TWI475736B - Manufacturing method of electroluminescent display apparatus and plating machine - Google Patents
Manufacturing method of electroluminescent display apparatus and plating machine Download PDFInfo
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本發明有關於顯示裝置,且特別是有關於電激發光顯示裝置的製作方法以及鍍膜機台。The present invention relates to a display device, and more particularly to a method of fabricating an electroluminescent display device and a coating machine.
有機發光二極體(Organic Light Emittine Diode,OLED)具有結構簡單、不需外加背光源、解析度高、像素獨立色彩表現佳、反應時間較短等優異的特性,目前已普遍運用於平面顯示器之全彩化的製程技術中。The Organic Light Emittine Diode (OLED) has excellent characteristics such as simple structure, no need for external backlight, high resolution, good pixel independent color performance, and short reaction time. It has been widely used in flat panel displays. Full color process technology.
有機發光二極體顯示元件的製作方法係利用陰影罩幕(Shadow Mask)與像素對位技術將有機發光材料蒸鍍於玻璃基板上以形成一圖案化的有機發光層,其中陰影罩幕係由一金屬薄膜以及一與金屬薄膜的周邊區相連的框架構成。框架係用以固定金屬薄膜並對金屬薄膜施加張力以維持金屬薄膜的平整性。The method for fabricating an organic light-emitting diode display device is to deposit an organic light-emitting material on a glass substrate by using a shadow mask and a pixel alignment technique to form a patterned organic light-emitting layer, wherein the shadow mask is composed of a shadow mask. A metal film and a frame connected to the peripheral region of the metal film are formed. The frame is used to fix the metal film and apply tension to the metal film to maintain the flatness of the metal film.
近年來,隨著玻璃基板的製作技術日益進步,玻璃基板的尺寸日益增加,因此,需要使用尺寸較大的陰影罩幕。然而,陰影罩幕的尺寸增加會衍生出一些問題,例如:框架尺寸增加會導致重量增加且容易變形,因此,在儲存、搬運、與製程中對人員的操作以及機台設計會增加許多難度,以致於製作成本提高;金屬薄膜的尺寸受到供應商的限制,故不易取得大尺寸的金屬薄膜;以及隨著金屬薄膜的尺寸增加,用以加工金屬薄膜的機具也須配合放大,以致於製作成本大幅提高。In recent years, as the production technology of glass substrates has progressed, the size of glass substrates has been increasing, and therefore, it has been required to use a large-sized shadow mask. However, the increase in the size of the shadow mask can cause problems, such as an increase in the size of the frame, which leads to an increase in weight and an easy deformation. Therefore, the handling of personnel and the design of the machine during the storage, handling, and manufacturing process add a lot of difficulty. As a result, the manufacturing cost is increased; the size of the metal film is limited by the supplier, so that it is difficult to obtain a large-sized metal film; and as the size of the metal film increases, the tool for processing the metal film must also be enlarged, so that the manufacturing cost A substantial increase.
本發明一實施例提供一種電激發光顯示裝置的製作方法,包括提供一基板,基板具有相對的一第一側與一第二側;於基板的第一側上配置一磁性元件;提供多個陰影罩幕單元;使各陰影罩幕單元與基板的第二側對位;以磁性元件對已完成對位的各陰影罩幕單元施加磁力,以使已完成對位的各陰影罩幕單元貼合基板的第二側,其中貼合基板的陰影罩幕單元構成一陰影罩幕,陰影罩幕具有一暴露出基板的開口圖案;對基板的第二側進行一沉積製程,以於陰影罩幕的開口圖案中沉積一圖案化電激發光層;以及移除陰影罩幕。An embodiment of the present invention provides a method for fabricating an electroluminescent display device, including providing a substrate having a first side and a second side opposite to each other; and arranging a magnetic element on the first side of the substrate; a shadow mask unit; the shadow mask unit is aligned with the second side of the substrate; the magnetic element applies a magnetic force to each of the shadow mask units that have been aligned, so that the shadow mask units that have been aligned are pasted The second side of the substrate, wherein the shadow mask unit of the substrate is formed with a shadow mask, the shadow mask has an opening pattern exposing the substrate; and a deposition process is performed on the second side of the substrate to shield the shadow A patterned electroluminescent layer is deposited in the opening pattern; and the shadow mask is removed.
本發明一實施例提供一種鍍膜機台,適於在一基板上形成一圖案化電激發光層,鍍膜機台包括一鍍膜腔體;一磁性吸盤,位於鍍膜腔體中,且適於固定基板以及以磁力固定設置於基板上的多個陰影罩幕單元,陰影罩幕單元構成一陰影罩幕,且陰影罩幕具有一暴露出基板的開口圖案;以及一鍍膜源,位於鍍膜腔體中,且適於將一電激發光材料鍍於開口圖案中。An embodiment of the present invention provides a coating machine for forming a patterned electroluminescent layer on a substrate, the coating machine includes a coating cavity, and a magnetic chuck disposed in the coating cavity and adapted to fix the substrate And a plurality of shadow mask units fixedly disposed on the substrate by magnetic force, the shadow mask unit forms a shadow mask, and the shadow mask has an opening pattern exposing the substrate; and a coating source is located in the coating cavity. And suitable for plating an electroluminescent material into the opening pattern.
以下將詳細說明本發明實施例之製作與使用方式。然應注意的是,本發明提供許多可供應用的發明概念,其可以多種特定型式實施。文中所舉例討論之特定實施例僅為製造與使用本發明之特定方式,非用以限制本發明之範圍。此外,在不同實施例中可能使用重複的標號或標示。這些重複僅為了簡單清楚地敘述本發明,不代表所討論之不同實施例及/或結構之間具有任何關連性。再者,當述及一第一材料層位於一第二材料層上或之上時,包括第一材料層與第二材料層直接接觸或間隔有一或更多其他材料層之情形。在圖式中,實施例之形狀或是厚度可擴大,以簡化或是方便標示。再者,圖中未繪示或描述之元件,為所屬技術領域中具有通常知識者所知的形式。The manner of making and using the embodiments of the present invention will be described in detail below. It should be noted, however, that the present invention provides many inventive concepts that can be applied in various specific forms. The specific embodiments discussed herein are merely illustrative of specific ways of making and using the invention, and are not intended to limit the scope of the invention. Moreover, repeated numbers or labels may be used in different embodiments. These repetitions are merely for the purpose of simplicity and clarity of the invention and are not to be construed as a limitation of the various embodiments and/or structures discussed. Furthermore, when a first material layer is referred to or on a second material layer, the first material layer is in direct contact with or separated from the second material layer by one or more other material layers. In the drawings, the shape or thickness of the embodiment may be expanded to simplify or facilitate the marking. Furthermore, elements not shown or described in the figures are in the form known to those of ordinary skill in the art.
