KR20110067513A - Liquid crystal display device - Google Patents

Abstract

PURPOSE: A liquid crystal display device is provided to evaluate whether a PCB is properly attached to a liquid crystal display panel by using a bonding mark as well as an align mark. CONSTITUTION: A liquid crystal display device comprises a liquid crystal display panel(100), a PCB(200) which is connected to the liquid crystal display panel, and a first align mark and a second align mark which is placed corresponding to the first align mark. The liquid crystal display panel comprises a first align mark and a first bonding key mark(140a). The first align mark and the first bonding key mark.

Description

[0001] LIQUID CRYSTAL DISPLAY DEVICE [0002]

The embodiment relates to a liquid crystal display device, and more particularly, to a liquid crystal display device capable of quantifying a bonding alignment during bonding of a liquid crystal display panel and a printed circuit board.

Recently, with the development of the information society, the necessity of flat panel displays having excellent characteristics such as thinning, light weight, and low power consumption has emerged. Among them, liquid crystal display devices have a resolution and color. It is applied to many parts because of its excellent display and image quality.

In general, a liquid crystal display device is formed by arranging two substrates on which electrodes are formed so that the surfaces on which two electrodes are formed face each other, injecting a liquid crystal material between the two substrates, and then applying voltage to the two electrodes. By moving the liquid crystal molecules by the electric field is a device that represents the image by the transmittance of light that varies accordingly.

Such a liquid crystal display device is a liquid crystal display panel in which liquid crystal is injected between two substrates, a backlight unit disposed under the liquid crystal display panel and used as a light source, and a driving unit for driving the liquid crystal display panel located outside the liquid crystal display panel. Is done.

In accordance with the trend toward lighter, thinner and lower cost of liquid crystal display devices, a chip on glass (COG) mounting method and a printed circuit board are directly bonded to the liquid crystal display panel. Film on glass (FOG) mounting method is adopted.

Chip-on glass and film-on-glass mounting methods use an anisotropic conductive film (ANISTROPIC CONDUCTIVE FILM) to electrically and mechanically connect the driving circuit or the printed circuit board with the liquid crystal panel.

In the past, when the printed circuit board and the liquid crystal display panel are bonded to each other in a film-on-glass mounting method, whether or not the printed circuit board is properly bonded to the liquid crystal display panel is confirmed between bonding marks and bonding pads. Visual inspection comparing the width of the liver was performed.

Therefore, there was no quantitative evaluation criteria for determining whether the printed circuit board was properly bonded. In addition, when the printed circuit board is stretched by heat at the time of bonding, it is difficult to grasp the stretched degree and apply a thermal correction value.

That is, referring to FIGS. 1A to 1C, conventionally, only an alignment mark is provided on a liquid crystal display panel and a printed circuit board, and the thinner alignment mark is displayed in a rectangular shape or the like. Therefore, when the liquid crystal display panel and the printed circuit board are bonded together, it is difficult to clearly determine how much mis-alignment occurs, and when it is determined that the misalignment is quantitative, A separate measurement process was needed for the judgment.

In addition, even when the printed circuit board is stretched by heat at the time of bonding, a separate measurement process is required to determine the heat correction value.

The embodiment provides a liquid crystal display device capable of quantitatively evaluating whether a printed circuit board is properly bonded to a liquid crystal display panel and deriving a thermal correction value when the printed circuit board is extended by heat.

According to an exemplary embodiment, a liquid crystal display (LCD) device may include: a liquid crystal display panel displaying an image and including a first alignment mark and a first bonding key mark; And a printed circuit board connected to the liquid crystal display panel and including a second alignment mark and a second bonding key mark respectively corresponding to the first alignment mark and the first bonding key mark. .

In addition, in the liquid crystal display, the plurality of bonding key marks may be provided, and the bonding key marks may have different sizes.

In addition, the adhesion key marks may be arranged in a line or may be formed on both sides of the alignment mark.

The liquid crystal display device according to the embodiment may include a bonding key mark in addition to the alignment mark to quantitatively evaluate whether the printed circuit board is properly bonded to the liquid crystal display panel.

In addition, by varying the size of the cemented key mark, by displaying the length of the gap in the cemented key mark, it is possible to quantitatively evaluate the degree of distortion of the printed circuit board.

In addition, by providing the bonding key marks on both sides of the alignment mark, when the printed circuit board is stretched by heat at the time of bonding, it is possible to derive the thermal correction value immediately without additional measurement.

In the description of the embodiments, each panel, member, frame, key, mark, or substrate is formed on or under the "on" of each panel, member, frame, key, mark, or substrate, and the like. When described as being "in" and "under" includes both those that are formed "directly" or "indirectly" through other components.

In addition, the criteria for the top, side or bottom of each component will be described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 illustrates a case in which a liquid crystal display panel and a printed circuit board are bonded to each other according to an exemplary embodiment. 3 illustrates a case in which a liquid crystal display panel and a printed circuit board are bonded to each other according to another exemplary embodiment. 4 illustrates a case in which a liquid crystal display panel and a printed circuit board are bonded to each other according to another exemplary embodiment. 5 is an enlarged perspective view illustrating a portion of the cemented key mark in accordance with one embodiment. FIG. 6 is a plan view of a portion of the cemented key mark in FIG. 5.

