KR20100058037A - 취성기판의 브레이킹 장치 및 그 방법 - Google Patents
취성기판의 브레이킹 장치 및 그 방법 Download PDFInfo
- Publication number
- KR20100058037A KR20100058037A KR1020080116701A KR20080116701A KR20100058037A KR 20100058037 A KR20100058037 A KR 20100058037A KR 1020080116701 A KR1020080116701 A KR 1020080116701A KR 20080116701 A KR20080116701 A KR 20080116701A KR 20100058037 A KR20100058037 A KR 20100058037A
- Authority
- KR
- South Korea
- Prior art keywords
- heating air
- brittle substrate
- steam
- air
- heater
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
Description
Claims (4)
- 외부로부터 공급되는 에어를 가열하는 제1 히터;상기 제1 히터에 의해 가열된 1차 가열 에어에 증기를 공급하는 증기 공급장치;상기 1차 가열 에어와 증기가 서로 혼합된 것을 가열하는 제2 히터; 및상기 제2 히터에 의해 가열된 2차 가열 에어를 취성기판으로 분사하는 노즐부를 포함하는 것을 특징으로 하는 취성기판의 브레이킹 장치.
- 외부로부터 공급되는 에어를 가열하여 1차 가열 에어를 생성하는 1차 가열 에어 생성단계;상기 1차 가열된 에어를 증기와 혼합하는 혼합단계;상기 혼합된 에어와 증기를 가열하여 수분 함량이 1~10부피%인 2차 가열 에어를 생성하는 2차 가열 에어 생성단계; 및상기 2차 가열 에어를 취성기판의 표면에 분사하는 분사단계를 포함하는 것을 특징으로 하는 취성기판의 브레이킹 방법.
- 제2항에 있어서,상기 1차 가열 에어의 온도는 80℃~250℃의 범위에 있는 것을 특징으로 하는 취성기판의 브레이킹 방법.
- 제2항 또는 제3항에 있어서,상기 2차 가열 에어의 온도는 80℃~250℃의 범위에 있는 것을 특징으로 하는 취성기판의 브레이킹 방법.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080116701A KR101104078B1 (ko) | 2008-11-24 | 2008-11-24 | 취성기판의 브레이킹 장치 및 그 방법 |
TW097148124A TW201020221A (en) | 2008-11-24 | 2008-12-10 | Fragile substrate breaking apparatus and method |
CN200810185804A CN101734845A (zh) | 2008-11-24 | 2008-12-10 | 脆基板裂片设备和方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080116701A KR101104078B1 (ko) | 2008-11-24 | 2008-11-24 | 취성기판의 브레이킹 장치 및 그 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100058037A true KR20100058037A (ko) | 2010-06-03 |
KR101104078B1 KR101104078B1 (ko) | 2012-01-11 |
Family
ID=42359739
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080116701A KR101104078B1 (ko) | 2008-11-24 | 2008-11-24 | 취성기판의 브레이킹 장치 및 그 방법 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR101104078B1 (ko) |
CN (1) | CN101734845A (ko) |
TW (1) | TW201020221A (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101946541B1 (ko) | 2017-07-12 | 2019-02-11 | 김영범 | 디스플레이 기판의 브레이킹 장치 |
CN110746104B (zh) * | 2019-10-31 | 2022-02-11 | 南京赢羊光子科技有限公司 | 一种激光精密加工玻璃的切割裂片方法和系统 |
CN115521053A (zh) * | 2022-10-25 | 2022-12-27 | 深圳市益铂晶科技有限公司 | 一种玻璃激光切割的定点加温裂片方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004217492A (ja) * | 2003-01-17 | 2004-08-05 | Murakami Corp | ガラス板材の切抜方法 |
KR20050068218A (ko) * | 2003-12-29 | 2005-07-05 | 엘지.필립스 엘시디 주식회사 | 액정 표시패널의 절단장치 및 그 절단방법 |
WO2005113212A1 (ja) * | 2004-05-20 | 2005-12-01 | Mitsuboshi Diamond Industrial Co., Ltd. | マザー基板分断方法、マザー基板スクライブ装置、プログラムおよび記録媒体 |
JP2006206361A (ja) | 2005-01-27 | 2006-08-10 | Optrex Corp | ガラス板の切断方法及び切断装置 |
-
2008
- 2008-11-24 KR KR1020080116701A patent/KR101104078B1/ko active IP Right Grant
- 2008-12-10 CN CN200810185804A patent/CN101734845A/zh active Pending
- 2008-12-10 TW TW097148124A patent/TW201020221A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW201020221A (en) | 2010-06-01 |
CN101734845A (zh) | 2010-06-16 |
KR101104078B1 (ko) | 2012-01-11 |
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