第1A圖至第1D圖繪示本發明一實施例之電激發光顯示裝置的製程剖面圖。第2A圖至第2D圖繪示第1A圖至第1D圖之基板的下視圖,且第1A圖至第1D圖係繪示第2A圖至第2D圖中沿I-I’線段的剖面圖。第3A圖與第3B圖繪示第1A圖至第1B圖之基板與電磁鐵的上視圖。1A to 1D are cross-sectional views showing processes of an electroluminescence display device according to an embodiment of the present invention. 2A to 2D are lower views of the substrate of FIGS. 1A to 1D, and FIGS. 1A to 1D are cross-sectional views taken along line II' of FIGS. 2A to 2D. . 3A and 3B are top views of the substrate and the electromagnet of FIGS. 1A to 1B.
本實施例是用多個小片的陰影罩幕單元取代習知的大型陰影罩幕作為蒸鍍罩幕,詳細而言,本實施例係將這些小片的陰影罩幕單元一一對位並以磁力將其吸附(或貼合)在基板上以構成一蒸鍍罩幕。In this embodiment, a plurality of small-sized shadow mask units are used instead of the conventional large shadow masks as vapor deposition masks. In detail, in this embodiment, the shadow mask units of the small pieces are paired and magnetically It is adsorbed (or bonded) on a substrate to constitute an evaporation mask.
請同時參照第1A圖、第2A圖與第3A圖,提供一基板110,基板110具有相對的一第一側112與一第二側114,且基板110可具有多個固定區F1、F2、F3、F4、F5、F6、F7、F8。Referring to FIG. 1A, FIG. 2A and FIG. 3A, a substrate 110 is provided. The substrate 110 has a first side 112 and a second side 114. The substrate 110 can have a plurality of fixed areas F1 and F2. F3, F4, F5, F6, F7, F8.
接著,請同時參照第1A圖與第3A圖,在基板110的第一側112上配置一磁性元件120,磁性元件120例如為一電磁鐵元件。在一實施例中,磁性元件120包括多個彼此分離的電磁鐵E1、E2、E3、E4、E5、E6、E7、E8,且電磁鐵E1、E2、E3、E4、E5、E6、E7、E8分別位於固定區F1、F2、F3、F4、F5、F6、F7、F8中。Next, referring to FIGS. 1A and 3A, a magnetic element 120 is disposed on the first side 112 of the substrate 110. The magnetic element 120 is, for example, an electromagnet element. In an embodiment, the magnetic element 120 includes a plurality of electromagnets E1, E2, E3, E4, E5, E6, E7, E8 separated from each other, and the electromagnets E1, E2, E3, E4, E5, E6, E7, E8 is located in the fixed areas F1, F2, F3, F4, F5, F6, F7, and F8, respectively.
請參照第1A圖,提供多個陰影罩幕單元S1、S2、S3、S4、S5、S6、S7、S8,其中陰影罩幕單元S5、S6、S7、S8僅繪示於第2C圖中。陰影罩幕單元S1、S2、S3、S4、S5、S6、S7、S8例如為金屬薄膜、或是其他適合被磁性吸附的薄膜。詳細而言,可先將這些陰影罩幕單元S1、S2、S3、S4、S5、S6、S7、S8配置於一載具130上,並將載具130連同其上的陰影罩幕單元S1、S2、S3、S4、S5、S6、S7、S8移至基板110下方。載具130可為一用以支撐陰影罩幕單元S1、S2、S3、S4、S5、S6、S7、S8的框架。Referring to FIG. 1A, a plurality of shadow mask units S1, S2, S3, S4, S5, S6, S7, S8 are provided, wherein the shadow mask units S5, S6, S7, S8 are only shown in FIG. 2C. The shadow mask units S1, S2, S3, S4, S5, S6, S7, and S8 are, for example, metal thin films or other thin films suitable for magnetic adsorption. In detail, the shadow mask units S1, S2, S3, S4, S5, S6, S7, S8 may be first disposed on a carrier 130, and the carrier 130 together with the shadow mask unit S1 thereon. S2, S3, S4, S5, S6, S7, and S8 are moved below the substrate 110. The carrier 130 can be a frame for supporting the shadow mask units S1, S2, S3, S4, S5, S6, S7, S8.
之後,請同時參照第1A圖、第2A圖與第3A圖,使陰影罩幕單元S1與基板110的第二側114對位,以使陰影罩幕單元S1對齊固定區F1。然後,使電磁鐵E1具有磁力(例如對電磁鐵E1通電),以將陰影罩幕單元S1吸引至基板110的固定區F1中,並貼合基板110的第二側114。值得注意的是,第1A圖至第1D圖以及第3A圖與第3B圖的電磁鐵圖示係以填有斜線的方塊代表通電的電磁鐵(具有磁性),以空白的方塊代表未通電的電磁鐵(不具有磁性)。Thereafter, referring to FIG. 1A, FIG. 2A and FIG. 3A simultaneously, the shadow mask unit S1 is aligned with the second side 114 of the substrate 110 such that the shadow mask unit S1 is aligned with the fixed area F1. Then, the electromagnet E1 is made to have a magnetic force (for example, energizing the electromagnet E1) to attract the shadow mask unit S1 into the fixed area F1 of the substrate 110 and to conform to the second side 114 of the substrate 110. It should be noted that the electromagnets in Figures 1A to 1D and 3A and 3B represent the energized electromagnets (with magnetic properties) with squares filled with diagonal lines and unpowered with blank squares. Electromagnet (no magnetic).
接著,請參照第1B圖,使陰影罩幕單元S2與基板110的第二側114對位,以使陰影罩幕單元S2對齊固定區F2。然後,請同時參照第1B圖、第2B圖與第3B圖,使電磁鐵,E2具有磁力,以將陰影罩幕單元S2吸引至基板110的固定區F2中,並貼合基板110的第二側114。Next, referring to FIG. 1B, the shadow mask unit S2 is aligned with the second side 114 of the substrate 110 to align the shadow mask unit S2 with the fixed area F2. Then, referring to FIG. 1B, FIG. 2B and FIG. 3B simultaneously, the electromagnet, E2 has a magnetic force to attract the shadow mask unit S2 into the fixed area F2 of the substrate 110 and to adhere to the second of the substrate 110. Side 114.
