KR20100085128A - Substrate transfer apparatus, substrate transfer method and vacuum processing apparatus - Google Patents

Substrate transfer apparatus, substrate transfer method and vacuum processing apparatus Download PDF

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Publication number
KR20100085128A
KR20100085128A KR1020107011326A KR20107011326A KR20100085128A KR 20100085128 A KR20100085128 A KR 20100085128A KR 1020107011326 A KR1020107011326 A KR 1020107011326A KR 20107011326 A KR20107011326 A KR 20107011326A KR 20100085128 A KR20100085128 A KR 20100085128A
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KR
South Korea
Prior art keywords
substrate
frame
carrier
adsorption
vertical state
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KR1020107011326A
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Korean (ko)
Inventor
요시히로 투야마
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가부시키가이샤 알박
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Publication of KR20100085128A publication Critical patent/KR20100085128A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Provided is a substrate transfer apparatus wherein a carrier for transferring a substrate in the vertical state is reduced in weight. A substrate transfer apparatus for transferring a flat-plate-like substrate (W) to a carrier (23) which transfers the substrate (W) in the vertical state is provided with a placing mechanism (22). The placing mechanism (22) includes a frame (37), which has a rectangular frame body and turns about a turning axis (L) extending in the horizontal direction; a plurality of suction pads (46) arranged on the frame for sucking the substrate (W); and a driving section (35) which turns the frame in a state between the horizontal state and the vertical state. The placing mechanism (22) sucks the substrate (W) in the horizontal state by the suction pads on the frame in the horizontal state, turns the frame from the horizontal state to the vertical state by holding the substrate on the frame, and the substrate (W) in the vertical state is transferred to the carrier (23).

Description

SUBSTRATE TRANSFER APPARATUS, SUBSTRATE TRANSFER METHOD AND VACUUM PROCESSING APPARATUS

The present invention relates to a substrate transfer apparatus, a substrate transfer method, and a vacuum processing apparatus including the substrate transfer apparatus.

Conventionally, there existed a vacuum processing apparatus which vacuum-processes, such as forming a thin film by sputtering, with respect to large glass substrates employ | adopted for flat panel displays, such as a liquid crystal display. In recent years, as such a vacuum processing apparatus, in order to improve production efficiency, many so-called inline vacuum processing apparatuses which sequentially convey a board | substrate to several vacuum processing chambers and process them continuously are employ | adopted. For example, Patent Literature 1 discloses a vacuum processing apparatus including a vacuum frame and a rectangular frame carrier for conveying the substrate in a vertical state in the vacuum processing chamber. In this way, by transporting the substrate to the vacuum processing chamber in a state in which the carrier is placed vertically, a large number of carriers can be arranged while suppressing an increase in the installation space of the vacuum processing apparatus even when the substrate is enlarged. Improvement is planned.

By the way, in the said patent document 1, when conveying a board | substrate to a carrier, a conveyance robot receives the board | substrate before a process stored in the predetermined position, and places a board | substrate on the carrier of the horizontal fall state (horizontal state). After the substrate is supported by the carrier, the carrier is rotated by the rotating mechanism to stand upright, so that the substrate is supported by the carrier in a vertically standing state (vertical state). That is, in the above conventional configuration, the carrier rotates between the horizontal state and the vertical state. For this reason, in order to reduce the curvature when a carrier rotates, it is necessary to thicken the member which comprises a carrier, and to increase its rigidity, and there exists a problem that the weight of a carrier increases. As a result, there has been a problem that the production cost of each carrier increases as the manufacturing cost of each carrier increases, and the power required to rotate the carrier or convey the substrate to the vacuum processing chamber increases.

[Patent Document 1] Japanese Patent Laid-Open No. 2006-114675

The present invention provides a substrate transport apparatus, a substrate transport method, and a vacuum processing apparatus capable of reducing the weight of a carrier for transporting a substrate in a vertical state.

A first aspect of the present invention is a substrate transfer device. A substrate transport apparatus for flipping a substrate to a carrier for transporting a flat substrate in a vertical state includes a frame having a rectangular frame and capable of rotating about a rotation axis extending in a horizontal direction, and provided in the frame. And a transfer mechanism including a plurality of suction pads for adsorbing the substrate, and a drive unit for rotating the frame between a horizontal state and a vertical state, wherein the transfer mechanism includes a substrate in a horizontal state. Is adsorbed by a plurality of adsorption pads and rotates the frame from a horizontal state to a vertical state while supporting the substrate in the frame, thereby passing the substrate in a vertical state to the carrier.

A second aspect of the present invention is a substrate transport method. In a substrate transport method of receiving a substrate from a substrate transport apparatus by a carrier for transporting a flat substrate in a vertical state, the method may include: maintaining a horizontal state in the substrate transport apparatus with a frame having a plurality of suction pads; Adsorbing the substrate with a plurality of adsorption pads in the horizontal state of the frame, rotating the frame from the horizontal state to the vertical state while supporting the substrate in the frame, and passing the substrate in the vertical state to the carrier It includes.

A third aspect of the present invention is a vacuum processing apparatus. The vacuum processing apparatus includes a vacuum processing chamber for evacuating a flat substrate, a carrier for conveying the substrate in a vertical state to the vacuum processing chamber, and a substrate conveying apparatus for receiving the substrate through the carrier, wherein the substrate conveying apparatus The frame has a rectangular frame and can be rotated around a horizontal axis extending in a horizontal direction, a plurality of suction pads mounted on the frame to adsorb the substrate, and the frame is in a horizontal state and a vertical state. A transfer mechanism having a drive unit rotating between the drive unit and a control unit for controlling the drive unit and the plurality of suction pads, wherein the transfer mechanism includes a plurality of suction pads in a horizontal state of the frame with a substrate in a horizontal state; The frame is rotated from the horizontal state to the vertical state while supporting the substrate in the frame The substrate in the vertical state is delivered to the carrier.

1 is a schematic configuration diagram of a vacuum processing apparatus.
2 is a schematic configuration diagram of a substrate transfer device.
3 is a right side view showing the schematic configuration of the transfer mechanism.
4 is a plan view showing a schematic configuration of a transfer mechanism.
5 is a front view illustrating a schematic configuration of a transfer mechanism.
6 is a front view illustrating a schematic configuration of a carrier.
It is a schematic diagram which shows the adsorption area formed on the frame.
8 is a cross-sectional view showing a schematic configuration of the suction pad.
9A to 9E are operation explanatory diagrams showing an operation of turning over a substrate to a carrier.
10A to 10D are operation explanatory diagrams showing an operation of receiving a substrate from a carrier.

