1288471 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種電漿顯示器之誘電層的製作方法， 特別關於一種先利用低燒成溫度再利用高燒成溫度之電漿 顯示器誘電層的製作方法。 【先前技術】 _ 電漿顯示器（plasma display panel，PDP)是一種藉由氣 體放電來產生發光的平面顯示器，其最大的特色是輕、薄、 易大型化且視角相當廣。電漿顯示器的發光原理是靠電漿 產生紫外光來照射在螢光體上，再由螢光體發出可見光。 請參考第1圖。第1圖為習知電漿顯示器1〇的示意圖。 習知電漿顯示器1〇可利用交流電驅動，其包含有一殼體（圖 未示），一後板12與一前板14平行地安裝於後板12之上。 ® 如板14之下表面設置有複數個平行排列之電極對π ,每 一電極對16包含有共同電極(c〇mmon electrode)17以及掃 描電極(scanelectrode)18, 一誘電層20設置於前板14之下 表面並覆蓋電極對16,以及一由氧化鎂（MgO)所構成之保 護層22設於誘電層20之下表面，用來保護誘電層2〇 ,使 之不受電漿的濺射而造成劣化。後板12之上表面設置有複 數個平行排列之定址電極(data electrode)24，一誘電層26 . 设置於後板12之上表面並覆蓋定址電極24，複數個阻隔 1288471 k * 壁（rib)28設置於誘電層26上方，以及三種不同顏色之螢光 體(phosphor)，包括藍色、紅色與綠色螢光體、30R、 30G依序地填入阻隔壁28之間。此外，每二相鄰之阻隔壁 • 28之間充填電離氣體（圖未示），且阻隔壁28之頂端係固定 • 於保護層22之下表面，用以使阻隔壁28二邊的電漿無法 相互流通。 共同電極17以及掃描電極18均包含有一維持電極 ·( sustain electrode ) 32 以及一輔助電極（bus electrode ) 34。 維持電極32係為一較寬之透明電極，通常由氧化銦錫 (indium tin oxide，ITO)等所製成，用來引發並維持放電。而 輔助電極34則為一較細且不透明之金屬電極，通常由鉻_ 銅-鉻或銀等金屬所製成，並且平行地設置於維持電極32 表面，用來輔助維持電極32引發放電，並降低共同電極 17以及掃描電極18的電阻。此外，定址電極24亦為金屬 ® 電極’其與電極對Μ之交會處另形成有複數個以阻隔壁 28互相分隔之藍色_示單元（display cen) 36B、紅色顯示單 兀36R以及綠色顯示單元36G，以分別顯示藍光、紅光以 及綠光。其中，誘電層20及26的功用在於提供交流所需 之電容並對電流設限以防止短路，同時亦提供壁電荷累積 之功能。 . 在上述f知€漿_示器之各誘電層2G及26的製作方法 1288471 中，通常係分別利用二次以上之誘電層印刷、乾燥以及燒 成的流程來加以製作，而每次流程中之誘電層可由相同或 不同材料所構成。例如，若每次流程之誘電層均由相同材 料所構成，則每次流程所使用之燒成溫度亦完全相同，如 此’在連續高溫燒成的情況下，將使得誘電層與金屬電極 產生反應’造成黃化問題與電遷移(migration)現象，並會使 誘電層中所產生之氣泡變多及耐壓性變差，進而造成面板 品質不良，更因為連續高溫燒成而造成較多之能源損耗及 設備老化。然而，若每次流程之誘電層由不同材料所構成， 習知技術通常是先利用一較高之燒成溫度對先行形成之誘 電層進行燒成，接著再利用一較低之燒成溫度對之後形成 之誘電層進行燒成，但此方式因為需使用多種誘電層材 料，因此會造成原料管理較繁雜、製程條件不同而管理較 費時以及製造成本較單一材料高等缺點。 【發明内容】 本發明之主要目的在於提供一種電漿顯示器之誘電層 的製作方法，以改善上述問題。 本發明係揭露一種電漿顯示器之誘電層的製作方法。 首先提供一基板，基板表面設置有複數個平行排列之電 極，接著形成一第一誘電層於基板表面，且第一誘電層覆 蓋各電極。然後利用一第一燒成溫度對第一誘電層進行一1288471 IX. Description of the Invention: [Technical Field] The present invention relates to a method for fabricating a soldering layer of a plasma display, and more particularly to a soldering layer of a plasma display which first utilizes a low firing temperature and reuses a high firing temperature Production Method. [Prior Art] _ Plasma display panel (PDP) is a flat panel display that emits light by gas discharge. Its biggest feature is light, thin, easy to enlarge, and has a wide viewing angle. The principle of illumination of a plasma display is that ultraviolet light is generated by plasma to illuminate the phosphor, and then the phosphor emits visible light. Please refer to Figure 1. Figure 1 is a schematic view of a conventional plasma display. The conventional plasma display unit 1 can be driven by an alternating current, and includes a casing (not shown), and a rear plate 12 is mounted on the rear plate 12 in parallel with a front plate 14. ® If the surface of the lower surface of the plate 14 is provided with a plurality of electrode pairs π arranged in parallel, each electrode pair 16 includes a common electrode 17 and a scan electrode 18, and a dielectric layer 20 is disposed on the front plate. The lower surface 14 covers the electrode pair 16, and a protective layer 22 made of magnesium oxide (MgO) is provided on the lower surface of the electric layer 20 to protect the electric layer 2 from being sputtered by the plasma. Causes deterioration. The upper surface of the rear plate 12 is provided with a plurality of parallel arranged data electrodes 24, a soldering layer 26. The upper surface of the rear plate 12 is disposed and covers the address electrodes 24, and the plurality of barriers are 1288471 k* ribs. 28 is disposed above the trapping layer 26, and three different color