KR20100132915A - 도포, 현상 장치 및 기판의 이면 세정 방법 - Google Patents

도포, 현상 장치 및 기판의 이면 세정 방법 Download PDF

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Publication number
KR20100132915A
KR20100132915A KR1020100054140A KR20100054140A KR20100132915A KR 20100132915 A KR20100132915 A KR 20100132915A KR 1020100054140 A KR1020100054140 A KR 1020100054140A KR 20100054140 A KR20100054140 A KR 20100054140A KR 20100132915 A KR20100132915 A KR 20100132915A
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KR
South Korea
Prior art keywords
substrate
cleaning
back surface
wafer
resist film
Prior art date
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KR1020100054140A
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English (en)
Korean (ko)
Inventor
요오이찌 도꾸나가
슈우이찌 니시끼도
히로찌까 다나까
Original Assignee
도쿄엘렉트론가부시키가이샤
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Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20100132915A publication Critical patent/KR20100132915A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/0209—Cleaning of wafer backside
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
KR1020100054140A 2009-06-10 2010-06-09 도포, 현상 장치 및 기판의 이면 세정 방법 KR20100132915A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009139555A JP2010287686A (ja) 2009-06-10 2009-06-10 塗布、現像装置及び基板の裏面洗浄方法。
JPJP-P-2009-139555 2009-06-10

Publications (1)

Publication Number Publication Date
KR20100132915A true KR20100132915A (ko) 2010-12-20

Family

ID=43338293

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100054140A KR20100132915A (ko) 2009-06-10 2010-06-09 도포, 현상 장치 및 기판의 이면 세정 방법

Country Status (4)

Country Link
JP (1) JP2010287686A (ja)
KR (1) KR20100132915A (ja)
CN (1) CN101923286B (ja)
TW (1) TW201110220A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180027357A (ko) * 2016-09-05 2018-03-14 가부시키가이샤 스크린 홀딩스 기판 세정 장치 및 그것을 구비하는 기판 처리 장치
US10857570B2 (en) 2015-02-16 2020-12-08 SCREEN Holding Co., Ltd. Substrate processing apparatus

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102722084B (zh) * 2011-03-31 2014-05-21 京东方科技集团股份有限公司 一种光刻方法和设备
US8657963B2 (en) * 2011-09-22 2014-02-25 Taiwan Semiconductor Manufacturing Company, Ltd. In-situ backside cleaning of semiconductor substrate
CN103094066A (zh) * 2011-10-27 2013-05-08 沈阳芯源微电子设备有限公司 一种晶圆的生产中的清洗方法
JP2014067910A (ja) * 2012-09-26 2014-04-17 Tokyo Electron Ltd 塗布膜形成装置、塗布膜形成方法、塗布、現像装置、塗布、現像方法及び記憶媒体
JP6077311B2 (ja) * 2013-01-11 2017-02-08 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ ネガティブ現像処理方法およびネガティブ現像処理装置
JP5867473B2 (ja) 2013-09-19 2016-02-24 東京エレクトロン株式会社 塗布、現像装置、塗布、現像装置の運転方法及び記憶媒体
CN104134631B (zh) * 2014-07-16 2016-11-23 京东方科技集团股份有限公司 阵列基板的制作方法及设备
JP6352230B2 (ja) * 2015-10-09 2018-07-04 東京エレクトロン株式会社 基板処理方法、基板処理装置及び記録媒体
JP6726575B2 (ja) * 2016-02-01 2020-07-22 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置、基板処理装置、基板洗浄方法および基板処理方法
US10276365B2 (en) 2016-02-01 2019-04-30 SCREEN Holdings Co., Ltd. Substrate cleaning device, substrate processing apparatus, substrate cleaning method and substrate processing method
JP6279037B2 (ja) * 2016-08-30 2018-02-14 東京エレクトロン株式会社 基板洗浄方法および基板洗浄システム
CN107591347A (zh) * 2017-08-16 2018-01-16 长江存储科技有限责任公司 用于晶圆的清洁装置及清洁方法
JP7232596B2 (ja) * 2018-08-30 2023-03-03 東京エレクトロン株式会社 基板処理装置および基板処理方法
CN110874018A (zh) * 2018-09-04 2020-03-10 长鑫存储技术有限公司 一种光刻胶涂布设备及涂布方法
CN111162201A (zh) * 2018-11-08 2020-05-15 陕西坤同半导体科技有限公司 柔性组件清洁方法及清洁设备
JP7430144B2 (ja) * 2021-01-26 2024-02-09 Ｔｏｗａ株式会社 クリーニング機構、樹脂成形装置及び樹脂成形品の製造方法
CN114823434B (zh) * 2022-06-28 2022-09-16 合肥新晶集成电路有限公司 晶圆清洗系统及方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW417154B (en) * 1998-08-05 2001-01-01 Tokyo Electron Ltd Coating and developing method and apparatus therefor
JP3892635B2 (ja) * 2000-02-04 2007-03-14 大日本スクリーン製造株式会社 洗浄装置
JP3595756B2 (ja) * 2000-06-01 2004-12-02 キヤノン株式会社 露光装置、リソグラフィ装置、ロードロック装置、デバイス製造方法およびリソグラフィ方法
JP2003163196A (ja) * 2001-11-28 2003-06-06 Kaijo Corp 半導体基板の基板洗浄装置及び洗浄方法
JP4318913B2 (ja) * 2002-12-26 2009-08-26 東京エレクトロン株式会社 塗布処理装置
JP4271109B2 (ja) * 2004-09-10 2009-06-03 東京エレクトロン株式会社 塗布、現像装置、レジストパターン形成方法、露光装置及び洗浄装置
JP2006269974A (ja) * 2005-03-25 2006-10-05 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2006332185A (ja) * 2005-05-24 2006-12-07 Tokyo Electron Ltd 基板処理装置、及び基板処理方法
CN100576077C (zh) * 2005-05-30 2009-12-30 东京毅力科创株式会社 涂布方法和涂布装置
JP4983565B2 (ja) * 2006-12-20 2012-07-25 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法及び記憶媒体
JP5183993B2 (ja) * 2007-07-26 2013-04-17 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4976949B2 (ja) * 2007-07-26 2012-07-18 大日本スクリーン製造株式会社 基板処理装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10857570B2 (en) 2015-02-16 2020-12-08 SCREEN Holding Co., Ltd. Substrate processing apparatus
KR20180027357A (ko) * 2016-09-05 2018-03-14 가부시키가이샤 스크린 홀딩스 기판 세정 장치 및 그것을 구비하는 기판 처리 장치

Also Published As

Publication number Publication date
CN101923286B (zh) 2013-07-24
CN101923286A (zh) 2010-12-22
JP2010287686A (ja) 2010-12-24
TW201110220A (en) 2011-03-16

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