EMBODIMENT OF THE INVENTION Hereinafter, the vacuum processing apparatus 1 of one Embodiment is demonstrated with reference to drawings. For example, the said vacuum processing apparatus 1 is embodied as what is called an inline type vacuum processing apparatus which conveys a board | substrate to a several vacuum processing chamber one by one, and processes it continuously.

The vacuum processing apparatus 1 shown in FIG. 1 forms a predetermined | prescribed thin film by sputtering etc. with respect to the large glass substrate (for example, 2 m or more of one side) which can be employ | adopted for flat panel displays, such as a liquid crystal display, etc. Will be processed.

The vacuum processing apparatus 1 is equipped with the board | substrate conveying apparatus 11, The board | substrate conveying apparatus 11 receives the flat board-shaped board | substrate between the carriers 23 (refer FIG. 2) which moves the conveyance path 12. As shown in FIG. And receiving. In one embodiment, the some carrier 23 is provided on the conveyance path 12. The carrier 23 moves along the conveyance path 12 (rotates to the right in FIG. 1), and receives the substrate from the substrate conveying apparatus 11. Thereafter, the carrier 23 moves in the order of the preliminary chamber 14a, the vacuum processing chambers 15, 16, 17 and the preliminary chamber 14b through the rotating mechanism 13a, and the substrate transport apparatus through the rotating mechanism 13b. Return to (11). The carrier 23 returned to the substrate conveying apparatus 11 passes the processed substrate to the substrate conveying apparatus 11. In the preliminary chamber 14a, the carrier 23 evacuates the room and high-vacuums, after which the carrier 23 vacuum-processes the chamber. (15) Bring in. In the preliminary chamber 14b, the carrier 23 is carried out after the interior of the room is opened to the atmosphere to become atmospheric pressure. In each vacuum processing chamber 15, 16, 17, various processes such as heating and sputtering are performed on the substrate conveyed by the carrier 23 under vacuum conditions. Moreover, the vacuum processing apparatus 1 is equipped with the control apparatus 18, and each control apparatus 18 is the board | substrate conveyance apparatus 11, the carrier 23, the conveyance path 12, the rotation mechanism 13a, 13b), the operations of the preliminary chambers 14a and 14b and the vacuum processing chambers 15, 16 and 17 are controlled. And the vacuum processing apparatus 1 performs a predetermined | prescribed vacuum process with respect to the board | substrate before a process conveyed in the upstream of a glass substrate manufacturing line, and carries out the processed board | substrate to the downstream side of a glass substrate manufacturing line.

2 shows a schematic configuration diagram of the substrate transport apparatus 11. The board | substrate conveying apparatus 11 is equipped with the rod feed mechanism 22 which receives a board | substrate from the upstream conveyor 21 which conveys a board | substrate before a process in the upstream of a glass substrate manufacturing line. The transfer mechanism 22 is disposed to face the transfer path 12, and takes the substrate over the carrier 23. In addition, the upstream conveyor 21 is comprised by the roller conveyor. Moreover, the board | substrate conveying apparatus 11 is installed in parallel with the conveyance mechanism 22 along the conveyance path 12, and simultaneously receives the dummy cassette 24 which accommodates a test board, and the dummy cassette 24 along the conveyance path 12. As shown in FIG. ) Is provided side by side and at the same time has an unloading transfer mechanism 25 configured in the same manner as the load transfer mechanism 22. On the other hand, the dummy cassette 24 is equipped with the roller conveyor which conveys a test board | substrate between the transfer mechanisms 22 and 25. As shown in FIG. On the opposite side of the conveying path 12 with the conveying mechanism 25 interposed, the downstream conveyor 26 receiving the processed substrate from the conveying mechanism 25 and conveying the substrate on the downstream side of the glass substrate manufacturing line is provided. It is arranged. That is, in this embodiment, the vacuum processing apparatus 1 receives a board | substrate to the carrier 23 by the feed mechanism 22 for loading, and the board | substrate 23 from the carrier 23 by the feed mechanism 25 for unloading. It consists of a so-called one-through vacuum processing apparatus. The upstream side conveyor 21, the transfer mechanism 22, the carrier 23, the dummy cassette 24, the transfer mechanism 25, and the downstream conveyor 26 are connected to the control apparatus 18, and the operation | movement is Controlled. On the other hand, the downstream conveyor 26 is comprised by the roller conveyor. In addition, the test substrate accommodated in the dummy cassette 24 confirms whether desired film formation is performed when the film forming conditions in the vacuum processing chambers 15, 16, and 17 are changed or when the apparatus is started. It can be used for things.

3 shows a schematic configuration of the transfer mechanism 22 and the carrier 23 for rods. In addition, in order to understand easily, only some structure of the conveyance mechanism 22 is shown in FIG. In addition, about the unloading feed mechanism 25, since it is comprised similarly to the load feed mechanism 22, description is abbreviate | omitted. The transfer mechanism 22 has a case 31 provided with a rectangular bottom plate 32. A plurality of support rods 33 are provided on the bottom plate 32, and a flat top plate 34 is provided on the upper end of the support rods 33. That is, the case 31 is formed in the rectangular parallelepiped shape by which the side surface opened. In the drive part 35 arrange | positioned on the bottom plate 32, the frame 37 located above the top plate 34 is provided through the support member 36. As shown in FIG. The supporting member 36 and the frame 37 are horizontally fallen (hereinafter referred to as a horizontal state) by the drive part 35 around the rotational axis L extending in the horizontal direction (ground vertical direction). It is possible to rotate between the vertical states (hereinafter referred to as vertical states). In addition, the support member 36 and the frame 37 are moved back and forth and vertical in the horizontal direction (left and right direction in FIG. 3, hereinafter referred to as a y direction) with respect to the carrier 23 by the drive part 35. It is supported so that it can move up and down along (it is called an up-down direction and a z direction below in FIG. 3). The rotation shaft L is disposed on the support member 36. When the support member 36 is rotated by the drive part 35 around the rotation shaft L, the frame 37 rotates integrally with the support member 36. The drive part 35 is connected to the control apparatus 18, and the movement of the frame 37 in the y direction and z direction, and rotation of the rotational axis L are controlled. Moreover, the drive part 35 is comprised with the ball screw mechanism etc. which linearly move a ball screw, for example by rotating a hollow shaft by a motor.

