JP2014045028A - Substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of avoiding stress concentration in a peripheral part of a substrate and improving substrate processing quality.SOLUTION: A substrate processing apparatus includes a spin chuck 2 which holds and rotates a substrate W. The spin chuck 2 includes a spin base 6 which is rotated around a rotation axis L1 and a plurality of holding bases 7 provided on the spin base 6. Each holding base 7 is displaceable between a holding position at which the substrate W is held and a releasing position at which holding of the substrate W is released. A fixing pin 28 and a movable pin 29 are supported on the holding base 7. The fixing pin 28 includes a fixed contact part 32 in which a relative position to the holding base 7 is fixed. The movable pin 29 includes a movable contact part 33 which can relatively move to the holding base 7. The movable pin 29 is elastically biased toward a peripheral end surface of the substrate W by biasing means.

Description

  The present invention relates to a substrate processing apparatus that holds a substrate by pins that come into contact with a peripheral end surface of the substrate and processes the held substrate with a processing liquid. Examples of substrates to be processed include semiconductor wafers, liquid crystal display substrates, plasma display substrates, FED (Field Emission Display) substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photo Mask substrates, ceramic substrates, solar cell substrates and the like are included.

  An example of a substrate processing apparatus for processing a substrate such as a semiconductor wafer is disclosed in Patent Document 1. The substrate processing apparatus includes a spin chuck that horizontally holds and rotates a single substrate, and a nozzle that supplies a processing liquid to the substrate held by the spin chuck. The spin chuck includes a spin base and three holding members disposed at equal intervals in the vicinity of the peripheral edge thereof. Each holding member has a plurality of holding pins and a horizontal support pin on the upper surface, and has a shaft portion rotatably attached to the spin base on the lower surface. The shaft is rotated about its axis by an interlocking link mechanism built in the spin base. The holding member is rotated by the rotation of the shaft portion, and accordingly, the pair of holding pins are rotated along an arcuate track. Accordingly, the holding pins can be moved closer to or away from the peripheral edge of the substrate, and the substrate can be held or released.

  Since the pair of holding pins is configured to hold the substrate by contacting the substrate, the stress applied to the substrate from the holding pins is dispersed, thereby preventing the substrate from being damaged.

JP 2006-253210 A

  However, in the configuration of Patent Document 1, each of the pair of holding pins is fixed to the holding member and does not move relative to the holding member. For this reason, only one of the pair of holding pins may come into contact with the substrate, and the other holding pin may be separated from the substrate. More specifically, an error may occur in the arrangement of the holding pins due to a limit on processing accuracy. There may also be variations in the size and shape of the substrate. In these cases, both of the pair of holding pins do not necessarily contact the peripheral end surface of the substrate.

Therefore, in the configuration of Patent Document 1, stress concentrates on the place where one holding pin is in contact with the peripheral edge of the substrate, which may adversely affect the substrate or damage the substrate.
In addition, the holding pins designed on the assumption that both of the pair of holding pins abut against the substrate may have insufficient strength when holding the substrate with only one of them. If each holding pin is formed sufficiently large, the strength problem may be overcome, but the large holding pin prevents the processing liquid from being discharged from the substrate, so that the processing quality on the substrate surface in the vicinity of the holding pin may be deteriorated. There is. Specifically, the replacement efficiency of the processing liquid in the vicinity of the contact portion between the holding pin and the substrate may be deteriorated, or the processing liquid may remain on the surface of the substrate in the vicinity of the holding pin after the drying process, resulting in poor drying.

  Accordingly, an object of the present invention is to provide a substrate processing apparatus capable of avoiding stress concentration at the peripheral edge of the substrate and improving the substrate processing quality.

