KR100496255B1 - Plasma Display Panel and Method of Fabricating The same - Google Patents

Abstract

The present invention relates to a plasma display panel capable of preventing damage to an address electrode and a lower dielectric layer by a mold and a method of manufacturing the same.

A method of manufacturing a plasma display panel according to the present invention includes bonding a first green sheet to a substrate, forming a plurality of address electrodes on the first green sheet, and forming a substrate on which the plurality of address electrodes are formed. First firing, bonding a second green sheet having an area smaller than that of the first green sheet so that both ends of each of the plurality of address electrodes are exposed on the first green sheet; Forming a dielectric layer on the sheet, and pressing the mold on the dielectric layer and then firing the secondary to form a partition wall.

Description

Plasma Display Panel and Method for Fabrication thereof {Plasma Display Panel and Method of Fabricating The same}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel, and more particularly, to a plasma display panel capable of preventing damage to an address electrode and a lower dielectric layer by a mold, and a method of manufacturing the same.

Plasma Display Panels (hereinafter referred to as "PDPs") display an image including characters or graphics by emitting phosphors by ultraviolet rays of 147 nm generated upon discharge of He + Xe or Ne + Xe gas. Such a PDP is not only thin and easy to enlarge, but also greatly improved in quality due to recent technology development.

Referring to FIG. 1, a conventional PDP includes an upper plate UP on which a sustain electrode pair 4 is formed on an upper substrate 16, and a lower plate DP on which an address electrode 2 is formed on a lower substrate 14. do.

On the upper substrate 16 of the upper plate UP, the sustain electrode pairs 4 are formed with a predetermined interval therebetween, and the upper dielectric 16 and the protective film are formed on the upper substrate 16 on which the sustain electrode pairs 4 are formed. 10) are formed sequentially. The upper dielectric 12 accumulates wall charges during the plasma discharge, and the protective film 10 protects the pair of sustain electrodes 4 and the upper dielectric 12 from sputtering of gas ions during plasma discharge, It increases the emission efficiency.

The address electrode 2 is formed on the lower substrate 14 of the lower plate DP, and the partition 8 which divides the lower dielectric 18 and the discharge cells is formed on the lower substrate 14 on which the address electrode 2 is formed. do. Phosphor 6 is applied to the surfaces of the lower dielectric 18 and the partition 8. The phosphor 6 emits light by ultraviolet rays generated at the time of plasma discharge so that visible light is generated.

The discharge cells of the PDP are injected with a mixed gas of He + Xe or Ne + Xe.

The partition 8 serves to prevent electrical and optical crosstalk between discharge cells. Therefore, the partition wall 8 is the most important factor for display quality and luminous efficiency, and as the panel is enlarged and fixed, various studies on the partition wall have been made. As the barrier rib manufacturing method, a screen printing method, a sand blasting method, an additive, a photosensitive paste method, and a low temperature cofired ceramic on metal (LTCCM) method are applied.

Among them, the screen printing method has the advantages of a simple process and a low manufacturing cost, but there is a problem of repeating the screen and substrate alignment, printing and drying of the glass paste several times during every printing. In addition, when the position of the screen and the glass substrate is shifted, the partition wall is deformed, so that the shape accuracy of the partition wall is lowered.

The sand blasting method has a merit of forming a partition on a large-area substrate, but a large amount of glass paste removed by the abrasive (sand particles) has a disadvantage of wasting material and manufacturing cost. In addition, the substrate is impacted by the abrasive, so that the substrate is cracked or damaged.

The addition method has an advantage of forming barrier ribs on a large-area substrate, but it is difficult to separate the photoresist and glass paste, leaving a residue or breaking the barrier ribs in forming the barrier ribs.

The LTCCM method has a low temperature process and a simple process compared with other barrier rib manufacturing methods.

2A to 2H show step by step the manufacturing method of the lower plate of the PDP using the LTCCM method.

First, as shown in Figure 2a to provide a green sheet (30). The green sheet 30 is manufactured by drying a slurry in which a glass powder, an organic solution, a plasticizer, a binder, an additive, and the like are mixed in a predetermined ratio on a polyester film, and forming a sheet in a doctor blading, followed by drying. .