As shown in FIG. 4, the frame 37 includes an upper edge 41 positioned vertically upward, a lower edge 42 positioned vertically downward, and one end and a lower edge 42 of the upper edge 41 vertically. Right edge 43 (the right in FIG. 4) which connects one end of), and left edge 44 (the left in FIG. 4) which connects the other end of the upper edge 41 and the other end of the lower edge 42 It has a frame consisting of. In addition, in this embodiment, the frame 37 is arrange | positioned in parallel between the right edge 43 and the left edge 44, and the plurality which connects the upper edge 41 and the lower edge 42 (this embodiment) Four poles 45 are provided. Therefore, the frame 37 is formed in the shape of a fence. A plurality of suction pads 46 are provided on the upper edge 41, the lower edge 42, the right edge 43, and the left edge 44. The adsorption pad 46 is connected to the control apparatus 18, and has a function which adsorb | sucks the board | substrate W. As shown in FIG.

As the transfer mechanism 22, the substrate W supplied from the upstream conveyor 21 is conveyed from the upper edge 41 of the frame 37 toward the lower edge 42 (upper side in the lower side in FIG. 4). do. In addition, the test board supplied from the dummy cassette 24 is conveyed toward the right edge 43 (left to right in FIG. 4) from the left edge 44. In addition, board | substrate loading into the frame 37 (and board | substrate carrying out from the frame 37) is performed in the horizontal state of the frame 37. As shown in FIG. Inside the frame of the frame 37, a plurality of first conveying units 47 and a dummy cassette 24 for conveying the substrate W supplied from the upstream conveyor 21 from above the frame 37. The some 2nd conveyance part 48 which conveys the test board supplied from the upper side of the frame 37 is provided. The first and second carriers 47 and 48 may each be one. In this embodiment, a conveyance means is comprised by the 1st and 2nd conveyance parts 47 and 48. FIG. In each 1st conveyance part 47, the some roller which can be rolled along the y direction (up-down direction in FIG. 4) is arrange | positioned in the y direction. That is, the 1st conveyance part 47 is comprised by the roller conveyor which can convey a board | substrate along the y direction. The 1st conveyance part 47 is substantially in the x direction (left-right direction in FIG. 4) between the right edge 43 and the rod 45, and between the pole 45 and the left edge 44. FIG. They are arranged at about the same interval. On the other hand, in each 2nd conveyance part 48, the some roller which can be rolled along an x direction is arrange | positioned in the x direction. In other words, the 2nd conveyance part 48 consists of a roller conveyor which can convey a board | substrate along an x direction. The 2nd conveyance part 48 is arrange | positioned between the upper edge 41 and the lower edge 42 so that it may become substantially equally spaced in a y direction.

As shown in FIG. 5, in this embodiment, the base 49 which supports each 1st conveyance part 47 is fixed on the top plate 34 of the case 31, whereby each 1st conveyance part ( 47) is provided so that movement in the z direction is impossible. On the other hand, the base 51 which supports each 2nd conveyance part 48 is connected by the 1st actuator 50 fixed on the top plate 34 of the case 31. As shown in FIG. Therefore, each 2nd conveyance part 48 is provided so that the 1st actuator 50 can move to az direction. The 1st conveyance part 47, the 2nd conveyance part 48, and the 1st actuator 50 are connected to the control apparatus 18, and the operation is controlled. In addition, in this embodiment, the 1st conveyance part 47 is supported by the cylindrical support member provided on the base 49, and the 2nd conveyance part 48 is provided on the base 51. As shown in FIG. It is supported by the cylindrical support member. The base 51 is formed in a lattice pattern so as to connect the second conveyance portions 48, and is disposed between the support members that support the first conveyance portion 47. Therefore, the base 51 can move in a z direction without interfering with the 1st conveyance part 47. FIG. Like the drive part 35, the 1st actuator 50 is comprised by a motor, a ball screw, etc.

In addition, as shown in FIG. 4, the plurality of needle-like lift pins 52 for lifting the substrate W conveyed on the frame 37 are provided inside the frame body of the frame 37. The plurality of lift pins 52 are arranged in a lattice pattern such that the distance between the lift pins 52 adjacent to each other is substantially the same. As shown in FIG. 5, the base 54 supporting each lift pin 52 is connected to a second actuator 53 fixed on the top plate 34 of the case 31, whereby each lift pin ( 52 can be moved simultaneously in the z direction. In addition, on the outer side of the frame 37, a plurality of alignment pins 56 are provided on the outer periphery of the top plate 34 via the third actuator 55 (two in each side in this embodiment) ( See FIG. 4). Each 3rd actuator 55 is comprised so that the alignment pin 56 can be moved to a z direction, and can also be moved to an x direction or a y direction. Specifically, the alignment pin 56 provided on the outer side of the upper edge 41 and the lower edge 42 is provided to be movable in the z direction and the y direction, and the outer side of the right edge 43 and the left edge 44. The alignment pin 56 provided in the is provided so that a movement to a z direction and an x direction is possible. In addition, the second and third actuator ( 55 is connected to the control apparatus 18, and the operation is controlled. On the other hand, in this embodiment, the base 54 is formed in grid | lattice form so that each lift pin 52 may connect, between the support members which support the 1st conveyance part 47, and the 2nd conveyance part 48 ) Is arranged between the supporting members. Therefore, the base 54 (namely, each lift pin 52) can move in a z direction, without interfering with the 1st and 2nd conveyance parts 47 and 48. FIG. The plurality of alignment pins 56 are each independently movable. The 2nd and 3rd actuators 53 and 55 are comprised with the motor, the ball screw, etc. similarly to the drive part 35. As shown in FIG.

