KR20120031224A - 인광 변환 적외선 ｌｅｄ - Google Patents

인광 변환 적외선 ｌｅｄ Download PDF

Info

Publication number
KR20120031224A
KR20120031224A KR1020127001032A KR20127001032A KR20120031224A KR 20120031224 A KR20120031224 A KR 20120031224A KR 1020127001032 A KR1020127001032 A KR 1020127001032A KR 20127001032 A KR20127001032 A KR 20127001032A KR 20120031224 A KR20120031224 A KR 20120031224A
Authority
KR
South Korea
Prior art keywords
light
phosphor
light source
infrared
rare earth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020127001032A
Other languages
English (en)
Korean (ko)
Inventor
윌리암 로스 라포포트
제임스 케인
기린 티. 카스테리노
Original Assignee
허니웰 인터내셔널 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 허니웰 인터내셔널 인코포레이티드 filed Critical 허니웰 인터내셔널 인코포레이티드
Publication of KR20120031224A publication Critical patent/KR20120031224A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18165—Exposing the passive side of the semiconductor or solid-state body of a wire bonded chip

Landscapes

  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
  • Respiratory Apparatuses And Protective Means (AREA)
KR1020127001032A 2009-06-19 2010-06-15 인광 변환 적외선 ｌｅｄ Ceased KR20120031224A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US21853109P 2009-06-19 2009-06-19
US61/218,531 2009-06-19
US12/791,021 2010-06-01
US12/791,021 US8426871B2 (en) 2009-06-19 2010-06-01 Phosphor converting IR LEDs

Publications (1)

Publication Number Publication Date
KR20120031224A true KR20120031224A (ko) 2012-03-30

Family

ID=43353489

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127001032A Ceased KR20120031224A (ko) 2009-06-19 2010-06-15 인광 변환 적외선 ｌｅｄ

Country Status (6)

Country Link
US (2) US8426871B2 (enExample)
EP (1) EP2443676A4 (enExample)
JP (1) JP2012531043A (enExample)
KR (1) KR20120031224A (enExample)
CN (1) CN102804423A (enExample)
WO (1) WO2010147925A2 (enExample)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI396310B (zh) * 2009-10-02 2013-05-11 億光電子工業股份有限公司 發光二極體結構
US8975806B2 (en) * 2010-08-31 2015-03-10 Toshiba Lighting & Technology Corporation Bulb-type lamp
US10286088B2 (en) 2011-05-05 2019-05-14 Rutgers, The State University Of New Jersey Multifunctional infrared-emitting composites
DE102011113963A1 (de) * 2011-09-21 2013-03-21 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement
SG2012068508A (en) * 2012-09-13 2014-04-28 Schneider Electric South East Asia Hq Pte Ltd A relay and a method for indicating a relay failure
DK2943056T3 (da) 2013-01-11 2017-11-06 Philips Lighting Holding Bv Havebrugsbelysningsanordning og fremgangsmåde til at stimulere en plantes plantevækst og biorytme
DE102013106573B4 (de) * 2013-06-24 2021-12-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlungsemittierendes optoelektronisches Bauelement, Gassensor mit strahlungsemittierenden optoelektronischen Bauelement und Verfahren zur Herstellung eines strahlungsemittierenden optoelektronischen Bauelements
DE102014107321B4 (de) 2014-05-23 2019-06-27 Tailorlux Gmbh Infrarot LED
DE102014112681A1 (de) 2014-09-03 2016-03-03 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil und Blitzlicht
WO2016054764A1 (en) * 2014-10-08 2016-04-14 GE Lighting Solutions, LLC Materials and optical components for color filtering in lighting apparatus
DE102015104237B4 (de) 2015-03-20 2022-10-06 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement
DE102015106757A1 (de) * 2015-04-30 2016-11-03 Osram Opto Semiconductors Gmbh Strahlungsemittierendes optoelektronisches Bauelement
CN105078411B (zh) * 2015-06-18 2017-11-24 京东方光科技有限公司 游泳穿戴设备及上肢穿戴设备
DE102015114661A1 (de) * 2015-09-02 2017-03-02 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils
CN105280774A (zh) * 2015-09-18 2016-01-27 华灿光电(苏州）有限公司 一种白光发光二极管及其制作方法
US10303246B2 (en) * 2016-01-20 2019-05-28 North Inc. Systems, devices, and methods for proximity-based eye tracking
EP3444231A4 (en) * 2016-04-15 2019-11-13 Koito Manufacturing Co., Ltd. NANO COMPOSITE AND NANOCOMPOSITE PRODUCTION METHOD
CN206218163U (zh) * 2016-10-11 2017-06-06 深圳市其真实业有限公司 智能充气游泳衣
US10679975B2 (en) * 2016-11-17 2020-06-09 Signify Holding B.V. Lighting device with UV LED
JP7088027B2 (ja) * 2017-01-31 2022-06-21 三菱ケミカル株式会社 発光装置、および蛍光体
EP3457444A1 (en) * 2017-09-19 2019-03-20 ams AG Phosphor-converted light-emitting device
CN109964324B (zh) * 2017-09-28 2021-11-12 亮锐控股有限公司 红外发射器件
CN110155276A (zh) * 2018-02-05 2019-08-23 青海新东联信息技术有限公司 一种防溺水自动救援装置
US11417806B2 (en) * 2018-07-30 2022-08-16 Lumileds Llc Dielectric mirror for broadband IR LEDs
CN109148672A (zh) * 2018-08-10 2019-01-04 国红（深圳）光电科技有限公司 一种近红外光学装置
DE112019004254B4 (de) 2018-09-28 2022-06-15 Ngk Insulators, Ltd. Leuchtstoffelement, verfahren zu dessen herstellung und beleuchtungsvorrichtung
US11262046B2 (en) * 2019-03-27 2022-03-01 Ngk Insulators, Ltd. Phosphor element, method for producing same, and lighting device
DE102019115351A1 (de) 2019-06-06 2020-12-10 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterbauelement mit Strahlungskonversionselement und Verfahren zum Herstellen von Strahlungskonversionselementen
JP7323787B2 (ja) * 2019-07-31 2023-08-09 日亜化学工業株式会社 照明装置及び赤外線カメラ付き照明装置
EP3800675B1 (en) * 2019-10-01 2024-01-24 Lumileds LLC Swir pcled and phosphors emitting in the 1100 - 1700 nm range
KR20220094291A (ko) 2020-12-28 2022-07-06 삼성전자주식회사 Led 모듈 및 조명 장치
US12325815B2 (en) * 2021-08-20 2025-06-10 Lumileds Llc Phosphor compositions and short wavelength infrared emitting pcLEDs emitting in the 1600-2200 nm wavelength range
US11809839B2 (en) 2022-01-18 2023-11-07 Robert Lyden Computer language and code for application development and electronic and optical communication
WO2024208701A1 (en) * 2023-04-04 2024-10-10 Ams-Osram International Gmbh Optoelectronic component, method for producing an optoelectronic component, and use of an optoelectronic component

