JP2015140279A - Method for cutting glass film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for cutting a glass film, capable of accurately laser-cutting the glass film when laser-cut and preventing an uncut portion from remaining.SOLUTION: A method for cutting a glass film comprises: the initial crack formation step of forming an initial crack 12 in one end 4a of a cutting schedule line 4 crossing between end parts of a glass film 2; the stress addition step of curving a part including the cutting schedule line 4 in the glass film 2 to act tensile stress in a direction orthogonal to the cutting schedule line 4; and the cutting step of developing the initial crack 12 toward the other end 4b along the cutting schedule line 4 by heating with irradiation of a laser 5 and cooling with a coolant 7 following the heating. The initial crack formation step is performed in the state of leveling a part including the one end 4a of the cutting schedule line 4 in the glass film 2, and an uncut portion in the cutting step is cut by performing the stress addition step.

Description

  The present invention relates to a glass film cleaving method for cleaving a glass film by laser cleaving.

  Mobile devices such as smartphones and tablet PCs that are rapidly spreading in recent years are required to be lightweight, and the current situation is that thinning of glass substrates used in such devices is being promoted. It is. As a response to such a demand, a glass film in which a glass substrate is thinned to a film shape (for example, a thickness of 200 μm or less) has been developed.

  One method for cleaving this glass film is laser cleaving. In this method, first, an initial crack is formed at the end of the glass film. Then, the heating part heated by the laser irradiation and the cooling part cooled by jetting of the refrigerant (for example, mist-like water) and following the heating part are used as the starting point of the initial crack, and the end of the glass film It is formed sequentially so as to cross the space. Thereby, an initial crack progresses with the thermal stress which originates in the temperature difference of a heating part and a cooling part, and a glass film is cleaved.

  By the way, when cleaving a glass film by laser cleaving, there are the following difficulties. That is, as shown in FIG. 7 (a), in the vicinity of the end portion 101a of the glass film 101, which is the end point of the crack 100, the heating unit 102 and the cooling unit 103 are represented by a two-dot chain line in FIG. It is difficult to secure a space for forming both. For this reason, it becomes difficult to form both parts 102 and 103 on the glass film 101 simultaneously.

  As a result, in the vicinity of the end portion 101a of the glass film 101, the required thermal stress for causing the crack 100 to propagate cannot be applied, and the progress of the crack 100 stops before reaching the end portion 101a. Thus, as shown in FIG. 7B, there is a problem that the uncut portion 101b remains in the glass film 101.

  Here, Patent Document 1 discloses a laser cleaving apparatus that can break down not only glass but also various brittle materials including glass and that can solve the above-described problems.

  In the cleaving of the brittle material substrate using the same apparatus, first, the brittle material substrate is bent to apply a tensile stress in a direction orthogonal to the planned initial crack propagation direction (scheduled progress direction). In this state, initial cracks are formed at the end of the brittle material substrate, and a heating unit and a cooling unit are sequentially formed on the brittle material substrate. Thereby, an initial crack is advanced and a brittle material substrate is cleaved.

  According to such an aspect, even if the thermal stress for progressing the initial crack is insufficient at the end that is the end point of the progress of the initial crack, due to the tensile stress acting on the curved brittle material substrate, It is possible to maintain the progress of the initial crack. Therefore, it is possible to suitably prevent the remaining uncut portion from remaining.

JP 2012-45830 A

  However, the laser cleaving apparatus disclosed in Patent Document 1 still has the following problems to be solved. That is, when the apparatus disclosed in this document is used for cleaving a glass film, an initial crack is formed at the end of the glass film in a state where a tensile stress is applied due to bending.

  Therefore, the initial crack may be formed in an unintended direction due to tensile stress. When such a situation occurs, when performing laser cleaving, the initial crack progresses in a direction different from the intended direction, or it becomes impossible to propagate the initial crack itself. There was a problem that the execution of cleaving was hindered.

  This invention made | formed in view of the said situation makes it a technical subject to make it possible to perform exact laser cleaving, and to prevent the remainder of a cutting | disconnection part, when cleaving a glass film by laser cleaving.