之後,請同時參照第1C圖與第2C圖,以相同的方式分別將陰影罩幕單元S3、S4、S5、S6、S7、S8吸引至基板110的固定區F3、F4、F5、F6、F7、F8中,並貼合基板110的第二側114。此時,貼合基板110的陰影罩幕單元S1、S2、S3、S4、S5、S6、S7、S8構成一陰影罩幕S,陰影罩幕S具有一暴露出基板110的開口圖案OP。Thereafter, referring to FIG. 1C and FIG. 2C simultaneously, the shadow mask units S3, S4, S5, S6, S7, and S8 are respectively attracted to the fixed areas F3, F4, F5, F6, and F7 of the substrate 110 in the same manner. In F8, the second side 114 of the substrate 110 is bonded. At this time, the shadow mask units S1, S2, S3, S4, S5, S6, S7, S8 of the bonding substrate 110 constitute a shadow mask S having an opening pattern OP exposing the substrate 110.
然後,對基板110的第二側114進行一沉積製程(例如蒸鍍製程),以於陰影罩幕S的開口圖案OP中沉積一圖案化電激發光層140(如第1D圖所示)。Then, a deposition process (for example, an evaporation process) is performed on the second side 114 of the substrate 110 to deposit a patterned electroluminescent layer 140 (shown in FIG. 1D) in the opening pattern OP of the shadow mask S.
之後,請同時參照第1D圖與第2D圖,移除陰影罩幕S,移除的方法例如為使電磁鐵E1、E2、E3、E4、E5、E6、E7、E8的磁力消失,也就是使電磁鐵E1、E2、E3、E4、E5、E6、E7、E8未通電。當電磁鐵E1、E2、E3、E4、E5、E6、E7、E8的磁力消失之後,陰影罩幕S會受到重力的作用而落回位於基板110下方的載具130上。After that, please refer to the 1D image and the 2D image at the same time, and remove the shadow mask S. For example, the magnetic force of the electromagnets E1, E2, E3, E4, E5, E6, E7, E8 disappears, that is, The electromagnets E1, E2, E3, E4, E5, E6, E7, and E8 are not energized. When the magnetic forces of the electromagnets E1, E2, E3, E4, E5, E6, E7, E8 disappear, the shadow mask S is returned by gravity to the carrier 130 located below the substrate 110.
值得注意的是,由於本實施例係用多個小片的陰影罩幕單元S1、S2、S3、S4、S5、S6、S7、S8取代習知的大型陰影罩幕作為蒸鍍罩幕,因此,只需將這些小片的陰影罩幕單元一一對位並以磁力將其吸附(或貼合)在基板110上以構成一蒸鍍罩幕即可,而無需使用習知的大型框架以及大片金屬薄膜。It should be noted that, since the present embodiment uses a plurality of small-sized shadow mask units S1, S2, S3, S4, S5, S6, S7, S8 to replace the conventional large shadow mask as a vapor deposition mask, It is only necessary to put the shadow mask units of these small pieces in a pair and magnetically adsorb (or fit) them on the substrate 110 to form an evaporation mask without using a conventional large frame and large metal. film.
詳細而言,由於本實施例的陰影罩幕單元尺寸較小,因此容易維持陰影罩幕單元的平整性,故可直接與基板對位並平貼在基板上,而無需使用框架,或者是僅需使用尺寸較小且強度較低的框架,而無需如習知技術一般由於大片金屬薄膜易有平整性不易維持的問題而需使用尺寸大且強度高的大型框架。In detail, since the shadow mask unit of the embodiment has a small size, it is easy to maintain the flatness of the shadow mask unit, so that it can be directly aligned with the substrate and affixed to the substrate without using a frame, or only It is necessary to use a frame having a small size and a low strength, and it is not necessary to use a large-sized frame having a large size and high strength because a large metal film is liable to be difficult to maintain flatness as in the prior art.
由於本實施例無需使用習知的大型框架以及大片金屬薄膜,因此,本實施例的製程較為容易、金屬薄膜原料取得容易、且製作成本低。Since this embodiment does not require the use of a conventional large frame and a large metal film, the process of the present embodiment is relatively easy, the metal film raw material is easy to obtain, and the manufacturing cost is low.
此外,本實施例的鍍膜製程可以是在一鍍膜機台P(如第1A圖所示)中進行,鍍膜機台P適於在基板110上形成一圖案化電激發光層140,鍍膜機台P包括一鍍膜腔體P1、一磁性吸盤P2、一鍍膜源P3以及一固持結構P4。固持結構P4與磁性吸盤P2位於鍍膜腔體P1中,且磁性吸盤P2係固定在固持結構P4上,且磁性吸盤P2適於固定基板110以及以磁力固定設置於基板110上的陰影罩幕單元S1、S2、S3、S4、S5、S6、S7、S8。鍍膜源P3位於鍍膜腔體P1中,且適於將一電激發光材料鍍於開口圖案OP中。In addition, the coating process of the embodiment may be performed in a coating machine P (as shown in FIG. 1A), and the coating machine P is adapted to form a patterned electroluminescent layer 140 on the substrate 110, and the coating machine P includes a plating chamber P1, a magnetic chuck P2, a coating source P3, and a holding structure P4. The holding structure P4 and the magnetic chuck P2 are located in the coating cavity P1, and the magnetic chuck P2 is fixed on the holding structure P4, and the magnetic chuck P2 is adapted to fix the substrate 110 and the shadow mask unit S1 fixed on the substrate 110 by magnetic force. , S2, S3, S4, S5, S6, S7, S8. The coating source P3 is located in the plating chamber P1 and is adapted to plate an electroluminescent material into the opening pattern OP.
詳細而言,磁性吸盤P2包括電磁鐵E1、E2、E3、E4、E5、E6、E7、E8(或是永久磁鐵)以及一適於固定電磁鐵或是永久磁鐵的固定裝置P21(下文將詳述固定裝置P21的結構以及將磁性吸盤P2安裝於固持結構P4上的製程)。In detail, the magnetic chuck P2 includes electromagnets E1, E2, E3, E4, E5, E6, E7, E8 (or permanent magnets) and a fixing device P21 suitable for fixing an electromagnet or a permanent magnet (hereinafter will be detailed) The structure of the fixing device P21 and the process of mounting the magnetic chuck P2 on the holding structure P4).
當磁性吸盤P2是包括電磁鐵時,磁性吸盤P2可藉由控制輸入電磁鐵E1、E2、E3、E4、E5、E6、E7、E8的電流控制電磁鐵E1、E2、E3、E4、E5、E6、E7、E8的磁力。磁性吸盤P2可藉由使電磁鐵不通電而使消除其磁力,以移除對應的陰影罩幕單元。或者是,當磁性吸盤P2是包括永久磁鐵時,可藉由使磁性吸盤P2與基板110分離來移除基板110上的陰影罩幕單元。When the magnetic chuck P2 includes an electromagnet, the magnetic chuck P2 can control the electromagnets E1, E2, E3, E4, E5 by controlling the currents of the input electromagnets E1, E2, E3, E4, E5, E6, E7, E8, The magnetic force of E6, E7 and E8. The magnetic chuck P2 can eliminate its magnetic force by causing the electromagnet to be de-energized to remove the corresponding shadow mask unit. Alternatively, when the magnetic chuck P2 includes a permanent magnet, the shadow mask unit on the substrate 110 can be removed by separating the magnetic chuck P2 from the substrate 110.