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3757147A (en) * 1971-05-18 1973-09-04 Cambridge Thermionic Corp Stepping motor
US3757174A (en) 1972-07-31 1973-09-04 Sharp Kk Light emitting four layer semiconductor
JPS512393A (enExample) * 1974-06-24 1976-01-09 Hitachi Ltd
US4176418A (en) * 1977-11-14 1979-12-04 Scott Lawrence S Apparatus for automatic inflation of diver flotation means
DE3379525D1 (en) * 1982-12-27 1989-05-03 Mitsubishi Monsanto Chem Epitaxial wafer for use in the production of an infrared led
JP2770708B2 (ja) * 1992-06-30 1998-07-02 日亜化学工業株式会社 赤色ないし赤外発光蛍光体及びこれを用いた液晶ライトバルブｃｒｔ
DE19638667C2 (de) * 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
TW383508B (en) * 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
US5831268A (en) * 1996-11-25 1998-11-03 Morita; Yoshimitsu Sensing device for reflective clear material using infrared LED
US5865529A (en) * 1997-03-10 1999-02-02 Yan; Ellis Light emitting diode lamp having a spherical radiating pattern
US5813753A (en) * 1997-05-27 1998-09-29 Philips Electronics North America Corporation UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light
US5962971A (en) * 1997-08-29 1999-10-05 Chen; Hsing LED structure with ultraviolet-light emission chip and multilayered resins to generate various colored lights
US6252254B1 (en) * 1998-02-06 2001-06-26 General Electric Company Light emitting device with phosphor composition
US6366018B1 (en) * 1998-10-21 2002-04-02 Sarnoff Corporation Apparatus for performing wavelength-conversion using phosphors with light emitting diodes
TW433551U (en) * 1999-10-26 2001-05-01 You Shang Hua Improvement of cup base for light emitting diode chip
US6513949B1 (en) * 1999-12-02 2003-02-04 Koninklijke Philips Electronics N.V. LED/phosphor-LED hybrid lighting systems
TW498561B (en) * 2000-05-04 2002-08-11 Mu-Jin You Light emitting diode, manufacturing method and metal substrate for the same
JP2001352101A (ja) 2000-06-06 2001-12-21 Nichia Chem Ind Ltd 発光装置
US6682331B1 (en) * 2002-09-20 2004-01-27 Agilent Technologies, Inc. Molding apparatus for molding light emitting diode lamps
US6744077B2 (en) * 2002-09-27 2004-06-01 Lumileds Lighting U.S., Llc Selective filtering of wavelength-converted semiconductor light emitting devices
US7026755B2 (en) * 2003-08-07 2006-04-11 General Electric Company Deep red phosphor for general illumination applications
EP1738107A4 (en) * 2004-04-23 2008-12-31 Light Prescriptions Innovators OPTICAL DISTRIBUTOR FOR LIGHT-EMITTING DIODES
US20060038198A1 (en) * 2004-08-23 2006-02-23 Chua Janet B Y Device and method for producing output light having a wavelength spectrum in the visible range and the infrared range using a fluorescent material
JP4245182B2 (ja) 2004-09-22 2009-03-25 独立行政法人科学技術振興機構 水溶性蛍光材料およびその製造方法
JP4649641B2 (ja) * 2004-11-26 2011-03-16 株式会社フジクラ アルファサイアロン蛍光体とその製造方法、アルファサイアロン蛍光体原料粉末及び発光ダイオードランプ
JP2006152958A (ja) 2004-11-30 2006-06-15 Shimadzu Corp ターボ分子ポンプ
WO2007017049A1 (de) 2005-08-11 2007-02-15 Merck Patent Gmbh Photonisches material mit regelmässig angeordneten kavitäten
SE532215C2 (sv) * 2005-11-18 2009-11-17 Consensum As Skyddsmetod och säkerhetsanordning vid SCUBA-dykning
TWM294622U (en) * 2006-01-12 2006-07-21 Genius Electronic Optical Co Ltd Collimating lens of the LED lamp
JP2008124168A (ja) 2006-11-10 2008-05-29 Matsushita Electric Ind Co Ltd 半導体発光装置
US8297061B2 (en) * 2007-08-02 2012-10-30 Cree, Inc. Optoelectronic device with upconverting luminophoric medium
JP2009065145A (ja) * 2007-08-10 2009-03-26 Mitsubishi Chemicals Corp 半導体発光装置、バックライトおよびカラー画像表示装置
KR101055769B1 (ko) * 2007-08-28 2011-08-11 서울반도체 주식회사 비화학양론적 정방정계 알칼리 토류 실리케이트 형광체를채택한 발광 장치
US7663095B2 (en) * 2007-09-20 2010-02-16 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Photodetector with embedded infrared filter
WO2009145676A2 (en) * 2008-05-28 2009-12-03 Bogachev, Alexey Nikolaevich Rebreather oxygen risk alarm
JP2010097829A (ja) * 2008-10-16 2010-04-30 Stanley Electric Co Ltd 照明装置および車両用灯具