Referring to FIG. 2, the liquid crystal display panel 100 displays an image by adjusting the intensity of light passing through in units of pixels. Although not shown in detail, the liquid crystal display panel 100 is interposed between a thin film transistor (TFT) substrate, a color filter substrate, and a substrate disposed between the two substrates to maintain a uniform cell gap facing each other. It includes a liquid crystal layer.

A plurality of gate lines are formed in the thin film transistor substrate, a plurality of data lines intersecting the plurality of gate lines are formed, and a thin film transistor TFT is formed at an intersection area of the gate line and the data line.

The thin film transistor TFT fills a liquid crystal cell with an image signal supplied from a data line in response to a scan signal supplied from a gate line. The liquid crystal cell controls light transmittance by driving a liquid crystal having dielectric anisotropy according to a charged image signal.

The liquid crystal display panel 100 includes a display area, that is, an area in which light beams are actually transmitted to display an image, that is, a driving area, and a non-display area, that is, a non-drive area, in which an image is not displayed because the light beam is blocked by a black matrix. Include. The liquid crystal display panel 100 and the printed circuit board 200 are bonded to the non-display area 110.

The non-display area 110 is provided with an alignment mark 130 and bonding key marks 140a and 140b. The alignment mark 130 and the adhesion key marks 140a and 140b are used to determine a misalignment when the liquid crystal display panel 100 is bonded to the printed circuit board 200.

The printed circuit board 200 is electrically connected to the thin film transistor substrate. The printed circuit board 200 may be a flexible printed circuit board (FPCB).

The liquid crystal display panel 100 includes a first alignment mark 130 and first bonding key marks 140a and 140b, and the printed circuit board 200 includes the first alignment mark 130 and the first alignment mark 130. The second alignment mark 230 and the second engagement key marks 240a and 240b respectively corresponding to the first engagement key marks 140a and 140b are included.

The first sticking key marks 140a and 140b and the second sticking key marks 240a and 240b correspond to each other. The first bonding key marks 140a and 140b correspond to the second bonding key marks 240a and 240b so that the first bonding key marks 140a and 140b are twisted with respect to the printed circuit board 200. Able to know. This can be seen by the length of the scale, etc., in which the first engagement key marks 140a and 140b are displayed on the second engagement key marks 240a and 240b. Accordingly, the printed circuit board 200 should be corrected to the degree that the first bonding key marks 140a and 140b are misaligned with respect to the printed circuit board 200.

Therefore, in the liquid crystal display according to the exemplary embodiment, since the degree of twisting of the first bonding key marks 140a and 140b is numerically determined according to a definite criterion, the trial and error may be repeated several times. The printed circuit board 200 may be quantitatively corrected without going through.

In one embodiment, a plurality of the first sticking key marks (140a, 140b) and the second sticking key marks (240a, 240b) may be formed. In addition, the first bonding key marks 140a and 140b have the same size, but the second bonding key marks 240a and 240b have different sizes. In addition, the size of the second bonding key marks 240a and 240b may decrease as the inside of the printed circuit board enters from the outside of the printed circuit board, but vice versa.

Therefore, when the first engagement key marks 140a and 140b and the second engagement key marks 240a and 240b are formed in plural numbers, the number of comparison targets increases so that the degree of twisting can be determined more effectively. In addition, since the sizes of the first bonding key marks 140a and 140b are the same, but the sizes of the second bonding key marks 240a and 240b are different from each other, more quantitative evaluation is possible. . That is, since the first bonding key marks 140a and 140b are the same, when the first bonding key marks 140a and 140b and the second bonding key marks 240a and 240b having different sizes correspond to each other, The degree of twisting can be easily understood, and the quantitative evaluation can be performed by the length of the scale or the like displayed on the second bonding key marks 240a and 240b.

As a result, when the sizes of the second engagement key marks 240a and 240b are displayed, the degree of distortion can be quantitatively evaluated in comparison with the respective second engagement keys 241, 242 and 243.

In one embodiment, the plurality of second sticking key marks 240a and 240b may be arranged in a line corresponding to the first sticking key marks 140a and 140b. In addition, as shown in FIG. 3, the second sticking key marks 250a and 250b may be disposed in one region of the first sticking key marks 150a and 150b. Since it is possible to compare the misalignment at a time by using a plurality of bonding keys of different sizes, it is possible to more effectively determine the misalignment.

The first bonding key mark may be cross-shaped (140a, 140b) or bar (160a, 160b), but is not limited thereto. The second bonding key mark has a shape corresponding thereto. That is, when the first engagement key marks 140a and 140b have a cross shape, the second engagement key marks 240a and 240b have a cross-road shape in which a cross shape may be disposed in the center, and the first engagement key marks 140a and 140b may have a cross shape. When the key marks 160a and 160b are rod-shaped, the second cemented key marks 260a and 260b may be shaped like sharp pencils.