  The substrate processing apparatus of the present invention is a substrate processing apparatus that holds a substrate (W) and processes it with a processing liquid, and is displaced between a holding position where the substrate is held and a release position where the holding of the substrate is released. A holding base (7, 43, 52, 64) which is possible and a fixed abutting portion (32) whose relative position with respect to the holding base is fixed, and when the holding base is in the holding position, A fixing pin (28) supported by the holding base so that the contact portion comes into contact with the peripheral end surface of the substrate and the fixed contact portion is separated from the peripheral end surface of the substrate when the holding base is in the release position; And a movable contact portion (33, 44) movable relative to the holding base, and the holding base is in a contact range from an intermediate position closer to the holding position than the release position to the holding position. When the movable contact portion is A movable pin (29, 42, 53, 63) supported by the holding base so as to be in contact with an end surface and so that the movable contact portion is separated from the peripheral end surface of the substrate when the holding base is in a release position; And a biasing means (37, 46) for resiliently biasing the movable abutting portion toward the peripheral end surface of the substrate in the abutting range. In addition, although the alphanumeric character in a parenthesis represents the corresponding component etc. in below-mentioned embodiment, it is not the meaning which limits a claim to embodiment. The same applies hereinafter.

  According to this configuration, the holding base can be displaced between the holding position and the release position. A fixed pin and a movable pin are supported on the holding base, and these are displaced along with the displacement of the holding base. When the holding base is in the release position, the fixed contact portion of the fixed pin and the movable contact portion of the movable pin are both separated from the peripheral end surface of the substrate. When the holding base is displaced from the release position to the holding position, the movable contact portion contacts the peripheral end surface of the substrate at the intermediate position, and the fixed contact portion contacts the peripheral end surface of the substrate at the holding position. In the contact range from the intermediate position to the holding position, the biasing means elastically biases the movable contact portion toward the peripheral end surface of the substrate.

  Therefore, in a state where the holding base has reached the holding position, both the fixed pin and the movable pin are reliably in contact with the peripheral end surface of the substrate. As a result, the stress applied to the peripheral end surface of the substrate can be dispersed, so that adverse effects on the substrate and damage to the substrate due to large stress can be avoided. In addition, since both the fixed pin and the movable pin can be reliably brought into contact with the peripheral end surface of the substrate, the fixed pin and the movable pin do not need to have great strength. Therefore, they can be designed relatively small. Accordingly, even when the substrate is processed with the processing liquid, it is possible to suppress or prevent the replacement efficiency of the processing liquid from being deteriorated or the remaining processing liquid from occurring between the fixed pin and the movable pin and the substrate. . Therefore, high-quality substrate processing can be realized.

In one embodiment of the present invention, the movable pin is supported so as to be movable relative to the holding base, and the biasing means is an elastic member (between the movable pin and the holding base). 37) (claim 2).
According to this configuration, the movable contact portion can be pressed against the peripheral end surface of the substrate by elastically biasing the movable pin toward the peripheral end surface of the substrate by the elastic member. Accordingly, both the fixed contact portion of the fixed pin and the movable contact portion of the movable pin can be reliably brought into contact with the peripheral end surface of the substrate with a simple configuration.

In another embodiment of the present invention, the movable pin includes a fixed portion (45) fixed to the holding base, and the urging means makes the fixed portion and the movable contact portion relative to each other. An elastic coupling member (46) that couples displaceably is included (claim 3).
According to this configuration, the movable contact portion can be displaced relative to the holding base by the action of the elastic coupling member incorporated in the movable pin. Accordingly, both the fixed contact portion of the fixed pin and the movable contact portion of the movable pin can be reliably brought into contact with the peripheral end surface of the substrate with a simpler configuration.

