KR20100061935A - Composition of barrier rib and plasma display panel - Google Patents

Abstract

PURPOSE: A composition of a barrier rib and a plasma display panel are provided to improve degree of uniformity of the barrier rib by manufacturing the barrier rib using filler which has high thermal conductivity and to enhance structural reliability of the barrier rib. CONSTITUTION: A composition of a barrier rib includes glass materials and filler. The filler includes one material which is selected from silicon carbide and carbon nanotubes and one material which is selected from boron nitride, zinc oxide, and alumina. The glass material does not include lead component. A plasma display panel comprises: a front substrate(101); a rear substrate(111) facing to the front substrate; and the barrier rib which is arranged between the front and rear substrates and includes the silicon carbide or carbon nanotubes.

Description

Bulkhead composition and plasma display panel {Composition of Barrier Rib and Plasma Display Panel}

The present invention relates to a partition wall composition and a plasma display panel.

The plasma display panel includes a phosphor layer formed in a discharge cell divided by a partition, and includes a plurality of electrodes.

When the drive signal is supplied to the electrode of the plasma display panel, the discharge is generated by the drive signal supplied in the discharge cell. Here, when discharged by a drive signal in the discharge cell, the discharge gas filled in the discharge cell generates vacuum ultraviolet rays, and the vacuum ultraviolet light emits the phosphor formed in the discharge cell to emit visible light. Generate. The visible light displays an image on the screen of the plasma display panel.

SUMMARY OF THE INVENTION An object of the present invention is to provide a plasma display panel and a partition composition in which the uniformity of the partition walls is improved by manufacturing partition walls using a filler having high thermal conductivity.

The partition composition according to the present invention may include a glass material and a filler, and the filler may include at least one material of silicon carbide (SiC) and carbon nanotubes (CNT).

In addition, the filler may further include at least one material of boron nitride (BN), zinc oxide (ZnO), and alumina (Al ₂ O ₃ ).

In addition, the glass material may not include a lead (Pb) component.

Plasma display panel according to the present invention is disposed between the front substrate, the rear substrate disposed opposite the front substrate and the front substrate and the rear substrate, and at least one material of silicon carbide (SiC) and carbon nanotubes (CNT) It may include a partition wall.

In addition, the partition wall may further include at least one material of boron nitride (BN), zinc oxide (ZnO), and alumina (Al ₂ O ₃ ).

In addition, the glass material may not include a lead (Pb) component.

The barrier rib composition and the plasma display panel according to the present invention can improve the uniformity of the barrier rib by manufacturing the barrier rib using a filler having high thermal conductivity, thereby improving the structural reliability of the barrier rib.

Hereinafter, a barrier rib composition and a plasma display panel according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a diagram for explaining the structure of a plasma display panel.

Referring to FIG. 1, the plasma display panel 100 includes a front substrate 101 on which display electrodes 102 and 103 are disposed, and address electrodes 113 and X intersecting the display electrodes 102 and 103. It may include a rear substrate 111.

The display electrodes 102 and 103 may refer to the scan electrodes 102 and Y and the sustain electrodes 103 and Z, respectively.

The discharge currents of the scan electrodes 102 and Y and the sustain electrodes 103 and Z are limited on the display electrodes 102 and 103, that is, the scan electrodes 102 and Y and the sustain electrodes 103 and Z. An upper dielectric layer 104 may be disposed that insulates between 102 and Y and the sustain electrodes 103 and Z.

A protective layer 105 may be formed on top of the upper dielectric layer 104 to facilitate discharge conditions. The protective layer 105 may include a material having a high secondary electron emission coefficient, such as magnesium oxide (MgO).

Address electrodes 113 and X may be formed on the rear substrate 111, and a lower dielectric layer 115 may be formed on the address electrodes 113 and X to insulate the address electrodes 113 and X.

On top of the lower dielectric layer 115 is formed a discharge space, that is, partitions 112 such as stripe type, well type, delta type, and honeycomb type for partitioning the discharge cells. Can be. Accordingly, a first discharge cell emitting red (R) light, a second discharge cell emitting blue (B) light, and green (Green) between the front substrate 101 and the rear substrate 111. : G) A third discharge cell or the like that emits light can be formed.

In addition, the partition wall 112 may include a first partition wall 112a and a second partition wall 112b that cross each other, where the height of the first partition wall 112a and the height of the second partition wall 112b may be different from each other. have. In addition, the first partition wall 112a may be parallel to the scan electrode 102 and the sustain electrode 103, and the second partition wall 112b may be parallel to the address electrode 113.