As shown in FIG. 3, the carrier 23 moves the conveyance path 12 in a vertical state. As shown in FIG. 6, the carrier 23 is formed in a rectangular rim shape, and the inner periphery 61 thereof is formed closer than the outer periphery 62. In addition, a rectangular edge-shaped recess 63 is formed on an opposing surface (that is, a substrate supporting surface) of the carrier 23 facing the frame 37 of the conveying mechanism 22 rotated in a vertical state. The substrate support 64 which has two side parts (left side part, right side part) and a lower side part, and formed in the width | variety smaller than the width | variety of the inner periphery 61 is being fixed to this recessed part 63. As shown in FIG. The substrate holder 64 can be accommodated in a state in which the substrate W is mounted on the upper end surface (mounting surface 65) of the lower side of the substrate holder 64. In other words, the substrate W is mounted on the mounting surface 65 and received in the carrier 23. The substrate support 64 is made of a resin material such as Vespel (registered trademark).

The carrier 23 is provided with a plurality of clamps 66 that can support the substrate W on the carrier 23 by hanging the substrate W mounted on the mounting surface 65. Specifically, each clamp 66 has its proximal end attached to an outer periphery 62 at each side of the carrier 23, and its proximal end has an inner circumferential end of the substrate support 64. It protrudes inward rather than inside. Each clamp 66 is provided so that rotation is possible between the state which fell in parallel with the carrier 23, and the state which was perpendicular | vertical with respect to the carrier 23. FIG. In addition, a protruding portion 67 is formed below the carrier 23. When the projection part 67 is pinched by the clamping mechanism (not shown) provided in the conveyance path 12, the carrier 23 will be aligned with respect to the conveyance mechanism 22 in the x direction of the conveyance path 12. As shown in FIG.

As shown in FIG. 3, the photoelectric sensor 68 which detects the position in the z direction of the mounting surface 65 is provided between the transfer mechanism 22 and the carrier 23. The photoelectric sensor 68 as a position sensor is controlled by the controller 18, and outputs the position of the mounting surface 65 to the controller 18. In addition, the photoelectric sensor 68 is comprised by the multi-axis photoelectric sensor which contains a several light transmitting element and a pair of light receiving element in a single unit, for example. A plurality of light transmitting elements and a pair of light receiving elements are arranged in a line in the multi-axis photoelectric sensor so that the plurality of optical axes line up in a straight line. Light transmitted from each light transmitting element and reflected by the carrier 23 and the substrate support 64 is received by the corresponding light receiving element. The control apparatus 18 detects the change of the light reception amount of each light receiving element, and detects the position change in the z direction of the board support 64.

For example, as shown in FIG. 7, the frame 37 is provided with 12 suction pads 46 at the upper edge 41 and the lower edge 42, respectively, and the right edge 43 and the left edge ( Five adsorption pads 46 are provided in 44 respectively. Therefore, 34 suction pads 46 are arranged in the rectangular frame of the frame 37. In this embodiment, a plurality of adsorption regions (for example, four regions 71 to 74) to the substrate W are set in the frame 37. Each adsorption zone includes at least one adsorption pad 46. In this case, the same negative pressure is supplied (at the same time) to the adsorption pad 46 included in the same adsorption region, and the negative pressure of each adsorption region can be controlled independently.

Specifically, in the frame 37, the upper main suction area 71 set at the upper edge 41 portion (upper edge portion) and the lower main suction area 72 set at the lower edge 42 portion (lower edge portion). And the right side adsorption area 73 set at the right side 43 part (right side part), and the left side side adsorption area 74 set at the left side edge 44 part (left side part). Preferably, the upper main adsorption area 71 is divided in the center position, and consists of the 1st upper main adsorption area 75 and the 2nd upper main adsorption area 76 as a division area, respectively. In this case, at least one suction pad 46 (in each of the regions 75 and 76 in FIG. 7, for example, six) is disposed in each of the regions 75 and 76. Further, preferably, the lower main adsorption region 72 is also divided at its center position, and each includes the first lower main adsorption region 77 and the second lower main adsorption region 78 as the divided regions. Also in this case, at least one suction pad 46 (in each of the regions 75 and 76, for example, six in each of the regions 77 and 78) is disposed. Therefore, in the present embodiment, six adsorption regions 73 to 78 including four divided regions 75 to 78 are set in the frame 37. In the frame 37, six conduits 79a to 79f for supplying negative pressure to the adsorption pads 46 included in each of the adsorption regions 73 to 78 are provided to extend, and at the same time, the conduits 79a to 79f. Is connected to a common negative pressure source 81 via six valves 80a to 80f provided outside the frame 37, respectively. For this reason, the negative pressure of the adsorption | suction area | regions 73-78 is controlled independently from each other, and can adsorb | suck the board | substrate W for every adsorption | suction area | region. Moreover, vacuum sensors 82a-82f are provided in the pipe lines 79a-79f, respectively, and the pressure in each pipe line 79a-79f is measured. The valves 80a to 80f, the negative pressure source 81, and the vacuum sensors 82a to 82f are connected to the control device 18, and their operation is controlled.

In addition, in this embodiment, either the direction of the 1st upper main suction area | region 75 and the 2nd upper main suction area | region 76 and the 1st lower main suction area | region 77 and the 2nd lower main suction area | region 78 When the board | substrate W is adsorb | sucked in either of the directions, it is possible to support the board | substrate W without falling from the frame 37. FIG.

As shown in FIG. 8, the suction pad 46 includes an output tube 91 to which negative pressure is supplied, a corrugated pad portion 92 attached to the tip of the output tube 91, and a tip of the pad portion 92 (FIG. 8). And an attachment 93 attached to the substrate W and having a contact portion with the substrate W. The attachment 93 is made of a resin material made of PEEK (Poly Ether Ether Ketone) or the like. In this embodiment, the adsorption pad 46 is comprised from the so-called buffer adsorption pad with which the output pipe 91 is movable along the axial direction. Specifically, the output tube 91 includes a hollow first shaft 94 and a hollow second shaft 95 inserted into the first shaft 94, and an inner circumferential surface of the first shaft 94. The flange portion 96 extends toward the inner side in the radial direction at an intermediate position in the axial direction. In the first shaft 94, a coil spring 97 is interposed between the flange portion 96 and the second shaft 95. By this structure, the suction pad 46 is movable in the direction orthogonal to the board | substrate supporting surface of the frame 37. FIG. In addition, the sealing material (not shown) is interposed between the first shaft 94 and the second shaft 95 to maintain the airtightness in the output pipe 91 and at the same time, the second shaft 95 from the first shaft 94. ) Is constructed so that it does not stick out.