FIG. 1 is a side view showing a schematic configuration of a substrate processing apparatus according to a first embodiment of the present invention. FIG. 2 is a plan view showing a schematic configuration of the substrate processing apparatus according to the first embodiment. FIG. 3A is a schematic enlarged top view showing the holding base and the configuration related thereto according to the first embodiment, and shows a state where the holding base is in the holding position. FIG. 3B is a schematic enlarged top view showing the holding base according to the first embodiment and a configuration related thereto, and shows a state where the holding base is in the release position. FIG. 3C is a schematic enlarged top view showing the holding base according to the first embodiment and a configuration related thereto, and shows a state where the holding base is in an intermediate position. 4A and 4B are schematic enlarged side views showing the configuration and operation of the holding base and the fixing pins arranged on the holding base according to the first embodiment. 5A and 5B are schematic enlarged side views showing the configuration and operation of the holding base and the movable pins arranged on the holding base according to the first embodiment. FIG. 6 is a process diagram showing an example of processing by the substrate processing apparatus according to the first embodiment. FIG. 7 is a graph for explaining the contradiction between the drying time and the contact width between the substrate and the holding pin. FIG. 8 is a schematic enlarged side view showing the configuration of the holding base and the movable pin of the substrate processing apparatus according to the second embodiment of the present invention. FIG. 9 is a schematic enlarged top view of the holding base of the substrate processing apparatus according to the third embodiment of the present invention. FIG. 10 is a schematic enlarged top view of the holding base of the substrate processing apparatus according to the fourth embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a side view showing a schematic configuration of a substrate processing apparatus according to a first embodiment of the present invention, and FIG. 2 is a plan view thereof.
The substrate processing apparatus 1 is a single-wafer type substrate processing apparatus that processes circular substrates W such as semiconductor wafers one by one. The substrate processing apparatus 1 includes a spin chuck 2 (substrate holding means) that holds a substrate W horizontally and rotates it around a vertical rotation axis L1 passing through the center of the substrate W, and a substrate W held on the spin chuck 2. And a processing liquid supply mechanism 3 (processing liquid supply means) for supplying the processing liquid. The spin chuck 2 is accommodated in a processing chamber 4 partitioned by a partition wall (not shown).

  The spin chuck 2 is disposed on the spin base 6, a cylindrical rotary shaft 5 that extends vertically along the rotational axis L 1, a disc-shaped spin base 6 that is horizontally attached to the upper end of the rotary shaft 5, and the spin base 6. A plurality of holding bases 7 and a spin motor 8 (chuck rotation drive mechanism) that rotates the rotation shaft 5 around the rotation axis L1 are included. The spin chuck 2 is a clamping chuck that holds the substrate W horizontally with the substrate W held in the horizontal direction.

In this embodiment, the four holding bases 7 are arranged at appropriate intervals along the circumference corresponding to the outer peripheral shape of the substrate W at the peripheral edge of the upper surface of the spin base 6. Note that three or more holding bases may be arranged. For example, six holding bases may be arranged on the spin base 6.
The spin chuck 2 can sandwich and hold the substrate W in the horizontal direction by bringing a plurality of holding pins 9 supported by the holding bases 7 into contact with the peripheral end surface of the substrate W. As a result, the substrate W is horizontally held in a state of being spaced upward from the upper surface of the spin base 6. The spin chuck 2 has a horizontal support pin 10 on the spin base 6. When the substrate W is delivered between the spin chuck 2 and the substrate transport robot (not shown), the horizontal support pins 10 are in contact with the lower surface of the substrate W and support the substrate W at the delivery height. When processing by rotating the substrate W, the holding pins 9 are brought into contact with the peripheral end surface of the substrate W, thereby separating the substrate W above the horizontal support pins 10 and processing the substrate at a processing height higher than the delivery height. W is held. In a state where the substrate W is held at the processing height, the driving force of the spin motor 8 is input to the rotation shaft 5, whereby the substrate W rotates around the vertical rotation axis L <b> 1 passing through the center of the substrate W.

  The processing liquid supply mechanism 3 includes an upper surface processing liquid supply mechanism 11 that supplies the processing liquid to the upper surface of the substrate W held by the spin chuck 2. The upper surface processing liquid supply mechanism 11 includes a chemical liquid nozzle 12, a first chemical liquid supply pipe 13, and a first chemical liquid valve 14. Further, the upper surface treatment liquid supply mechanism 11 includes a rinse liquid nozzle 15, a first rinse liquid supply pipe 16, and a first rinse liquid valve 17. The first chemical liquid supply pipe 13 is connected to the chemical liquid nozzle 12. The first chemical liquid valve 14 is interposed in the first chemical liquid supply pipe 13. The first rinse liquid supply pipe 16 is connected to the rinse liquid nozzle 15. The first rinse liquid valve 17 is interposed in the first rinse liquid supply pipe 16.