此外,雖然第1C圖所示為水平蒸鍍製程(基板110呈水平方向配置),但在其他實施例中,亦可在鍍膜腔體P1中加裝旋轉機構,以使基板110呈垂直方向配置,然後,進行一垂直蒸鍍製程。Further, although FIG. 1C shows a horizontal vapor deposition process (the substrate 110 is disposed in the horizontal direction), in other embodiments, a rotation mechanism may be added to the plating chamber P1 to arrange the substrate 110 in the vertical direction. Then, a vertical evaporation process is performed.
值得注意的是,本實施例係以八個電磁鐵E1、E2、E3、E4、E5、E6、E7、E8、八個陰影罩幕單元S1、S2、S3、S4、S5、S6、S7、S8、八個固定區F1、F2、F3、F4、F5、F6、F7、F8為例作說明,但並非用以限定本發明,也就是說,在其他實施例中,可視情況而增減電磁鐵、陰影罩幕單元與固定區的數量以及排列等。It should be noted that, in this embodiment, eight electromagnets E1, E2, E3, E4, E5, E6, E7, E8, and eight shadow mask units S1, S2, S3, S4, S5, S6, and S7 are used. S8, eight fixed areas F1, F2, F3, F4, F5, F6, F7, F8 are taken as an example, but are not intended to limit the present invention, that is to say, in other embodiments, the electromagnetic field may be increased or decreased as appropriate. The number and arrangement of iron, shadow mask units and fixed areas.
第11A圖與第11B圖繪示本發明一實施例之固定裝置的製作流程圖。值得注意的是,第11A圖與第11B圖未繪示電磁鐵E5、E6、E7、E8。請參照第1圖與第11A圖,固定裝置P21包括一上蓋P21a與一下蓋P21b,其中下蓋P21b具有一容置空間A,其適於容置電磁鐵E1、E2、E3、E4、E5、E6、E7、E8(或是永久磁鐵)。11A and 11B are flow charts showing the fabrication of a fixing device according to an embodiment of the present invention. It should be noted that the electromagnets E5, E6, E7, and E8 are not shown in FIGS. 11A and 11B. Referring to FIG. 1 and FIG. 11A, the fixing device P21 includes an upper cover P21a and a lower cover P21b, wherein the lower cover P21b has an accommodating space A, which is adapted to receive the electromagnets E1, E2, E3, E4, E5, E6, E7, E8 (or permanent magnet).
請參照第1圖與第11B圖,將電磁鐵E1、E2、E3、E4、E5、E6、E7、E8置於容置空間A中,並將上蓋P21a配置於下蓋P21b上,以密封容置空間A。然後,可選擇性地利用多個螺絲B將上蓋P21a鎖於下蓋P21b上,以將電磁鐵E1、E2、E3、E4、E5、E6、E7、E8固定在容置空間A中,而構成磁性吸盤P2。值得注意的是,上蓋P21a與下蓋P21b亦可選擇以其他方式接合,故第1圖並未繪示螺絲B。Referring to FIG. 1 and FIG. 11B, the electromagnets E1, E2, E3, E4, E5, E6, E7, and E8 are placed in the accommodating space A, and the upper cover P21a is disposed on the lower cover P21b to seal the contents. Set space A. Then, the upper cover P21a can be selectively locked to the lower cover P21b by using a plurality of screws B to fix the electromagnets E1, E2, E3, E4, E5, E6, E7, E8 in the accommodating space A, and constitute Magnetic chuck P2. It should be noted that the upper cover P21a and the lower cover P21b may also be selectively joined in other manners, so the first figure does not show the screw B.
第12A圖與第12B圖繪示本發明一實施例之將磁性吸盤安裝於固持結構上的製程正視圖。第13A圖與第13B圖繪示第12A圖與第12B圖的側視圖。值得注意的是,為簡化說明,第12A圖、第12B圖、第13A圖與第13B圖僅簡略繪示磁性吸盤P2,而未繪示其詳細結構。12A and 12B are elevational views showing a process of mounting a magnetic chuck on a holding structure according to an embodiment of the present invention. 13A and 13B are side views of the 12A and 12B drawings. It should be noted that, in order to simplify the description, the magnetic chuck P2 is only schematically illustrated in FIGS. 12A, 12B, 13A and 13B, and the detailed structure thereof is not shown.
請參照第12A圖與第13A圖,固持結構P4的下表面P41之鄰近(固持結構P4的)相對二外緣P42、43的部份配置有多個L型固持件P44,固持結構P4與L型固持件P44之間存在凹槽R。之後,請參照第12B圖與第13B圖,將磁性吸盤P2插入凹槽R中,以藉由L型固持件P44將磁性吸盤P2固定在固持結構P4上。Referring to FIGS. 12A and 13A, a portion of the lower surface P41 of the holding structure P4 (of the holding structure P4) opposite to the two outer edges P42, 43 is provided with a plurality of L-shaped holding members P44, and the holding structures P4 and L are disposed. There is a groove R between the retainers P44. Thereafter, referring to FIGS. 12B and 13B, the magnetic chuck P2 is inserted into the recess R to fix the magnetic chuck P2 to the holding structure P4 by the L-shaped holder P44.
第4A圖至第4D圖繪示本發明一實施例之電激發光顯示裝置的製程剖面圖。第5A圖至第5D圖繪示第4A圖至第4D圖之基板的下視圖,且第4A圖至第4D圖係繪示第5A圖至第5D圖中沿I-I’線段的剖面圖。4A to 4D are cross-sectional views showing processes of an electroluminescent display device according to an embodiment of the present invention. 5A to 5D are lower views of the substrate of FIGS. 4A to 4D, and FIGS. 4A to 4D are cross-sectional views taken along line I-I' of FIGS. 5A to 5D. .
本實施例相似於前述第1A圖至第1D圖的實施例,兩者主要的差別在於本實施例是利用機械手臂使陰影罩幕單元與基板對位。This embodiment is similar to the foregoing embodiments of FIGS. 1A to 1D. The main difference between the two is that the present embodiment uses a mechanical arm to align the shadow mask unit with the substrate.
