KR20100137441A - 실리콘 조성물, 실리콘 접착제, 피복된 기판 및 적층 기판 - Google Patents

실리콘 조성물, 실리콘 접착제, 피복된 기판 및 적층 기판 Download PDF

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Publication number
KR20100137441A
KR20100137441A KR1020107019633A KR20107019633A KR20100137441A KR 20100137441 A KR20100137441 A KR 20100137441A KR 1020107019633 A KR1020107019633 A KR 1020107019633A KR 20107019633 A KR20107019633 A KR 20107019633A KR 20100137441 A KR20100137441 A KR 20100137441A
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KR
South Korea
Prior art keywords
silicone
substrate
silicone resin
silicon
groups
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020107019633A
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English (en)
Korean (ko)
Inventor
칼 페어뱅크
나단 피. 그리어
비중 주
Original Assignee
다우 코닝 코포레이션
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Publication date
Application filed by 다우 코닝 코포레이션 filed Critical 다우 코닝 코포레이션
Publication of KR20100137441A publication Critical patent/KR20100137441A/ko
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31609—Particulate metal or metal compound-containing
    • Y10T428/31612—As silicone, silane or siloxane

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
KR1020107019633A 2008-03-04 2009-02-23 실리콘 조성물, 실리콘 접착제, 피복된 기판 및 적층 기판 Ceased KR20100137441A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3344108P 2008-03-04 2008-03-04
US61/033,441 2008-03-04

Publications (1)

Publication Number Publication Date
KR20100137441A true KR20100137441A (ko) 2010-12-30

Family

ID=40565115

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107019633A Ceased KR20100137441A (ko) 2008-03-04 2009-02-23 실리콘 조성물, 실리콘 접착제, 피복된 기판 및 적층 기판

Country Status (6)

Country Link
US (1) US20120052309A1 (enExample)
EP (1) EP2265666B1 (enExample)
JP (1) JP2011517327A (enExample)
KR (1) KR20100137441A (enExample)
CN (1) CN101959947B (enExample)
WO (1) WO2009111190A1 (enExample)

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JP5844798B2 (ja) * 2010-04-28 2016-01-20 スリーエム イノベイティブ プロパティズ カンパニー ポリマーコーティングのためのナノシリカ系プライマーを含む物品及び方法
JP5434954B2 (ja) * 2010-05-07 2014-03-05 信越化学工業株式会社 剥離紙又は剥離フィルム用下塗りシリコーン組成物、並びに処理紙又は処理フィルム
JP5640476B2 (ja) * 2010-06-08 2014-12-17 信越化学工業株式会社 光半導体素子封止用樹脂組成物及び発光装置
KR101762348B1 (ko) * 2010-06-11 2017-07-27 가부시키가이샤 아데카 규소 함유 경화성 조성물, 그 규소 함유 경화성 조성물의 경화물 및 그 규소 함유 경화성 조성물로 형성되는 리드 프레임 기판
WO2012027337A1 (en) 2010-08-23 2012-03-01 Dow Corning Corporation Phosphosiloxane resins, and curable silicone compositions, free-standing films, and laminates comprising the phosphosiloxane resins
JP5760376B2 (ja) * 2010-10-22 2015-08-12 旭硝子株式会社 支持体、ガラス基板積層体、支持体付き表示装置用パネル、オルガノポリシロキサン組成物、および表示装置用パネルの製造方法
EP2638106A1 (en) 2010-11-09 2013-09-18 Dow Corning Corporation Hydrosilylation cured silicone resins plasticized by organophosphorous compounds
EP2655057A2 (en) * 2010-12-22 2013-10-30 Dow Corning Corporation Silicone composition, silicone adhesive, coated and laminated substrates
FI127433B (fi) 2011-06-14 2018-05-31 Pibond Oy Menetelmä siloksaanimonomeerien syntetisoimiseksi sekä näiden käyttö
CN104488089A (zh) * 2012-07-19 2015-04-01 日立化成株式会社 钝化层形成用组合物、带钝化层的半导体基板、带钝化层的半导体基板的制造方法、太阳能电池元件、太阳能电池元件的制造方法及太阳能电池
CN102796488B (zh) * 2012-07-26 2014-08-20 深圳大学 耐高温绝缘胶粘剂
US20140127857A1 (en) * 2012-11-07 2014-05-08 Taiwan Semiconductor Manufacturing Company, Ltd. Carrier Wafers, Methods of Manufacture Thereof, and Packaging Methods
US10290531B2 (en) * 2013-04-30 2019-05-14 John Cleaon Moore Release layer for subsequent manufacture of flexible substrates in microelectronic applications
US9751989B2 (en) * 2015-12-22 2017-09-05 Shin-Etsu Chemical Co., Ltd. Condensation curable resin composition and semiconductor package
CN106739411A (zh) * 2016-11-17 2017-05-31 江苏铁锚玻璃股份有限公司 一种带硅氧表面涂层塑料板与玻璃板的粘接方法
US20210277237A1 (en) * 2018-06-08 2021-09-09 Elkem Silicones Shanghai Co., Ltd. Curable silicone composition
JP7172805B2 (ja) * 2019-04-02 2022-11-16 信越化学工業株式会社 付加硬化型シリコーン接着剤組成物
JP7677641B2 (ja) * 2019-08-05 2025-05-15 ジェセ ロジャース， 調整可能な電極受入部を持つ不活性ガス溶接トーチヘッド
CN118480270A (zh) 2019-10-30 2024-08-13 瓦克化学股份公司 含硅酸的含cnt硅氧烷的配制品
CN113980614B (zh) * 2021-11-18 2023-04-28 江阴市江泰高分子新材料有限公司 一种高洁净度保护膜及其制备方法

