KR20100057042A - 광학 부품，상기 부품의 제조 방법 및 상기 부품을 포함하는 광전 조립체 유닛 - Google Patents

광학 부품，상기 부품의 제조 방법 및 상기 부품을 포함하는 광전 조립체 유닛 Download PDF

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Publication number
KR20100057042A
KR20100057042A KR1020107005554A KR20107005554A KR20100057042A KR 20100057042 A KR20100057042 A KR 20100057042A KR 1020107005554 A KR1020107005554 A KR 1020107005554A KR 20107005554 A KR20107005554 A KR 20107005554A KR 20100057042 A KR20100057042 A KR 20100057042A
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KR
South Korea
Prior art keywords
molding material
resin molding
component
optical component
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020107005554A
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English (en)
Korean (ko)
Inventor
거트루드 크라우터
톨스텐 핏존카
Original Assignee
오스람 옵토 세미컨덕터스 게엠베하
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Application filed by 오스람 옵토 세미컨덕터스 게엠베하 filed Critical 오스람 옵토 세미컨덕터스 게엠베하
Publication of KR20100057042A publication Critical patent/KR20100057042A/ko
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020107005554A 2007-09-04 2008-08-14 광학 부품，상기 부품의 제조 방법 및 상기 부품을 포함하는 광전 조립체 유닛 Ceased KR20100057042A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102007041889.4 2007-09-04
DE102007041889 2007-09-04
DE102007052133.4 2007-10-31
DE102007052133A DE102007052133A1 (de) 2007-09-04 2007-10-31 Optisches Bauteil, Verfahren zur Herstellung des Bauteils und optoelektronisches Bauelement mit dem Bauteil

Publications (1)

Publication Number Publication Date
KR20100057042A true KR20100057042A (ko) 2010-05-28

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ID=40299222

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107005554A Ceased KR20100057042A (ko) 2007-09-04 2008-08-14 광학 부품，상기 부품의 제조 방법 및 상기 부품을 포함하는 광전 조립체 유닛

Country Status (8)

Country Link
US (1) US8194326B2 (https=)
EP (1) EP2185952B1 (https=)
JP (1) JP2010539521A (https=)
KR (1) KR20100057042A (https=)
CN (1) CN101796435B (https=)
DE (1) DE102007052133A1 (https=)
TW (1) TWI382504B (https=)
WO (1) WO2009030193A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6444979B2 (ja) * 2013-03-27 2018-12-26 オーエルイーディーワークス ゲーエムベーハーＯＬＥＤＷｏｒｋｓ ＧｍｂＨ 改良型有機発光ダイオード（ｏｌｅｄ）の光源
JP2015079926A (ja) * 2013-09-10 2015-04-23 旭化成ケミカルズ株式会社 光デバイス、およびその製造方法
US10584223B2 (en) * 2014-10-20 2020-03-10 Dow Toray Co., Ltd. Optical member, optical semiconductor device, and illumination apparatus
JP6446280B2 (ja) 2015-01-28 2018-12-26 日立オートモティブシステムズ株式会社 電子装置
DE102015103335A1 (de) * 2015-03-06 2016-09-08 Osram Opto Semiconductors Gmbh Optoelektronische Vorrichtung und Verfahren zur Herstellung einer optoelektronischen Vorrichtung
CN109411587B (zh) * 2018-12-10 2020-11-27 浙江单色电子科技有限公司 一种含硅胶透镜的紫光led生产方法及其紫光led

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4125319A (en) * 1976-05-03 1978-11-14 Eastman Kodak Company Active light control device
JPS5599932A (en) * 1979-01-24 1980-07-30 Hitachi Ltd Surface treatment of organic high polymer
EP0844265B1 (en) * 1995-08-11 2002-11-20 Daikin Industries, Limited Silicon-containing organic fluoropolymers and use of the same
WO1999048339A1 (en) * 1998-03-17 1999-09-23 Seiko Epson Corporation Substrate for patterning thin film and surface treatment thereof
ATE344805T1 (de) * 1999-09-08 2006-11-15 Daikin Ind Ltd Fluorchemisches klebstoffmaterial und daraus erhältliches schichtförmiges produkt
CA2478601A1 (en) 2002-03-07 2003-09-18 Petroferm Inc. Dust repellant compositions
JP4506070B2 (ja) * 2002-11-01 2010-07-21 コニカミノルタホールディングス株式会社 防眩層の形成方法、防眩フィルムの製造方法及び防眩層形成用のインクジェット装置
DE102004019973B4 (de) * 2004-02-29 2006-07-13 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines kontaminationsgeschützten, optoelektronischen Bauelements und kontaminationsgeschütztes, optoelektronisches Bauelement
JP4496394B2 (ja) * 2004-03-31 2010-07-07 日本ゼオン株式会社 耐候性レンズ又はプリズム
US6991826B2 (en) * 2004-04-20 2006-01-31 3M Innovative Properties Company Antisoiling coatings for antireflective substrates
JP4539518B2 (ja) 2005-03-31 2010-09-08 セイコーエプソン株式会社 電気光学装置及び電気光学装置の製造方法
JP2006285104A (ja) * 2005-04-04 2006-10-19 Dainippon Printing Co Ltd カラーフィルタおよびカラーフィルタの製造方法
JP4946163B2 (ja) * 2005-07-21 2012-06-06 ソニー株式会社 金属酸化物ナノ粒子の製造方法

Also Published As

Publication number Publication date
TW200913183A (en) 2009-03-16
WO2009030193A1 (de) 2009-03-12
US20100220396A1 (en) 2010-09-02
CN101796435A (zh) 2010-08-04
TWI382504B (zh) 2013-01-11
EP2185952A1 (de) 2010-05-19
CN101796435B (zh) 2015-08-19
JP2010539521A (ja) 2010-12-16
EP2185952B1 (de) 2018-12-12
US8194326B2 (en) 2012-06-05
DE102007052133A1 (de) 2009-03-05

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