  When the first chemical solution valve 14 is opened, the chemical solution is supplied from the first chemical solution supply pipe 13 to the chemical solution nozzle 12. Further, when the first chemical liquid valve 14 is closed, supply of the chemical liquid from the first chemical liquid supply pipe 13 to the chemical liquid nozzle 12 is stopped. The chemical solution discharged from the chemical solution nozzle 12 is supplied to the center of the upper surface of the substrate W held by the spin chuck 2. Similarly, when the first rinse liquid valve 17 is opened, the rinse liquid is supplied from the first rinse liquid supply pipe 16 to the rinse liquid nozzle 15. When the first rinse liquid valve 17 is closed, the supply of the rinse liquid from the first rinse liquid supply pipe 16 to the rinse liquid nozzle 15 is stopped. The rinse liquid discharged from the rinse liquid nozzle 15 is supplied to the center of the upper surface of the substrate W held by the spin chuck 2.

  The processing liquid supply mechanism 3 includes a lower surface processing liquid supply mechanism 18 that supplies the processing liquid to the lower surface of the substrate W held by the spin chuck 2. The lower surface processing liquid supply mechanism 18 includes a lower surface nozzle 19 that discharges the processing liquid toward the lower surface of the substrate W held by the spin chuck 2, a first processing liquid supply pipe 20 that extends vertically in the rotation shaft 5, A second processing liquid supply pipe 21 connected to the first processing liquid supply pipe 20. Further, the lower surface treatment liquid supply mechanism 18 includes a second chemical liquid supply pipe 22 and a second rinse liquid supply pipe 23 connected to the second treatment liquid supply pipe 21, and a second chemical liquid supply pipe 22. A chemical liquid valve 24 and a second rinse liquid valve 25 interposed in the second rinse liquid supply pipe 23 are included.

  The lower surface nozzle 19 includes a facing portion 26 that faces the central region of the lower surface of the substrate W held by the spin chuck 2. The facing portion 26 is disposed above the spin base 6. The facing portion 26 has, for example, a disc shape arranged along a horizontal plane. In the vicinity of the center of the facing portion 26, a processing liquid discharge port 27 that discharges the processing liquid toward the center of the lower surface of the substrate W held by the spin chuck 2 is formed.

  When the second chemical liquid valve 24 is opened, the chemical liquid is supplied from the first processing liquid supply pipe 20 to the lower surface nozzle 19 via the second processing liquid supply pipe 21. Further, when the second chemical liquid valve 24 is closed, the supply of the chemical liquid to the lower surface nozzle 19 is stopped. The chemical liquid supplied to the lower surface nozzle 19 is discharged upward from the processing liquid discharge port 27. As a result, the chemical solution is supplied to the center of the lower surface of the substrate W held by the spin chuck 2. Similarly, when the second rinsing liquid valve 25 is opened, the rinsing liquid is supplied from the first processing liquid supply pipe 20 to the lower surface nozzle 19 via the second processing liquid supply pipe 21. When the second rinse liquid valve 25 is closed, the supply of the rinse liquid to the lower surface nozzle 19 is stopped. The rinse liquid supplied to the lower surface nozzle 19 is discharged upward from the processing liquid discharge port 27 and is supplied to the center of the lower surface of the substrate W held by the spin chuck 2.

  Chemical solutions supplied from the processing solution supply mechanism 3 to the substrate W include sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, BHF (Buffered Hydrogen Fluoride), ammonia water, hydrogen peroxide water, organic acid ( Examples thereof include a liquid containing at least one of citric acid, oxalic acid, etc., organic alkali (eg, TMAH: tetrathylammonium hydroxide, etc.), surfactant, and corrosion inhibitor. The rinse liquid supplied from the processing liquid supply mechanism 3 to the substrate W includes pure water (deionized water), carbonated water, electrolytic ion water, hydrogen water, ozone water, and a diluted concentration (for example, about 10 to 100 ppm). Examples thereof include hydrochloric acid water.

3A, 3B, and 3C are schematic enlarged top views showing the holding base 7 and the configuration related thereto.
3A shows a state in which the holding base 7 is in the holding position and the substrate W is held by the fixed pin 28 and the movable pin 29. In FIG. 3B, the holding base 7 is in the release position. A state in which the substrate W is supported by the horizontal support pins 10 is shown. FIG. 3C shows a state where the holding base 7 is in an intermediate position between the holding position and the release position.

