KR20110089096A - 열전도성 시트 - Google Patents

열전도성 시트 Download PDF

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Publication number
KR20110089096A
KR20110089096A KR1020110009573A KR20110009573A KR20110089096A KR 20110089096 A KR20110089096 A KR 20110089096A KR 1020110009573 A KR1020110009573 A KR 1020110009573A KR 20110009573 A KR20110009573 A KR 20110009573A KR 20110089096 A KR20110089096 A KR 20110089096A
Authority
KR
South Korea
Prior art keywords
conductive sheet
thermally conductive
boron nitride
test
thermal conductive
Prior art date
Application number
KR1020110009573A
Other languages
English (en)
Korean (ko)
Inventor
세이지 이즈따니
히사에 우찌야마
다까히로 후꾸오까
가즈따까 하라
히또쯔구 히라노
Original Assignee
닛토덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛토덴코 가부시키가이샤 filed Critical 닛토덴코 가부시키가이샤
Publication of KR20110089096A publication Critical patent/KR20110089096A/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
KR1020110009573A 2010-01-29 2011-01-31 열전도성 시트 KR20110089096A (ko)

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
JP2010018256 2010-01-29
JPJP-P-2010-018256 2010-01-29
JP2010090908 2010-04-09
JPJP-P-2010-090908 2010-04-09
JP2010161845 2010-07-16
JPJP-P-2010-161849 2010-07-16
JPJP-P-2010-161847 2010-07-16
JPJP-P-2010-161850 2010-07-16
JPJP-P-2010-161845 2010-07-16
JP2010161847 2010-07-16
JP2010161849 2010-07-16
JP2010161850 2010-07-16
JPJP-P-2010-161853 2010-07-16
JP2010161853 2010-07-16

Publications (1)

Publication Number Publication Date
KR20110089096A true KR20110089096A (ko) 2011-08-04

Family

ID=44408060

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110009573A KR20110089096A (ko) 2010-01-29 2011-01-31 열전도성 시트

Country Status (5)

Country Link
US (1) US20110259569A1 (zh)
JP (1) JP2012039060A (zh)
KR (1) KR20110089096A (zh)
CN (1) CN102140257B (zh)
TW (1) TWI492972B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201203477A (en) 2010-01-29 2012-01-16 Nitto Denko Corp Power module
TWI470705B (zh) * 2012-02-07 2015-01-21 Pram Technology Inc 封裝元件之封裝製程改善
US9859484B2 (en) 2012-10-24 2018-01-02 Sharp Kabushiki Kaisha Light emitting apparatus
CN103059567B (zh) * 2013-01-23 2015-04-22 苏州大学 一种阻燃六方氮化硼/热固性树脂复合材料及其制备方法
CN105899613A (zh) 2014-01-08 2016-08-24 捷恩智株式会社 热传导性片用树脂组合物、热传导性片、树脂覆膜金属、电子装置
JP6473597B2 (ja) * 2014-10-22 2019-02-20 株式会社Kri 高熱伝導有機無機コンポジット材料の製造方法
JP6795285B2 (ja) * 2015-02-26 2020-12-02 住友ベークライト株式会社 熱伝導性シート、熱伝導性シートの硬化物および半導体装置
US11884039B2 (en) 2017-05-10 2024-01-30 Sekisui Chemical Co., Ltd. Insulating sheet and laminate
JP7101693B2 (ja) * 2017-09-28 2022-07-15 富士フイルム株式会社 放熱シートおよび放熱シート付きデバイス
CN110157153B (zh) * 2018-02-11 2022-02-08 中国科学院深圳先进技术研究院 一种环氧树脂/有序氮化硼复合材料及其制备方法
CN110047877A (zh) * 2019-03-27 2019-07-23 武汉华星光电半导体显示技术有限公司 一种有机发光二极管显示面板、显示模组及电子装置
JP7233564B2 (ja) * 2019-11-07 2023-03-06 帝人株式会社 放熱シート及びその製造方法
JP7446138B2 (ja) * 2020-03-27 2024-03-08 株式会社ノリタケカンパニーリミテド セラミックスシート、セラミックスシートの製造方法およびグリーンシート

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6162849A (en) * 1999-01-11 2000-12-19 Ferro Corporation Thermally conductive thermoplastic
US6919504B2 (en) * 2002-12-19 2005-07-19 3M Innovative Properties Company Flexible heat sink
US20070259211A1 (en) * 2006-05-06 2007-11-08 Ning Wang Heat spread sheet with anisotropic thermal conductivity
JP4916764B2 (ja) * 2006-05-10 2012-04-18 電気化学工業株式会社 異方熱伝導積層型放熱部材
JP4889110B2 (ja) * 2007-02-05 2012-03-07 日東電工株式会社 熱伝導性樹脂組成物および熱伝導性シートとその製造方法
JP5002280B2 (ja) * 2007-02-14 2012-08-15 日東電工株式会社 樹脂成形品製造方法
JP5407120B2 (ja) * 2007-04-11 2014-02-05 日立化成株式会社 熱伝導シート、その製造方法およびこれを用いた放熱装置
US20080271832A1 (en) * 2007-05-04 2008-11-06 Tyco Electronics Corporation Thermo-conductive, heat-shrinkable, dual-wall tubing
JP5525682B2 (ja) * 2007-05-15 2014-06-18 出光ライオンコンポジット株式会社 ポリアリーレンサルファイド樹脂組成物及びそれからなる成形品
JP2009081253A (ja) * 2007-09-26 2009-04-16 Nitto Shinko Kk 絶縁シート
JP2009280650A (ja) * 2008-05-20 2009-12-03 Shin Kobe Electric Mach Co Ltd 熱可塑性樹脂組成物及び熱可塑性樹脂成形品
CN101343402B (zh) * 2008-08-27 2011-04-20 南亚塑胶工业股份有限公司 印刷电路板用高导热、高玻璃化转变温度的树脂组合物及其预浸渍体及涂层物
JP5330910B2 (ja) * 2009-07-03 2013-10-30 電気化学工業株式会社 樹脂組成物及びその用途
JP5513840B2 (ja) * 2009-10-22 2014-06-04 電気化学工業株式会社 絶縁シート、回路基板及び絶縁シートの製造方法

Also Published As

Publication number Publication date
JP2012039060A (ja) 2012-02-23
CN102140257B (zh) 2015-10-07
US20110259569A1 (en) 2011-10-27
CN102140257A (zh) 2011-08-03
TWI492972B (zh) 2015-07-21
TW201132691A (en) 2011-10-01

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