KR20100066237A - Method of testing for connection condition between display panel and driver ic and display device using the same - Google Patents

Abstract

PURPOSE: A method for testing a connection condition between a liquid crystal panel and a driver IC and the liquid crystal display device using the same are provided to add a test point to a liquid crystal panel, thereby measuring a resistance value. CONSTITUTION: In a liquid crystal panel(10), the first pad and the second pad are formed. The first pad is electrically connected to the first test point(41). The second pad is electrically connected to the second test point(42). A driver IC(Integrated Circuit)(20) drives the liquid crystal panel. In the driver IC, the first bump and the second bump electrically connected each other are formed. The first bump and the second bump are located in the left side of the driver IC.

Description

TECHNICAL FIELD OF TESTING FOR TESTING FOR CONNECTION CONDITION BETWEEN DISPLAY PANEL AND DRIVER IC AND DISPLAY DEVICE USING THE SAME}

The present invention relates to a method for testing a connection state between a liquid crystal panel and a driver IC, and a liquid crystal display device using the same.

Recently, as the information society has evolved rapidly, there is a need for a flat panel display having excellent characteristics such as thinning, light weight, and low power consumption, among which a liquid crystal display device has a resolution. It is applied to many parts because it is excellent in color display, image quality, etc.

In general, a liquid crystal display device arranges two substrates on which electrodes are formed so that the surfaces on which the two electrodes are formed face each other, injects a liquid crystal material between the two substrates, and applies a voltage to the two electrodes to generate an electric field. By moving the liquid crystal molecules, the image is expressed by the transmittance of light that varies accordingly.

The liquid crystal display includes a liquid crystal panel in which liquid crystal is injected between two substrates, a backlight unit disposed under the liquid crystal panel and used as a light source, and a driving unit for driving the liquid crystal panel, which is located outside the liquid crystal panel.

Here, the driving unit includes a driving circuit (hereinafter referred to as a driver integrated circuit (IC)) for applying a signal to the wiring of the liquid crystal panel, and according to a method of mounting the driver IC on the liquid crystal panel, a chip on glass (COG) chip on glass, tape carrier package (TCP), chip on film (COF), and the like.

The COG is a technology for mounting a driver IC on the array substrate of the liquid crystal panel, the TCP or COF is to mount the driver IC using a separate film and to bend the film with the driver IC to the back of the liquid crystal panel It has a compact structure.

The present invention provides a display device capable of testing a connection state between a liquid crystal panel and a driver IC.

According to an exemplary embodiment of the present invention, a liquid crystal display device includes: a liquid crystal panel having a first pad electrically connected to a first test point and a second pad electrically connected to a second test point; and driving the liquid crystal panel; And a driver IC in which a first bump and a second bump are electrically connected to each other.

In the test method of the liquid crystal display according to the exemplary embodiment of the present invention, a first pad electrically connected to the first test point and a second pad electrically connected to the second test point are electrically connected to each other. Mounting a driver IC having first and second bumps formed thereon; And testing a connection state of the liquid crystal panel and the driver IC.

According to the present invention, the connection state between the liquid crystal panel and the driver IC can be tested by adding a test point on the liquid crystal panel to measure the resistance value.

The entire test can be performed using the test method, and there is an advantage in that the automation of the COG bonding test is also possible.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a front view illustrating a liquid crystal display according to an exemplary embodiment of the present invention.

Referring to FIG. 1, a liquid crystal display device includes a liquid crystal panel 10, a driver IC 20, and a connection board 30.

The liquid crystal panel 10 displays an image by adjusting the intensity of light passing in units of pixels. The liquid crystal panel 10 includes a color filter substrate and a thin film transistor substrate bonded together with a liquid crystal interposed therebetween. The liquid crystal panel 10 includes a plurality of liquid crystal cells arranged in a matrix at the intersection of the data line and the gate line.

The thin film transistor TFT formed in each of the liquid crystal cells charges the liquid crystal cell with an image signal supplied from the data line in response to a scan signal supplied from the gate line. The liquid crystal cell controls light transmittance by driving a liquid crystal having dielectric anisotropy according to a charged image signal.

On the liquid crystal panel 10 according to the present invention, test points 41, 42, 43, and 44 are formed to test a connection state with the driver IC 20.

The driver IC 20 is mounted on a thin film transistor substrate of the liquid crystal panel 10 in a chip on glass (COG) manner to drive the liquid crystal panel 10.

