KR20100015756A - 기판 이송용 로봇의 엔드 이펙터 - Google Patents
기판 이송용 로봇의 엔드 이펙터 Download PDFInfo
- Publication number
- KR20100015756A KR20100015756A KR1020097021955A KR20097021955A KR20100015756A KR 20100015756 A KR20100015756 A KR 20100015756A KR 1020097021955 A KR1020097021955 A KR 1020097021955A KR 20097021955 A KR20097021955 A KR 20097021955A KR 20100015756 A KR20100015756 A KR 20100015756A
- Authority
- KR
- South Korea
- Prior art keywords
- end effector
- frp
- fibers
- transfer robot
- substrate transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Program-controlled manipulators
- B25J9/0009—Constructional details, e.g. manipulator supports, bases
- B25J9/0012—Constructional details, e.g. manipulator supports, bases making use of synthetic construction materials, e.g. plastics, composites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US92194607P | 2007-04-05 | 2007-04-05 | |
| US60/921,946 | 2007-04-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20100015756A true KR20100015756A (ko) | 2010-02-12 |
Family
ID=39575867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020097021955A Ceased KR20100015756A (ko) | 2007-04-05 | 2008-04-02 | 기판 이송용 로봇의 엔드 이펙터 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20080247857A1 (enExample) |
| EP (1) | EP2137762A1 (enExample) |
| JP (1) | JP2010524241A (enExample) |
| KR (1) | KR20100015756A (enExample) |
| CN (1) | CN101652852B (enExample) |
| WO (1) | WO2008124421A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150131101A (ko) * | 2013-03-13 | 2015-11-24 | 베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크. | 복합 엔드 이펙터들 |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20130007548A (ko) * | 2010-03-04 | 2013-01-18 | 제이엑스 닛코닛세키에너지주식회사 | 로보트 핸드 |
| CN102050330B (zh) * | 2010-11-05 | 2013-02-06 | 深圳市华星光电技术有限公司 | 机械手臂及具有该机械手臂的搬运装置 |
| US9004846B2 (en) | 2011-02-11 | 2015-04-14 | The Procter & Gamble Company | Gripper assembly for moving device |
| US20120205928A1 (en) * | 2011-02-11 | 2012-08-16 | Stefano La Rovere | Gripper Assembly for Mechanical Device |
| JP5447470B2 (ja) * | 2011-09-22 | 2014-03-19 | 株式会社安川電機 | ハンドおよびロボット |
| US20130156530A1 (en) * | 2011-12-14 | 2013-06-20 | Intermolecular, Inc. | Method and apparatus for reducing contamination of substrate |
| US9884426B2 (en) | 2013-06-27 | 2018-02-06 | De-Sta-Co Europe Gmbh | Boom utilized in a geometric end effector system |
| KR102177156B1 (ko) * | 2014-03-10 | 2020-11-10 | 삼성전자주식회사 | 로봇 및 그를 구비한 기판 처리 장치 |
| DE102015111859B4 (de) * | 2015-07-22 | 2022-02-24 | Fibro Läpple Technology GmbH | Höchstgeschwindigkeitsportalsystem mit Linearantrieb |
| US10192761B2 (en) * | 2016-02-15 | 2019-01-29 | Asm Technology Singapore Pte Ltd | Pick arm comprising a winged part for a bonding apparatus |
| NL2018244B1 (en) * | 2017-01-27 | 2018-08-07 | Suss Microtec Lithography Gmbh | Endeffektor |
| KR101859153B1 (ko) * | 2017-10-11 | 2018-05-16 | 주식회사 넥스컴스 | 외팔보 형태로 된 카세트용 서포트바의 진동감쇠장치 |