In addition, the height of the first partition wall 112a may be lower than the height of the second partition wall 112b. Then, the impurity gas inside the panel can be effectively exhausted to the outside during the injection process of the exhaust and discharge gas, and the discharge gas can be evenly diffused inside the panel.

In addition, the partition wall 112 may include a material having excellent thermal conductivity. Preferably, the partition wall 112 may include at least one material of silicon carbide (SiC) and carbon nano-tube (CNT) having excellent thermal conductivity. In addition, the partition wall 112 may further include at least one material of boron nitride (Bron Nitride: BN), zinc oxide (Zinc Oxide: ZnO), and alumina (Alumina: Al ₂ O ₃ ).

The composition of the partition 112 will be described in more detail later.

The discharge gas may be filled in the discharge cells partitioned by the partition wall 112.

In addition, a phosphor layer 114 for emitting visible light for image display may be formed in a discharge cell partitioned by the partition wall 112. For example, a first phosphor layer that generates red light, a second phosphor layer that generates blue light, and a third phosphor layer that generates green light may be formed.

In addition, the above description shows only the case where the upper dielectric layer 104 and the lower dielectric layer 115 are each one layer, but at least one of the upper dielectric layer 104 and the lower dielectric layer 115 is shown. May be made of a plurality of layers.

In addition, although the width and thickness of the address electrode 113 formed on the rear substrate 111 may be substantially constant, the width or thickness inside the discharge cell may be different from the width or thickness outside the discharge cell. . For example, the width or thickness inside the discharge cell may be wider or thicker than that outside the discharge cell.

When a predetermined signal is supplied to at least one of the scan electrode 102, the sustain electrode 103, and the address electrode 113, discharge may occur in the discharge cell. As such, when discharge is generated in the discharge cell, ultraviolet rays may be generated by the discharge gas filled in the discharge cell, and the ultraviolet rays may be irradiated onto the phosphor particles of the phosphor layer 114. Then, a predetermined image may be displayed on the screen of the plasma display panel 100 by the phosphor particles irradiated with ultraviolet rays to emit visible light.

2 to 3 are diagrams for explaining the method for producing a partition wall.

First, referring to FIG. 2, first, a glass material, a filler, an organic solvent, a binder, an additive, and the like may be mixed to form a barrier paste (S200). Here, the glass material used for manufacturing the partition paste has a form of glass powder.

Here, the glass material may be used to form the strength of the partition wall to a sufficiently high level. For example, the glass material is 5 to 25 parts by weight SiO ₂ , 20 to 45 parts by weight B ₂ O ₃ , 15 to 45 parts by weight ZnO, 0.1 to 20 parts by weight MgO, 0.1 to 20 parts by weight SrO, 0.1 to 20 parts by weight BaO, It may comprise from 0.1 to 10 parts by weight of Na ₂ O, 0.1 to 10 parts by weight of Li ₂ O and, from 0.1 to 10 parts by weight of Al ₂ O ₃ material.

In addition, the glass material used to manufacture the partition paste may not include a lead (Pb) component. The lead component may cause serious environmental pollution and serious adverse effects on the human body, so the glass material used for manufacturing the partition wall of the plasma display panel of the present invention may preferably contain no lead component.

In addition, the filler may be used to keep the height of the partition sufficiently high in forming the partition and to sufficiently strengthen the strength of the partition.

In addition, the filler may include a material having excellent thermal conductivity. When the filler of the material excellent in thermal conductivity is used, the uniformity of a partition can be improved.

On the other hand, the filler used in the production of the partition wall in the present invention is not particularly limited as long as the thermal conductivity is excellent, but a material that excessively lowers the strength of the partition wall, excessively high or low thermal expansion coefficient or material with an excessively high melting temperature is used It may be desirable not to.

For example, copper (Cu) has a very good thermal conductivity of about 397 [W / mK]. However, when copper is used as a filler, the dielectric constant of the partition wall is excessively lowered, thereby deteriorating panel characteristics and at the same time having a high melting point. It can be difficult to apply.

In consideration of this, the filler used in the present invention may include at least one material of silicon carbide (SiC) and carbon nano-tube (CNT) having excellent thermal conductivity, and more preferably. Preferably, the filler may further include at least one material of boron nitride (BN), zinc oxide (ZnO), and alumina (Alumina: Al ₂ O ₃ ).

Thereafter, the barrier rib paste may be applied to the rear substrate by using a screen printing method (S210).

