JP2010524241A - 基板を搬送するためのエンドエフェクタおよびロボット - Google Patents

基板を搬送するためのエンドエフェクタおよびロボット Download PDF

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Publication number
JP2010524241A
JP2010524241A JP2010502254A JP2010502254A JP2010524241A JP 2010524241 A JP2010524241 A JP 2010524241A JP 2010502254 A JP2010502254 A JP 2010502254A JP 2010502254 A JP2010502254 A JP 2010502254A JP 2010524241 A JP2010524241 A JP 2010524241A
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JP
Japan
Prior art keywords
end effector
frp
fibers
intermediate member
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010502254A
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English (en)
Japanese (ja)
Other versions
JP2010524241A5 (enExample
Inventor
一郎 湯浅
祐一 丸山
照和 土岐
勲 深津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2010524241A publication Critical patent/JP2010524241A/ja
Publication of JP2010524241A5 publication Critical patent/JP2010524241A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0009—Constructional details, e.g. manipulator supports, bases
    • B25J9/0012—Constructional details, e.g. manipulator supports, bases making use of synthetic construction materials, e.g. plastics, composites
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2010502254A 2007-04-05 2008-04-02 基板を搬送するためのエンドエフェクタおよびロボット Pending JP2010524241A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US92194607P 2007-04-05 2007-04-05
PCT/US2008/059102 WO2008124421A1 (en) 2007-04-05 2008-04-02 An end effector of a robot for transporting substrates

Publications (2)

Publication Number Publication Date
JP2010524241A true JP2010524241A (ja) 2010-07-15
JP2010524241A5 JP2010524241A5 (enExample) 2011-05-12

Family

ID=39575867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010502254A Pending JP2010524241A (ja) 2007-04-05 2008-04-02 基板を搬送するためのエンドエフェクタおよびロボット

Country Status (6)

Country Link
US (1) US20080247857A1 (enExample)
EP (1) EP2137762A1 (enExample)
JP (1) JP2010524241A (enExample)
KR (1) KR20100015756A (enExample)
CN (1) CN101652852B (enExample)
WO (1) WO2008124421A1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6410999B1 (ja) * 2017-12-25 2018-10-24 堺ディスプレイプロダクト株式会社 蒸着マスク、蒸着方法及び有機ｅｌ表示装置の製造方法
JP6411000B1 (ja) * 2017-12-25 2018-10-24 堺ディスプレイプロダクト株式会社 蒸着マスク、蒸着方法及び有機ｅｌ表示装置の製造方法
JP2019112712A (ja) * 2018-09-25 2019-07-11 堺ディスプレイプロダクト株式会社 蒸着マスク、蒸着方法及び有機ｅｌ表示装置の製造方法
JP2019112713A (ja) * 2018-09-25 2019-07-11 堺ディスプレイプロダクト株式会社 蒸着マスク、蒸着方法及び有機ｅｌ表示装置の製造方法
JP2023105858A (ja) * 2022-01-20 2023-08-01 東京エレクトロン株式会社 基板支持部材、基板搬送装置及び基板支持部材の製造方法

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US8827339B2 (en) * 2010-03-04 2014-09-09 Jx Nippon Oil & Energy Corporation Robot hand
CN102050330B (zh) * 2010-11-05 2013-02-06 深圳市华星光电技术有限公司 机械手臂及具有该机械手臂的搬运装置
US20120205928A1 (en) * 2011-02-11 2012-08-16 Stefano La Rovere Gripper Assembly for Mechanical Device
US9004846B2 (en) 2011-02-11 2015-04-14 The Procter & Gamble Company Gripper assembly for moving device
JP5447470B2 (ja) * 2011-09-22 2014-03-19 株式会社安川電機 ハンドおよびロボット
US20130156530A1 (en) * 2011-12-14 2013-06-20 Intermolecular, Inc. Method and apparatus for reducing contamination of substrate
US20140265394A1 (en) * 2013-03-13 2014-09-18 Varian Semiconductor Equipment Associates, Inc. Composite end effectors
US9884426B2 (en) 2013-06-27 2018-02-06 De-Sta-Co Europe Gmbh Boom utilized in a geometric end effector system
KR102177156B1 (ko) * 2014-03-10 2020-11-10 삼성전자주식회사 로봇 및 그를 구비한 기판 처리 장치
DE102015111859B4 (de) * 2015-07-22 2022-02-24 Fibro Läpple Technology GmbH Höchstgeschwindigkeitsportalsystem mit Linearantrieb
US10192761B2 (en) * 2016-02-15 2019-01-29 Asm Technology Singapore Pte Ltd Pick arm comprising a winged part for a bonding apparatus
NL2018244B1 (en) * 2017-01-27 2018-08-07 Suss Microtec Lithography Gmbh Endeffektor
KR101859153B1 (ko) * 2017-10-11 2018-05-16 주식회사 넥스컴스 외팔보 형태로 된 카세트용 서포트바의 진동감쇠장치
CN108517113A (zh) * 2018-05-07 2018-09-11 安徽悦尔伟塑料机械有限公司 高硬度塑料机械手及其制备方法
WO2019239700A1 (ja) * 2018-06-15 2019-12-19 日鉄テックスエンジ株式会社 ワーク搬送部材、ワーク搬送装置、および、熱処理装置
US20210031368A1 (en) * 2019-08-02 2021-02-04 Dextrous Robotics, Inc. Robotic system for picking and placing objects from and into a constrained space
US11845184B2 (en) 2022-04-18 2023-12-19 Dextrous Robotics, Inc. System and/or method for grasping objects

