201020221 九、發明說明： 【相關申請案參照】 本申印案主張2008年11月24曰申請之韓國專利 研案2_-_7Gl號’其揭露整體結合於此作為參 【發明所屬之技術領域】 ❹ $發明侧於紐基板破㈣置及錢，尤其是關 於月b藉由噴灑含有水氣之加熱空氣到脆性基板之劃刻 線’以加速裂痕拓展並改善破裂產量之跪性基板破裂裝 置及方法。 【先前技術】 一般而言，用於平面板顯示器之液晶顯示器 (LCD)、有機發光面板、無機發光面板、穿透式投影面 ❿ 板、反射式投影面板等，使用自脆性母玻璃面板（於後 稱為「脆性基板」）切割成預定尺寸之單位玻璃面板。 於此，脆性基板的切割是透過形成劃刻線之劃刻程 序，其藉由施加壓力到由例如鑽石製成之劃刻輪，並沿 基板表面之切割計畫線移動劃刻輪，以及破裂程序，其 藉由施加壓力負載及彎矩到脆性基板，或藉由加熱或冷 卻環繞劃刻線裂痕（較佳稱為「垂直裂痕」）之區域來進 行切割。執行劃刻程序之裝置通稱為劃刻裝置或劃刻 201020221 器，執行破裂程序之農置通稱 及破裂裝置可結合成-個裝置，或各可為獨立=置 ㈣：時利公開案2〇〇5__5912號(於後稱「習 拓展劃刻線㈣痕财狀雜基板之厚度方向 參 ❷ =圖3『，習知劃刻裝置包含其上供放置脆性基 ^ 行安裝於桌台31兩侧之導軌32及 動安裝於導軌32及33之滑動㈣及35、 >口 ¥軌32及33使滑動件34及35滑 及38、水平安裝於滑動件34及犯間引= 及可滑動地安裝於導引條36之劃刻頭2〇/丨停％ 再者，控鮮元包含轉雜馬達37及38之第-^區動器41及第二驅動11 42、驅動咖頭驅動馬達45之 第三驅動1147、控制第一到第三驅動器4卜42、及47 之控 44、錢絲於_⑽附 34位置之滑動件感卿43。 制，月動仟 46為由劃刻頭驅動馬達 20藉由滾珠螺桿46的轉 於此，未提及之參考符號 45轉動之滾珠螺桿，且劃刻頭 動，沿導引條36往復移動。 201020221 如圖2所示’劃刻頭20包含裝配有壓力裝置（未顯 示）之頭主體22,以及安裝於頭主體22之下並裝配有劃 刻輪21之輪支托器27。 同時，於習知技術中，破裂裝置藉由拓展形成於脆 性基板1之劃刻線裂痕來進行破裂，其使用蒸氣產生器 Φ 52喷麗具有使脆性基板1膨脹之溫度之蒸氣到形成於脆 性基板1之劃刻線，藉此於脆性基板丨之厚度方向拓展 劃刻線之裂痕。 於此 瘵氣產生器52包含裝設於頭主體22之主體 52a、賴氣通過之彈性管52b、整體地裝設於輪支托器 =之喷嘴頭52c、以及朝脆性基板丨喷麓蒸氣之嗔嘴 參 。於此，彈性管52b之一端連接主體孤，而另一端 連接噴嘴頭52d。 再者m橢圓形、矩形、或狹縫形蒸氣喷灑 =於喷嘴52d’且蒸氣喷_藉由劃刻輪、 口 21形成之劃 將簡述習知利用上述劃職置之劃刻及破裂程序。 首先’藉由沿職綠丨之_計纽（劃刻計畫 8 201020221 線）移動劃刻輪21而形成劃刻線之劃刻程序中，脆性基 板1放置於桌台31，然後在控制器44的控制下，第^ 驅動器47驅動劃刻頭驅動馬達45»當劃刻頭2〇藉由劃 刻頭驅動馬達45自劃刻起始位置沿切割計晝線移動 時，女裝於劃刻頭20之劃刻輪21移動並形成劃刻線 施加壓力負載到脆性基板1。 _ · ❹ 在以此方式執行劃刻程序於脆性基板1後，執行破 裂程序。201020221 IX. Invention Description: [Related application reference] This application for the Korean Patent Research No. 2_-_7Gl filed on November 24, 2008, is disclosed in its entirety as a reference to the technical field of the invention. $Inventive side of the new substrate is broken (4) and money, especially for the month b by spraying the slash line containing the heated air of water to the brittle substrate to accelerate the crack expansion and improve the fracture yield of the sturdy substrate rupture device and method . [Prior Art] In general, a liquid crystal display (LCD), an organic light-emitting panel, an inorganic light-emitting panel, a transmissive projection panel, a reflective projection panel, etc. for a flat panel display are used, and a self-brittle mother glass panel is used. Hereinafter, it is referred to as a "brittle substrate") and is cut into a unit glass panel of a predetermined size. Here, the cutting of the brittle substrate is performed by a scribe process for forming a scribe line by applying pressure to a scribe wheel made of, for example, diamond, and moving the scribe wheel along the cutting line of the substrate surface, and rupturing The procedure is performed by applying a compressive load and bending moment to the brittle substrate, or by heating or cooling the area surrounding the scribe line crack (preferably referred to as "vertical crack"). The device for performing the scribing procedure is generally referred to as a scribing device or a scribing 201020221 device, and the agricultural device and the rupture device performing the rupture program may be combined into one device, or