KR20110038608A - 다층 기판 및 발광 다이오드를 포함하는 장치 - Google Patents

다층 기판 및 발광 다이오드를 포함하는 장치 Download PDF

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Publication number
KR20110038608A
KR20110038608A KR1020107023773A KR20107023773A KR20110038608A KR 20110038608 A KR20110038608 A KR 20110038608A KR 1020107023773 A KR1020107023773 A KR 1020107023773A KR 20107023773 A KR20107023773 A KR 20107023773A KR 20110038608 A KR20110038608 A KR 20110038608A
Authority
KR
South Korea
Prior art keywords
composite structure
substrate
layer
multilayer composite
diode
Prior art date
Application number
KR1020107023773A
Other languages
English (en)
Korean (ko)
Inventor
크리스토프 베허
Original Assignee
3에이 테크놀로지 앤드 메니지먼트 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3에이 테크놀로지 앤드 메니지먼트 리미티드 filed Critical 3에이 테크놀로지 앤드 메니지먼트 리미티드
Publication of KR20110038608A publication Critical patent/KR20110038608A/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
    • F21V33/006—General building constructions or finishing work for buildings, e.g. roofs, gutters, stairs or floors; Garden equipment; Sunshades or parasols
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/092—Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
KR1020107023773A 2008-04-25 2009-04-14 다층 기판 및 발광 다이오드를 포함하는 장치 KR20110038608A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008021014.5 2008-04-25
DE102008021014A DE102008021014A1 (de) 2008-04-25 2008-04-25 Vorrichtung mit einer Mehrschichtplatte sowie Licht emittierenden Dioden

Publications (1)

Publication Number Publication Date
KR20110038608A true KR20110038608A (ko) 2011-04-14

Family

ID=41021022

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107023773A KR20110038608A (ko) 2008-04-25 2009-04-14 다층 기판 및 발광 다이오드를 포함하는 장치

Country Status (7)

Country Link
EP (1) EP2272103A1 (de)
JP (1) JP2011519155A (de)
KR (1) KR20110038608A (de)
CN (1) CN102027605A (de)
DE (1) DE102008021014A1 (de)
TW (1) TW201009775A (de)
WO (1) WO2009129947A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009004724A1 (de) * 2009-01-15 2010-07-22 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauteils und optoelektronisches Bauteil
DE102011101805B4 (de) 2011-05-17 2016-08-25 Fela Holding Gmbh Schaltungsträger
WO2013117198A1 (en) * 2012-02-08 2013-08-15 Scanled Ipr Aps An assembly of a construction panel and a light emitting diode
CN105789938B (zh) * 2014-12-23 2020-08-04 南京中兴软件有限责任公司 机架内部供电方法、总线式供电板以及通信设备
DE102015006619A1 (de) * 2015-05-24 2016-11-24 Technische Universität Chemnitz Aus einem hybriden Werkstoffverbund bestehendes Achsbauteil in Verbindung mit einem Straßenfahrzeug oder einem Straßenfahrzeug oder einem mobilen Arbeitsgerät
US10267504B2 (en) 2016-01-11 2019-04-23 Led Ibond International Aps Electrical supply module for flexible coupling
WO2018077359A1 (en) 2016-10-31 2018-05-03 Led Ibond International Aps Electrical supply system
WO2023041136A1 (en) 2021-09-20 2023-03-23 LED iBond International A/S An led plug
DE102022116234A1 (de) 2022-06-29 2024-01-04 Pfanner Schutzbekleidung Gmbh Flächige Anzeigevorrichtung

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4039034A1 (de) 1990-12-07 1992-06-11 Heiland Bernd Gross-display
ATE324686T1 (de) 2001-08-13 2006-05-15 Katholm Invest As Adapter zum energietransfer
JP2006128512A (ja) * 2004-10-29 2006-05-18 Ngk Spark Plug Co Ltd 発光素子用セラミック基板
TWI251301B (en) 2004-11-29 2006-03-11 Unimicron Technology Corp Substrate core and method for fabricating the same
JP2006156747A (ja) * 2004-11-30 2006-06-15 Ngk Spark Plug Co Ltd 配線基板
US7952112B2 (en) * 2005-04-29 2011-05-31 Philips Lumileds Lighting Company Llc RGB thermal isolation substrate
DE102006014808A1 (de) 2005-06-03 2007-03-22 Mediamesh Gbr (Vertretungsberechtigte Gesellschafter: Gkd Ag Metallgewebe, Anordnung eines Metallgewebes und Verfahren zum Illuminieren
KR100638876B1 (ko) * 2005-07-22 2006-10-27 삼성전기주식회사 보호 소자의 배치 구성을 개선한 측면형 발광 다이오드
JP5214128B2 (ja) * 2005-11-22 2013-06-19 シャープ株式会社 発光素子及び発光素子を備えたバックライトユニット
US8643195B2 (en) * 2006-06-30 2014-02-04 Cree, Inc. Nickel tin bonding system for semiconductor wafers and devices
TW200810145A (en) 2006-08-04 2008-02-16 Chiang Cheng Ting A lighting structure with light emitting diodes and the method thereof

Also Published As

Publication number Publication date
CN102027605A (zh) 2011-04-20
TW201009775A (en) 2010-03-01
WO2009129947A1 (de) 2009-10-29
EP2272103A1 (de) 2011-01-12
DE102008021014A1 (de) 2009-10-29
JP2011519155A (ja) 2011-06-30

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