The green sheet 30 is bonded to the lower substrate 14 as shown in FIG. 2B by a laminating process using a uniform pressure and temperature. The address electrode 2 is formed on the lower substrate 14 to which the green sheet 30 is bonded as shown in FIG. 2C. On the lower substrate 14 on which the address electrode 2 is formed, as shown in FIG. 2D, the dielectric slurry is completely printed and then dried to form the lower dielectric layer 18.

On the upper side of the lower substrate 14 on which the lower dielectric layer 18 is formed, as shown in FIG. 2E, the mold 38 having the grooves 38a opposite to the partition wall is formed. Using this mold 38, the lower substrate 14 on which the lower dielectric layer 18 is formed at a predetermined pressure is pressed as shown in FIG. 2F. When the mold 38 is pressed, the green sheet 30 and the lower dielectric layer 18 are moved into the groove 38a of the mold 38 to rise. Then, as shown in FIG. 2G, the partition 38 is completed by the firing process after the mold 38 is separated from the green sheet 30 and the lower dielectric layer 37.

However, when a crack is generated in the lower dielectric layer 18 closest to the mold 38 due to the pressure of the lower dielectric layer 18 and the green sheet 30 by the mold in the barrier rib manufacturing method using the LTCCM method. Often occurs. There is a problem in that the discharge is generated even at a relatively low voltage by the address electrode 2 exposed between the cracked lower dielectric layers 18. In severe cases, there is a problem that disconnection of the address electrode 18 occurs.

Accordingly, it is an object of the present invention to provide a PDP and a method of manufacturing the same that can prevent damage to an address electrode and a lower dielectric layer by a mold.

In order to achieve the above object, a method of manufacturing a plasma display panel according to the present invention comprises the steps of bonding a first green sheet on a substrate, forming a plurality of address electrodes on the first green sheet, First firing the substrate on which the address electrodes are formed, and bonding a second green sheet having a smaller area than the first green sheet so that both ends of each of the plurality of address electrodes are exposed on the first green sheet. And forming a dielectric layer on the second green sheet, and pressing the mold on the dielectric layer, followed by secondary firing, to form a partition wall.

delete

The pressing of the mold to form the partition wall may include forming the partition wall by pressing the mold on which the groove having a shape opposite to the partition wall is formed on the substrate on which the dielectric layer is formed.

At least one of the first and second firing temperatures is characterized in that about 750 ℃.

At least one of the first and second green sheets includes 10 to 45 wt% SiO ₂ , 15 to 50 wt% ZnO, 10 to 45 wt% MgO, and 5 to 30 wt% B ₂ O ₃ . 92 to 95 wt% of a compound; It is characterized by consisting of 5 ~ 8wt% poster light.

delete

In order to achieve the above object, the plasma display panel according to the present invention is formed with a first green sheet formed of a partition composition, and a smaller area than the first green sheet formed on the first green sheet and formed of a partition composition. A partition wall formed of a second green sheet formed by pressing a mold on the first and second green sheets; And an address electrode formed between the first and second green sheets, wherein the second green sheet is formed such that both ends of each of the address electrodes formed on the first green sheet are exposed. .

delete

At least one of the first and second green sheets includes 10 to 45 wt% SiO ₂ , 15 to 50 wt% ZnO, 10 to 45 wt% MgO, and 5 to 30 wt% B ₂ O ₃ . 92 to 95 wt% of a compound; It is characterized by consisting of 5 ~ 8wt% poster light.

delete

Other objects and features of the present invention in addition to the above objects will be apparent from the description of the embodiments with reference to the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described with reference to FIGS. 3 to 5G.

3 is a cross-sectional view showing a PDP according to the present invention.

Referring to FIG. 3, a PDP according to the present invention includes an upper plate UP having a pair of sustain electrodes 54 formed on an upper substrate 66, and a lower plate DP formed with an address electrode 52 formed on a lower substrate 64. ).