  The present invention, which was created to solve the above problems, includes an initial crack forming step for forming an initial crack at one end of a planned cutting line that crosses between the ends of the glass film, and a planned cutting line in the glass film. The initial crack is cut along the planned cutting line by curving the part to be included and applying a stress to the tensile stress in the direction orthogonal to the planned cutting line, heating by laser irradiation, and cooling by the refrigerant following this process. A cleaving method for a glass film including a cleaving step that progresses toward the other end, and performing an initial crack forming step in a state in which a portion including one end of a cleaving planned line in the glass film is flattened, It is characterized by cleaving the uncut portion in the cleaving step by executing the stress applying step.

  According to such a method, an initial crack formation process is performed in the state which planarized the site | part (henceforth an initial crack formation site | part) including the one end of the breaking line in a glass film. Therefore, the initial crack is formed in the initial crack formation site under a state in which the tensile stress acting by the curvature of the glass film is almost completely eliminated. For this reason, it becomes possible to avoid the occurrence of a situation in which the initial crack is formed in an unintended direction, and in the cleaving step, the initial crack can be reliably propagated along the planned cleaving line. it can. Further, when the cleaving process is performed, even if the thermal stress for developing the initial crack is insufficient in the vicinity of the other end of the cleaving line, the direction of orthogonal to the cleaving line is performed by executing the stress applying process. Due to the tensile stress acting on the initial crack, the initial crack progresses in the uncut portion in the cleaving process. From the above, according to this method, it is possible to perform accurate laser cleaving and prevent the occurrence of uncut portions.

  In the above method, the stress applying step may be performed from the start of the cleaving step until the glass film is cleaved over the entire length of the cleaved planned line, or stress is applied only at the cleaving of the remaining portion. You may perform a process.

  If the stress applying step is executed at least when the remaining portion is cleaved, the initial cracks progress in the remaining portion in the cleaving step, and the remaining portion can be prevented.

  In the above method, on each of the one side and the other side with the planned cutting line as a boundary, a support member that supports the glass film and can rotate about an axis extending in parallel with the planned cutting line is provided. The stress applying step may be performed by rotating the supporting member on the side and the supporting member on the other side in opposite directions.

  If it does in this way, as one side supporting member and the other side supporting member autorotate in the opposite direction, a part including a planned cutting line in the glass film (hereinafter referred to as a peripheral part of the cutting planned line) Can be curved and the stress application step can be performed. Moreover, it is possible to change the curvature at the time of curvature in the site | part around a cutting planned line by the magnitude of the rotation angle at the time of both support members rotating. For this reason, according to the thickness of the glass film used as the object of a cleaving, the tensile stress of a suitable magnitude | size can be made to act on the cutting | disconnection planned line periphery site | part.

  In the above method, a stress applying step is performed by providing a supporting member that supports the glass film on each of one side and the other side with the planned cutting line as a boundary and injecting gas toward the planned cutting line. May be.

  If it does in this way, the part around a cutting planned line will curve with injection of gas, and a stress provision process can be performed. Further, it is possible to change the curvature at the time of bending around the planned cutting line depending on the magnitude of the gas injection pressure. For this reason, according to the thickness of the glass film used as the object of a cleaving, the tensile stress of a suitable magnitude | size can be made to act on the cutting | disconnection planned line periphery site | part.

  In the above method, it is preferable to provide a plurality of holes on the support surface that supports the glass film in the support member, and to generate a negative pressure on the glass film through the holes when the stress applying step is performed.

  If it does in this way, at the time of execution of a stress provision process, a glass film will be adsorbed and fixed to a support member. Therefore, it becomes possible to execute the stress applying step more stably. In addition, sliding between the support member and the glass film can be prevented, and occurrence of a situation in which the glass film is damaged can be avoided.

  As described above, according to the present invention, when a glass film is cleaved by laser cleaving, it is possible to perform accurate laser cleaving and to prevent remaining uncut portions.

It is a top view which shows the laser cleaving apparatus used for the cleaving method of the glass film which concerns on 1st embodiment of this invention. It is a front view which shows the laser cleaving apparatus used for the cleaving method of the glass film which concerns on 1st embodiment of this invention. It is a front view which shows the cleaving method of the glass film which concerns on 1st embodiment of this invention. It is a front view which shows the cleaving method of the glass film which concerns on 1st embodiment of this invention. It is front sectional drawing which shows the cleaving method of the glass film which concerns on 1st embodiment of this invention. It is front sectional drawing which shows the cleaving method of the glass film which concerns on 2nd embodiment of this invention. It is a top view which shows the cleaving method of the glass film in the past.

