KR20090132966A - Apparatus for holding a substrate - Google Patents

Abstract

PURPOSE: A substrate holding apparatus is provided to satisfy various demands of a user by rotating a chuck or chuck pin clockwise or counter clockwise. CONSTITUTION: A ring gear(240) rotates in both directions with regard to a chuck(200). The ring gear includes an inner ring(242), an outer ring(244), and a connection bar(246). A connection bar connects the inner ring and the outer ring radially. A chuck pin(220) includes a lower gear part and an upper eccentric part. The lower gear part is engaged with the ring gear. The upper eccentric part fixes the substrate by the rotation. A pair of springs(260) are arranged in a circumference direction of the ring gear to face each other. The pair of springs returns the ring gear to an initial position.

Description

Substrate holding device {Apparatus for holding a substrate}

The present invention relates to a substrate fixing apparatus used for fixing a substrate in a sheet cleaning equipment for cleaning the substrate, specifically, the substrate is fixed to the substrate chuck pins included in the substrate fixing apparatus rotates in both directions, regardless of the rotation direction It is related with the board | substrate fixing apparatus which can be fixed.

In general, a semiconductor device may be manufactured by repeatedly performing a deposition, an etching process, or the like using a substrate. During such processes, contaminants such as various particles, metal impurities, organic impurities, and the like may remain on the substrate. Since the contaminants adversely affect the yield and reliability of the semiconductor device, a process of removing contaminants remaining on the substrate is performed during semiconductor manufacturing.

Substrate processing method for the process can be largely divided into dry processing method and wet processing method, among which the wet processing method using a variety of chemical liquid, batch type cleaning (batch type) processing a plurality of substrates at the same time It is divided into equipment and single wafer type cleaning equipment that processes substrates in sheets.

Recently, since very high cleanliness is required on the surface of the substrate, sheet cleaning equipment is widely used to satisfy this.

The single type cleaning apparatus includes a chamber in which a substrate is accommodated and a chamber in which the cleaning process is performed, a chuck that rotates in a state where the substrate is fixed, and a nozzle for supplying a cleaning liquid such as chemical liquid and pure liquid to the substrate.

1 is a perspective view schematically showing a chuck 110 and a nozzle 122 used for cleaning a substrate W in a general sheet type cleaning equipment 100.

A chuck pin 112 for fixing the substrate W is disposed around the upper portion of the chuck 120, and the chuck 110 rotates while the substrate W is fixed by the chuck pin 112. The cleaning liquid is supplied onto the substrate W from the nozzle 122 provided at the upper one side of the 110. At this time, the nozzle driving motor 124 pivots the nozzle 122 so that the cleaning liquid can be evenly distributed to the upper surface of the substrate W, thereby improving the cleaning efficiency.

However, the chuck pin 112 of the conventional single sheet cleaning equipment 100 rotates only in one direction to fix the substrate W, and releases the substrate W by rotating in the opposite direction. For this reason, the chuck 110 should also rotate only in one direction. Because the ring gear rotates in a direction opposite to the chuck pins 112, when the chuck pins 112 hold the substrate W, the chuck 110 rotates in a direction opposite to the direction of rotation of the chuck pins 112. This is because the ring gear in the closed state may return to the original position, thereby releasing the fixing of the substrate W so that the substrate W may be separated from the chuck 110.

In addition, the chuck pin 120 that rotates only in one direction does not satisfy the various needs of the user to fix the substrate by rotating the chuck pin 120 in a desired direction, either clockwise or counterclockwise, according to a preference. When the 120 rotates only in one direction, only one side of the chuck pin 120 is worn, so that the life of the chuck pin 120 may be shortened.

Accordingly, an object of the present invention is to provide a substrate fixing apparatus that can satisfy various needs of a user by fixing a substrate by rotating a chuck pin in a desired direction in a clockwise or counterclockwise direction in a sheet type cleaning equipment.

In addition, another object of the present invention to provide a substrate fixing apparatus that can be fixed to the substrate irrespective of the rotation direction of the chuck of the single wafer cleaning equipment.