值得注意的是,本實施例之元件相似於第1A圖至第1D圖的元件,因此,在本實施例中的元件的標號與第1A圖至第1D圖的元件相同者,代表兩者的材質、結構相似,於此不再贅述。It is to be noted that the elements of the present embodiment are similar to the elements of FIGS. 1A to 1D, and therefore, the elements of the present embodiment have the same reference numerals as those of the first to third figures, representing both. The materials and structures are similar and will not be described here.
請同時參照第4A圖與第5A圖,提供一基板110。接著,在基板110的第一側112上配置一磁性元件410,磁性元件410例如為一永久磁鐵元件。在一實施例中,磁性元件410可為多個彼此分離的永久磁鐵412,且這些永久磁鐵412可分別位於基板110的固定區F1、F2、F3、F4、F5、F6、F7、F8中(其配置方式類似第3A圖中的電磁鐵E1、E2、E3、E4、E5、E6、E7、E8的配置方式)。Please refer to FIG. 4A and FIG. 5A simultaneously to provide a substrate 110. Next, a magnetic element 410 is disposed on the first side 112 of the substrate 110, and the magnetic element 410 is, for example, a permanent magnet element. In an embodiment, the magnetic element 410 can be a plurality of permanent magnets 412 separated from each other, and the permanent magnets 412 can be respectively located in the fixed areas F1, F2, F3, F4, F5, F6, F7, F8 of the substrate 110 ( The arrangement is similar to that of the electromagnets E1, E2, E3, E4, E5, E6, E7, and E8 in Fig. 3A).
在另一實施例中,磁性元件410可為一連續的永久磁鐵層,其可覆蓋第一側112的固定區F1、F2、F3、F4、F5、F6、F7、F8。在一實施例中,磁性元件410可為一電磁鐵元件。In another embodiment, the magnetic element 410 can be a continuous layer of permanent magnets that can cover the fixed areas F1, F2, F3, F4, F5, F6, F7, F8 of the first side 112. In an embodiment, the magnetic element 410 can be an electromagnet element.
接著,將一陰影罩幕單元S1置於一機械手臂420上,並藉由機械手臂420使陰影罩幕單元S1與基板110的第二側114對位,以使陰影罩幕單元S1對齊固定區F1。之後,藉由磁性元件410的磁力將陰影罩幕單元S1吸引至基板110的固定區F1中,並貼合基板110的第二側114。Next, a shadow mask unit S1 is placed on a robot arm 420, and the shadow mask unit S1 is aligned with the second side 114 of the substrate 110 by the robot arm 420 to align the shadow mask unit S1 with the fixed area. F1. Thereafter, the shadow mask unit S1 is attracted to the fixed area F1 of the substrate 110 by the magnetic force of the magnetic element 410, and is bonded to the second side 114 of the substrate 110.
然後,請同時參照第4B圖與第5B圖,將一陰影罩幕單元S2置於機械手臂420上,並藉由機械手臂420使陰影罩幕單元S2與基板110的第二側114對位,以使陰影罩幕單元S2對齊固定區F2。之後,藉由磁性元件410的磁力將陰影罩幕單元S2吸引至基板110的固定區F2中,並貼合基板110的第二側114。Then, referring to FIG. 4B and FIG. 5B simultaneously, a shadow mask unit S2 is placed on the robot arm 420, and the shadow mask unit S2 is aligned with the second side 114 of the substrate 110 by the robot arm 420. In order to align the shadow mask unit S2 with the fixed area F2. Thereafter, the shadow mask unit S2 is attracted to the fixed area F2 of the substrate 110 by the magnetic force of the magnetic member 410, and is bonded to the second side 114 of the substrate 110.
之後,請同時參照第4C圖與第5C圖,以相同的方式分別將陰影罩幕單元S3、S4、S5、S6、S7、S8貼合至基板110的固定區F3、F4、F5、F6、F7、F8中。此時,貼合基板110的陰影罩幕單元S1、S2、S3、S4、S5、S6、S7、S8構成一陰影罩幕S,陰影罩幕S具有一暴露出基板110的開口圖案OP。Thereafter, referring to FIG. 4C and FIG. 5C simultaneously, the shadow mask units S3, S4, S5, S6, S7, and S8 are respectively attached to the fixed areas F3, F4, F5, and F6 of the substrate 110, in the same manner. F7, F8. At this time, the shadow mask units S1, S2, S3, S4, S5, S6, S7, S8 of the bonding substrate 110 constitute a shadow mask S having an opening pattern OP exposing the substrate 110.
然後,以一鍍膜源P3對基板110的第二側114進行一沉積製程(例如蒸鍍製程),以於陰影罩幕S的開口圖案OP中沉積一圖案化電激發光層140(如第4D圖所示)。Then, a deposition process (for example, an evaporation process) is performed on the second side 114 of the substrate 110 by using a plating source P3 to deposit a patterned electroluminescent layer 140 in the opening pattern OP of the shadow mask S (eg, 4D). Figure shows).
之後,請同時參照第4D圖與第5D圖,移除陰影罩幕S,以使陰影罩幕S落至基板110下方的機械手臂420上。當磁性元件410為永久磁鐵時,移除陰影罩幕S的方法可為自基板110上移除磁性元件410。另外,當磁性元件410為電磁鐵時,移除陰影罩幕S的方法可為使磁性元件410的磁力消失。Thereafter, please refer to FIGS. 4D and 5D simultaneously, and remove the shadow mask S so that the shadow mask S falls onto the robot arm 420 below the substrate 110. When the magnetic element 410 is a permanent magnet, the method of removing the shadow mask S may be to remove the magnetic element 410 from the substrate 110. In addition, when the magnetic element 410 is an electromagnet, the method of removing the shadow mask S may be to make the magnetic force of the magnetic element 410 disappear.
第6A圖至第6F圖繪示本發明一實施例之電激發光顯示裝置的製程剖面圖。第7A圖至第7C圖繪示第6A圖至第6C圖之基板的上視圖,第7D圖至第7F圖繪示第6D圖至第6F圖之基板的下視圖,且第6A圖至第6F圖係繪示第7A圖至第7F圖中沿I-I’線段的剖面圖。6A to 6F are cross-sectional views showing processes of an electroluminescence display device according to an embodiment of the present invention. 7A to 7C are top views of the substrate of FIGS. 6A to 6C, and FIGS. 7D to 7F are lower views of the substrate of FIGS. 6D to 6F, and FIG. 6A to FIG. The 6F diagram shows a cross-sectional view along line I-I' in the 7A to 7F drawings.