phosphors, including blue, red and green phosphors, 30R, 30G are sequentially filled between the barrier walls 28. In addition, an ionized gas (not shown) is filled between each adjacent barrier wall 28, and the top end of the barrier wall 28 is fixed to the lower surface of the protective layer 22 for making plasma on both sides of the barrier wall 28. Can not circulate each other. The common electrode 17 and the scan electrode 18 each include a sustain electrode 32 and a bus electrode 34. The sustain electrode 32 is a wide transparent electrode, usually made of indium tin oxide (ITO) or the like, for inducing and sustaining discharge. The auxiliary electrode 34 is a thin and opaque metal electrode, usually made of metal such as chromium-copper-chromium or silver, and is disposed in parallel on the surface of the sustain electrode 32 to assist the sustain electrode 32 to initiate discharge. The electric resistance of the common electrode 17 and the scan electrode 18 is lowered. In addition, the address electrode 24 is also a metal® electrode. The intersection of the electrode and the electrode is further formed with a plurality of blue _ display units (display cen) 36B, a red display unit 36R and a green display. Unit 36G to display blue light, red light, and green light, respectively. Among them, the functions of the dielectric layers 20 and 26 are to provide the capacitance required for the alternating current and to limit the current to prevent short circuit, and also provide the function of wall charge accumulation. In the above-described method, the method 12828, which is used to manufacture the respective dielectric layers 2G and 26, is usually produced by using a process of printing, drying, and baking of two or more layers, respectively, in each flow. The layer of electrical attraction may be composed of the same or different materials. For example, if the trapping layers of each process are made of the same material, the firing temperature used in each process is exactly the same, so that in the case of continuous high-temperature firing, the trapping layer reacts with the metal electrode. 'Causes the problem of yellowing and migration, and causes the bubbles generated in the trapping layer to become more and the pressure resistance to deteriorate, resulting in poor panel quality and more energy due to continuous high temperature firing. Loss and equipment aging. However, if the trapping layer of each process consists of different materials, conventional techniques usually first use a higher firing temperature to fire the previously formed trapping layer, and then use a lower firing temperature pair. The solder layer formed thereafter is fired, but this method requires the use of a plurality of soldering layer materials, which results in a disadvantage of complicated material management, different process conditions, time-consuming management, and high manufacturing cost compared to a single material. SUMMARY OF THE INVENTION A primary object of the present invention is to provide a method of fabricating a soldering layer for a plasma display to improve the above problems. The invention discloses a method for fabricating a soldering layer of a plasma display. First, a substrate is provided. The surface of the substrate is provided with a plurality of electrodes arranged in parallel, and then a first electric layer is formed on the surface of the substrate, and the first electric layer covers the electrodes. And then using a first firing temperature to perform a first electrical layer