In such a coating process of the barrier rib paste, the barrier rib paste may be applied to the rear substrate several times in order to apply the barrier rib paste to a sufficient thickness.

In addition, a drying process may be further included between the application processes of each partition paste.

After the barrier paste is applied, the barrier material layer 300 may be formed on the rear substrate 111 as shown in FIG. 3A. In FIG. 3, an identification number 113 is an address electrode X, and an identification number 115 is a lower dielectric layer.

After the coating process of the partition paste, the developing process S220 may be performed.

In this development step, as shown in FIG. 3B, a photo mask 310 having a predetermined pattern is disposed on the barrier material layer 300, and the barrier material layer 300 is formed using a photo mask. It can be exposed. Here, in order to expose the barrier material layer 300, it is possible to form a photoresist layer on the barrier material layer 300.

Thereafter, the exposed partition wall material layer 300 may be etched by sandblasting or etching to perform a development process.

After the developing process, if the photoresist layer remains on the barrier material layer 300, a process of removing the photoresist layer may be further added.

Thereafter, when the baking process S230 is performed by applying a predetermined heat to the developed barrier material layer 300, the barrier rib 112 may be formed as shown in FIG. 3C.

2 to 3 illustrate only an example of a method of manufacturing the partition wall 112 using an etching process or a sand blast process, the partition wall (Laminating) method using a green sheet (Laminating) method using a green sheet ( It may also be possible to form 112.

On the other hand, the glass material and filler which are mixed together in the formation process of a partition paste differ in density from each other. Due to the difference in density between the glass material and the filler, uniformity of the partition wall may be reduced during firing.

In the present invention, in order to prevent the lowering of the uniformity of the partition wall according to the density difference between the glass material and the filler, the material of the filler is used as having excellent thermal conductivity as shown in Table 1 below.

Referring to Table 1 below, the silicon carbide (SiC) material has a thermal conductivity of about 77.5 [W / mK], and the carbon nanotube (CNT) material has a high thermal conductivity of about 1200 [W / mK]. It can be seen that.

Table 1

When using at least one of silicon carbide (SiC) and carbon nanotubes (CNT) as a filler material, as shown in Table 1 above, glass particles, that is, glass powder, are more easily melted during firing of the partition material. It can be to improve the uniformity of the partition wall.

On the other hand, when using a material having a relatively low thermal conductivity as a material of the filler, unlike the present invention is shown in Figure 4 and Table 2 below.

4 is a diagram for explaining a comparative example.

In the present invention and another comparative example, at least one of silica (Silica: SiO ₂ ) or titanium oxide (Titanium Oxide: TiO ₂ ) is used as a material of the filler.

Table 2

The thermal conductivity of silica (SiO ₂ ) is approximately 1.38 [W / mK], and the thermal conductivity of titanium oxide (TiO ₂ ) is approximately 7.4 [W / mK].

Looking at the case of forming the partition wall using the filler of the material shown in Table 2 as in the case of FIG.

Referring to FIG. 4, the partition material layer 420 having completed the development process as shown in (a) has a structure in which the glass particles 410 and the filler 400 are entangled. Of course, in the case of (a), in addition to the glass particles 410 and the filler 400, materials such as an organic solvent and a binder may be further mixed.

Subsequently, when the firing process is performed, as in the case of FIG. 4B, the glass material particles 410 or the filler 400 may be melted to form the partition wall 112. Here, materials such as an organic solvent and a binder mixed with the filler 400 and the glass ash particles 410 may be continuously disappeared.

However, when the filler 400 having low thermal conductivity is used as described in Table 2, as in the case of FIG. 4B, the glass material particles which do not melt around the filler 400 and maintain the crystal state ( 410 may be present.

This phenomenon is due to the difference in the particle size of the filler 400 and the glass particles 410 and the low thermal conductivity of the filler 400 is not sufficient heat transfer to the glass particles 410 disposed around the filler 400. It can happen because

When the phenomenon as shown in (b) of FIG. 4 occurs, the uniformity of the partition wall 112 is lowered, and thus, the strength of the partition wall 112 is weakened, so that structural reliability may be lowered.

In addition, in the case of (b) of FIG. 4, a space may be formed in the partition wall because the glass particles 410 are not melted. Due to the low thermal conductivity of the filler 400, a material such as an organic solvent or a binder may not be completely burned in this space and may remain.

Residues such as organic solvents or binders may cause deterioration of panel characteristics.

On the other hand, in the present invention, as described in Table 1, since the partition wall is manufactured by using a filler including a material having excellent thermal conductivity, for example, silicon carbide (SiC) and carbon nanotube (CNT) material, Enough heat can be transferred to the surrounding glass particles.