本實施例相似於前述第4A圖至第4D圖的實施例,兩者主要的差別在於本實施例是在蒸鍍腔體外利用機械手臂將多個陰影罩幕單元組裝在基板上以形成一由基板、陰影罩幕單元、以及磁性元件所構成的組合體,並以機械手臂將組合體移入蒸鍍腔體,並待蒸鍍製程結束後以機械手臂將組合體移出蒸鍍腔體。This embodiment is similar to the foregoing embodiments of FIGS. 4A to 4D. The main difference between the two is that the present embodiment uses a robotic arm to assemble a plurality of shadow mask units on the substrate outside the evaporation chamber to form a A combination of a substrate, a shadow mask unit, and a magnetic element, and the assembly is moved into the vapor deposition chamber by a robot arm, and the assembly is removed from the evaporation chamber by a robot arm after the vapor deposition process is completed.
值得注意的是,本實施例之元件相似於第1A圖至第1D圖以及第4A圖至第4D圖的元件,因此,在本實施例中的元件的標號與第1A圖至第1D圖以及第4A圖至第4D圖的元件相同者,代表兩者的材質、結構相似,於此不再贅述。It is to be noted that the elements of the present embodiment are similar to the elements of FIGS. 1A to 1D and FIGS. 4A to 4D, and therefore, the labels of the elements in the present embodiment and FIGS. 1A to 1D and The components of FIGS. 4A to 4D are the same, and the materials and structures of the two are similar, and will not be described herein.
請同時參照第6A圖與第7A圖,在蒸鍍腔體外,提供一基板110,並將一陰影罩幕單元S1置於一機械手臂610上,以藉由機械手臂610將陰影罩幕單元S1移至基板110上方並與第二側114的固定區F1對位後,放置於第二側114的固定區F1中。Referring to FIG. 6A and FIG. 7A simultaneously, a substrate 110 is provided outside the evaporation chamber, and a shadow mask unit S1 is placed on a robot arm 610 to shield the shadow mask unit S1 by the robot arm 610. After being moved over the substrate 110 and aligned with the fixed area F1 of the second side 114, it is placed in the fixed area F1 of the second side 114.
接著,請同時參照第6B圖與第7B圖,將一陰影罩幕單元S2置於機械手臂610上,以藉由機械手臂610將陰影罩幕單元S2移至基板110上方並與第二側114的固定區F2對位後,放置於第二側114的固定區F2中。Next, please refer to FIG. 6B and FIG. 7B simultaneously, and place a shadow mask unit S2 on the robot arm 610 to move the shadow mask unit S2 to the upper side of the substrate 110 and the second side 114 by the robot arm 610. After the fixed area F2 is aligned, it is placed in the fixed area F2 of the second side 114.
然後,請同時參照第6C圖與第7C圖,以相同的方式分別將陰影罩幕單元S3、S4、S5、S6、S7、S8放置於基板110的固定區F3、F4、F5、F6、F7、F8中。然後,於基板110的第一側112上配置磁性元件620,以使已配置於第二側114上的陰影罩幕單元S1、S2、S3、S4、S5、S6、S7、S8貼合基板110。Then, referring to FIG. 6C and FIG. 7C at the same time, the shadow mask units S3, S4, S5, S6, S7, and S8 are respectively placed in the fixed areas F3, F4, F5, F6, and F7 of the substrate 110 in the same manner. , F8. Then, the magnetic element 620 is disposed on the first side 112 of the substrate 110 such that the shadow mask units S1, S2, S3, S4, S5, S6, S7, S8 disposed on the second side 114 are bonded to the substrate 110. .
此時,貼合基板110的陰影罩幕單元S1、S2、S3、S4、S5、S6、S7、S8構成一陰影罩幕S,陰影罩幕S具有一暴露出基板110的開口圖案OP,且基板110、磁性元件620、以及陰影罩幕S構成一組合體630。At this time, the shadow mask units S1, S2, S3, S4, S5, S6, S7, S8 of the bonding substrate 110 constitute a shadow mask S having an opening pattern OP exposing the substrate 110, and The substrate 110, the magnetic element 620, and the shadow mask S constitute an assembly 630.
之後,請同時參照第6D圖與第7D圖,翻覆組合體630以使陰影罩幕S朝向下方,並將組合體630置於機械手臂610上,以藉由機械手臂610將組合體630移至蒸鍍腔體642中(如第6E圖所示)。Thereafter, referring to FIG. 6D and FIG. 7D simultaneously, flipping the assembly 630 to face the shadow mask S downward, and placing the assembly 630 on the robot arm 610 to move the assembly 630 by the robot arm 610 to The chamber 642 is vapor-deposited (as shown in Fig. 6E).
接著,請同時參照第6E圖與第7E圖,利用蒸鍍腔體642中的一蒸發源644對基板110的第二側114進行蒸鍍製程,以於陰影罩幕S的開口圖案OP中蒸鍍一圖案化電激發光層140(如第6F圖所示)。Next, referring to FIG. 6E and FIG. 7E, the second side 114 of the substrate 110 is vapor-deposited by an evaporation source 644 in the evaporation chamber 642 to be steamed in the opening pattern OP of the shadow mask S. A patterned electroluminescent layer 140 is plated (as shown in Figure 6F).
之後,請同時參照第6F圖與第7F圖,將組合體630連同鍍於其上的圖案化電激發光層140置於機械手臂610上,以藉由機械手臂610將組合體630移至蒸鍍腔體642外。Thereafter, referring to FIG. 6F and FIG. 7F, the assembly 630 and the patterned electroluminescent layer 140 plated thereon are placed on the robot arm 610 to move the assembly 630 to the steam by the robot arm 610. The plating chamber 642 is outside.
然後,移除陰影罩幕S,第7F圖係繪示移除陰影罩幕S後的基板110的下視圖。在一實施例中,磁性元件620可為一永久磁鐵元件,且移除陰影罩幕S的方法可為自基板110移除永久磁鐵元件。Then, the shadow mask S is removed, and the 7F is a bottom view of the substrate 110 after the shadow mask S is removed. In an embodiment, the magnetic element 620 can be a permanent magnet element, and the method of removing the shadow mask S can be to remove the permanent magnet element from the substrate 110.
此外,雖然前述實施例皆是以磁力固定陰影罩幕單元,但是本發明並不以此為限,在其他實施例中,也可以以夾具固定陰影罩幕單元。In addition, although the foregoing embodiments all use a magnetic force to fix the shadow mask unit, the present invention is not limited thereto. In other embodiments, the shadow mask unit may also be fixed by a clamp.