each may be independent = set (4): Shili public case 2〇〇 5__5912 (hereinafter referred to as the "expansion of the scribe line (four) traces of the thickness of the miscellaneous substrate of the direction of the direction = Figure 3", the conventional scribe device contains the brittle foundation on which to install on both sides of the table 31 The guide rail 32 and the sliding (4) and 35, > the mouth rails 32 and 33 of the rails 32 and 33 are slidably and slidably mounted on the slider 34 and the slidably mounted sliding member 34 and The scribed head of the guide bar 36 is 〇/丨%%. Further, the control unit includes the first-region actuator 41 and the second driver 11 42 of the turning motors 37 and 38, and the driving coffee driving motor 45 The third drive 1147 controls the first to third actuators 4, 42 and 47, and the money is at the position of the slider of the _(10) attached position 34. The system is used to drive the motor by the scribe head. By means of the ball screw 46, the ball screw, which is not mentioned by the reference numeral 45, is rotated, and the head is moved, along the guide bar 36. 201020221 As shown in Fig. 2, the 'scratch head 20' includes a head main body 22 equipped with a pressure device (not shown), and a wheel support device 27 mounted under the head main body 22 and equipped with a scribe wheel 21. In the prior art, the rupture device performs rupture by expanding the scribe line crack formed on the brittle substrate 1, and uses the vapor generator Φ 52 to spray the vapor having the temperature at which the brittle substrate 1 is expanded to the brittle substrate. The scribe line of 1 expands the crack of the scribe line in the thickness direction of the brittle substrate 。. The helium gas generator 52 includes the main body 52a of the head main body 22, the elastic tube 52b through which the gas passes, and the whole The nozzle head 52c is mounted on the wheel supporter and the nozzle is sprayed toward the brittle substrate. Here, one end of the elastic tube 52b is connected to the main body, and the other end is connected to the nozzle head 52d. Shape, Rectangular, or Slit-Type Vapor Spray = at Nozzle 52d' and Vapor Spray_Drawing by Scratch Wheel, Port 21 will briefly describe the scribing and rupture procedures that are conventionally utilized. _ _ _ _ _ _ _ In the scribing procedure of moving the scribing wheel 21 to form a scribing line, the brittle substrate 1 is placed on the table 31, and then under the control of the controller 44, the second actuator 47 drives the scribing head driving motor. 45»When the scribe head 2 移动 is moved along the cutting line by the scribe head driving motor 45, the scribe wheel 21 of the scribe head 20 moves and forms a scribe line to apply pressure Loaded to the brittle substrate 1. _ · ❹ After the scribing procedure is performed on the brittle substrate 1 in this manner, the rupture process is performed.