| WO2019130387A1 (ja) * | 2017-12-25 | 2019-07-04 | 堺ディスプレイプロダクト株式会社 | 蒸着マスク、蒸着方法及び有機el表示装置の製造方法 |
| WO2019130388A1 (ja) * | 2017-12-25 | 2019-07-04 | 堺ディスプレイプロダクト株式会社 | 蒸着マスク、蒸着方法及び有機el表示装置の製造方法 |
| CN108517113A (zh) * | 2018-05-07 | 2018-09-11 | 安徽悦尔伟塑料机械有限公司 | 高硬度塑料机械手及其制备方法 |
| CN112368118B (zh) * | 2018-06-15 | 2024-04-02 | 日铁综合工程株式会社 | 工件输送构件、工件输送装置以及热处理装置 |
| JP6591022B2 (ja) * | 2018-09-25 | 2019-10-16 | 堺ディスプレイプロダクト株式会社 | 蒸着マスク、蒸着方法及び有機el表示装置の製造方法 |
| JP6768758B2 (ja) * | 2018-09-25 | 2020-10-14 | 堺ディスプレイプロダクト株式会社 | 蒸着マスク、蒸着方法及び有機el表示装置の製造方法 |
| US11548152B2 (en) | 2019-08-02 | 2023-01-10 | Dextrous Robotics, Inc. | Systems and methods for robotic control under contact |
| JP7816870B2 (ja) * | 2022-01-20 | 2026-02-18 | 東京エレクトロン株式会社 | 基板支持部材、基板搬送装置及び基板支持部材の製造方法 |
| WO2023205176A1 (en) | 2022-04-18 | 2023-10-26 | Dextrous Robotics, Inc. | System and/or method for grasping objects |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000343476A (ja) * | 1999-06-09 | 2000-12-12 | Nippon Mitsubishi Oil Corp | 搬送用部材 |
| CN100402246C (zh) * | 2001-03-29 | 2008-07-16 | 日石三菱株式会社 | 机器人手部件及其制造方法 |
| US6815037B2 (en) * | 2001-09-19 | 2004-11-09 | Nippon Mitsubishi Oil Corporation | Carrier member made of a UV resistant fiber-reinforced composite material and process for producing thereof |
| JP2005054541A (ja) * | 2003-08-07 | 2005-03-03 | Nippon Oil Corp | 炭素繊維強化プラスチック製梁部材および炭素繊維により補強した梁部材 |
| WO2005102618A1 (ja) * | 2004-04-20 | 2005-11-03 | Nippon Oil Corporation | ロボットハンド部材、その製造方法及びロボットハンド |
| JP2005340480A (ja) * | 2004-05-26 | 2005-12-08 | Nippon Oil Corp | 基板カセット用サポートバー |
| US7073834B2 (en) * | 2004-06-25 | 2006-07-11 | Applied Materials, Inc. | Multiple section end effector assembly |
| CH697200A5 (de) * | 2004-10-01 | 2008-06-25 | Oerlikon Assembly Equipment Ag | Klemmvorrichtung und Transportvorrichtung zum Transportieren von Substraten. |
-
2008
- 2008-03-25 US US12/079,174 patent/US20080247857A1/en not_active Abandoned
- 2008-04-02 WO PCT/US2008/059102 patent/WO2008124421A1/en not_active Ceased
- 2008-04-02 KR KR1020097021955A patent/KR20100015756A/ko not_active Ceased
- 2008-04-02 JP JP2010502254A patent/JP2010524241A/ja active Pending
- 2008-04-02 EP EP08744912A patent/EP2137762A1/en not_active Withdrawn
- 2008-04-02 CN CN2008800108057A patent/CN101652852B/zh not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150131101A (ko) * | 2013-03-13 | 2015-11-24 | 베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크. | 복합 엔드 이펙터들 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010524241A (ja) | 2010-07-15 |
| WO2008124421A1 (en) | 2008-10-16 |
| CN101652852A (zh) | 2010-02-17 |
| EP2137762A1 (en) | 2009-12-30 |
| US20080247857A1 (en) | 2008-10-09 |
| CN101652852B (zh) | 2011-12-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
St.27 status event code: N-2-6-B10-B15-exm-PE0601 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |