary embodiments of the present invention will be described in relation to the arrangement structure of the magnetic force providing unit 20, the magnetic force contacting unit 22, and the magnetic force blocking unit 24 of the pattern-forming substrate holding assembly 100. Let's do it.

6 to 8 are diagrams for explaining examples of using the magnetic force providing portion, the magnetic contact portion and the magnetic shield of the pattern holding substrate holding assembly of the present invention.

Referring to FIG. 6, the magnetic adhesion part 22 is disposed on one surface of the substrate G to form a pattern, such as an organic thin film, based on the substrate G, and the substrate is an opposite surface to the one surface of the substrate G mentioned above. (G) The magnetic force providing unit 20 is disposed on the other surface. At this time, the magnetic force contact portion 22 may be repeatedly provided for a portion of the bar structure 22a to be divided into a magnetic force contact portion and a magnetic force non-adherence portion (the remaining portion). The magnetic force providing unit 20 may also be repeatedly provided to a portion of the bar structure 20a so as to be divided into a magnetic force providing portion and a non-magnetic portion providing portion (the remaining portion).

Thus, when the magnetic force providing part 20 is fixed between the magnetic contact part and the magnetic non-contact part of the magnetic force contact part 22 while the magnetic force contact part 22 is fixed, the pattern forming part 10 and the substrate adsorption part ( 12) can be easily attached and separated. In addition, even when the magnetic force contact portion 22 is fixed between the magnetic force providing portion and the non-magnetic force providing portion of the magnetic force providing portion 20 while the magnetic force providing portion 20 is fixed, the pattern forming portion 10 and the substrate adsorption portion ( 12) can be attached and separated.

In FIG. 6, the magnetic force adhesion part 22 is disposed on one surface of the substrate G, and the magnetic force providing part 20 is disposed on the other surface of the substrate G. However, magnetic force is applied to one surface of the substrate G. The provision part 20 may be arrange | positioned, and the magnetic force adhesion part 22 may be arrange | positioned at the other surface of the board | substrate G.

Referring to FIG. 7, the magnetic force contact part 22 is disposed on one surface of the substrate G, and the magnetic force providing part 20 is disposed on the other surface of the substrate G. In addition, the magnetic force blocking unit 24 is disposed between the other surface of the substrate G and the magnetic force providing unit 20.

At this time, the magnetic force contact portion 22 may be repeatedly provided for a portion of the bar structure 22a to be divided into a magnetic force contact portion and a magnetic force non-adherence portion (the remaining portion). The magnetic force providing unit 20 may also be repeatedly provided to a portion of the bar structure 20a so as to be divided into a magnetic force providing portion and a non-magnetic portion providing portion (the remaining portion). In addition, even in the case of the magnetic shield 24, it can be repeatedly provided for a portion of the bar structure (24a) so that it can be divided into a magnetic block and the magnetic force non-blocking portion (the remaining portion).

Accordingly, the magnetic force providing portion 20 and the magnetic force blocking portion 24 are appropriately varied between the magnetic force adhesion portion and the magnetic force non-adherence portion of the magnetic force adhesion portion 22 while the magnetic force adhesion portion 22 is fixed, or the magnetic force. In a state in which the providing unit 20 is fixed, the magnetic force contacting unit 22 and the magnetic force blocking unit 24 are appropriately varied between the magnetic force providing unit and the non-magnetic field providing unit of the magnetic force providing unit 20, or the magnetic block unit ( When the magnetic force contacting portion 22 and the magnetic force providing portion 20 are properly varied between the magnetic force blocking portion and the magnetic force non-blocking portion of the magnetic force blocking portion 24 while the 24 is fixed, the pattern forming portion 10 and the substrate The adsorption part 12 can be easily stuck and separated.

In addition, the magnetic force blocking part 24 is appropriately changed in the state where the magnetic force providing part of the magnetic force providing part 20 and the magnetic force contacting part of the magnetic force contacting part 22 are fixed to correspond to each other, or the magnetic force providing part 20 is provided. In the state where the magnetic force providing portion and the magnetic force blocking portion of the magnetic force blocking portion 24 are fixed to correspond to each other, the magnetic force contact portion 22 is appropriately changed, or the magnetic force non-blocking portion of the magnetic force blocking portion 24 and Even when the magnetic force providing unit 20 is appropriately changed in a state where the magnetic force contacting portions 22 of the magnetic force contacting portions 22 are fixed to correspond to each other, the pattern forming portion 10 and the substrate adsorption portion 12 are easily adhered to and separated from each other. You can.

In FIG. 7, the magnetic force contact portion 22 is disposed on one surface of the substrate G, and the magnetic force blocking portion 24 and the magnetic force providing portion 20 are disposed on the other surface of the substrate G. The magnetic force blocking part 24 and the magnetic force providing part 20 are disposed on one surface of the substrate G, and the magnetic force contacting part 22 is disposed on the other surface of the substrate G, or the magnetic force blocking part is disposed on one surface of the substrate G. The magnetic force providing portion 20 may be disposed on the other surface of the substrate G and the magnetic force contact portion 22 is disposed.

Referring to FIG. 8, the magnetic force contact part 22 is disposed on one surface of the substrate G, and the magnetic force providing part 20 is disposed on the other surface of the substrate G. The magnetic force blocking part 24 is disposed between the other surface of the substrate G and the magnetic force providing part 20.

At this time, the magnetic force contact portion 22 is the first frame (10b) itself, the magnetic force providing portion 20 iteratively for each part of the bar structure (20a) to be divided into a magnetic force providing portion and the non-magnetic force providing portion (the remaining portion). It may be provided as, and in the case of the magnetic block 24, it can be repeatedly provided for a portion of the bar structure (24a) so that it can be divided into the magnetic block and the non-magnetic block.

Accordingly, when the magnetic force providing unit 20 is appropriately variable in a state where the magnetic force blocking unit 24 is fixed, or when the magnetic force blocking unit 24 is appropriately changed while the magnetic force providing unit 20 is fixed, a pattern The formation part 10 and the board | substrate adsorption part 12 can contact and isolate easily.

In FIG. 8, the magnetic force contact portion 22 is disposed on one surface of the substrate G, and the magnetic force blocking portion 24 and the magnetic force providing portion 20 are disposed on the other surface of the substrate G. The magnetic force blocking part 24 and the magnetic force providing part 20 are disposed on one surface of the substrate G, and the magnetic force contacting part 22 is disposed on the other surface of the substrate G, or the magnetic force blocking part is disposed on one surface of the substrate G. The magnetic force providing portion 20 may be disposed on the other surface of the substrate G and the magnetic force contact portion 22 is disposed.

In addition, in FIG. 8, the magnetic force contact part 22 is provided as the first frame 10b itself, but the moon structure 22a can be divided into the magnetic force contact part 22 and the magnetic force contact part. When repeatedly provided to a portion of the) may be provided with the magnetic force providing unit 20 as the second frame 12b itself.

In addition, in the present invention, in addition to the structure and the variable of the magnetic force providing unit 20, the magnetic force contacting portion 22, the magnetic force blocking portion 24, etc. mentioned above, through the relationship between the provision of magnetic force, blocking of magnetic force and magnetic force pattern forming unit In the case where the 10 and the substrate adsorption part 12 can be easily brought into close contact with and separated from each other, the structures and variables of the magnetic force providing part 20, the magnetic force contact part 22, and the magnetic force blocking part 24 are variously modified. You can.

In addition, the pattern holding substrate holding assembly 100 of the present invention forms a pattern on the substrate G by holding and transferring the substrate G and the mask 10a together, thereby actively utilizing the organic thin film deposition. Can be. Thus, the organic thin film deposition apparatus may include the substrate holding assembly 100 for pattern formation mentioned above.

As such, when the organic thin film deposition apparatus including the substrate-forming substrate holding assembly 100 for pattern formation is used, staining and adsorbing of foreign matters can be prevented when the substrate G is held, and the substrate G is sag. The flatness can be kept constant by holding without forming a thin film pattern more stably. Since the substrate G can be easily separated without applying a physical force, breakage of the substrate G generated when the substrate G is separated can be prevented in advance.

According to the substrate holding assembly for forming a pattern and the organic thin film deposition apparatus of the present invention mentioned above, since the substrate is held using an electrostatic force, it is possible to prevent the occurrence of stains and adsorption of foreign substances when holding the substrate, and the pattern forming unit and the substrate adsorption. Since the substrate is interposed between the parts by magnetic force, the flatness of the substrate can be kept constant, and the substrate can be separated by the electrostatic and magnetic forces, thereby improving product reliability and process reliability. As a result, it can contribute to the development of the flat panel display industry.

10: pattern forming portion 10a: mask
10b: first frame 12: substrate adsorption portion
12a: electrostatic chuck 12b: second frame
20: magnetic force providing portion 22: magnetic force contact portion
24: magnetic shield 20a, 22a, 24a: bar structure
25: battery 40: variable part
100: substrate holding assembly for pattern formation
G: Substrate

Claims (11)