  Hereinafter, the cleaving method of the glass film which concerns on embodiment of this invention is demonstrated with reference to attached drawing. In addition, it is preferable to apply the cleaving method of the glass film demonstrated below to the cleaving of the glass film whose thickness is 200 micrometers or less.

  First, the laser cleaving apparatus used for the glass film cleaving method according to the first embodiment of the present invention will be described.

  1 and 2 are a plan view and a front view, respectively, showing the laser cleaving apparatus 1. As shown in these drawings, the laser cleaving apparatus 1 performs heating along a movable table 3 as a supporting member that supports the glass film 2 and a planned cutting line 4 that crosses between the ends of the glass film 2. A laser irradiator 6 that irradiates the laser 5, a refrigerant injection nozzle 8 that injects a refrigerant 7 (for example, mist-like water) for cooling the glass film 2 following the irradiation of the laser 5, and the glass film 2. And a support base 9 for supporting the vicinity of one end 4a of the planned cutting line 4 in FIG.

  One movable table 3 is arranged on each of one side and the other side with the planned cutting line 4 as a boundary. For each of the movable tables 3, a plurality of holes 3 b are provided in the support surface 3 a that supports the glass film 2. Each of the holes 3b is connected to a negative pressure generator (not shown) (for example, a vacuum pump), and with the generation of the negative pressure, the movable table 3 sucks the glass film 2 through the holes 3b. It can be fixed. Moreover, both movable tables 3 can move in synchronization with a direction parallel to the planned cutting line 4 as indicated by arrows in FIG. Further, each of the movable tables 3 includes a shaft 3c extending in parallel with the planned cutting line 4. As shown by arrows in FIG. 2, the two movable tables 3 are mutually connected with the shaft 3c as a rotation center. It is possible to rotate in the reverse direction. Then, due to the rotation, both movable tables 3 are inclined from the horizontal posture (the posture represented by the solid line in FIG. 2) to the inclined posture (the posture represented by the two-dot chain line in FIG. 2), thereby cleaving the glass film 2. The vicinity of the line 4 is elastically deformed from a flat state to a curved state so as to be convex upward. The rotation angle at which each of the movable tables 3 rotates around the shaft 3 c can be adjusted to an arbitrary angle according to the thickness of the glass film 2.

  The laser irradiator 6 is installed above the glass film 2 in a fixed state. And with the movement of the movable table 3, it is set as the structure which irradiates the laser 5 along the cutting line 4 with respect to the glass film 2 which passes the downward direction of the laser irradiation device 6, and heats it. Similarly to the laser irradiator 6, the refrigerant injection nozzle 8 is installed above the glass film 2 in a fixed state. And it is set as the structure which inject | pours the refrigerant | coolant 7 with respect to the location which has irradiated the laser 5 in the cutting planned line 4, and cools. Accordingly, as represented by a two-dot chain line in FIG. 1, the heating unit 10 heated by the irradiation of the laser 5 and the cooling unit 11 that is cooled by jetting of the refrigerant and follows the heating unit 10 are broken lines. 4 are sequentially formed from the one end 4a side toward the other end 4b side.

  As shown in FIG. 2, the support base 9 is located between the two movable tables 3 and has a function of supporting the vicinity of one end 4 a of the planned cutting line 4 in the glass film 2. Further, the support base 9 is configured to be movable up and down along the vertical direction as indicated by an arrow in FIG. Thereby, a support position (a position represented by a solid line in FIG. 2) when supporting the vicinity of one end 4a and a separation position (a position represented by a two-dot chain line in FIG. 2) separated from the glass film 2 It is possible to move between.

  Hereinafter, the cleaving method of the glass film which concerns on 1st embodiment of this invention using said laser cleaving apparatus is demonstrated.

  In the glass film cleaving method according to the first embodiment, an initial crack forming step of forming an initial crack 12 at one end 4a of a cleaving planned line 4 that crosses between the ends of the glass film 2, and a glass film 2 By applying a stress applying step of bending a portion including the planned cutting line 4 and applying a tensile stress in a direction perpendicular to the planned cutting line 4, heating by irradiation with the laser 5, and cooling by the refrigerant 7 following this, A cleaving step of causing the crack 12 to progress along the planned cleaving line 4 toward the other end 4b.

