TW201009775A - Device with a multi-layer board and light-emitting diodes - Google Patents
Device with a multi-layer board and light-emitting diodes Download PDFInfo
- Publication number
- TW201009775A TW201009775A TW098113765A TW98113765A TW201009775A TW 201009775 A TW201009775 A TW 201009775A TW 098113765 A TW098113765 A TW 098113765A TW 98113765 A TW98113765 A TW 98113765A TW 201009775 A TW201009775 A TW 201009775A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- layers
- diode
- light
- panel
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
- F21V33/006—General building constructions or finishing work for buildings, e.g. roofs, gutters, stairs or floors; Garden equipment; Sunshades or parasols
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/092—Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008021014A DE102008021014A1 (de) | 2008-04-25 | 2008-04-25 | Vorrichtung mit einer Mehrschichtplatte sowie Licht emittierenden Dioden |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201009775A true TW201009775A (en) | 2010-03-01 |
Family
ID=41021022
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098113765A TW201009775A (en) | 2008-04-25 | 2009-04-24 | Device with a multi-layer board and light-emitting diodes |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP2272103A1 (de) |
JP (1) | JP2011519155A (de) |
KR (1) | KR20110038608A (de) |
CN (1) | CN102027605A (de) |
DE (1) | DE102008021014A1 (de) |
TW (1) | TW201009775A (de) |
WO (1) | WO2009129947A1 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009004724A1 (de) * | 2009-01-15 | 2010-07-22 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Bauteils und optoelektronisches Bauteil |
DE102011101805B4 (de) | 2011-05-17 | 2016-08-25 | Fela Holding Gmbh | Schaltungsträger |
WO2013117198A1 (en) * | 2012-02-08 | 2013-08-15 | Scanled Ipr Aps | An assembly of a construction panel and a light emitting diode |
CN105789938B (zh) * | 2014-12-23 | 2020-08-04 | 南京中兴软件有限责任公司 | 机架内部供电方法、总线式供电板以及通信设备 |
DE102015006619A1 (de) * | 2015-05-24 | 2016-11-24 | Technische Universität Chemnitz | Aus einem hybriden Werkstoffverbund bestehendes Achsbauteil in Verbindung mit einem Straßenfahrzeug oder einem Straßenfahrzeug oder einem mobilen Arbeitsgerät |
US10267504B2 (en) | 2016-01-11 | 2019-04-23 | Led Ibond International Aps | Electrical supply module for flexible coupling |
WO2018077359A1 (en) | 2016-10-31 | 2018-05-03 | Led Ibond International Aps | Electrical supply system |
WO2023041136A1 (en) | 2021-09-20 | 2023-03-23 | LED iBond International A/S | An led plug |
DE102022116234A1 (de) | 2022-06-29 | 2024-01-04 | Pfanner Schutzbekleidung Gmbh | Flächige Anzeigevorrichtung |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4039034A1 (de) | 1990-12-07 | 1992-06-11 | Heiland Bernd | Gross-display |
ATE324686T1 (de) | 2001-08-13 | 2006-05-15 | Katholm Invest As | Adapter zum energietransfer |
JP2006128512A (ja) * | 2004-10-29 | 2006-05-18 | Ngk Spark Plug Co Ltd | 発光素子用セラミック基板 |
TWI251301B (en) | 2004-11-29 | 2006-03-11 | Unimicron Technology Corp | Substrate core and method for fabricating the same |
JP2006156747A (ja) * | 2004-11-30 | 2006-06-15 | Ngk Spark Plug Co Ltd | 配線基板 |
US7952112B2 (en) * | 2005-04-29 | 2011-05-31 | Philips Lumileds Lighting Company Llc | RGB thermal isolation substrate |
DE102006014808A1 (de) | 2005-06-03 | 2007-03-22 | Mediamesh Gbr (Vertretungsberechtigte Gesellschafter: Gkd Ag | Metallgewebe, Anordnung eines Metallgewebes und Verfahren zum Illuminieren |
KR100638876B1 (ko) * | 2005-07-22 | 2006-10-27 | 삼성전기주식회사 | 보호 소자의 배치 구성을 개선한 측면형 발광 다이오드 |
JP5214128B2 (ja) * | 2005-11-22 | 2013-06-19 | シャープ株式会社 | 発光素子及び発光素子を備えたバックライトユニット |
US8643195B2 (en) * | 2006-06-30 | 2014-02-04 | Cree, Inc. | Nickel tin bonding system for semiconductor wafers and devices |
TW200810145A (en) | 2006-08-04 | 2008-02-16 | Chiang Cheng Ting | A lighting structure with light emitting diodes and the method thereof |
-
2008
- 2008-04-25 DE DE102008021014A patent/DE102008021014A1/de not_active Withdrawn
-
2009
- 2009-04-14 JP JP2011505404A patent/JP2011519155A/ja active Pending
- 2009-04-14 EP EP09734548A patent/EP2272103A1/de not_active Withdrawn
- 2009-04-14 WO PCT/EP2009/002711 patent/WO2009129947A1/de active Application Filing
- 2009-04-14 CN CN2009801147532A patent/CN102027605A/zh active Pending
- 2009-04-14 KR KR1020107023773A patent/KR20110038608A/ko not_active Application Discontinuation
- 2009-04-24 TW TW098113765A patent/TW201009775A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN102027605A (zh) | 2011-04-20 |
WO2009129947A1 (de) | 2009-10-29 |
EP2272103A1 (de) | 2011-01-12 |
DE102008021014A1 (de) | 2009-10-29 |
KR20110038608A (ko) | 2011-04-14 |
JP2011519155A (ja) | 2011-06-30 |
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