The connection substrate 30 is connected to the thin film transistor substrate. The connection substrate 30 is bonded to the thin film transistor substrate and electrically connected to the thin film transistor substrate. The connection board 30 is a flexible printed circuit board (FPCB).

The connecting substrate 30 is connected to the liquid crystal panel 10 by an anisotropic conductive film (ACF, not shown).

FIG. 2A is a front view illustrating a part of the liquid crystal panel 10 corresponding to parts A and A 'of FIG. 1, and FIG. 2B is a bump of the driver IC 20 corresponding to parts A and A' of FIG. 1. Is a front view showing the projected shape by dotted lines.

The liquid crystal panel 10 includes a first pad 51, a second pad 52, a third pad 53, a fourth pad 54, a plurality of other pads 50, and a first test point. (41), the second test point 42, the third test point 43 and the fourth test point 44.

The plurality of pads 50 are connected to the plurality of bumps 60 of the driver IC 20. Accordingly, the plurality of pads 50 are disposed at positions corresponding to the plurality of bumps 60 of the driver IC 20.

The first test point 41, the second test point 42, the third test point 43, and the fourth test point 44 are the first pad 51, the second pad 52, and the third test point 44. The pad 53, the fourth pad 54, and the plurality of pads 50 are disposed outside the arrangement area of the pads 50. That is, the first pad 51, the second pad 52, the third pad 53, the fourth pad 54, and the plurality of pads 50 are mounted in the mounting area 70 of the driver IC 20. ) And the first test point 41, the second test point 42, the third test point 43, and the fourth test point 44 are mounted in the mounting area of the driver IC 20. 70) placed outside

Specifically, the first test point 41 and the second test point 42 are disposed outside the left side of the mounting area 70 of the driver IC 20 on the liquid crystal panel 10, and the third test point 43 and The fourth test point 44 is disposed outside the right side of the mounting area 70 of the driver IC 20 on the liquid crystal panel 10.

The first pad 51, the second pad 52, the third pad 53, and the fourth pad 54 on the liquid crystal panel 10 are respectively the first bump 21 of the driver IC 20, The second bumps 22, the third bumps 23, and the fourth bumps 24 correspond to each other.

The first test point 41 is electrically connected to each other through the first pad 51 and the connection line 45. The second test point 42 is electrically connected to the second pad 52 through another connection line 46.

The third test point 43 on the right side of the liquid crystal panel 10 is electrically connected to each other through the third pad 53 and the connection line 47, and the fourth test point 44 is connected to the fourth pad ( 54 and the other connection line 48 are electrically connected to each other.

The driver IC 20 includes a plurality of bumps 60 in addition to the first bump 21, the second bump 22, the third bump 23, and the fourth bump 24.

As described above, the plurality of bumps 60 are electrically connected to the plurality of pads 50 on the liquid crystal panel 10. That is, the plurality of bumps 60 are disposed at positions corresponding to the plurality of pads 50 on the liquid crystal panel 10, respectively.

The first bump 21 and the second bump 22 according to the embodiment of the present invention are electrically connected to each other through the connection line 25. In addition, the third bump 23 and the fourth bump 24 are electrically connected to each other through another connection line 26.

The plurality of pads 50, the first pad 51, the second pad 52, the third pad 53, the fourth pad 54 and the driver IC 20 on the liquid crystal panel 10 described above. The plurality of bumps 60, the first bump 21, the second bump 22, the third bump 23, and the fourth bump 24 are electrically connected to each other. Hereinafter, a description will be given of how the liquid crystal panel 10 and the driver IC 20 are electrically connected.

3 is a perspective view illustrating a state in which the liquid crystal panel 10 and the driver IC 20 illustrated in FIGS. 2A and 2B are connected to each other.

The driver IC 20 is mounted on a thin film transistor substrate of the liquid crystal panel 10 in a chip on glass (COG) manner to drive the liquid crystal panel 10.

In the driver IC 20 according to the exemplary embodiment of the present invention, the first bump 21, the second bump 22, the third bump 23, and the fourth bump 24 are each formed on the liquid crystal panel 10. The first pad 51, the second pad 52, the third pad 53, and the fourth pad 54 are disposed to correspond to each other. In addition, each of the plurality of bumps 60 of the driver IC 20 may be disposed to correspond to each of the plurality of pads 50 on the liquid crystal panel 10.