On the upper substrate 66 of the upper plate UP, sustain electrode pairs 54Y and 54Z are formed with a predetermined interval therebetween. Each of the sustain electrode pairs 54Y and 54Z is a transparent electrode 54a made of a transparent electrode material (ITO) having a relatively wide width and a good light transmittance of 90% or more, and a bus electrode 54b having a relatively narrow width. Is done. Here, the transparent electrode material (ITO) has a large resistance value and thus does not transmit power efficiently. Therefore, the resistive component of the transparent electrode 54a is compensated for by forming a bus electrode 54b made of a material having good conductivity, for example, silver (Ag) or copper (Cu), on the transparent electrode 54a. The sustain electrode pairs 54Y and 54Z are divided into a scan electrode 54Y mainly supplied by a scan signal for panel scanning and a sustain signal for discharge sustaining, and a sustain electrode 54Z mainly supplied with a sustain signal.

The upper dielectric 62 and the passivation layer 60 are sequentially formed on the upper substrate 66 on which the sustain electrode pairs 54 are formed. The upper dielectric 62 accumulates wall charges during the plasma discharge, and the protective film 60 protects the pair of sustain electrodes 54 and the upper dielectric 62 from sputtering of gas ions during plasma discharge, It increases the emission efficiency.

The address electrode 52 is formed on the lower substrate 64 of the lower plate DP, and the partition wall 58 for dividing the lower dielectric 68 and the discharge cells is formed on the lower substrate 64 on which the address electrode 52 is formed. do. The partition wall 58 is formed by protruding the first and second green sheets 80 and 72 and the lower dielectric layer 68 by the LTCCM method. The first green sheet 80 is formed on the front surface of the lower substrate 64, and the second green sheet 72 has the address electrodes 52 formed so that both ends of the address electrode 52 are exposed as shown in FIG. 4. It is formed on the first green sheet 80. The second green sheet 72 formed to expose both ends of the address electrode 52 facilitates alignment of the metal mold for forming the partition wall later. The thickness of the first and second green sheets 72 and 80 is determined according to the dielectric constant of the glass powder included in the first and second green sheets 72 and 80. The thickness of at least one of the first and second green sheets 72 and 80 is, for example, about 20 to 150 μm,

Each of the first and second green sheets 80, 72 consists of, for example, a mixture of about 92-95 wt% and about 5-8 wt% Fosterite. Fosterite can increase the flow temperature when using glass powder having a softening point lower than the crystallization temperature. The mixture will have a content condition as shown in Table 1.

SiO ₂ ZnO MgO B ₂ O ₃ 10 ~ 45wt% 15 ~ 50wt% 10 ~ 45wt% 5 ~ 30wt%

The phosphor 56 is applied to the surface of the protruding lower dielectric 68 forming the partition 58 to emit visible light by ultraviolet rays generated during plasma discharge. Then, an inert gas for gas discharge is injected into the discharge space inside the PDP.

The PDP discharge cell is selected by the counter discharge between the address electrode 52 and the scan electrode 54Y, and then sustains the discharge by the surface discharge between the sustain electrode pairs 54Y and 54Z. In the PDP discharge cell, the phosphor 56 emits light by ultraviolet rays generated during the sustain discharge, so that visible light is emitted outside the discharge cell to display an image.

5A to 5G illustrate a method of manufacturing a lower plate of a PDP according to an embodiment of the present invention.

First, as shown in FIG. 5A, a first green sheet 80 is prepared. The first green sheet 80 is composed of a mixture of about 92 to 95 wt% and about 5 to 8 wt% Fosterite. The mixture contains 10-45 wt% SiO ₂ , 15-50 wt% ZnO, 10-45 wt% MgO, and 5-30 wt% B ₂ O ₃ .

The first green sheet 80 is laminated on the lower substrate 64 as shown in FIG. 5B. At this time, as a material of the lower substrate 64 to which the first green sheet 80 is bonded, a metal, for example, titanium (Titanum) is usually used. Titanium may be manufactured to have a thickness thinner than that of other glass and ceramic materials because of its greater strength and heat resistance than glass or ceramic substrates, and may reduce thermal and mechanical deformation of the lower substrate 64.

The address electrode 52 is formed on the lower substrate 64 to which the first green sheet 80 is bonded as shown in FIG. 5C. After the address electrode 52 is formed, the lower substrate 64 on which the address electrode 52 is formed is first baked at about 700 to 850 ° C, for example, 750 ° C. The second green sheet 72 is laminated on the primary fired lower substrate 64 as shown in FIG. 5D. The second green sheet 72 is formed to have a size relatively smaller than that of the first green sheet 80 so that both ends of each of the plurality of address electrodes 52 are exposed. 80). The lower dielectric layer 68 is formed by completely printing the dielectric slurry on the lower substrate 64 on which the second green sheet 72 is formed and then drying.