Accordingly, the glass particles around the filler are sufficiently melted to prevent the occurrence of a phenomenon as shown in FIG. 4B, and thus, to improve the uniformity of the partition wall and to improve the structural reliability.

In addition, since the thermal conductivity of the filler is sufficiently high, it is possible to completely burn out a material such as an organic solvent or a binder around the filler, thereby improving panel characteristics.

On the other hand, in the present invention, the filler may be used only with silicon carbide (SiC) material, or it may be possible to use only carbon nanotube (CNT) material.

In addition, a silicon carbide (SiC) material and a carbon nanotube (CNT) material may be mixed and used as a filler.

As described above, when the silicon carbide (SiC) material and the carbon nanotube (CNT) material are mixed and used as a filler, considering that the thermal conductivity of the carbon nanotube (CNT) is higher than that of the silicon carbide (SiC) In addition, it is possible to make the content of the carbon nanotube (CNT) material in the filler more than that of the silicon carbide (SiC) material.

In addition, in the present invention, the filler used for the manufacture of the partition wall may further use other materials having sufficiently high thermal conductivity in addition to silicon carbide (SiC) and carbon nanotube (CNT) materials.

For example, in the present invention, the filler may further include at least one material of boron nitride (Bron Nitride: BN), zinc oxide (ZnO), and alumina (Alumina: Al ₂ O ₃ ) shown in Table 3 below. Can be.

As shown in Table 3, the thermal conductivity of boron nitride (BN) is approximately 20.0 [W / mK], the thermal conductivity of zinc oxide (ZnO) is approximately 23.4 [W / mK], and the thermal conductivity of alumina (Al ₂ O ₃ ). The figure is approximately 30.0 [W / mK], which shows that the thermal conductivity is relatively high.

Therefore, even if at least one of boron nitride (BN), zinc oxide (ZnO) and alumina (Al ₂ O ₃ ) is used as the filler material, it is possible to sufficiently prevent the occurrence of the phenomenon as shown in FIG.

Table 3

On the other hand, when the glass material used for the manufacture of the partition paste contains a lead (Pb) component, the thermal conductivity of lead (Pb) is relatively high at about 34.9 [W / mK].

Therefore, when the glass material does not contain a lead (Pb) component, the occurrence of the phenomenon as shown in FIG.

However, since lead (Pb) may cause serious environmental pollution, such as adversely affecting the human body, it may be desirable to limit its use. Accordingly, in the present invention, it may be preferable that the glass material used for manufacturing the partition paste does not contain a lead (Pb) component.

In addition, in the present invention, since the glass material does not include a lead (Pb) component having a relatively high thermal conductivity, when the filler of the same material as in Table 2 is used, a phenomenon such as (b) of FIG. 4 may occur. will be.

Therefore, when the glass material used to manufacture the partition does not contain lead (Pb), it may be desirable to use a material having high thermal conductivity as a filler, as shown in Table 1 or Table 3.

As such, the technical configuration of the present invention described above can be understood by those skilled in the art that the present invention can be implemented in other specific forms without changing the technical spirit or essential features of the present invention.

Therefore, the exemplary embodiments described above are to be understood as illustrative and not restrictive in all respects, and the scope of the present invention is indicated by the appended claims rather than the foregoing detailed description, and the meaning and scope of the claims are as follows. And all changes or modifications derived from the equivalent concept should be interpreted as being included in the scope of the present invention.

1 is a diagram for explaining the structure of a plasma display panel;

2 to 3 are views for explaining a method for producing a partition wall.

4 is a diagram for explaining a comparative example.

Claims (6)

Glass material; And Filler; Including, The filler is a partition composition comprising at least one material of silicon carbide (SiC) and carbon nanotubes (CNT). The method of claim 1, The filler further comprises a material of at least one of boron nitride (BN), zinc oxide (ZnO) and alumina (Al ₂ O ₃ ). The method of claim 1, The glass material does not contain a lead (Pb) component partition wall composition. Front substrate; A rear substrate disposed opposite the front substrate; And A partition wall disposed between the front substrate and the rear substrate and including at least one material of silicon carbide (SiC) and carbon nanotube (CNT); Plasma display panel comprising a. The method of claim 4, wherein The partition wall further includes at least one material of boron nitride (BN), zinc oxide (ZnO), and alumina (Al ₂ O ₃ ). The method of claim 4, wherein The glass material does not contain a lead (Pb) component plasma display panel.

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