  First, an initial crack formation process is performed. In this initial crack formation step, first, as shown in FIG. 3, the entire glass film 2 is supported in a flat state by both the movable tables 3 in a horizontal posture and the support base 9 in a state of being raised to the support position. Is done. And the initial crack 12 is formed in the one end 4a of the planned cutting line 4 by rolling the wheel cutter 13 and pressing the glass film 2 under this state.

  Here, at the time of performing the initial crack forming step, the direction in which the wheel cutter 13 rolls is preferably the direction from the inner side of the glass film 2 toward the end side along the planned cutting line 4. Moreover, it is preferable that the distance which the wheel cutter 13 rolls shall be in the range of 5 mm-10 mm.

  When the initial crack formation step is completed, the support base 9 is lowered to the separation position as shown in FIG. Then, the negative pressure is generated by the negative pressure generator, so that the glass film 2 is adsorbed and fixed to the support surfaces 3a of both movable tables 3. Next, a stress applying step is executed. In this stress applying step, the two movable tables 3 are tilted from the horizontal posture to the inclined posture by the rotations of the two movable tables 3 in opposite directions. Thereby, only the vicinity of the planned cutting line 4 in the glass film 2 is elastically deformed from a flat state to a curved state, and a tensile stress acts in a direction orthogonal to the planned cutting line 4. In addition, in this embodiment, until the glass film 2 is cleaved over the full length of the cleaving planned line 4, it continues performing a stress provision process.

  And after starting execution of a stress provision process, a cleaving process is performed. In this cleaving step, both the movable tables 3 are moved in synchronization with the direction parallel to the cleaving line 4 and, as shown in FIG. 4, the laser 5 along the cleaving line 4 starts from the initial crack 12. Irradiation and injection of the refrigerant 7 that follows this are performed. Thereby, the initial crack 12 is propagated along the planned cutting line 4 toward the other end 4b by the thermal stress generated due to the temperature difference between the heating unit 10 and the cooling unit 11.

  Here, at the time of executing the cleaving step, the speed at which both movable tables 3 move in a direction parallel to the cleaving line 4 is preferably within a range of 35 mm / s to 160 mm / s.

  As shown in FIG. 5 (showing a state where the initial crack 12 has reached the AA cross section in FIG. 1), when the initial crack 12 progresses to the vicinity of the other end 4b of the planned cutting line 4, the initial crack 12 Insufficient thermal stress to develop However, by executing the stress application step, the initial crack 12 continues to progress due to the tensile stress acting in the direction orthogonal to the planned cutting line 4, and the initial crack 12 is connected to the other end 4 b of the planned cutting line 4. To reach. Thereby, the glass film 2 is cleaved over the full length of the cleaving planned line 4.

  Hereinafter, the operation and effect of the glass film cleaving method according to the first embodiment of the present invention will be described.

  According to the cleaving method of the glass film according to the first embodiment, the initial crack forming step is performed in a state where the entire glass film 2 is flattened. Therefore, the initial crack 12 is formed in the state where the tensile stress acting by the curvature of the glass film 2 is almost completely eliminated at the one end 4 a of the planned cutting line 4. For this reason, it is possible to avoid the occurrence of a situation in which the initial crack 12 is formed in an unintended direction. As a result, in the cleaving step, the initial crack 12 can be reliably propagated along the planned cutting line 4.

  In addition, this effect | action and effect are heightened more because the one end 4a vicinity of the cutting planned line 4 in the glass film 2 is supported by the support stand 9. FIG.

  Moreover, at the time of execution of the cleaving process, even if the thermal stress for developing the initial crack 12 is insufficient in the vicinity of the other end 4b of the cleaving planned line 4, the cleaving schedule is performed because the stress applying process is performed. Due to the tensile stress acting in the direction orthogonal to the line 4, the progress of the initial crack 12 is continued, and the initial crack 12 reaches the other end 4 b of the planned breaking line 4. From the above, according to the method for cleaving the glass film, it is possible to perform accurate laser cleaving and prevent the occurrence of uncut portions.

  Furthermore, according to this glass film cleaving method, the following actions and effects can be obtained.

  That is, in this method, it is possible to change the curvature of the glass film 2 during bending in the vicinity of the planned cutting line 4 depending on the rotation angle when both the movable tables 3 rotate. For this reason, an appropriate magnitude | size tensile stress can be made to act at the time of execution of a stress provision process according to the thickness of the glass film 2 used as the object of cleaving.