On the upper side of the lower substrate 64 on which the lower dielectric layer 68 is formed, as shown in FIG. 5E, the molds 88 in which the grooves 88a of the opposite side of the partition wall are formed are aligned. Using this mold 88, the lower substrate 64 on which the lower dielectric layer 68 is formed at a predetermined pressure is pressed as shown in Fig. 5F. When the mold 88 is pressed, the first and second green sheets 80 and 72 and the lower dielectric layer 68 are moved into the grooves 88a of the mold 88 to rise.

After the mold 88 is separated from the partition forming first and second green sheets 80 and 72 and the lower dielectric layer 68 as shown in FIG. 5G, the partition walls are formed by secondary firing while passing through a temperature raising, holding, and cooling zone. do. This secondary firing process is performed at a temperature of 700 ~ 850 ℃ to remove the organic material in the first and second green sheet 68 is burned out.

As described above, in the PDP and the manufacturing method thereof according to the present invention, the first and second green sheets and the lower dielectric layer, which are formed with the address electrodes therebetween, protrude under pressure applied by a mold to form partition walls. The disconnection of the address electrode due to the pressure applied by the mold by the second green sheet and the lower dielectric layer can be prevented. In addition, even if a crack occurs in the lower dielectric layer, exposure of the address electrode may be prevented by the second green sheet, thereby preventing mis-discharge.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

1 is a perspective view illustrating a surface discharge plasma display panel of an AC driving method.

2A to 2G are diagrams illustrating a method of manufacturing a plasma display panel using a conventional LTCCM method step by step.

3 is a cross-sectional view showing a plasma display panel according to the present invention.

4 is a view illustrating in detail the second green sheet illustrated in FIG. 3.

5A through 5G are diagrams illustrating a method of manufacturing a plasma display panel according to an exemplary embodiment of the present invention.

<Description of Symbols for Main Parts of Drawings>

2,52: address electrode 4,54: sustain electrode pair

6,56 phosphor 8,58 partition wall

10,60: protective film 12,18,62,68: dielectric layer

14,64: Lower board 16,66: Upper board

30,72,80 Green Sheet 38,88 Mold

Claims (10)

Bonding the first green sheet onto the substrate; Forming a plurality of address electrodes on the first green sheet; Primary firing the substrate on which the plurality of address electrodes are formed; Bonding a second green sheet having a smaller area than the first green sheet so that both ends of each of the plurality of address electrodes are exposed on the first green sheet; Forming a dielectric layer on the second green sheet; And pressing the mold on the dielectric layer, followed by secondary firing, to form a partition wall. delete The method of claim 1, Pressing the mold to form the partition wall And forming a barrier rib by pressing a mold having grooves having a shape opposite to the barrier rib on the substrate having the dielectric layer formed thereon. The method of claim 1, At least one of the first and second firing temperature is about 750 ℃ manufacturing method of a plasma display panel. The method of claim 1, At least one of the first and second green sheets 92 to 95 wt% of a compound containing 10 to 45 wt% SiO ₂ , 15 to 50 wt% ZnO, 10 to 45 wt% MgO, and 5 to 30 wt% B ₂ O ₃ ; Method of manufacturing a plasma display panel, characterized in that consisting of 5 ~ 8wt% poster light. delete A first green sheet formed of a partition composition and a second green sheet formed on the first green sheet with a smaller area than the first green sheet, and formed of a partition composition, the first and second greens A partition wall formed by pressing a mold on the sheet; An address electrode formed between the first and second green sheets, And the second green sheet is formed such that both ends of each of the plurality of address electrodes formed on the first green sheet are exposed. delete The method of claim 7, wherein At least one of the first and second green sheets 92 to 95 wt% of a compound comprising 10 to 45 wt% SiO ₂ , 15 to 50 wt% ZnO, 10 to 45 wt% MgO, and 5 to 30 wt% B ₂ O ₃ ; Plasma display panel, characterized in that consisting of 5 ~ 8wt% posterlight. delete