KR20100131458A - 방습 시트, 휨 방지 목질판 및 화장판 - Google Patents
방습 시트, 휨 방지 목질판 및 화장판 Download PDFInfo
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- KR20100131458A KR20100131458A KR1020107020905A KR20107020905A KR20100131458A KR 20100131458 A KR20100131458 A KR 20100131458A KR 1020107020905 A KR1020107020905 A KR 1020107020905A KR 20107020905 A KR20107020905 A KR 20107020905A KR 20100131458 A KR20100131458 A KR 20100131458A
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27D—WORKING VENEER OR PLYWOOD
- B27D5/00—Other working of veneer or plywood specially adapted to veneer or plywood
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27M—WORKING OF WOOD NOT PROVIDED FOR IN SUBCLASSES B27B - B27L; MANUFACTURE OF SPECIFIC WOODEN ARTICLES
- B27M3/00—Manufacture or reconditioning of specific semi-finished or finished articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
- B32B21/04—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B21/08—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
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Abstract
Description
도 2는 본 발명에 관한 방습 시트의 제2 실시 형태를 나타내는 층 구성도.
도 3은 본 발명의 방습 시트를 사용한 휨 방지 목질판(제1 형태)의 일 실시예를 나타내는 층 구성도.
도 4는 본 발명의 방습 시트를 사용한 화장판(제1 형태)의 일 실시예를 나타내는 층 구성도.
도 5는 본 발명에 관한 휨 방지 목질판(제2 형태)의 일 실시예를 나타내는 층 구성도.
도 6은 본 발명에 관한 화장판(제2 형태)의 일 실시예를 나타내는 층 구성도.
2(a), 1 : 휨 방지 목질판
2(b), 2 : 화장판
10 : 합성 수지제 기재층
11 : 증착층
12, 13, 19 : 접착제층
14, 15, 16 : 접착용 프라이머층
20 : 목질계 기재
30 : 화장 시트
Claims (15)
- 합성 수지제 기재층의 한쪽 면측에 증착층이 적층되고, 상기 합성 수지제 기재층의 다른 쪽 면 또는 증착층면 중 적어도 어느 한 면에 접착용 프라이머층을 마련하여 이루어지는 방습 시트이며, 상기 접착용 프라이머층이 커플링제를 함유하는 방습 시트.
- 제1항에 있어서, 상기 커플링제가 실란계 커플링제인 방습 시트.
- 제1항에 있어서, 상기 합성 수지제 기재층과 상기 증착층 사이에 프라이머층을 갖는 방습 시트.
- 합성 수지제 기재층의 한쪽 면측에 증착층이 적층되고, 상기 합성 수지제 기재층의 다른 쪽 면에 접착제층을 개재하여 화장 시트가 적층되고, 상기 증착층면에 접착용 프라이머층을 마련하여 이루어지는 방습 시트이며, 상기 접착용 프라이머층이 커플링제를 함유하는 방습 시트.
- 제4항에 있어서, 상기 커플링제가 실란계 커플링제인 방습 시트.
- 제4항에 있어서, 상기 합성 수지제 기재층과 상기 증착층 사이에 프라이머층을 갖는 방습 시트.
- 제1항에 기재된 방습 시트를 목질계 기재의 한쪽 면에 접착제층을 개재하여 상기 접착용 프라이머층이 상기 목질계 기재측에 위치하도록 적층하여 이루어지는 휨 방지 목질판.
- 제7항에 기재된 휨 방지 목질판의 목질계 기재의 다른 쪽 면에 접착제층을 개재하여 제4항에 기재된 방습 시트를 적층하여 이루어지는 화장판.
- 합성 수지제 기재층의 한쪽 면측에 증착층이 적층되어 이루어지는 방습 시트를, 목질계 기재의 한쪽 면에 목질계 기재용 접착제층을 개재하여 적층한 휨 방지 목질판이며, 상기 목질계 기재용 접착제층이 커플링제를 함유하는 휨 방지 목질판.
- 제9항에 있어서, 상기 커플링제가 실란계 커플링제인 휨 방지 목질판.
- 제9항에 기재된 휨 방지 목질판의 상기 방습 시트의 표출면에 접착용 프라이머층이 마련되어 있는 휨 방지 목질판.
- 제9항에 기재된 휨 방지 목질판의 상기 목질계 기재면에, 목질계 기재용 접착제층을 개재하여, 합성 수지제 기재층의 한쪽 면측에 증착층이 적층되고, 상기 합성 수지제 기재층의 다른 쪽 면에 접착제층을 개재하여 화장 시트가 적층되어 이루어지는 방습 시트가 적층되어 이루어지는 화장판이며, 상기 목질계 기재용 접착제층이 커플링제를 함유하는 화장판.
- 제12항에 있어서, 상기 커플링제가 실란계 커플링제인 화장판.
- 제12항에 있어서, 화장 시트가 적층되어 이루어지는 상기 방습 시트의 증착층면에 접착용 프라이머층이 마련되어 있고, 상기 접착용 프라이머층이 커플링제를 함유하는 화장판.
- 제14항에 있어서, 상기 커플링제가 실란계 커플링제인 화장판.
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008085189 | 2008-03-28 | ||
JPJP-P-2008-085225 | 2008-03-28 | ||
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