於習知破裂程序中，首先蒸氣透過喷嘴52d之蒸氣 喷灑口喷灑到透過上述劃刻程序形成之劃刻線，而 的蒸氣藉由毛細作用滲透入具有微米等級開口之劃刻 線裂痕。然後’聽高溫蒸氣，使得在咖線形成處^ 脆性基板1部分的體積膨脹，藉由毛細作用已滲透入具 有微米等關π之綱㈣痕之錢i氣同時體積膨 脹，使得裂痕械性基板1之背側拓展。因此，脆性基 板1沿劃刻線自發性破裂而無需施加機械幫矩。 根據此習知破裂裝置，於蒸氣產生器52之主體5% 内’通常提簡定財_室。於此，利關縮空氣射 出水到腔室之倾安裝於腔室之-側，而加熱透過喷嘴 喷灑之小水滴以將其改變為蒸氣之加熱器，安裝於 喷嘴之腔室之周圍。 ^ 9 201020221 因此，利用壓縮空氣吹入腔室的水通過喷嘴時變成 這些細滴在腔室内由加熱器加熱經過相變化成為 蒸氣，而蒸氣透過噴嘴52d之噴灑口喷灑到劃刻線。 a然而，於習知技術中，即使加熱器是安裝於噴嘴及 腔至之周圍’常溫的水及壓縮空氣持續地供應到噴嘴内 參 部然後立即通過。因此，很難充分地提高透過喷嘴喷灑 之小水滴的溫度。 ' 因此，就習知破裂裝置而言，並未完全蒸氣化小水 滴，而因形成於脆性基板表面之水滴留下污潰，或造成 劃刻線裂痕拓展不均勻。 具體而言，污潰及裂痕拓展不均勻是因為形成於脆 性基板表面上之水滴的溫度比蒸氣的溫度還低所造成 •的。 【發明内容】 本發明目的在於提供一種脆性基板破裂裝置及方 法，其快速地將激熱（intense heat)轉移到脆性基板之 劃刻線，以改善劃刻線之裂痕拓展效應，以及避免水滴 形成，而使裂痕拓展均勻且能降低例如污潰之產品缺 陷0 10 201020221 根據本發明-方面’―種脆性基板破裂裝置包含： 第-加鮮’加熱自外部供應之空氣；減供應裝置， 供應蒸氣到由第-加熱器加熱之第—次加熱空氣二 加熱器’加熱第-次加熱空氣及蒸氣之混合物；以及喷 嘴’將由第二加熱ϋ加熱之第二次加熱空氣魏到脆性 基板。 根據本發明另一方面，一種脆性基板破裂方法包 含：藉由加熱自外部供應之空氣，形成第一次加熱空 氣；混合第一次加熱空氣與蒸氣；藉由加熱空氣及蒸氣 之混合物，形成第二次加熱空氣，其水氣含量為體積百 分比1-10% ;以及將第二次加熱空氣喷灑到脆性基板。 於此’第一次加熱空氣之溫度可在80°C至250°C之 再者，第二次加熱空氣之溫度可在80°C至250°C之 範圍。 【實施方式】 於後’將參考圖3及圖4說明本發明例示實施例。 首先’如圖3所示，根據本發明例示實施例之跪性 201020221 基板破裂裝置1000包含蒸氣供應裝置1〇〇、加熱自外部 供應之空氣50之第一加熱器200、第二加熱器300，加 熱第一加熱器200加熱之第一次加熱空氣210與蒸氣供 應裝置100供應之蒸氣110之混合物220、以及喷嘴 500,將由第二加熱器300加熱之第二次加熱空氣310 喷灑到脆性基板400之劃刻線。 φ 锅爐型、先前所述之喷嘴加熱器型、或其他已知常 用的蒸氣供應裝置類型，可用作為蒸氣供應裝置100。 電熱系統或燃燒加熱系統皆可能作為第一加熱器 200及第二加熱器300。 類似於圖2所示之習知技術，雖然破裂裝置1000 可與劃刻裝置一起移動，以連續執行劃刻及破裂，然而 破裂裝置亦可與劃刻裝置分別地移動。 ❿ 以下將參考圖4說明根據本發明之脆性基板破裂方 法。 首先’利用第一加熱器2〇〇’將自外部供應之空氣 加熱到約80X：至約250°C而形成第一次加熱空氣 (S10)。如下所述，第一次加熱空氣的溫度範圍為容易 獲得第二次加熱空氣，且同時避免後續混入的蒸氣冷卻 12 201020221 而形成水滴所需之溫度。 接著，第一次加熱空氣與蒸氣供應裝置1〇〇供應 蒸氣混合（S20)。In the conventional rupture procedure, first, the vapor is sprayed through the vapor discharge port of the nozzle 52d to the scribe line formed by the scribe process, and the vapor penetrates into the scribe line crack having the micrometer-scale opening by capillary action. Then 'listen to the high-temperature vapor, so that the volume of the brittle substrate 1 is expanded at the place where the coffee line is formed, and the capillary has penetrated into the micro-gas, which has a micron-like symmetry, and the volume expands, causing the cracked mechanical substrate. The back side of 1 expands. Therefore, the brittle substrate 1 spontaneously ruptures along the scribe line without applying a mechanical moment. According to this conventional rupture device, within the body 5% of the steam generator 52, the chamber is usually simplified. Here, the air is sprayed to the chamber to be mounted on the side of the chamber, and the water droplets sprayed through the nozzle to change it into a vapor heater are installed around the chamber of the nozzle. ^ 9 201020221 Therefore, when water blown into the chamber by the compressed air passes through the nozzle, these fine droplets are heated by the heater in the chamber to change into a vapor, and the vapor is sprayed through the nozzle of the nozzle 52d to the scribe line. a However, in the prior art, even if the heater is installed around the nozzle and the cavity, the water of normal temperature and the compressed air are continuously supplied to the nozzle inner portion and then immediately passed. Therefore, it is difficult