Accordingly, the misalignment is determined by the degree that the first engagement key marks 140a and 140b deviate from the central portion of the second engagement key marks 240a and 240b.

In addition, by displaying the length of the interval in the second engagement key marks (240a, 240b) corresponding to the first engagement key marks (140a, 140b) (for example, by displaying the scale as described above), the miss Quantitative evaluation of the alignment is possible.

In addition, the transverse direction may be more effective in preventing misalignment than the longitudinal direction of the engagement key marks. Accordingly, as shown in FIG. 4, the first bonding key marks 160a and 160b are rectangular (that is, a rectangle longer than the horizontal direction), and the second bonding key marks 260a and 260b are pencil-shaped. A quantitative evaluation of the misalignment is possible by using a shape having a sharp end, such as a shape, and marking the length by a scale or the like as described above.

The second bonding key marks 240a and 240b may be formed on both sides of the second alignment mark 230 of the printed circuit board 200. Accordingly, by providing the second bonding key marks 240a and 240b at both sides of the alignment mark, the thermal correction value is immediately obtained without additional measurement when the printed circuit board 200 is stretched by heat at the time of bonding. Can be derived.

That is, in the case where the printed circuit board 200 and the liquid crystal display panel 100 are bonded together, a misalignment occurs when the printed circuit board is extended by heat. The liquid crystal display according to the present invention can derive the thermal correction value at the same time as the alignment without actually measuring the misalignment degree.

5 is an enlarged perspective view illustrating a portion of the cemented key mark in accordance with one embodiment. FIG. 6 is a plan view of a portion of the cemented key mark in FIG. 5.

As shown in FIG. 5, a plurality of first bonding key marks 140a and 140b are provided in the non-display area 110 of the liquid crystal display panel 100, and correspondingly, the second bonding key is attached to the printed circuit board 200. The marks 240a and 240b are provided. In FIG. 5, only the cross shape is illustrated, but the shape of the fitting key is not limited to the cross shape.

As shown in FIG. 6, the first cemented key marks 140a and 140b have the same size, but the second cemented key marks 240a and 240b are smaller in size from the outside to the inside of the printed circuit board 200. Lose. Therefore, by using the second bonding key marks 240a and 240b having different sizes, the misalignment can be determined as described above, and quantitative determination is also possible.

As described above, in the related art, the first align mark 130 is determined based on the position and area corresponding to the second align mark 230, but there is no criterion for misalignment. However, quantitative evaluation was not possible.

However, the liquid crystal display according to the embodiment may further include a bonding key mark as well as an alignment mark, thereby quantitatively evaluating whether the printed circuit board 200 is properly bonded to the liquid crystal display panel 100.

In addition, by varying the size of the cemented key mark, by displaying the length of the interval in the cemented key mark, it is possible to quantitatively evaluate the degree of distortion of the printed circuit board 200.

In addition, by providing the bonding key marks on both sides of the alignment mark, when the printed circuit board is stretched by heat at the time of bonding, it is possible to derive the thermal correction value immediately without additional measurement.

Although described above with reference to the embodiment is only an example and is not intended to limit the invention, those of ordinary skill in the art to which the present invention does not exemplify the above within the scope not departing from the essential characteristics of this embodiment It will be appreciated that many variations and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

FIG. 1A illustrates a case where a conventional liquid crystal display panel and a printed circuit board are bonded together.

FIG. 1B illustrates a case in which the liquid crystal display panel and the printed circuit board are properly aligned in FIG. 1A, and FIG. 1C illustrates a case in which misalignment occurs between the liquid crystal display panel and the printed circuit board.

2 illustrates a case in which a liquid crystal display panel and a printed circuit board are bonded to each other according to an exemplary embodiment.

3 illustrates a case in which a liquid crystal display panel and a printed circuit board are bonded to each other according to another exemplary embodiment.

4 illustrates a case in which a liquid crystal display panel and a printed circuit board are bonded to each other according to another exemplary embodiment.

5 is an enlarged perspective view illustrating a portion of the cemented key mark in accordance with one embodiment.

FIG. 6 is a plan view of a portion of the cemented key mark in FIG. 5.

Claims (7)

A liquid crystal display panel which displays an image and includes a first alignment mark and a first bonding key mark; And And a printed circuit board connected to the liquid crystal display panel, the printed circuit board including a second alignment mark and a second bonding key mark corresponding to the first alignment mark and the first bonding key mark, respectively. Display. The method of claim 1, And the second bonding key mark is plural. The method of claim 2, And the plurality of second bonding key marks have different sizes. The method of claim 2, And the plurality of second bonding key marks are arranged in a line. The method of claim 1, And the first alignment mark and the first bonding key mark are formed in a non-display area of the liquid crystal display panel. The method of claim 1, And the second bonding key mark is formed on both sides of the second alignment mark of the printed circuit board. The method of claim 1, And the first cemented key mark is cross-shaped or rod-shaped.

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