  In this method, the glass film 2 is attracted and fixed to the support surface 3a of the movable table 3 when the stress application step is executed. Therefore, it becomes possible to perform a stress application process stably. Moreover, sliding with the movable table 3 and the glass film 2 can be prevented, and it is possible to avoid the situation where the glass film 2 is damaged.

  Further, in this method, at the time of executing the stress application step, the vicinity of the planned cutting line 4 in the glass film 2 is curved in a single manner so that the entire region thereof is convex upward. For this reason, it becomes easy to curve the vicinity of the planned cutting line 4 with a uniform curvature. Thereby, generation | occurrence | production of the situation which a variation produces in the magnitude | size of the tensile stress which acts by execution of a stress provision process can be avoided.

  Hereinafter, the laser cleaving apparatus used for the cleaving method of the glass film which concerns on 2nd embodiment of this invention is demonstrated.

  FIG. 6 is a front sectional view showing the laser cleaving apparatus 1. In addition, regarding each component of the laser cleaving apparatus 1, the same component as the laser cleaving apparatus used in the first embodiment is attached to each component in each drawing referred to in the description of the first embodiment. By attaching the same reference numerals as those described above, redundant description is omitted.

  The laser cleaving apparatus 1 is different from the laser cleaving apparatus used in the first embodiment described above in that the shaft 3c is removed from the movable table 3 and the movable table 3 is disposed between the two. And it is a point provided with the gas injector 15 which injects the gas 14 (for example, air) toward the cutting projected line 4. FIG.

  In this laser cleaving apparatus 1, the shaft 3c is removed from the movable table 3, so that the movable table 3 always maintains a horizontal posture.

  The gas injector 15 is positioned between both movable tables 3 and extends in a direction parallel to the planned cutting line 4. And with the movement of the movable table 3, the gas 14 is injected toward the cutting planned line 4 with respect to the glass film 2 which passes the upper direction of the gas injector 15. FIG. Thereby, the vicinity of the planned cutting line 4 in the glass film 2 is elastically deformed from a flat state to a curved state. The injection pressure of the gas 14 can be adjusted to an arbitrary pressure.

  Hereinafter, the cleaving method of the glass film which concerns on 2nd embodiment of this invention using said laser cleaving apparatus is demonstrated. In the following description, only the difference from the glass film cleaving method according to the first embodiment will be described. Steps not mentioned below are executed in the same manner as in the first embodiment.

  The glass film cleaving method according to the second embodiment is different from the glass film cleaving method according to the first embodiment in the execution mode of the stress application step. That is, in the method for cleaving a glass film according to the second embodiment, the vicinity of the cleaved planned line 4 in the glass film 2 is elastically deformed from a flat state to a curved state by the injection of the gas 14, and the cleaved planned line is obtained. Tensile stress acts in a direction perpendicular to 4.

  Hereinafter, the operation and effect of the glass film cleaving method according to the second embodiment of the present invention will be described.

  Also by the glass film cleaving method according to the second embodiment, the following effects (1) to (3) are obtained for the same reason as the glass film cleaving method according to the first embodiment. (1) It is possible to execute reliable laser cleaving. (2) Generation of uncut portions can be prevented. (3) Generation | occurrence | production of the damage | wound in the glass film 2 can be avoided.

  In this method, the curvature of the glass film 2 during bending can be changed in the vicinity of the planned cutting line 4 depending on the magnitude of the injection pressure of the gas 14. For this reason, an appropriate magnitude | size tensile stress can be made to act at the time of execution of a stress provision process according to the thickness of the glass film 2 used as the object of cleaving.

  Here, the cleaving method of the glass film which concerns on this invention is not limited to the aspect demonstrated by said embodiment. For example, in the above embodiment, in the initial crack forming step, the initial crack is formed in a state where the entire glass film is flattened. However, in the initial crack forming step, it is sufficient that at least a portion including one end of the planned cutting line in the glass film is flat. Therefore, for example, the initial crack forming step may be executed in a state where only the vicinity of one end is flattened.