Still another object of the present invention is to provide a substrate fixing apparatus capable of extending the life of the chuck pins by rotating the chuck pins of the single-leaf type cleaning equipment in both directions so as to evenly wear the chuck pins.

The substrate fixing device of the present invention is used in a single sheet cleaning equipment including a chuck for supporting a substrate. The substrate fixing device engages with a ring gear and a ring gear that can rotate in both directions with respect to the chuck and rotates corresponding to the rotation of the ring gear. It includes a chuck pin for fixing the, and a restoring member arranged in the circumferential direction of the ring gear so that at least one pair is facing each other to return the rotated ring gear to its original position.

The ring gear includes a ring-shaped inner ring, a ring-shaped outer ring disposed outside the inner ring, and a rod-shaped connecting bar for radially connecting the inner ring and the outer ring.

The restoring member may be a spring arranged symmetrically about this connecting bar, which spring is coupled to the connecting bar of the ring gear.

Alternatively, the restoring member may be a magnetic body including a first magnetic body attached to the ring gear and a pair of second magnetic bodies arranged to face each other about the first magnetic body.

Preferably, the first magnetic body and the second magnetic body may be permanent magnets.

Preferably, the first magnetic body may be a permanent magnet, the second magnetic body may be an electromagnet, and a power supply controller for selectively supplying current to the second magnetic body may be further included.

When the restoring member is a magnetic body, a blocking member may be provided to surround the first magnetic body and the second magnetic body to prevent the magnetic force generated from the first magnetic body and the second magnetic body from affecting the upper portion of the chuck.

According to the substrate fixing apparatus according to the present invention, it is possible to rotate the chuck pin in both directions for fixing the substrate, it is possible to meet the various needs of the user to rotate the chuck pin in the desired direction of the clockwise or counterclockwise direction.

In addition, according to the substrate fixing apparatus according to the present invention, there is an effect that can be fixed to the substrate irrespective of the rotation direction of the chuck used in the single wafer cleaning equipment.

In addition, according to the substrate fixing device according to the present invention, as the chuck pin rotates in both directions, the wear degree of the chuck pin is even, thereby preventing the wear on only one side, thereby extending the life of the chuck pin.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or limited by the embodiments. For reference, in the present description, the same numbers refer to substantially the same elements, and may be described by quoting the contents described in other drawings under the above rules, and the contents repeated or deemed apparent to those skilled in the art may be omitted.

2 is a perspective view illustrating a substrate fixing apparatus according to a first embodiment of the present invention, and the top plate of the chuck 200 is omitted, and the substrate fixing apparatus for fixing the substrate is shown in detail. It is a perspective view of the chuck pin with which the board | substrate fixing apparatus of this invention is equipped.

Referring to FIG. 2, the substrate fixing device according to the present embodiment engages with a ring gear 240 and a ring gear 240 capable of rotating in both directions with respect to the chuck 200 to correspond to the rotation of the ring gear 240. The rotating chuck pin 220, and a spring 260 that is a restoring member for returning the rotated ring gear 240 to its original position.

The ring gear 240 radially connects the inner ring 242 having a ring shape, the outer ring 244 having a larger diameter than the inner ring 242, and the inner ring 242 and the outer ring 244. It is provided with a bar-shaped connecting bar 246.

Referring to FIG. 3, the chuck pin 220 includes a lower gear part 222 engaging with the ring gear 240 and an upper eccentric part 224 protruding upward of the chuck 200 to fix the substrate by rotation. do. As the ring gear 240 rotates the lower gear part 222, the upper eccentric part 224 may fix the substrate or release the fixed state.

In other words, the ring gear 240 is connected to a motor (not shown), which is a driving member, receives a driving force from the motor to rotate relative to the chuck, and the rotation of the ring gear 240 is eventually engaged with the chuck pin ( Rotate 220). The chuck pin 220 disposed around the chuck 200 is rotated to fix the substrate loaded on the chuck 200.