第8圖繪示本發明一實施例之多個陰影罩幕單元的上視圖。在一實施例中,如第8圖所示,將多個陰影罩幕單元810配置於一基板110上。每個陰影罩幕單元810的單元開口圖案812係分別對應一個電激發光顯示裝置(例如小尺寸的顯示面板)的電激發光層的圖案。也就是說,可利用一個陰影罩幕單元810定義出一個電激發光顯示裝置的電激發光層的圖案。因此,可利用配置於基板110上的多個陰影罩幕單元810在基板110上同時定義出多個電激發光顯示裝置的電激發光層的圖案。Figure 8 is a top plan view of a plurality of shadow mask units in accordance with an embodiment of the present invention. In one embodiment, as shown in FIG. 8, a plurality of shadow mask units 810 are disposed on a substrate 110. The unit opening pattern 812 of each of the shadow mask units 810 corresponds to a pattern of an electroluminescent layer of an electroluminescent display device (for example, a small-sized display panel). That is, a shadow mask unit 810 can be utilized to define a pattern of electroluminescent layers of an electroluminescent display device. Therefore, the patterns of the electroluminescent layers of the plurality of electroluminescent display devices can be simultaneously defined on the substrate 110 by using the plurality of shadow mask units 810 disposed on the substrate 110.
第9圖繪示本發明一實施例之多個陰影罩幕單元的上視圖。在一實施例中,如第9圖所示,將多個陰影罩幕單元910配置於一基板110上。每個陰影罩幕單元910的單元開口圖案912係分別對應一個電激發光顯示裝置(例如大尺寸的顯示面板)的部分電激發光層的圖案。因此,可藉由排列這些陰影罩幕單元910的單元開口圖案912以使其構成一個電激發光顯示裝置上所有電激發光層的圖案。如此一來,可利用這些陰影罩幕單元910在基板110上定義出單一個電激發光顯示裝置上所有電激發光層的圖案。Figure 9 is a top plan view of a plurality of shadow mask units in accordance with an embodiment of the present invention. In one embodiment, as shown in FIG. 9, a plurality of shadow mask units 910 are disposed on a substrate 110. The unit opening pattern 912 of each of the shadow mask units 910 corresponds to a pattern of a portion of the electroluminescent layer of an electroluminescent display device (eg, a large-sized display panel). Therefore, the cell opening patterns 912 of the shadow mask units 910 can be arranged to form a pattern of all of the electroluminescent layers on the electroluminescent display device. In this way, the shadow mask unit 910 can be used to define a pattern of all electroluminescent layers on a single electroluminescent display device on the substrate 110.
第10A圖繪示本發明一實施例之陰影罩幕單元的上視圖。第10B圖繪示第10A圖之陰影罩幕單元沿I-I’線段的剖面圖。在一實施例中,如第10A圖與第10B圖所示,陰影罩幕單元1010具有一金屬薄膜1012以及一單元框架1014,其中金屬薄膜1012具有一單元開口圖案1012a,且單元框架1014位於金屬薄膜1012的周邊區1012b。FIG. 10A is a top view of a shadow mask unit according to an embodiment of the present invention. Figure 10B is a cross-sectional view of the shadow mask unit of Figure 10A taken along line I-I'. In an embodiment, as shown in FIGS. 10A and 10B, the shadow mask unit 1010 has a metal film 1012 and a unit frame 1014, wherein the metal film 1012 has a unit opening pattern 1012a, and the unit frame 1014 is located in the metal. The peripheral region 1012b of the film 1012.
單元框架1014例如以焊接或膠合的方式與金屬薄膜1012接合,單元框架1014係用以提供金屬薄膜1012張力,以維持金屬薄膜1012的平整度。單元框架1014的厚度T1例如為0.2毫米~1毫米。金屬薄膜1012的厚度T2例如為0.03毫米~0.05毫米。單元框架1014的厚度T1例如為金屬薄膜1012的厚度T2的6~20倍。單元框架1014的材質例如為金屬。The unit frame 1014 is joined to the metal film 1012, for example, by soldering or gluing, and the unit frame 1014 is used to provide tension of the metal film 1012 to maintain the flatness of the metal film 1012. The thickness T1 of the unit frame 1014 is, for example, 0.2 mm to 1 mm. The thickness T2 of the metal thin film 1012 is, for example, 0.03 mm to 0.05 mm. The thickness T1 of the unit frame 1014 is, for example, 6 to 20 times the thickness T2 of the metal thin film 1012. The material of the unit frame 1014 is, for example, metal.
綜上所述,本發明係用多個小片的陰影罩幕單元取代習知的大型陰影罩幕作為蒸鍍罩幕,因此,只需將這些小片的陰影罩幕單元一一對位並以磁力將其吸附在基板上以構成一蒸鍍罩幕即可,而無需使用習知的大型框架以及大片金屬薄膜。如此一來,本發明的製程較為容易、金屬薄膜原料取得容易、且製作成本較低。In summary, the present invention replaces a conventional large shadow mask with a plurality of small-sized shadow mask units as an evaporation mask, so that the shadow mask units of the small pieces need only be paired and magnetically It can be adsorbed on a substrate to form an evaporation mask without using a conventional large frame and a large metal film. In this way, the process of the present invention is relatively easy, the metal film raw material is easy to obtain, and the manufacturing cost is low.
本發明雖以較佳實施例揭露如上,然其並非用以限定本發明的範圍,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可做些許的更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。The present invention has been disclosed in the above preferred embodiments, and is not intended to limit the scope of the present invention. Any one of ordinary skill in the art can make a few changes without departing from the spirit and scope of the invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims.
110...基板110. . . Substrate
112...第一側112. . . First side
114...第二側114. . . Second side
120、410、620...磁性元件120, 410, 620. . . Magnetic component
130...載具130. . . vehicle
140...圖案化電激發光層140. . . Patterned electroluminescent layer
412...永久磁鐵412. . . permanent magnet
420、610...機械手臂420, 610. . . Mechanical arm
630...組合體630. . . Combination
642...蒸鍍腔體642. . . Evaporation chamber
644...蒸發源644. . . Evaporation source
810、910、1010、S1、S2、S3、S4、S5、S6、S7、S8...陰影罩幕單元810, 910, 1010, S1, S2, S3, S4, S5, S6, S7, S8. . . Shadow mask unit
812、912、1012a...單元開口圖案812, 912, 1012a. . . Unit opening pattern
1012...金屬薄膜1012. . . Metal film
1012b...周邊區1012b. . . Surrounding area
1014...單元框架1014. . . Unit frame
E1、E2、E3、E4、E5、E6、E7、E8...電磁鐵E1, E2, E3, E4, E5, E6, E7, E8. . . Electromagnet
F1、F2、F3、F4、F5、F6、F7、F8...固定區F1, F2, F3, F4, F5, F6, F7, F8. . . Fixed area
OP...開口圖案OP. . . Opening pattern
P...鍍膜機台P. . . Coating machine
P1...鍍膜腔體P1. . . Coating cavity
P2...磁性吸盤P2. . . Magnetic chuck
P21...固定裝置P21. . . Fixtures
P21a...上蓋P21a. . . Upper cover
P21b...下蓋P21b. . . lower lid
P3...鍍膜源P3. . . Coating source
P4...固持結構P4. . . Holding structure
P44...L型固持件P44. . . L-shaped retaining member
S...陰影罩幕S. . . Shadow mask
T1、T2...厚度T1, T2. . . thickness
第1A圖至第1D圖繪示本發明一實施例之電激發光顯示裝置的製程剖面圖。1A to 1D are cross-sectional views showing processes of an electroluminescence display device according to an embodiment of the present invention.