  On the holding base 7, a plurality of holding pins 9 including a single fixed pin 28 and a plurality of movable pins 29 and a horizontal support pin 10 are arranged. In this embodiment, the plurality of holding pins 9 include a single fixed pin 28 and two movable pins 29. In this embodiment, the holding base 7 is formed in an elliptical shape, and has a rotating shaft 30 extending downward along the vertical direction in the vicinity of one end portion of the elliptical long axis. The rotating shaft 30 is connected to a holding base rotating mechanism 31 (see FIGS. 4A and 4B).

  The holding base 7 is rotationally displaced about a vertical rotation axis L2 coaxial with the rotation shaft 30 by the holding base rotation mechanism 31. Specifically, the holding base 7 has a holding position (position in FIG. 3A) that holds the substrate by bringing the fixed pin 28 and the movable pin 29 into contact with the peripheral end surface of the substrate W, and the fixed pin 28 and the movable pin 29. Is displaced from the release position (position of FIG. 3B) separated from the peripheral end surface of the substrate W. When the holding base 7 is in the release position, the substrate W is supported from below by the horizontal support pins 10.

Further, the holding base 7 is disposed at a predetermined interval upward from the upper surface of the spin chuck 2 (see FIGS. 4A and 4B). Thereby, even when the holding base 7 is rotationally displaced, since there is no sliding portion between the holding base 7 and the spin chuck 2, the generation of particles can be suppressed.
The fixed pin 28 has a fixed contact portion 32 whose relative position to the holding base 7 is fixed. When the holding base 7 is in the holding position, the fixed contact portion 32 contacts the peripheral end surface of the substrate W (see FIG. 3A). On the other hand, when the holding base 7 is in the release position, the fixed contact portion 32 is separated from the peripheral end surface of the substrate W (see FIG. 3B).

  The two movable pins 29 are arranged with the fixed pin 28 sandwiched in the circumferential direction of the substrate W, and each has a movable contact portion 33 that can move relative to the holding base 7. More specifically, the two movable contact portions 33 are arranged at predetermined intervals from the fixed contact portion 32 along the circumferential direction of the substrate W. More specifically, in a state where all of the fixed contact portion 32 and the two movable contact portions 33 are in contact with the peripheral end surface of the substrate W, the contact positions of the two movable contact portions 33 are fixed. The contact portions 32 are spaced apart from each other by a predetermined distance or more.

  The movable contact portion 33 contacts the peripheral end surface of the substrate W when the holding base 7 is in a predetermined contact range from an intermediate position (see FIG. 3C) closer to the holding position than the release position to the holding position. When the holding base 7 is on the release position side of the contact range, the movable contact portion 33 is separated from the peripheral end surface of the substrate W. Therefore, when the holding base 7 is in the release position, the movable contact portion 33 is separated from the peripheral end surface of the substrate W. The movable pin 29 is arranged to be displaced toward the substrate W prior to the fixed pin 28 when the holding base 7 is displaced from the release position toward the holding position. In this embodiment, the two movable pins 29 are arranged so as to contact the peripheral end surface of the substrate W almost simultaneously at the intermediate position in the process of displacement of the holding base 7 from the release position toward the holding position. ing. Therefore, as shown in FIG. 3C, when the holding base 7 is in the intermediate position, the movable contact portions 33 of the two movable pins 29 are in contact with the peripheral end surface of the substrate W, and the fixed contact portion of the fixed pin 28 is fixed. 32 is separated from the peripheral end surface of the substrate W.

  The horizontal support pin 10 is disposed at a position closer to the rotation axis L <b> 1 of the substrate W than the movable pin 29. More specifically, the horizontal support pins 10 are located inside the peripheral end surface of the substrate W in plan view even when the holding base 7 is in the release position. Therefore, when the holding base 7 is in the release position and the fixed pin 28 and the movable pin 29 are separated from the peripheral end surface of the substrate W, the substrate W is supported horizontally by the horizontal support pins 10. The horizontal support pin 10 may be disposed on the rotation axis L2. In this case, since the horizontal support pin 10 is the center of rotation, the position of the horizontal support pin 10 relative to the substrate W is fixed. Therefore, when the holding base 7 is rotationally displaced, the relative position between the horizontal support pins 10 and the substrate W is kept unchanged, so that the support position of the substrate W by the horizontal support pins 10 does not change, and rubbing between them. Does not occur. In this case, the fixed pin 28 and the movable pin 29 are rotationally displaced with the horizontal support pin 10 as the rotational center.