Also Published As

Publication number Publication date
WO2010147925A2 (en) 2010-12-23
EP2443676A2 (en) 2012-04-25
CN102804423A (zh) 2012-11-28
EP2443676A4 (en) 2014-10-15
US20100320480A1 (en) 2010-12-23
JP2012531043A (ja) 2012-12-06
US20120274471A1 (en) 2012-11-01
US8426871B2 (en) 2013-04-23
WO2010147925A3 (en) 2011-03-17

Similar Documents

Publication Publication Date Title
KR20120031224A (ko) 인광 변환 적외선 ｌｅｄ
US7859182B2 (en) Warm white LED-based lamp incoporating divalent EU-activated silicate yellow emitting phosphor
JP5951180B2 (ja) 飽和変換材料を有するエミッタパッケージ
JP4666891B2 (ja) ナノ粒子を用いる発光デバイス
US7768189B2 (en) White LEDs with tunable CRI
US6294800B1 (en) Phosphors for white light generation from UV emitting diodes
US8057706B1 (en) Moisture-resistant phosphor and associated method
US20160377262A1 (en) System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US20060181192A1 (en) White LEDs with tailorable color temperature
US12369438B2 (en) System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US20210366880A9 (en) Multi-layer conversion material for down conversion in solid state lighting
CN1653157A (zh) 波长变化的反应性树脂材料和发光二极管元件
JP2008227523A (ja) 窒化物蛍光体及びその製造方法並びに窒化物蛍光体を用いた発光装置
JP2006019409A (ja) 発光装置並びにそれを用いた照明、ディスプレイ用バックライト及びディスプレイ
US8519611B2 (en) Hybrid illumination system with improved color quality
US20140327023A1 (en) Phosphor assembly for light emitting devices
JP5905648B2 (ja) 半導体を利用した発光デバイス
KR102103881B1 (ko) Uv led칩을 이용하는 백색 발광소자
KR20070002385A (ko) 발광 소자
WO2004019422A1 (en) White light emitting device
US20230402573A1 (en) Coated phosphor particle, light emitting device including a coated phosphor particle, and method of making a coated phosphor particle
KR20050019741A (ko) 포화 인광체 고체 에미터
EP4537399A1 (en) Use of ksf phosphor in leds with wire-bonds with maximum amount of silver
KR20100061785A (ko) 발광 소자

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20120113

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20150608

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20160512

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20161118

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20160512

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I