第2A圖至第2D圖繪示第1A圖至第1D圖之基板的下視圖,且第1A圖至第1D圖係繪示第2A圖至第2D圖中沿I-I’線段的剖面圖。2A to 2D are lower views of the substrate of FIGS. 1A to 1D, and FIGS. 1A to 1D are cross-sectional views taken along line II' of FIGS. 2A to 2D. .
第3A圖與第3B圖繪示第1A圖至第1B圖之基板與電磁鐵的上視圖。3A and 3B are top views of the substrate and the electromagnet of FIGS. 1A to 1B.
第4A圖至第4D圖繪示本發明一實施例之電激發光顯示裝置的製程剖面圖。4A to 4D are cross-sectional views showing processes of an electroluminescent display device according to an embodiment of the present invention.
第5A圖至第5D圖繪示第4A圖至第4D圖之基板的下視圖,且第4A圖至第4D圖係繪示第5A圖至第5D圖中沿I-I’線段的剖面圖。5A to 5D are lower views of the substrate of FIGS. 4A to 4D, and FIGS. 4A to 4D are cross-sectional views taken along line I-I' of FIGS. 5A to 5D. .
第6A圖至第6F圖繪示本發明一實施例之電激發光顯示裝置的製程剖面圖。6A to 6F are cross-sectional views showing processes of an electroluminescence display device according to an embodiment of the present invention.
第7A圖至第7C圖繪示第6A圖至第6C圖之基板的上視圖,第7D圖至第7F圖繪示第6D圖至第6F圖之基板的下視圖,且第6A圖至第6F圖係繪示第7A圖至第7F圖中沿I-I’線段的剖面圖。7A to 7C are top views of the substrate of FIGS. 6A to 6C, and FIGS. 7D to 7F are lower views of the substrate of FIGS. 6D to 6F, and FIG. 6A to FIG. The 6F diagram shows a cross-sectional view along line I-I' in the 7A to 7F drawings.
第8圖繪示本發明一實施例之多個陰影罩幕單元的上視圖。Figure 8 is a top plan view of a plurality of shadow mask units in accordance with an embodiment of the present invention.
第9圖繪示本發明一實施例之多個陰影罩幕單元的上視圖。Figure 9 is a top plan view of a plurality of shadow mask units in accordance with an embodiment of the present invention.
第10A圖繪示本發明一實施例之陰影罩幕單元的上視圖。FIG. 10A is a top view of a shadow mask unit according to an embodiment of the present invention.
第10B圖繪示第10A圖之陰影罩幕單元沿I-I’線段的剖面圖。Figure 10B is a cross-sectional view of the shadow mask unit of Figure 10A taken along line I-I'.
第11A圖與第11B圖繪示本發明一實施例之固定裝置的製作流程圖。11A and 11B are flow charts showing the fabrication of a fixing device according to an embodiment of the present invention.
第12A圖與第12B圖繪示本發明一實施例之將磁性吸盤安裝於固持結構上的製程正視圖。12A and 12B are elevational views showing a process of mounting a magnetic chuck on a holding structure according to an embodiment of the present invention.
第13A圖與第13B圖繪示第12A圖與第12B圖的側視圖。13A and 13B are side views of the 12A and 12B drawings.
110...基板110. . . Substrate
112...第一側112. . . First side
114...第二側114. . . Second side
120...磁性元件120. . . Magnetic component
130...載具130. . . vehicle
S1、S2、S3、S4...陰影罩幕單元S1, S2, S3, S4. . . Shadow mask unit
E1、E2、E3、E4...電磁鐵E1, E2, E3, E4. . . Electromagnet
F1、F2、F3、F4...固定區F1, F2, F3, F4. . . Fixed area
P1...鍍膜腔體P1. . . Coating cavity
P2...磁性吸盤P2. . . Magnetic chuck
P21...固定裝置P21. . . Fixtures
P21a...上蓋P21a. . . Upper cover
P21b...下蓋P21b. . . lower lid
P3...鍍膜源P3. . . Coating source
P4...固持結構P4. . . Holding structure
P44...L型固持件。P44. . . L-shaped holder.
Claims (15)
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TW569306B (en) * | 2001-06-27 | 2004-01-01 | Eastman Kodak Co | Alignment device which facilitates deposition of organic material through a deposition mask |
TW200420735A (en) * | 2002-12-03 | 2004-10-16 | Seiko Epson Corp | Mask vapor deposition method, mask vapor deposition system, mask, process for manufacturing mask, apparatus for manufacturing display panel, display panel, and electronic device |
TW200537982A (en) * | 2004-05-06 | 2005-11-16 | Au Optronics Corp | A divided shadow mask device for fabricating organic light emitting diode display |
TW200600877A (en) * | 2004-06-25 | 2006-01-01 | Chi Mei Optoelectronics Corp | Method of manufacturing a display by mask alignment |
TW200637930A (en) * | 2005-03-24 | 2006-11-01 | Mitsui Shipbuilding Eng | Film forming device, film forming method, and method of producing organic el element |
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TW569306B (en) * | 2001-06-27 | 2004-01-01 | Eastman Kodak Co | Alignment device which facilitates deposition of organic material through a deposition mask |
TW200420735A (en) * | 2002-12-03 | 2004-10-16 | Seiko Epson Corp | Mask vapor deposition method, mask vapor deposition system, mask, process for manufacturing mask, apparatus for manufacturing display panel, display panel, and electronic device |
TW200537982A (en) * | 2004-05-06 | 2005-11-16 | Au Optronics Corp | A divided shadow mask device for fabricating organic light emitting diode display |
TW200600877A (en) * | 2004-06-25 | 2006-01-01 | Chi Mei Optoelectronics Corp | Method of manufacturing a display by mask alignment |
TW200637930A (en) * | 2005-03-24 | 2006-11-01 | Mitsui Shipbuilding Eng | Film forming device, film forming method, and method of producing organic el element |
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