KR20110084307A - 광전 반도체 소자 - Google Patents

광전 반도체 소자 Download PDF

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Publication number
KR20110084307A
KR20110084307A KR1020117013299A KR20117013299A KR20110084307A KR 20110084307 A KR20110084307 A KR 20110084307A KR 1020117013299 A KR1020117013299 A KR 1020117013299A KR 20117013299 A KR20117013299 A KR 20117013299A KR 20110084307 A KR20110084307 A KR 20110084307A
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KR
South Korea
Prior art keywords
semiconductor chip
conversion member
conversion
radiation
connection carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020117013299A
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English (en)
Korean (ko)
Inventor
랄프 빌쓰
Original Assignee
오스람 옵토 세미컨덕터스 게엠베하
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Application filed by 오스람 옵토 세미컨덕터스 게엠베하 filed Critical 오스람 옵토 세미컨덕터스 게엠베하
Publication of KR20110084307A publication Critical patent/KR20110084307A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
KR1020117013299A 2008-11-13 2009-11-02 광전 반도체 소자 Withdrawn KR20110084307A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008057140.7 2008-11-13
DE102008057140A DE102008057140A1 (de) 2008-11-13 2008-11-13 Optoelektronisches Bauelement

Publications (1)

Publication Number Publication Date
KR20110084307A true KR20110084307A (ko) 2011-07-21

Family

ID=42103012

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117013299A Withdrawn KR20110084307A (ko) 2008-11-13 2009-11-02 광전 반도체 소자

Country Status (7)

Country Link
US (1) US8558259B2 (enExample)
EP (1) EP2316130A2 (enExample)
JP (1) JP5544369B2 (enExample)
KR (1) KR20110084307A (enExample)
CN (1) CN102217065B (enExample)
DE (1) DE102008057140A1 (enExample)
WO (1) WO2010054622A2 (enExample)

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US20140022761A1 (en) * 2011-01-21 2014-01-23 Osram Sylvania Inc. Luminescent Converter and LED Light Source Containing Same
DE102011003989A1 (de) * 2011-02-11 2012-08-16 Osram Ag Leuchtvorrichtung
DE102011100710A1 (de) * 2011-05-06 2012-11-08 Osram Opto Semiconductors Gmbh Konversionselement für Leuchtdioden und Herstellungsverfahren
DE102012102859A1 (de) 2012-04-02 2013-11-14 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement umfassend eine Konverterträgerschicht, und Verfahren zur Herstellung eines optoelektronischen Bauelements umfassend eine Konverterträgerschicht
DE102012205469A1 (de) * 2012-04-03 2013-10-10 Osram Gmbh Leuchtvorrichtung und verfahren zum betreiben einer leuchtvorrichtung
DE102013211525A1 (de) 2013-06-19 2014-12-24 Osram Gmbh LED-Modul mit LED-Chips
JP2015115506A (ja) * 2013-12-12 2015-06-22 パナソニックＩｐマネジメント株式会社 照明光源
JP2014187392A (ja) * 2014-06-23 2014-10-02 Sharp Corp 発光装置及びこれを備えた照明装置
JP2016009761A (ja) * 2014-06-24 2016-01-18 株式会社小糸製作所 発光モジュール
JP2016051845A (ja) * 2014-09-01 2016-04-11 株式会社ジャパンディスプレイ 表示装置
KR20170073224A (ko) * 2015-12-18 2017-06-28 주식회사 트레이스 3차원 돔형 터치 패턴을 이용한 터치 스크린
JP6986698B2 (ja) * 2017-06-28 2021-12-22 パナソニックＩｐマネジメント株式会社 発光装置及びそれを備える光学分析システム
DE102018124751B4 (de) * 2018-10-08 2023-11-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils

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Also Published As

Publication number Publication date
CN102217065B (zh) 2014-07-02
EP2316130A2 (de) 2011-05-04
CN102217065A (zh) 2011-10-12
JP5544369B2 (ja) 2014-07-09
WO2010054622A2 (de) 2010-05-20
DE102008057140A1 (de) 2010-05-20
US20110272713A1 (en) 2011-11-10
WO2010054622A3 (de) 2010-07-08
US8558259B2 (en) 2013-10-15
JP2012508970A (ja) 2012-04-12

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PA0105 International application

Patent event date: 20110610

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20141027

Comment text: Request for Examination of Application

PC1202 Submission of document of withdrawal before decision of registration

Comment text: [Withdrawal of Procedure relating to Patent, etc.] Withdrawal (Abandonment)

Patent event code: PC12021R01D

Patent event date: 20150819

WITB Written withdrawal of application