to sufficiently increase the temperature of the water droplets sprayed through the nozzle. Therefore, in the case of the conventional rupture device, the small water droplets are not completely vaporized, and the water droplets formed on the surface of the brittle substrate are left dirty or the crease line cracks are unevenly expanded. Specifically, unevenness in fouling and crack propagation is caused by the fact that the temperature of the water droplets formed on the surface of the brittle substrate is lower than the temperature of the vapor. SUMMARY OF THE INVENTION An object of the present invention is to provide a brittle substrate rupturing device and method for rapidly transferring an intense heat to a scribe line of a brittle substrate to improve the crack propagation effect of the scribe line and to prevent water droplet formation. In order to make the crack spread evenly and to reduce product defects such as fouling 0 10 201020221 According to the invention - the aspect - the brittle substrate rupture device comprises: a first - fresher 'heating air supplied from the outside; a supply device, a supply of steam The first heated air second heater is heated by the first heater to heat the mixture of the first heated air and the vapor; and the nozzle 'heats the second heated air heated by the second heating crucible to the brittle substrate. According to another aspect of the present invention, a method for breaking a brittle substrate includes: forming a first heated air by heating air supplied from the outside; mixing the first heating air with the vapor; and heating the mixture of the air and the vapor to form a first The second heated air has a moisture content of 1-10% by volume; and a second heated air is sprayed onto the brittle substrate. Here, the temperature of the first heated air may be in the range of 80 ° C to 250 ° C, and the temperature of the second heated air may be in the range of 80 ° C to 250 ° C. [Embodiment] Hereinafter, an exemplary embodiment of the present invention will be described with reference to Figs. 3 and 4 . First, as shown in FIG. 3, the substrate rupture device 1000 according to an exemplary embodiment of the present invention includes a vapor supply device 1 , a first heater 200 that heats air 50 supplied from the outside, and a second heater 300. Heating the mixture 220 of the first heated air 210 heated by the first heater 200 and the vapor 110 supplied by the vapor supply device 100, and the nozzle 500, spraying the second heated air 310 heated by the second heater 300 onto the brittle substrate The scribe line of 400. The φ boiler type, the previously described nozzle heater type, or other known conventional steam supply type can be used as the steam supply unit 100. An electric heating system or a combustion heating system may be used as the first heater 200 and the second heater 300. Similar to the conventional technique shown in Fig. 2, although the rupture device 1000 can be moved together with the scribe device to continuously perform scribing and rupture, the rupture device can also be moved separately from the scribing device.