  In the above embodiment, after the initial crack formation process is completed, the glass film is in a mode of continuously executing the stress application process until the glass film is cleaved over the entire length of the planned cleaving line. is not. For example, after the initial crack forming process is completed, the cleaving process is executed without executing the stress applying process. And when the progress of the initial crack by thermal stress stops, you may perform a stress provision process. That is, it is also possible to adopt a mode in which the stress applying step is executed only when the uncut portion is cleaved. Furthermore, as an aspect in which the execution of the stress applying process is started at an arbitrary timing during the execution of the cleaving process and the stress applying process is continued until the glass film is cleaved over the entire length of the planned cutting line. Good.

  Moreover, in said embodiment, it is the aspect which curves only the vicinity of the cutting plan line in a glass film at the time of execution of a stress provision process, However, In a stress application process, the site | part containing the cleaving line at least in a glass film It suffices to be in a curved state. For this reason, it is good also as an aspect which curves the whole glass film in the direction orthogonal to a cleaving planned line. Furthermore, in the stress application step, it is only necessary that a tensile stress acts in a direction orthogonal to the planned cutting line. Therefore, contrary to the above embodiment, the glass film is curved so as to protrude downward. Also good. In addition, in the first embodiment described above, the position of the axis serving as the rotation center of the movable table may be an arbitrary position on the movable table. However, when the shaft is provided at a position away from the planned cutting line, it is preferable to provide a mechanism that allows the movable table to slide in a direction approaching the planned cutting line as the glass film is curved. Moreover, you may perform the execution of a stress provision process combining the rotation of the movable table in said 1st embodiment, and the injection of gas in 2nd embodiment.

  In the above embodiment, the support surface of the movable table is provided with a plurality of holes, and the support surface of the movable table adsorbs and fixes the glass film when the stress application step is performed. However, the glass film may be fixed to the movable table by, for example, placing a weight on the movable table via the glass film. Furthermore, in the above-described embodiment, the glass film is not adsorbed by the support surface of the movable table when the initial crack forming step is performed. However, the glass film may be adsorbed also in the initial crack forming step.

  Moreover, in said embodiment, a cleaving process is performed by fixing a laser irradiation machine and a refrigerant | coolant injection nozzle to a fixed point, and moving the glass film supported by the movable table. However, the present invention is not limited to this, and the cleaving step may be executed by fixing the glass film and moving the laser irradiator and the refrigerant injection nozzle. Furthermore, as long as the laser irradiator, the refrigerant injection nozzle, and the glass film are relatively moved, the cleaving step may be executed in any manner.

2 Glass film 3 Movable table 3a Support surface 3b Hole 3c Shaft 4 Scheduled line 4a One end of the planned split line 4b The other end of the planned split line 5 Laser 7 Refrigerant 12 Initial crack 14 Gas

Claims (6)

An initial crack forming step for forming an initial crack at one end of a planned cutting line that crosses between the ends of the glass film, and a portion including the planned cutting line in the glass film is curved, and is orthogonal to the planned cutting line. A stress applying step in which a tensile stress is applied in a direction, a cleaving step of causing the initial crack to propagate toward the other end along the planned cleaving line by heating by laser irradiation and cooling by a refrigerant that follows this. A method for cleaving a glass film containing
While performing the initial crack formation step in a state where the portion including one end of the planned cutting line in the glass film is flattened,
A cleaving method for a glass film, wherein the remaining portion in the cleaving step is cleaved by executing the stress applying step.   2. The method for cleaving a glass film according to claim 1, wherein the stress applying step is executed from the start of the cleaving step until the glass film is cleaved over the entire length of the cleaving line. .   The method for cleaving a glass film according to claim 1, wherein the stress applying step is executed only at the time of cleaving the uncut portion. Provided on each of the one side and the other side with the planned cutting line as a boundary is a support member that supports the glass film and that can rotate about an axis extending in parallel with the planned cutting line.
The cleaving of the glass film according to any one of claims 1 to 3, wherein the stress applying step is performed by rotating the supporting member on one side and the supporting member on the other side in opposite directions. Method. A support member for supporting the glass film is provided on each of the one side and the other side with the planned cutting line as a boundary,
The glass film cleaving method according to any one of claims 1 to 3, wherein the stress applying step is executed by injecting gas toward the cleaving line. Providing a plurality of holes on the support surface for supporting the glass film in the support member,
6. The method for cleaving a glass film according to claim 4, wherein a negative pressure is generated in the glass film through the hole during the execution of the stress applying step.

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