Next, the operation | movement which takes the board | substrate W conveyed from the upstream conveyor 21 to the carrier 23 from the transfer mechanism 22 for loading is demonstrated, referring FIG.

Prior to the delivery of the substrate W to the carrier 23, the protrusion 67 of the carrier 23 is sandwiched by a clamping mechanism (not shown) of the carrier path 12. As a result, the carrier 23 which does not support the board | substrate W is aligned with respect to the feed mechanism 22 for rods, and stops. At this time, in the transfer mechanism 22, the lift pins 52 and the alignment pins 56 are located below the first transfer section 47. In addition, since the 2nd conveyance part 48 is not used when receiving the board | substrate W conveyed from the upstream conveyor 21 by the carrier 23, since it is located below the 1st conveyance part 47, it remains. 9, the 2nd conveyance part 48 is abbreviate | omitted.

As shown in FIG. 9A, only the alignment pin 56 (left side in the drawing) provided on the outside of the lower edge 42 protrudes upwardly from the first conveying portion 47, and in this state, the upstream conveyor 21 The board | substrate W supplied from the 1st conveyance part 47 is conveyed above the frame 37. As shown in FIG. The board | substrate W conveyed by the 1st conveyance part 47 stops by contacting the alignment pin 56 provided in the outer side of the lower edge 42.

Next, as shown in FIG. 9B, the lift pin 52 rises above the first conveying portion 47 to support the substrate W, and at the same time, the upper edge 41, the right edge 43, and the left side. The alignment pin 56 provided in the outer side of each edge 44 rises. 9B, only the alignment pin 56 (right side in the figure) outside the upper edge 41 and the alignment pin 56 (left side in the figure) outside the lower edge 42 are shown. Each alignment pin 56 is moved in the x direction or the y direction, so that relative alignment between the frame 37 and the substrate W is performed.

When the relative alignment between the frame 37 and the substrate W is completed, as shown in FIG. 9C, the frame 37 is raised to adsorb the substrate W by the suction pad 46. Lift pin 52 and alignment pin 56 are lowered.

The controller 18 determines whether or not the pressure in each of the conduits 79a to 79f is equal to or less than a predetermined value after a predetermined time has elapsed since the adsorption pad 46 starts adsorption of the substrate W. That is, the adsorption force of the adsorption pad 46 contained in each adsorption area 73-78 is determined. At this time, when there is a pipeline in which the pressure is not lower than or equal to a predetermined value, the controller 18 closes the valve corresponding to the pipeline, and the adsorption operation of the adsorption pad 46 included in the corresponding adsorption region. Stop. And the control apparatus 18 adsorb | sucks the board | substrate W only by the adsorption pad 46 in the adsorption | suction area | region connected to the piping which is set to the pressure below a predetermined value. At this time, either one of the first upper main suction area 75 and the second upper main suction area 76, and either of the first lower main suction area 77 and the second lower main suction area 78 When the board | substrate W is adsorbed, the control apparatus 18 judges that the board | substrate W can be supported, and performs the following operation. On the other hand, the control apparatus 18 judges that the board | substrate W cannot support the board | substrate W, for example, when the board | substrate W is adsorbed only by the left side adsorption | suction area | region 74, etc. by the crack of the board | substrate W, etc. The substrate W is replaced.

Next, as shown in FIG. 9D, the frame 37 rotates from the horizontal state to the vertical state around the rotation axis L of the support member 36. Furthermore, the frame 37 moves in the z direction and the y direction based on the height of the mounting surface 65 detected by the photoelectric sensor 68 while the frame 37 is in a vertical state, and the lower end of the substrate W is mounted on the mounting surface. The substrate W is moved into the recess 63 of the carrier 23 so as not to contact 65. In addition, in this embodiment, the frame 37 moves the board | substrate W to the position which becomes only upwards only predetermined distance H (2 mm in this embodiment) from the mounting surface 65. FIG.

Then, the clamp 66 is laid in parallel with the carrier 23 to hang the substrate W, and vacuum suction by the suction pad 46 is released. Then, as shown in FIG. 9E, the substrate W falls naturally and is mounted on the mounting surface 65 of the substrate holder 64, and the substrate W is turned into the substrate holder 64 of the carrier 23. .

In addition, when the test substrate is conveyed from the dummy cassette 24 onto the transfer mechanism 22, the second transfer portion 48 is located above the first transfer portion 47, and the right edge 43 is provided. The alignment pin 56 located outside the upper side moves above the second conveying unit 48. In this state, the test substrate is conveyed from the left edge 44 to the right edge 43 by the second transfer portion 48. Subsequently, the relative alignment processing between the frame 37 and the test substrate and the transfer processing of the test substrate from the frame 37 to the carrier 23 are performed on the substrate W described above (FIG. 9B). To Fig. 9E).

Next, an operation of receiving the vacuum processed substrate W from the carrier 23 to the unloading transfer mechanism 25 will be described with reference to FIG. 10. In addition, in the unloading feed mechanism 25 shown in FIG. 10, the same code | symbol is attached | subjected and demonstrated to the same component part as the feed mechanism 22 for rods.

In the transfer mechanism 25, the projection 67 of the carrier 23 is sandwiched by the clamping mechanism (not shown) of the carrier path 12 before receiving the substrate W from the carrier 23. For this reason, the carrier 23 which conveys the vacuum processed board | substrate W is aligned with respect to the unloading feed mechanism 25, and stops. At this time, in the transfer mechanism 25, the lift pins 52 and the alignment pins 56 are located below the first transfer unit 47. On the other hand, since the 2nd conveyance part 48 is not used when carrying out the board | substrate W to the downstream conveyor 26 through the carrier 23, since it is located below the 1st conveyance part 47, In FIG. 10, the 2nd conveyance part 48 is abbreviate | omitted.

In this state, as shown in FIG. 10A, the frame 37 stands vertically, and the suction surface Wa of the substrate W held vertically in the carrier 23 is sucked by the suction pad 46. At this time, the rotation shaft L is located below the mounting surface 65 of the substrate support 64 at a position away from the frame 37 with respect to the carrier 23. In order to realize this positional relationship, for example, the supporting member 36 can be formed in an L-shaped cross section as shown in FIG. Next, the clamp 66 rotates in a vertical state in a parallel state with respect to the substrate support surface of the carrier 23 to release the support of the substrate W. As shown in FIG. Next, the frame 37 rotates from the vertical state to the horizontal state with the rotation axis L as the point. As a result, the substrate W is supported in the horizontal state by the frame 37 while being supported by the suction pad 46.

When the substrate W is adsorbed on the suction pad 46, the controller 18 passes the substrate W after the predetermined time has elapsed since the adsorption pad 46 starts adsorption by the suction pad 46. The valve W corresponding to the pipeline in which the pressure is not lower than or equal to the predetermined value is closed, and the substrate W is adsorbed only by the suction pad 46 connected to the pipeline in which the pressure is lower than or equal to the predetermined value.

In addition, as mentioned above, when the frame 37 adsorb | sucks the board | substrate W supported in the carrier 23, the rotation shaft L is located in the position which is farther from the frame 37 with respect to the carrier 23, It is located below the mounting surface 65 of the substrate support 64. For this reason, only after the adsorption of the board | substrate W, the frame 37 rotates only, and the upper end of the board | substrate W and the non-adsorption surface Wb of the board | substrate W are supported by the carrier 23, and The lower end moves as indicated by arrows Y1 and Y2, respectively. Therefore, when the frame 37 is rotated from the vertical state to the horizontal state, the substrate W is moved to the carrier 23 (for example, the mounting surface 65, etc.) without moving the frame 37 up and down and horizontally. It can prevent contact and damage.

Next, as shown in FIG. 10B, the suction by the suction pad 46 is released while the frame 37 rotated in the horizontal state supports the substrate W above the first transport portion 47. . Next, as shown in FIG. 10C, the lift pins 52 are raised above the frame 37 to support the substrate W, and the alignment pins 56 do not contact the substrate W. It rises outward. Each alignment pin 56 is moved in the x direction or the y direction, so that relative alignment between the frame 37 and the substrate W is performed.

And as shown in FIG. 10D, the frame 37, the lift pin 52, and the alignment pin 56 descend below the 1st conveyance part 47, and the board | substrate W is on the 1st conveyance part 47. As shown in FIG. Is mounted on. And the board | substrate W is conveyed by the conveyance mechanism 25 to the downstream conveyor 26 by the 1st conveyance part 47 being driven.

Therefore, in order not to rotate the carrier 23 between the horizontal state and the vertical state (that is, the state in which the carrier 23 is maintained in the vertical state), the member constituting the carrier 23 is made thick to increase its rigidity. There is no need, and the carrier 23 can be reduced in weight.

The substrate transport apparatus 11 of one embodiment has the following advantages.

(1) The substrate conveying apparatus 11 has a frame 37 which has a rectangular frame and which is rotatably supported on a pivot shaft L parallel to the frame extending along the horizontal direction, and a frame ( A transfer mechanism 22 having a plurality of suction pads 46 provided at 37 to adsorb the substrate W, a drive unit 35 for rotating the frame 37 between a horizontal state and a vertical state, and a transfer mechanism 22. The control apparatus 18 which controls the 22 is provided. The transfer mechanism 22 attracts the substrate W to the frame 37 in a horizontal state, rotates the frame 37 in a vertical state, and delivers the substrate W in the vertical state to the carrier 23. . The carrier 23 conveys the substrate W in a vertical state. Therefore, in order to prevent the carrier 23 from rotating between the horizontal state and the vertical state when exchanging the substrate W with the carrier 23, it is necessary to thicken the member constituting the carrier 23 to increase its rigidity. And the weight of the carrier 23 can be reduced. As a result, the manufacturing cost of each carrier 23 can be reduced, and the power required when carrying the carrier 23 can be reduced. Therefore, the production cost of the substrate W can be reduced. Moreover, in order to rotate only the board | substrate W by the frame 37, compared with the case where the carrier which supported the board | substrate W was rotated conventionally, the power required when making the board | substrate W into a vertical state from a horizontal state. Can be effectively reduced, and the production cost of the substrate W can be reduced.

(2) The transfer mechanism 22 rotates the frame 37 in a horizontal state after absorbing the substrate W supported in the vertical state to the carrier 23 into the frame 37 in the vertical state. Therefore, in order not to rotate the carrier 23 between the horizontal state and the vertical state when receiving the substrate W from the carrier 23, it is not necessary to thicken the member constituting the carrier 23 and increase its rigidity. . Therefore, the carrier 23 can be reduced in weight.

(3) The conveyance mechanism 22 is a first that is disposed inside the frame of the frame 37 in a horizontal state and conveys the substrate W supplied in a horizontal state from the upstream conveyor 21 on the frame 37. The conveyance part 47 is provided. Therefore, compared with the case where the transfer robot receives the board | substrate W before a process from the external transfer mechanism, and conveys it over the frame 37, the space which arrange | positions a transfer robot is not needed, and space can be saved.

(4) If the pressure in the conduits 79a to 79f does not fall below a predetermined value within a predetermined time after the controller 18 starts adsorption of the substrate W by the adsorption pad 46, the conduit The valves 80a to 80f provided in the valve are closed. Therefore, even if there is an adsorption region including the adsorption pad 46 which cannot be adhered to the substrate due to the warpage of the substrate W or the breakage of the substrate W, the adsorption pads 46 adhere to the substrate W closely. In the region, the substrate W can be adsorbed. Therefore, since a part of the board | substrate W cannot be adsorb | sucked when the board | substrate W is large, etc., it can reduce that the whole board | substrate W cannot be supported on the frame 37.

(5) Since the adsorption pad 46 is arranged in the frame 37 in the shape of a rectangular frame, the outer periphery of the substrate W is adsorbed and the warpage of the substrate W can be reduced. As a result, the number of adsorption pads 46 can be reduced, for example, compared with the case where the adsorption pads 46 are provided in a grid pattern inside the frame 37. In this case, when the frame 37 is in the vertical state, most of the weight of the substrate W acts on the upper edge 41 and the lower edge 42, so that the upper edge 41 and the lower edge 42 (the upper main portion). The substrate W is adsorbed and supported on the frame 37 by the adsorption pads 46 provided in the adsorption region 71 and the lower main adsorption region 72. Therefore, when the suction pad 46 provided in the upper main adsorption region 71 and the lower main adsorption region 72 cannot adsorb | suck the board | substrate W, when the curvature of the board | substrate W is large, the frame 37 It becomes difficult to support the substrate W on the substrate. In this regard, in the present embodiment, the suction pad 46 is provided on the frame 37, and the frame 37 has an upper main suction area 71, a lower main suction area 72, and a right side part. A plurality of adsorption regions consisting of the adsorption region 73 and the left subadsorption region 74 are formed. In addition, the upper main suction area 71 is composed of the first upper main suction area 75 and the second upper main suction area 76, and the lower main suction area 72 is the first lower main suction area 72. It consists of 77 and the 2nd lower main adsorption area | region 78. As shown in FIG. Therefore, even if the substrate W cannot be adsorbed in the first upper main adsorption region 75, for example, the frame W can be adsorbed in the second upper main adsorption region 76. It becomes possible to support the substrate W on the substrate 37. Therefore, the number of adsorption pads 46 can be reduced and at the same time, a part of the substrate W cannot be adsorbed, such as when the warp of the substrate W is large, so that the entire substrate W is framed 37. It is possible to further reduce the inability to support the substrate on the substrate.

(6) When the transfer mechanism 25 receives the substrate W supported in the perpendicular state to the carrier 23 by the plurality of suction pads 46 in the vertical state of the frame 37, the rotation shaft ( L is located below the mounting surface 65 of the carrier 23 while being located away from the frame 37 with respect to the carrier 23. Therefore, when the frame 37 is rotated, the frame 37 moves upward from the mounting surface 65 and moves away from the carrier 23. Therefore, it is not necessary to vertically move the frame 37 upwardly from the mounting surface 65 or to horizontally move it in the separation direction from the carrier 23. As a result, only by rotating the frame 37, the holding state of the substrate W is changed from the vertical state to the horizontal state while preventing the substrate W from contacting the mounting surface 65 or the like and being damaged.

(7) With the frame 37 in a vertical state, it is possible to move in the z direction and the y direction based on the position of the mounting surface 65 detected by the photoelectric sensor 68. Therefore, while controlling the movement of the frame 37 so that the lower end of the substrate W supported by the frame 37 in the vertical state does not contact the mounting surface 65, the substrate (in the recess 63 of the carrier 23) W) can be accommodated. Therefore, even when the substrate W is heated for the purpose of forming a homogeneous thin film and the carrier 23 is thermally expanded and the height of the mounting surface 65 is changed, the substrate W is damaged. It can be delivered to the carrier 23 without work.

In addition, the said embodiment can be implemented with the following aspects.

Instead of arranging the first conveying unit 47, the second conveying unit 48 and the lift pins 52 inside the frame 37, or in addition to arranging the inside of the frame 37, For example, it can arrange | position outside the frame 37 according to the magnitude | size of the board | substrate W. As shown in FIG. Thereby, even when the size of the board | substrate W becomes larger than the frame 37, it can convey to the frame 37 more reliably.

If the 2nd conveyance part 48 can move to z direction, without interfering with the 1st conveyance part 47, the 2nd conveyance part 48 can provide the 2nd conveyance part 48 in any way. For example, each 2nd conveyance part 48 can be moved to az direction by an individual actuator. Equally, it is not limited to supporting the lift pins 52 on the base 54. The lift pins 52 can be provided in any way as long as they can move in the z direction without interfering with the first and second conveyers 47 and 48.

The first and second conveying parts 47 and 48 can be constituted by, for example, belt conveyors instead of roller conveyors.

By supplying negative pressure to the adsorption pad 46, instead of vacuum adsorption of the substrate W, an electrostatic chuck can be provided in the frame 37, and the substrate W can be adsorbed by electrostatic adsorption.

Instead of connecting the pipe lines 79a to 79f to the common negative pressure source 81, each pipe line 79a to 79f can be connected to an individual negative pressure source.

Instead of arranging the plurality of suction pads 46 in the frame of the frame 37 in the shape of a rectangular frame, the rod 45 can be arranged in a lattice pattern.

Instead of the plurality of poles 45 connecting the upper edge 41 and the lower edge 42 of the frame 37, a plurality of wires coated with PEEK may be used. As a result, the frame can be reduced in weight as compared with the case where the rod 45 is employed.

It is not limited to moving the frame 37 in the z direction based on the height of the mounting surface 65 detected by the photoelectric sensor 68 in the vertical state of the frame 37. For example, when the frame 37 and the substrate W are aligned by the alignment pin 56, the alignment is previously determined based on the height of the mounting surface 65 detected by the photoelectric sensor 68. It can be carried out.

Instead of the photoelectric sensor 68, the position of the mounting surface 65 by thermal expansion can be estimated according to the temperature of the carrier 23 detected by the temperature sensor.

In the frame 37, a first upper main suction area 75, a second upper main suction area 76, a first lower main suction area 77, a second lower main suction area 78, a right side suction Although six adsorption | suction regions which consist of the area | region 73 and the left side adsorption | suction area | region 74 were formed, it is not limited to this, The adsorption | suction area | region can be formed in any way.

The substrate transfer apparatus 11 may not necessarily be equipped with the dummy cassette 24.