I 1288471 I # 第一燒成製程。最後再形成一第二誘電層於第一誘電層表 面，並利用一溫度高於第一燒成溫度之第二燒成溫度來對 第二誘電層進行一第二燒成製程。 由於本發明電漿顯示器之誘電層的製作方法，是先利 用一較低之燒成溫度來對第一誘電層進行燒結，接著再利 用一較高之燒成溫度來對第二誘電層進行燒結，以形成電 ，漿顯示器之誘電層，因此可減少黃化問題、電遷移現象、 誘電層中所產生之氣泡以及改善耐壓性不足的問題，更可 節省能源並延長燒成設備之使用壽命。此外，本發明適用 於使用單一材料之誘電層，因此可簡化原料之管理以及製 程，進而節省製造所需之成本。 【實施方式】 請參考第2圖及第3圖，第2圖及第3圖為本發明較 • 佳實施例之電漿顯示器誘電層的製作方法示意圖。如第2 圖所示’首先提供一基板40，其可為一電聚顯示器之前板 或後板。本發明較佳實施例中，基板40係為一電漿顯示器 之前板，其可由玻璃（glass)或石英（quartz)等透明材質所構 成。基板40表面設置有複數個平行排列之第一透明電極 42及第二透明電極44，其中第一透明電極42及第二透明 v 電極44可由氧化銦錫（indium tin oxide，ITO)或氧化銦辞 , (indium zinc oxide, IZO)等透明導電材料所構成，其係作為 1288471 複數個維持電極（sustain electrode)以用來引發並維持放 電。接著形成複數個第一金屬電極46及第二金屬電極48 分別設置於第一透明電極42及第二透明電極44表面，其 可由鉻-銅-鉻或銀等金屬所構成。其中，第一金屬電極46 及第一金屬電極48係作為複數個輔助電極（bus electrode) 並與相對應之維持電極分別構成一共同電極（c〇mm〇n electrode)50 及一掃描電極（scan eiectr〇de)52，且第一金屬 電極46及第二金屬電極48可用來辅助第一透明電極42及 第二透明電極44引發放電，並降低共同電極5〇以及掃描 電極52的電阻。 然後利用一網版印刷與乾燥製程或貼附製程形成一第 一誘電層54於基板40表面並覆蓋共同電極50以及掃描電 極52。接著再對第一誘電層54進行一第一燒成製程。其 中，第一燒成製程係應用一第一燒成溫度對第一誘電層54 進行燒成。本發明較佳實施例中，第一燒成製程可利用如 攝氏550度之第一燒成溫度對第一誘電層54進行如丨〇分 鐘之燒成。 如第3圖所示，接著再利用一網版印刷與乾燥製程或 貼附製程形成一第二誘電層56於第一誘電層54表面。然 後對第二誘電層56進行一第二燒成製程。其中，第二燒成 製程係依據第二誘電層56之材料特性，例如：軟化溫度 1288471 * 9 等，而應用-第二燒成溫度對第二誘電層^進行燒成。本 發明較佳實施例中，第二燒成製程可利用如攝氏57〇度之 第二燒成溫度對第二誘電層56進行如1G分鐘之燒成。 值彳于注意的疋，本發明之第一誘電層54及第二誘電層 56係可湘㈣之透明介電材料所構錢選用軟化溫度相 似之不同透明介電材料所構成。然後先依據透明介電材料 ^ 之材料特性，例如：軟化溫度，來設定第二燒成溫度，一 般約為攝氏570度至600度，接著再依據第二燒成溫度來 降低5度至5G度’以設定第_燒成溫度，例如本發明較佳 實施例中第一燒成溫度即為第二燒成溫度減攝氏2〇度。因 此本發明可避免習知製程因連續高溫燒成而使誘電層與金 屬電極產生反應，造成黃化問題與電遷移(migrati〇n)現象， 並防止誘電層中所產生之氣泡變多及耐壓性變差，進而改 善面板品質。此外，本發明較佳實施例雖僅揭露二次燒成 I步驟，然而本發明亦可適用於其他二次以上之燒成步驟的 製程。 請參考第4圖’第4圖為本發明較佳實施例之誘電層燒 成溫度與時間的關係示意圖。如第4圖所示，首先將一燒 成没備（圖未不）之溫度加熱至第一燒成溫度I，例如：攝氏 • 550度’並在一第一持溫區a中對第一誘電層54進行第一 •燒成製程。接著將燒成設備（圖未示）之溫度由第一燒成溫 1288471 =加熱至第一燒成溫度辽’例如··攝氏57〇度，並在一 士持酿區B中對第二誘電層％進行第二燒成製程。因此 . t月係彻先低溫再高溫之燒成步驟，以有效提高燒成 品質、減少能量損耗並延緩設備老化。 、相較於習知技術，本發明電漿顯示器之誘電層的製作方 法，其先利用一低燒成溫度再利用一高燒成溫度以形成電 鲁 I具不器之誘電層’因此可減少黃化問題、電遷移現象、 層中所產生之氣泡以及改善耐壓性不足的問題，更可 節省能源並延長燒成設備之使用壽命。此外，本發明適用 於使用單一材料之誘電層，因此可簡化原料之管理以及製 程，進而節省製造所需之成本。 以上所述僅為本發明之較佳實施例，凡依本發明申請 專利圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。 【圖式簡單說明】 第1圖為習知電漿顯示器的示意圖。 第2圖及第3圖為本發明較佳實施例之電漿顯示器誘電層 的製作方法示意圖。 第4圖為本發明較佳實施例之誘電層燒成溫度與時間的關 • 係示意圖。 11 1288471 【主要元件符號說明】 10 電漿顯示器 12 後板 14 前板 16 電極對 17 共同電極 18 掃描電極 20 誘電層 22 保護層 24 定址電極 26 誘電層 28 阻隔壁 30B 藍色螢光體 30R 紅色螢光體 30G 綠色螢光體 32 維持電極 34 辅助電極 36B 藍色顯示單元 36R 紅色顯示單元 36G 綠色顯示單元 40 基板 42 第一透明電極 44 第二透明電極 46 第一金屬電極 48 第二金屬電極 50 共同電極 52 掃描電極 54 第一誘電層 56 第二誘電層 12I 1288471 I # First firing process. Finally, a second electric layer is formed on the surface of the first electric layer, and a second firing process is performed on the second electric layer by using a second firing temperature higher than the first firing temperature. Since the electric layer of the plasma display of the present invention is produced by first sintering a first electric layer with a lower firing temperature, and then sintering the second electric layer with a higher firing temperature. In order to form the electric layer of the electric and plasma display, the yellowing problem, the electromigration phenomenon, the bubbles generated in the electric layer and the problem of insufficient pressure resistance can be reduced, and the energy can be saved and the service life of the burning equipment can be prolonged. . In addition, the present invention is applicable to a soldering layer using a single material, thereby simplifying the management of raw materials and processes, thereby saving the cost of manufacturing. [Embodiment] Please refer to FIG. 2 and FIG. 3, and FIG. 