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JPH0781074B2 (ja) * 1990-07-06 1995-08-30 信越化学工業株式会社 発泡性シリコーンゴム組成物及び耐火性目地シール材ならびにその製造方法
JPH05254912A (ja) * 1992-03-10 1993-10-05 Sumitomo Electric Ind Ltd 耐火性組成物
JP3574226B2 (ja) * 1994-10-28 2004-10-06 東レ・ダウコーニング・シリコーン株式会社 硬化性シリコーン組成物およびその硬化物
US5880194A (en) * 1997-09-09 1999-03-09 Dow Corning Corporation Firewall sealant
US5972512A (en) * 1998-02-16 1999-10-26 Dow Corning Corporation Silicone resin composites for fire resistance applications and method for fabricating same
US6623846B2 (en) * 2000-03-06 2003-09-23 Guardian Industries Corp. Low-emissivity glass coatings having a layer of nitrided nichrome and methods of making same
WO2004013255A1 (en) * 2002-08-01 2004-02-12 Polymers Australia Pty Limited Fire-resistant silicone polymer compositions
US6623864B1 (en) * 2003-01-13 2003-09-23 Dow Corning Corporation Silicone composition useful in flame retardant applications
JP2004361692A (ja) * 2003-04-07 2004-12-24 Dow Corning Asia Ltd 光伝送部材用硬化性オルガノポリシロキサン樹脂組成物、オルガノポリシロキサン樹脂硬化物からなる光伝送部材および光伝送部材の製造方法
JP4908736B2 (ja) * 2003-10-01 2012-04-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP2005171191A (ja) * 2003-12-15 2005-06-30 Fujikura Ltd 耐火性シリコーン樹脂組成物および低圧耐火ケーブル
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JP2007246775A (ja) * 2006-03-17 2007-09-27 Nisshin Steel Co Ltd 耐熱塗料およびプレコート鋼板

Also Published As

Publication number Publication date
CN101959947B (zh) 2014-02-26
CN101959947A (zh) 2011-01-26
EP2265666A1 (en) 2010-12-29
JP2011517327A (ja) 2011-06-02
WO2009111190A1 (en) 2009-09-11
US20120052309A1 (en) 2012-03-01
EP2265666B1 (en) 2015-03-25

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