A mask designed with a pattern for transferring to one surface of a substrate; And a pattern forming part disposed on one surface of the substrate and having a first frame formed to surround the mask.
An electrostatic chuck that adsorbs the other surface of the substrate by an electrostatic force; And a second frame formed to surround the electrostatic chuck so as to correspond to the first frame and disposed on the other surface of the substrate;
A magnetic force providing unit provided in any one of the first frame and the second frame to provide magnetic force; And
It includes a magnetic close contact portion provided in the other one frame to be in close contact by the magnetic force,
As the first frame and the second frame are in close contact with each other by the magnetic force, the pattern forming unit and the substrate adsorption unit are in close contact with each other, and the substrate is interposed between the pattern forming unit and the substrate adsorption unit. Holding assembly. The magnetic force providing part and the magnetic force contact part of claim 1, wherein each of the magnetic force providing part and the magnetic force contact part is repeatedly arranged in a part of each of the one frame and the other one frame. And a variable portion capable of varying at least one of the at least one of the portions and every other portion except the portion,
When the magnetic force providing part and the magnetic force contacting part are arranged to correspond to each other as at least one of the magnetic force providing part and the magnetic force contacting part is changed by the variable part, the pattern forming part and the substrate adsorption part are in close contact with each other. And the pattern forming portion and the substrate adsorption portion are separated from each other when the magnetic force providing portion and the magnetic force contacting portion are not disposed to correspond to each other. According to claim 1, wherein the magnetic force providing portion and each of the magnetic force contact portion is provided to be repeatedly arranged in each of the one and each of the one frame and the other frame, between the magnetic force providing portion and the magnetic force contact portion Magnetic blocker that is repeatedly disposed at every portion to block the magnetic force in the; And a variable part capable of varying at least one of the magnetic force providing part, the magnetic force close part, and the magnetic force blocking part to a position between every part and every other part except the part.
When at least one of the magnetic force providing part, the magnetic force contacting part, and the magnetic force blocking part is changed by the variable part, the pattern forming part and the substrate are attracted when the magnetic force providing part and the magnetic force contacting part are arranged to correspond to each other. The pattern forming portion and the substrate when the portion is in close contact with each other and the magnetic force providing portion and the magnetic force contacting portion are disposed so as not to correspond to each other, or when the magnetic force is cut off between the magnetic force providing portion and the magnetic adhesion portion by the magnetic force blocking portion. The substrate holding assembly for pattern formation, characterized in that the adsorption parts are separated from each other. According to claim 1, wherein any one of the magnetic force providing portion and the magnetic force contact portion is provided so as to be repeatedly arranged for each part of the one frame, the other one of the magnetic force providing portion and the magnetic force contact portion is the other one When provided as a frame itself, the magnetic force blocking portion is repeatedly provided for each portion to be able to block the magnetic force between the magnetic force providing portion and the magnetic force close portion; And at least one of the magnetic force providing unit and the magnetic force contacting unit and at least one of the magnetic force blocking unit, which is provided to be repeatedly disposed at every one portion of the frame in each of the portions and every other portion except the portion. Further provided with a variable portion that can be changed to position,
When the magnetic force providing part and the magnetic force contacting part are arranged to correspond to each other as at least one of the one and the magnetic force blocking part provided to be repeatedly disposed at a portion of the one frame by the variable part is variable. The pattern forming unit and the substrate adsorption unit may be in close contact with each other, and the pattern forming unit and the substrate adsorption unit may be separated from each other when the magnetic force is blocked between the magnetic force providing unit and the magnetic force contacting unit by the magnetic force blocking unit. Substrate holding assembly for pattern formation. The pattern holding substrate holding assembly of claim 1, further comprising a battery electrically connected to the electrostatic chuck to provide an electrostatic force to the electrostatic chuck. A mask designed with a pattern for transferring to one surface of a substrate; And a pattern forming part disposed on one surface of the substrate, the first frame including a first frame formed to surround the mask and being in close contact with magnetic force.
An electrostatic chuck that adsorbs the other surface of the substrate by an electrostatic force; And a second frame formed to surround the electrostatic chuck so as to correspond to the first frame and disposed on the other surface of the substrate;
A magnetic force providing unit positioned in an internal space of the second frame and repeatedly disposed at a portion of the internal space of the second frame to provide a magnetic force;
A magnetic force blocking unit repeatedly disposed at a portion of the second frame facing the first frame so as to block the magnetic force from being provided to the first frame; And
And a variable part connected to the magnetic force providing part so as to vary the bar structure of the magnetic force providing part by an operation of repeating contraction and expansion,
When the magnetic force providing unit is varied by the variable unit so that the magnetic force blocking unit is not disposed between the magnetic force providing unit and the first frame, the pattern forming unit and the substrate adsorption unit are in close contact with each other, and the magnetic force providing unit and the first frame are in close contact with each other. And the pattern forming portion and the substrate adsorption portion are separated from each other when the magnetic force providing portion is varied by the variable portion so that the magnetic force blocking portions are arranged between frames. The pattern holding substrate holding assembly of claim 6, wherein the first frame is made of stainless steel, the magnetic force providing portion is made of a permanent magnet, and the magnetic blocking portion is made of a ferromagnetic material. The substrate holding assembly of claim 7, wherein the ferromagnetic material comprises Mu metal. The pattern of claim 6, wherein the magnetic force providing part is formed of a bar structure to be positioned in an inner space of the second frame, and is repeatedly provided at a portion of the bar structure to provide the magnetic force. Forming substrate holding assembly. The substrate holding assembly of claim 6, further comprising a battery electrically connected to the electrostatic chuck to provide an electrostatic force to the electrostatic chuck. An organic thin film deposition apparatus comprising the substrate holding assembly for pattern formation according to claim 6.

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