2 and FIG. 3 are schematic diagrams showing a manufacturing method of a plasma display layer of a plasma display according to a preferred embodiment of the present invention. As shown in Fig. 2, a substrate 40 is first provided, which may be a front or back plate of an electropolymer display. In the preferred embodiment of the present invention, the substrate 40 is a front panel of a plasma display, which may be formed of a transparent material such as glass or quartz. The surface of the substrate 40 is provided with a plurality of first transparent electrodes 42 and second transparent electrodes 44 arranged in parallel. The first transparent electrode 42 and the second transparent v electrode 44 may be indium tin oxide (ITO) or indium oxide. A transparent conductive material such as (indium zinc oxide, IZO) is used as a 1288471 plurality of sustain electrodes for initiating and sustaining discharge. Then, a plurality of first metal electrodes 46 and second metal electrodes 48 are formed on the surfaces of the first transparent electrode 42 and the second transparent electrode 44, respectively, and may be made of a metal such as chromium-copper-chromium or silver. The first metal electrode 46 and the first metal electrode 48 serve as a plurality of bus electrodes and constitute a common electrode (c〇mm〇n electrode) 50 and a scan electrode (scan) respectively. The first metal electrode 46 and the second metal electrode 48 can be used to assist the first transparent electrode 42 and the second transparent electrode 44 to initiate discharge, and reduce the resistance of the common electrode 5A and the scan electrode 52. A first soldering layer 54 is then formed on the surface of the substrate 40 by a screen printing and drying process or a bonding process and covers the common electrode 50 and the scanning electrode 52. Then, the first soldering layer 54 is subjected to a first firing process. Among them, the first firing process applies a first firing temperature to the first dielectric layer 54 to be fired. In a preferred embodiment of the present invention, the first firing process may be performed by firing the first gettering layer 54 by, for example, a first minute firing temperature of 550 degrees Celsius. As shown in Fig. 3, a second solder layer 56 is then formed on the surface of the first solder layer 54 by a screen printing and drying process or a bonding process. A second firing process is then performed on the second electrical layer 56. The second firing process is based on the material properties of the second electrical layer 56, for example, a softening temperature of 1288471*9, and the second firing temperature is applied to the second electrical layer. In a preferred embodiment of the present invention, the second firing process can be performed by firing the second electrical layer 56 by, for example, 1 G minutes using a second firing temperature of, for example, 57 degrees Celsius. The value of the first electric layer 54 and the second electric layer 56 of the present invention is composed of a transparent dielectric material of the same type (4), and is made of a different transparent dielectric material having a softening temperature. Then, according to the material properties of the transparent dielectric material, for example, the softening temperature, the second firing temperature is set, generally about 570 degrees Celsius to 600 degrees Celsius, and then lowered by 5 degrees to 5 degrees according to the second firing temperature. 