The ring gear 240 and the chuck pin 220 of the substrate fixing apparatus according to the first embodiment of the present invention are configured to be rotatable in both directions. That is, referring to FIG. 2, the ring gear 240 rotates counterclockwise to rotate the chuck pin 220 clockwise to fix the substrate, and the chuck pins due to clockwise rotation of the ring gear 240 ( The fixing of the substrate may also be performed by the counterclockwise rotation of 220. In order to enable rotation of the ring gear 240 and the chuck pin 220 in both directions, it is preferable that the driving member uses a motor capable of forward rotation and reverse rotation.

As shown in FIG. 2, the spring 260 is coupled to the connecting bar 246 of the ring gear 240. Specifically, the spring 260 is arranged in the circumferential direction in the connecting bar 246 of the ring gear 240 so that two pairs to face each other, a pair of springs in each of the plurality of connecting bar 246 260 may be combined.

The type of the spring 260 is not limited, but in general, the spring 260 may be selected to have excellent compression characteristics in order to smoothly return the ring gear 240 to its original position. In addition, when the spring 260 has both a compressive force and a tensile force, since the home position return of the ring gear 240 can be performed more efficiently, a spring 260 having excellent compression and tensile characteristics can be selected. As the spring 260, a coil spring, an air spring, a rubber spring, or the like may be used. However, the restoring member is not necessarily limited to the spring, and any one of synthetic resin, rubber material, and the like may be used as long as it has a restoring force capable of returning the ring gear 240 to its original position.

The operation of the ring gear 240 to return to its original position by the spring 260 will be briefly described as follows.

In the state where the substrate is fixed by the chuck pin 220, the ring gear 240 is rotated in either the clockwise or counterclockwise direction from the original position, so that the pair of springs 260 arranged to face each other restoring force This will work. That is, one of the pair of springs 260 is a compressive force acts on the other, the tension force acts on the other. At this time, when the driving force applied from the motor is released, the ring gear 240 is returned to its original position by the compression force and the tension of the spring 260, and the chuck pin 220 engaged with the ring gear 240 also rotates to the original position. In this case, the state in which the substrate is restrained from the chuck pin 220 is released.

4 is a perspective view illustrating a substrate fixing apparatus according to a second exemplary embodiment of the present invention, and FIG. 5 schematically illustrates a magnetic body 360 and a blocking member 380 according to the second exemplary embodiment of the present invention. It is also.

The ring gear 340 and the chuck pin 320 including the inner ring 342, the outer ring 344, and the connecting bar 346 of the present embodiment have the structure of the ring gear 240 and the chuck pin 220 of the first embodiment. Since the operation method is the same as or similar to the description thereof will be omitted for simplicity.

The restoring member of the present embodiment is a magnetic body 360, and the magnetic body 360 faces each other with respect to the first magnetic body 362 and the first magnetic body 362 attached to the connection bar 346 of the ring gear 340. And a second magnetic body 364 arranged radially.

The first magnetic body 362 and the second magnetic body 264 may be permanent magnets. When arranged so that an attractive force acts between any one of the pair of second magnetic bodies 364 and the first magnetic body 362 adjacent thereto, the first magnetic body 362 adjacent to the other one of the second magnetic bodies 364 may be disposed. It is to have the polarity that the attraction force acts in between. On the contrary, when the repulsive force is applied between any one of the pair of second magnetic bodies 364 and the first magnetic body 362 adjacent thereto, the first magnetic body adjacent to the other one of the second magnetic bodies 364 may be disposed. The repulsive force acts between (362) to have a polarity. As such, either of the repulsive force or the attraction force acts on both sides of the connection bar 246 in the same manner, and when the ring gear 340 is out of the original position, the equilibrium state of the force is broken so that the magnetic material is in the ring gear 340. The restoring force by 360 acts.

The first magnetic body 362 may be a permanent magnet, and the second magnetic body 364 may be formed of an electromagnet. In this case, as shown in FIG. 5, a power supply controller 390 capable of selectively supplying current to the second magnetic material 364 that is an electromagnet is provided.