Citations (2)

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JP2000343476A (ja) * 1999-06-09 2000-12-12 Nippon Mitsubishi Oil Corp 搬送用部材
JP2005054541A (ja) * 2003-08-07 2005-03-03 Nippon Oil Corp 炭素繊維強化プラスチック製梁部材および炭素繊維により補強した梁部材

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KR20020077179A (ko) * 2001-03-29 2002-10-11 니폰 미쓰비시 오일 코포레이션 로봇 핸드 부재 및 그 제조 방법
US6815037B2 (en) * 2001-09-19 2004-11-09 Nippon Mitsubishi Oil Corporation Carrier member made of a UV resistant fiber-reinforced composite material and process for producing thereof
WO2005102618A1 (ja) * 2004-04-20 2005-11-03 Nippon Oil Corporation ロボットハンド部材、その製造方法及びロボットハンド
JP2005340480A (ja) * 2004-05-26 2005-12-08 Nippon Oil Corp 基板カセット用サポートバー
US7073834B2 (en) * 2004-06-25 2006-07-11 Applied Materials, Inc. Multiple section end effector assembly
CH697200A5 (de) * 2004-10-01 2008-06-25 Oerlikon Assembly Equipment Ag Klemmvorrichtung und Transportvorrichtung zum Transportieren von Substraten.

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
JP2000343476A (ja) * 1999-06-09 2000-12-12 Nippon Mitsubishi Oil Corp 搬送用部材
JP2005054541A (ja) * 2003-08-07 2005-03-03 Nippon Oil Corp 炭素繊維強化プラスチック製梁部材および炭素繊維により補強した梁部材

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6410999B1 (ja) * 2017-12-25 2018-10-24 堺ディスプレイプロダクト株式会社 蒸着マスク、蒸着方法及び有機ｅｌ表示装置の製造方法
JP6411000B1 (ja) * 2017-12-25 2018-10-24 堺ディスプレイプロダクト株式会社 蒸着マスク、蒸着方法及び有機ｅｌ表示装置の製造方法
WO2019130387A1 (ja) * 2017-12-25 2019-07-04 堺ディスプレイプロダクト株式会社 蒸着マスク、蒸着方法及び有機ｅｌ表示装置の製造方法
WO2019130388A1 (ja) * 2017-12-25 2019-07-04 堺ディスプレイプロダクト株式会社 蒸着マスク、蒸着方法及び有機ｅｌ表示装置の製造方法
US11038154B2 (en) 2017-12-25 2021-06-15 Sakai Display Products Corporation Vapor-deposition mask, vapor-deposition method and method for manufacturing organic el display apparatus
US11043635B2 (en) 2017-12-25 2021-06-22 Sakai Display Products Corporation Vapor-deposition mask having frame formed of carbon-fiber reinforced plastic, vapor-deposition method and method for manufacturing organic EL display apparatus
JP2019112712A (ja) * 2018-09-25 2019-07-11 堺ディスプレイプロダクト株式会社 蒸着マスク、蒸着方法及び有機ｅｌ表示装置の製造方法
JP2019112713A (ja) * 2018-09-25 2019-07-11 堺ディスプレイプロダクト株式会社 蒸着マスク、蒸着方法及び有機ｅｌ表示装置の製造方法
JP2023105858A (ja) * 2022-01-20 2023-08-01 東京エレクトロン株式会社 基板支持部材、基板搬送装置及び基板支持部材の製造方法

Also Published As

Publication number Publication date
EP2137762A1 (en) 2009-12-30
CN101652852A (zh) 2010-02-17
KR20100015756A (ko) 2010-02-12
US20080247857A1 (en) 2008-10-09
WO2008124421A1 (en) 2008-10-16
CN101652852B (zh) 2011-12-28

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