As described above, when the driver IC 20 is mounted in the COG method on the liquid crystal panel 10, the first test point 41, the first pad 51, and the first bump 21 on the liquid crystal panel 10 are provided. Are electrically connected to each other through a connection line 45, and the first pad 51 and the first bump 21 are connected to the second pad 52 and the second bump 22 through the connection line 25. The second pads 52 and the second bumps 22 are electrically connected to each other, and are electrically connected to each other through the second test point 42 and the connection line 46.

That is, whether the driver IC 20 is electrically connected to the liquid crystal panel 10 is determined by the first test point 41 and the first pad 51, the first bump 21, and the second bump 22. ) And the second test pad 42 is electrically connected to the second test point 42.

In addition, the third test point 43 is electrically connected to the fourth test point 44 via the third pad 53, the third bump 23, the fourth bump 24, and the fourth pad 54. Should be tested.

4 is a diagram illustrating a test state of a connection state between the liquid crystal panel 10 and the driver IC 20 according to an exemplary embodiment of the present invention.

As described above, the resistance tester is provided at each of the first test point 41 and the second test point 42 and the third test point 43 and the fourth test point 44 existing on the liquid crystal panel 10. You can test the connection with.

If the resistance of both ends is tested and the reference value is exceeded, the connection state can be classified as bad.

In addition, when the resistance difference between both ends is large, it is understood that the pressure did not work uniformly in the process of applying the driver IC 20 to the liquid crystal panel 10 using an anisotropic conductive film (not shown). Can be.

That is, the aforementioned test points 41, 42, 43, and 44 have a predetermined area and are formed to be exposed to the outside of the mounting area 70 of the driver IC 20, and the probes of the tester or the measuring device are in contact with each other.

When using this test method, it is possible to further quantify the existing visual inspection and sampling inspection, and also to perform the whole inspection. In addition, it is possible to implement the automation of the test by providing a separate resistance value meter.

In addition, although the preferred embodiment of the present invention has been shown and described above, the present invention is not limited to the specific embodiments described above, but the technical field to which the invention belongs without departing from the spirit of the invention claimed in the claims. Of course, various modifications can be made by those skilled in the art, and these modifications should not be individually understood from the technical spirit or prospect of the present invention.

1 is a front view illustrating a liquid crystal display according to an exemplary embodiment of the present invention.

FIG. 2A is a front view illustrating a part of the liquid crystal panel corresponding to parts A and A ′ of FIG. 1.

2B is a front view illustrating a state in which bumps of the driver ICs corresponding to parts A and A 'of FIG. 1 are projected.

3 is a perspective view illustrating a state in which the liquid crystal panel and the driver IC shown in FIGS. 2A and 2B are connected.

4 is a diagram illustrating a test state of a connection state between a liquid crystal panel and a driver IC according to an exemplary embodiment of the present invention.

Claims (10)

A liquid crystal panel having a first pad electrically connected to the first test point and a second pad electrically connected to the second test point; And a driver IC driving the liquid crystal panel and having first bumps and second bumps electrically connected to each other. The method of claim 1, The liquid crystal panel further includes a third pad electrically connected to a third test point and a fourth pad electrically connected to a fourth test point. The method of claim 2, The driver IC further comprises a third bump and a fourth bump electrically connected to each other. The method of claim 3, And the first and second bumps are positioned on the left side of the driver IC, and the third and fourth bumps are positioned on the right side of the driver IC. The method of claim 3, The first pad and the second pad are formed at positions corresponding to the first bump and the second bump, respectively, and the third pad and the fourth pad are formed at positions corresponding to the third bump and the fourth bump, respectively. Liquid crystal display. The method of claim 1, The first pad and the first bump are electrically connected to each other, And the second pad and the second bump are electrically connected to each other. The method of claim 3, The third pad and the third bump are electrically connected to each other, The fourth pad and the fourth bump are electrically connected to each other. The method of claim 1, And the first bump and the second bump are electrically connected to each other in the driver IC. Mounting a driver IC having a first bump and a second bump electrically connected to each other on a liquid crystal panel having a first pad electrically connected to the first test point and a second pad electrically connected to the second test point. step; And And testing a connection state of the liquid crystal panel and the driver IC. The method of claim 9, wherein the testing of the connection state of the liquid crystal panel and the driver IC comprises: And a method of measuring a resistance between the first test point and the second test point.

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