脆 A brittle substrate rupture method according to the present invention will be described below with reference to FIG. First, the air supplied from the outside is heated to about 80X: to about 250 °C by the first heater 2' to form the first heated air (S10). As described below, the temperature of the first heated air is such that it is easy to obtain a second heated air while avoiding the temperature required for the subsequent mixing of the vapor to cool the water droplets 12 201020221. Next, the first heated air is mixed with the vapor supply device 1 to supply steam (S20).
接著，加熱混合的空氣及蒸氣至約至約2如。C 而形成第二次加熱空氣，其水氣含量為體積百分比 1-10% (S30)。 若是初始供應相對較冷的空氣直接與蒸氣混合及 加熱，而不是混合及加熱第一次加熱空氣與蒸氣，則蒸 氣可在加熱前於混合當中冷卻並凝結成水，使得水滴可 形成於脆性基板表面。 再者，若第二次加熱空氣的溫度過低，可能形成水 滴於脆性基板，若溫度過高，則可能造成跪性基板之熱 損害。因此，較佳在約8(TC至約25(TC之溫度範圍，適 當地選擇其中有空氣及蒸氣一起混合之第二次加熱空 氣的溫度。 此外，水氣含量設定為體積百分比1 — 1〇% ,因為若 水氣太低則潛熱之加熱效果不顯著，而若溫度太高則水 滴可能形成於脆性基板表面。 ， 201020221 最後，含有水氣之第二次加熱空氣，透過喷嘴500 噴灑到脆性基板之劃刻線(S4〇)。 若如此進行’當加熱蒸氣接觸相對冷的脆性基板表 面時’由於相轉移的潛熱可立即轉移到脆性基板，且可 增加脆性基板的表面温度。此時，由於含於第二次加熱 空氣中之水氣量僅為體積百分比M⑽，空氣像以前一 ❹ 樣為向溫狀態，而不形成水滴。 >結果’由於第二次加熱空氣之溫度以及第二次加熱 空氣所含之水氣的潛熱，使激熱快速地轉移到脆性基板 之劃刻線’而改善劃刻線裂痕拓展效應。 再者’因為於破裂程序中水滴不會形成於脆性基 板，裂痕拓展均勻且可降低例如污潰之產品缺陷。 根據本發明之脆性基板破裂裝置及方法，由於第二 人加熱空氣之溫度以及第二次加熱空氣所含之水氣的 潛熱’使激熱快速地轉移到脆性基板之劃刻線，因此改 善劃刻線裂痕拓展效應。 再者’根據本發明，於破裂程序中喷灑之第二次加 熱空氣含有不超過體積百分比10%之水氣’使得於破聲 私序中水滴不會形成於脆性基板’因此裂痕拓展均句2 201020221 可降低產品缺陷。 曰雖然已參考特定例示實施例顯示及說明本發明，但 是熟此技術賴者細瞭在稍縣發明申請專利 圍界定之精神與㈣下在形式肠節上可有各種修改 及變化。Next, the mixed air and vapor are heated to about to about two. C forms a second heated air having a moisture content of 1-10% by volume (S30). If the initially supplied relatively cold air is directly mixed and heated with steam, rather than mixing and heating for the first time to heat the air and vapor, the vapor may be cooled and condensed into water during mixing before heating, so that water droplets may be formed on the brittle substrate. surface. Further, if the temperature of the second heated air is too low, water droplets may form on the brittle substrate, and if the temperature is too high, thermal damage to the inert substrate may occur. Therefore, it is preferred to select a temperature of the second heated air in which air and steam are mixed together in a temperature range of about 8 (TC to about 25 (TC). Further, the water vapor content is set to a volume percentage of 1 - 1 〇. %, because if the water vapor is too low, the heating effect of latent heat is not significant, and if the temperature is too high, water droplets may be formed on the surface of the brittle substrate. , 201020221 Finally, the second heated air containing moisture is sprayed through the nozzle 500 to the brittle substrate. The scribe line (S4〇). If so, when the heated vapor contacts the relatively cold brittle substrate surface, the latent heat due to phase transfer can be immediately transferred to the brittle substrate, and the surface temperature of the brittle substrate can be increased. The