Compared to the case where the second magnetic body 364 is a permanent magnet, when the second magnetic body 364 is made of an electromagnet, the current is supplied to the second magnetic body 364 only when the ring gear 340 is restored to its original position. Except that, the configuration and operating principle for the remaining parts are the same or similar. However, when the second magnetic body 364 is made of an electromagnet, there is an advantage in that the motor for rotating the ring gear 340 is not required. Specifically, since the rotation of the ring gear 340 can be performed by supplying a current to only one of the pair of second magnetic bodies 364, there is an effect of reducing the cost and installation space due to the motor.

Referring to FIG. 5, in the present embodiment, the upper and side surfaces of the blocking member 380 surround the magnetic body 360 and the lower part is fixed to the chuck 300. The blocking member 380 may be formed of a metal or rubber material that can effectively block the magnetic force, so that the magnetic force generated from the first magnetic body 362 and the second magnetic body 264 affects the upper portion of the chuck 300. To prevent them. The front 382 and the rear 384 of the blocking member 380 is made of a rubber material that is easily deformed, and does not prevent the connection bar 346 from rotating in a predetermined range.

According to the substrate fixing apparatus according to the present invention, since the rotation direction of the chuck pins 220 and 320 can be selected, the cleaning process can be performed by fixing the substrate regardless of the rotation direction of the chucks 200 and 300, and the chuck pins ( There is an advantage that can extend the life of (220,320). In addition, since the substrate fixing apparatus according to the present invention can be installed in the existing sheet type cleaning equipment only by a simple structure change, there is an advantage in terms of cost reduction and device simplification.

As described above, although described with reference to the preferred embodiment of the present invention, those skilled in the art various modifications and variations of the present invention without departing from the spirit and scope of the invention described in the claims below I can understand that you can.

Included in this specification.

1 is a perspective view schematically showing a chuck and a nozzle used for cleaning a substrate in a general sheet type cleaning equipment;

2 is a perspective view of a substrate holding apparatus according to a first embodiment of the present invention;

3 is a perspective view of a chuck pin of the substrate fixing device of the present invention;

4 is a perspective view showing a substrate holding apparatus according to a second embodiment of the present invention;

FIG. 5 is a schematic diagram illustrating a magnetic material, a power supply controller, and a blocking member according to a second embodiment of the present invention shown in FIG. 4.

<Explanation of symbols for the main parts of the drawings>

100: single sheet cleaning equipment 200, 300: chuck

220, 320: Chuck pin 240, 340: Ring gear

260: spring 360: magnetic material

380: blocking member 390: power supply controller

Claims (8)

In the substrate holding apparatus of the sheet cleaning equipment comprising a chuck for supporting a substrate, A ring gear capable of rotating in both directions with respect to the chuck; A chuck pin engaged with the ring gear and rotating to correspond to the rotation of the ring gear to fix the substrate; And A restoring member arranged in the circumferential direction of the ring gear so that at least one pair faces each other to return the ring gear to its original position; Substrate fixing device of the single wafer cleaning equipment comprising a. The method of claim 1, The ring gear includes a ring-shaped inner ring, a ring-shaped outer ring disposed outside the inner ring, and a rod-shaped connecting bar connecting the inner ring and the outer ring in a radial direction, The restoring member is a substrate fixing device of the sheet type cleaning equipment, characterized in that arranged symmetrically around the connection bar. The method according to claim 1 or 2, The restoring member is a spring, wherein the spring is fixed to the ring gear substrate fixing apparatus, characterized in that coupled to the ring gear. The method according to claim 1 or 2, The restoring member is a magnetic material, and the magnetic material includes a first magnetic body attached to the ring gear and a pair of second magnetic bodies arranged to face each other with respect to the first magnetic body. Board fixture. The method of claim 4, wherein The first magnetic body and the second magnetic body substrate fixing device of the sheet type cleaning equipment, characterized in that the permanent magnet. The method of claim 4, wherein And said first magnetic material is a permanent magnet and said second magnetic material is an electromagnet. The method of claim 6, And a power supply controller for selectively supplying current to the pair of second magnetic bodies. The method of claim 4, wherein The substrate holding apparatus of the single type cleaning equipment, characterized in that it further comprises a blocking member for blocking the magnetic force generated in the first magnetic material and the second magnetic material to affect the upper portion of the chuck.

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