The vacuum processing apparatus 1 is not limited to the so-called one-through type vacuum processing apparatus provided with the rod feed mechanism 22 and the unload transfer mechanism 22. For example, the vacuum processing apparatus 1 is comprised by the so-called return type vacuum processing apparatus which receives and receives the board | substrate W between the carriers 23 by one conveyance mechanism 22 or 25. As shown in FIG. May be

Claims (15)

In the substrate transfer apparatus for receiving the substrate to the carrier for transporting the flat substrate in a vertical state,
A frame having a rectangular frame and capable of rotating about a rotation axis extending in a horizontal direction;
A plurality of adsorption pads installed on the frame to adsorb the substrate; And
A transfer mechanism including a drive unit for rotating the frame between a horizontal state and a vertical state,
The transfer mechanism sucks the substrate in a horizontal state with the plurality of suction pads in a horizontal state of the frame, and rotates the frame from a horizontal state to a vertical state while supporting the substrate on the frame, thereby vertically And said substrate in a state is delivered to said carrier. The frame of claim 1, wherein the transfer mechanism absorbs and transfers the substrate supported in the vertical state to the carrier to the plurality of suction pads in the vertical state of the frame, and supports the substrate in the frame. The substrate transport apparatus, characterized in that for rotating from the vertical state to the horizontal state. The said conveyance mechanism is a inside of the said frame frame, The conveyance part is a conveyance part of Claim 1 or 2 which conveys the said board | substrate in the horizontal state of the said frame,
The driving unit supports the frame to be movable up and down along a vertical direction,
The conveying mechanism moves the frame below the conveying unit to convey the substrate by the conveying unit, and moves the frame above the conveying unit while the substrate is positioned above the frame. And a substrate transporting device for absorbing the substrate. The adsorption apparatus according to any one of claims 1 to 3, wherein a plurality of adsorption regions for the substrate are set in the frame, and each of the adsorption regions includes at least one adsorption pad and is included in the same adsorption region. The same negative pressure is supplied to the pad, and the negative pressure of each said adsorption | suction area | region can be controlled independently, The board | substrate conveying apparatus characterized by the above-mentioned. The method of claim 4, wherein the substrate transfer device,
A plurality of conduits provided corresponding to the plurality of adsorption regions, each of which supplies a negative pressure to the corresponding adsorption pad;
A common negative pressure source connected to the plurality of conduits;
A plurality of valves connected to the plurality of conduits, respectively, for opening and closing the corresponding conduits; And
A plurality of vacuum sensors, each disposed in the plurality of conduits, each measuring a pressure in the corresponding conduit;
And after the adsorption of the substrate by the plurality of adsorption pads, if there is a conduit whose pressure is not less than a predetermined value within a predetermined time, the conduit is closed. The method of claim 4 or 5, wherein the plurality of suction pads are arranged in a rectangular shape on the frame of the frame,
The frame of the frame is composed of an upper side, a lower side, a right side, a left side,
The plurality of adsorption zones include an upper main suction area set in the upper side, a lower main suction area set in the lower side, a right side suction area set in the right side, and a left side suction area set in the left side,
Each of the upper main suction region and the lower main suction region includes at least two divided regions. The method of claim 2, wherein the carrier has a mounting surface for supporting the lower end of the substrate in a vertical state,
When the transfer mechanism sucks over the substrate supported in the vertical state to the carrier with the plurality of suction pads in the vertical state of the frame, the rotational axis is a position away from the frame with respect to the carrier, The substrate transport apparatus is located below the mounting surface of the carrier. 8. The drive unit according to any one of claims 1 to 7, wherein the drive unit enables the frame to be moved up and down along a vertical direction, and at the same time, the frame is supported to be moved back and forth along a horizontal direction with respect to the carrier. Substrate transport apparatus, characterized in that. The carrier according to any one of claims 1 to 8, wherein the carrier has a mounting surface that supports a lower end of the substrate in a vertical state.
The substrate transport apparatus further includes a position sensor for detecting a height of the mounting surface of the carrier,
The driving unit supports the frame to be movable up and down along a vertical direction,
The transfer mechanism moves the frame up and down based on a detection result of the position sensor so that the lower end of the substrate does not come into contact with the mounting surface when the substrate in the vertical state is received by the carrier. Substrate conveying device. In a substrate transport method for receiving the substrate from the substrate transport apparatus to a carrier for transporting the flat substrate in a vertical state,
Maintaining a frame having a plurality of adsorption pads in a horizontal state in the substrate transport apparatus, and adsorbing the substrate in a horizontal state to the plurality of adsorption pads in a horizontal state of the frame;
Rotating the frame from a horizontal state to a vertical state while supporting the substrate in the frame; And
And passing the substrate in a vertical state to the carrier. The method of claim 10, further comprising: adsorbing the substrate supported in the vertical state to the carrier with the plurality of suction pads in the vertical state of the frame; And
And rotating the frame from a vertical state to a horizontal state while supporting the substrate in the frame. 12. The apparatus of claim 10 or 11, wherein the plurality of adsorption pads are distributed on the frame to a plurality of adsorption regions, each comprising at least one adsorption pad,
The substrate transport method,
Determining the adsorption force of the plurality of adsorption pads for each of the adsorption regions after a predetermined time after starting adsorption of the substrate by the plurality of adsorption pads; And
And determining for each of the adsorption regions whether to continue driving the plurality of adsorption pads, based on the result of the determination of the adsorption force. 12. The rotational axis of the frame according to claim 11, wherein when the substrate supported in the vertical state by the carrier is attracted to the plurality of suction pads in the vertical state of the frame, the rotational axis of the frame is located farther from the frame with respect to the carrier. Substrate transport method, characterized in that located below the mounting surface of the carrier. The carrier according to any one of claims 10 to 13, wherein the carrier has a mounting surface for supporting a lower end of the substrate in a vertical state.
Receiving the substrate in the vertical state to the carrier,
Detecting a height of the mounting surface of the carrier by a position sensor; And
And moving the frame up and down along the vertical direction based on a detection result of the position sensor so that the lower end of the substrate in the vertical state does not contact the mounting surface. As a vacuum processing apparatus,
A vacuum processing chamber for vacuum-treating a flat plate substrate;
A carrier for conveying the substrate in a vertical state to the vacuum processing chamber; And
A substrate conveying apparatus for receiving the substrate into the carrier, wherein the substrate conveying apparatus comprises:
A frame having a rectangular frame and capable of rotating about a rotation axis extending in a horizontal direction, a plurality of suction pads installed on the frame to adsorb the substrate, and the frame in a horizontal state and a vertical state A transfer mechanism having a drive unit that rotates therebetween; And
A control device for controlling the drive unit and the plurality of suction pads,
The transfer mechanism sucks the substrate in a horizontal state with the plurality of suction pads in a horizontal state of the frame, and rotates the frame from a horizontal state to a vertical state while supporting the substrate on the frame, thereby vertically And vacuuming the substrate in a state into the carrier.
KR1020107011326A 2007-12-11 2008-12-09 Substrate transfer apparatus, substrate transfer method and vacuum processing apparatus KR20100085128A (en)

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CN101889339B (en) 2012-09-05

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