'To set the _ firing temperature, for example, the first firing temperature in the preferred embodiment of the invention is the second firing temperature minus 2 degrees Celsius. Therefore, the present invention can prevent the conventional process from reacting with the metal electrode due to continuous high-temperature firing, causing yellowing problems and electromigration, and preventing the bubbles generated in the trap layer from becoming more and more resistant. The pressure is deteriorated to improve the panel quality. Further, although the preferred embodiment of the present invention discloses only the second firing step I, the present invention is also applicable to other two or more firing steps. Please refer to FIG. 4'. FIG. 4 is a schematic view showing the relationship between the firing temperature of the soldering layer and the time according to a preferred embodiment of the present invention. As shown in Fig. 4, first, the temperature of a firing (not shown) is heated to a first firing temperature I, for example, Celsius 550 degrees 'and the first in a first temperature holding zone a The electric layer 54 performs the first firing process. Then, the temperature of the firing device (not shown) is heated from the first firing temperature of 1288471 = to the first firing temperature, for example, 57 degrees Celsius, and the second electric induction is in the first brewing zone B. Layer % performs a second firing process. Therefore, the t-month is the first low temperature and high temperature firing step to effectively improve the firing quality, reduce energy loss and delay equipment aging. Compared with the prior art, the method for fabricating the electric layer of the plasma display of the present invention first utilizes a low firing temperature and then uses a high firing temperature to form a ferroelectric layer of the electric device. Yellowing problems, electromigration, bubbles generated in the layers, and problems of insufficient pressure resistance can save energy and extend the life of the burning equipment. In addition, the present invention is applicable to a soldering layer using a single material, thereby simplifying the management of raw materials and processes, thereby saving the cost of manufacturing. The above are only the preferred embodiments of the present invention, and all variations and modifications made by the patent application of the present invention are intended to be within the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a conventional plasma display. 2 and 3 are schematic views showing a method of fabricating a soldering layer of a plasma display according to a preferred embodiment of the present invention. Figure 4 is a schematic diagram showing the firing temperature and time of the soldering layer in accordance with a preferred embodiment of the present invention. 11 1288471 [Main component symbol description] 10 Plasma display 12 Rear plate 14 Front plate 16 Electrode pair 17 Common electrode 18 Scanning electrode 20 Electrically induced layer 22 Protective layer 24 Addressing electrode 26 Electrically induced layer 28 Barrier wall 30B Blue phosphor 30R Red Phosphor 30G Green phosphor 32 sustain electrode 34 auxiliary electrode 36B blue display unit 36R red display unit 36G green display unit 40 substrate 42 first transparent electrode 44 second transparent electrode 46 first metal electrode 48 second metal electrode 50 Common electrode 52 scan electrode 54 first electric layer 56 second electric layer 12