KR20120038511A - 조명 수단을 제조하기 위한 방법 그리고 조명 수단 - Google Patents

조명 수단을 제조하기 위한 방법 그리고 조명 수단 Download PDF

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Publication number
KR20120038511A
KR20120038511A KR1020127004430A KR20127004430A KR20120038511A KR 20120038511 A KR20120038511 A KR 20120038511A KR 1020127004430 A KR1020127004430 A KR 1020127004430A KR 20127004430 A KR20127004430 A KR 20127004430A KR 20120038511 A KR20120038511 A KR 20120038511A
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KR
South Korea
Prior art keywords
light emitting
lighting means
semiconductor bodies
carrier
semiconductor
Prior art date
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KR1020127004430A
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English (en)
Korean (ko)
Inventor
베어트홀트 한
마르쿠스 마우테
지크프리트 헤르만
Original Assignee
오스람 옵토 세미컨덕터스 게엠베하
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Application filed by 오스람 옵토 세미컨덕터스 게엠베하 filed Critical 오스람 옵토 세미컨덕터스 게엠베하
Publication of KR20120038511A publication Critical patent/KR20120038511A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/01—Manufacture or treatment
    • H10H29/036—Manufacture or treatment of packages
    • H10H29/0364—Manufacture or treatment of packages of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/01—Manufacture or treatment
    • H10H29/036—Manufacture or treatment of packages
    • H10H29/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
KR1020127004430A 2009-07-20 2010-07-16 조명 수단을 제조하기 위한 방법 그리고 조명 수단 Withdrawn KR20120038511A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009033915.9 2009-07-20
DE102009033915.9A DE102009033915B4 (de) 2009-07-20 2009-07-20 Verfahren zur Herstellung eines Leuchtmittels und Leuchtmittel

Publications (1)

Publication Number Publication Date
KR20120038511A true KR20120038511A (ko) 2012-04-23

Family

ID=43016842

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127004430A Withdrawn KR20120038511A (ko) 2009-07-20 2010-07-16 조명 수단을 제조하기 위한 방법 그리고 조명 수단

Country Status (6)

Country Link
EP (1) EP2457254B1 (https=)
JP (1) JP5813636B2 (https=)
KR (1) KR20120038511A (https=)
CN (1) CN102473704A (https=)
DE (1) DE102009033915B4 (https=)
WO (1) WO2011009821A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200062762A (ko) * 2018-11-27 2020-06-04 삼성전자주식회사 마이크로 광원 어레이, 이를 포함한 디스플레이 장치 및 디스플레이 장치의 제조 방법

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012202928A1 (de) * 2012-02-27 2013-08-29 Osram Gmbh Lichtquelle mit led-chip und leuchtstoffschicht
DE102013205179A1 (de) 2013-03-25 2014-09-25 Osram Gmbh Verfahren zum Herstellen einer elektromagnetische Strahlung emittierenden Baugruppe und elektromagnetische Strahlung emittierende Baugruppe
GB201413578D0 (en) * 2014-07-31 2014-09-17 Infiniled Ltd A colour iled display on silicon

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5940683A (en) * 1996-01-18 1999-08-17 Motorola, Inc. LED display packaging with substrate removal and method of fabrication
JP3473396B2 (ja) * 1998-04-23 2003-12-02 松下電器産業株式会社 光情報処理装置
EP0977063A1 (en) * 1998-07-28 2000-02-02 Interuniversitair Micro-Elektronica Centrum Vzw A socket and a system for optoelectronic interconnection and a method of fabricating such socket and system
JP3652945B2 (ja) * 1999-12-28 2005-05-25 松下電器産業株式会社 光情報処理装置
JP4182661B2 (ja) * 2001-10-31 2008-11-19 ソニー株式会社 画像表示装置及びその製造方法
JP2005093649A (ja) * 2003-09-17 2005-04-07 Oki Data Corp 半導体複合装置、ｌｅｄプリントヘッド、及び、それを用いた画像形成装置
US7294961B2 (en) * 2004-03-29 2007-11-13 Articulated Technologies, Llc Photo-radiation source provided with emissive particles dispersed in a charge-transport matrix
CN1622730A (zh) * 2004-12-16 2005-06-01 新磊微制造股份有限公司 发光模块
TWI420691B (zh) * 2006-11-20 2013-12-21 尼康股份有限公司 Ｌｅｄ裝置及其製造方法
DE102007010244A1 (de) * 2007-02-02 2008-08-07 Osram Opto Semiconductors Gmbh Anordnung und Verfahren zur Erzeugung von Mischlicht
JP2008262993A (ja) * 2007-04-10 2008-10-30 Nikon Corp 表示装置
EP1988577B1 (en) * 2007-04-30 2017-04-05 Tridonic Jennersdorf GmbH Light emitting diode module with silicon platform

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200062762A (ko) * 2018-11-27 2020-06-04 삼성전자주식회사 마이크로 광원 어레이, 이를 포함한 디스플레이 장치 및 디스플레이 장치의 제조 방법

Also Published As

Publication number Publication date
DE102009033915B4 (de) 2022-05-25
WO2011009821A1 (de) 2011-01-27
EP2457254B1 (de) 2020-03-18
JP5813636B2 (ja) 2015-11-17
JP2012533895A (ja) 2012-12-27
DE102009033915A1 (de) 2011-01-27
CN102473704A (zh) 2012-05-23
EP2457254A1 (de) 2012-05-30

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