amount of water contained in the second heated air is only a volume percentage M (10), and the air is in a warm state as before, without forming water droplets. > Result 'Because of the temperature of the second heated air and the second heating The latent heat of the water contained in the air causes the heat to be quickly transferred to the scribe line of the brittle substrate to improve the cracking effect of the scribe line crack. The water droplets in the sequence are not formed on the brittle substrate, and the cracks are uniformly expanded and can reduce defects such as fouling. According to the brittle substrate rupturing device and method of the present invention, the temperature of the second person heating air and the second heating air are included. The latent heat of the water vapor rapidly transfers the heat to the scribe line of the brittle substrate, thus improving the rip-line crack growth effect. Further, according to the present invention, the second heated air sprayed in the rupture program contains no Water vapor exceeding 10% by volume makes water droplets in the broken sound order not formed on the brittle substrate. Therefore, the crack can be reduced. The product defect can be reduced. Having described and illustrated the present invention with reference to specific exemplary embodiments, However, those who are familiar with this technology can make various modifications and changes in the form of the intestines in the form of the invention of the application for patents in the county and (4).
【圖式簡單說明】 參考以下詳細說㈣配合伴咖^ ,更清楚本發明 上述及其他目的、特徵、及優點，其中： 圖1為習知劃刻裝置之示意圖； 圖2為習知破裂裝置之示意圖； 圖3為根據本發明脆性基板破裂裝置之結構之 圖；以及 ·% 圖4為根據本發明脆性基板破裂方法之流程圖。 【主要元件符號說明】 1 跪性基板 20 劃刻頭 21 劃刻輪 22 頭主體 27 輪支托器 31 桌台 32 導軌 ❿ 15 201020221BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, and advantages of the present invention will become more apparent from the following detailed description of the <RTIgt; 3 is a view showing the structure of a brittle substrate breaking device according to the present invention; and FIG. 4 is a flow chart of a method for breaking a brittle substrate according to the present invention. [Description of main component symbols] 1 基板 substrate 20 scribe head 21 scribe wheel 22 head main body 27 wheel supporter 31 table 32 rail ❿ 15 201020221
33 導軌 34 滑動件 35 滑動件 36 導引條 37 線性馬達 38 線性馬達 41 第一驅動器 42 第二驅動器 43 滑動件感測器 44 控制器 45 劃刻頭驅動馬達 46 滾珠螺桿 47 第三驅動器 50 空氣 52 蒸氣產生器 52a 主體 52b 彈性管 52c 喷嘴頭 52d 喷嘴 100 蒸氣供應裝置 110 蒸氣 200 第一加熱器 210 第一次加熱空氣 220 混合物 201020221 300 第二加熱器 310 第二次加熱空氣 400 脆性基板 500 喷嘴 1000 脆性基板破裂裝置33 Guide rail 34 Slide 35 Slider 36 Guide strip 37 Linear motor 38 Linear motor 41 First drive 42 Second drive 43 Slider sensor 44 Controller 45 Scratch head drive motor 46 Ball screw 47 Third drive 50 Air 52 Vapor generator 52a Main body 52b Elastic tube 52c Nozzle head 52d Nozzle 100 Vapor supply device 110 Vapor 200 First heater 210 First heated air 220 Mixture 201020221 300 Second heater 310 Second heated air 400 Brittle substrate 500 Nozzle 1000 brittle substrate rupture device