  In this embodiment, all the holding bases 7 provided in the spin base 6 are similarly configured. Therefore, when the substrate W is to be rotated while being held, all the holding bases 7 are arranged in the holding position, so that the peripheral end surfaces of the substrate W are fixed pins 28 and movable pins respectively provided on all the holding bases 7. 29. Further, when the substrate W is transferred between the substrate transfer robot (not shown) and the spin chuck 2, all the holding bases 7 are arranged at the release position, so that the lower surface of the peripheral edge of the substrate W is all The holding base 7 is in contact with the horizontal support pins 10 provided respectively, and the substrate W is supported by the horizontal support pins 10 from below.

4A and 4B are schematic enlarged side views showing the configuration and operation of the holding base 7 and the fixing pin 28. FIG.
4A shows a state in which the holding base 7 is in the release position and the substrate W is horizontally supported by the horizontal support pins 10. In FIG. 4B, the holding base 7 is in the holding position and the substrate The state where W is held horizontally by the fixing pin 28 is shown.

  The holding base rotation mechanism 31 is connected to a rotating shaft 30 provided on the holding base 7. The holding base rotation mechanism 31 is accommodated in the spin chuck 2, for example. When the driving force of the holding base rotating mechanism 31 is input to the rotating shaft 30 of the holding base 7, the holding base 7 has the contact portions 32 and 33 of the fixed pin 28 and the movable pin 29 at the peripheral end surface of the substrate W. Between the holding position (see FIGS. 3A and 4B) where the substrate W is held and the release position (see FIGS. 3B and 4A) where the contact portions 32 and 33 are separated from the peripheral end surface of the substrate W. Displace between.

The horizontal support pin 10 has a substantially hemispherical head. Therefore, when the holding base 7 is in the release position, the horizontal support pins 10 make point contact with the lower surface of the peripheral edge of the substrate W. Thereby, the board | substrate W is horizontally supported by the horizontal support pin 10 from the lower surface side (refer FIG. 4A).
The fixing pin 28 is formed in a columnar shape, and has a V-shaped fixed contact portion 32 that opens in the horizontal direction toward the rotation axis L <b> 1 of the substrate W. Therefore, when the holding base 7 is rotated from the release position toward the holding position, the substrate W placed on the horizontal support pin 10 is below the fixed contact portion 32 whose peripheral end surface is V-shaped. While being guided by the inclined surface 32b, it rises from the delivery height to the processing height. When the holding base 7 reaches the holding position, the substrate W enters the fixed abutting portion 32 formed on the fixing pin 28, and the peripheral end portion is the upper inclined surface of the V-shaped fixed abutting portion 32. It is held horizontally by being sandwiched between 32a and the lower inclined surface 32b (see FIG. 4B).

5A and 5B are schematic enlarged side views showing the configuration and operation of the holding base 7 and the movable pin 29. FIG. 5A and 5B, parts corresponding to the parts shown in FIGS. 4A and 4B are denoted by the same reference numerals as those given to the respective parts, and description thereof will be omitted.
5A shows a state in which the holding base 7 is in the release position and the substrate W is horizontally supported by the horizontal support pins 10. In FIG. 5B, the holding base 7 is in the holding position and the substrate The state where W is held horizontally by the movable contact portion 33 of the movable pin 29 is shown.

The movable pin 29 is formed in a column shape, and has a V-shaped movable contact portion 33 that opens in the horizontal direction toward the rotation axis L <b> 1 of the substrate W.
The movable pin 29 integrally has a movable support portion 35 extending downward. The movable support portion 35 is inserted into the movable mechanism accommodating recess 34 provided in the holding base 7 below the movable pin 29. The movable mechanism accommodating recess 34 accommodates a movable mechanism 36 including an elastic member 37 as a biasing means and a stopper 38. In the example of FIGS. 5A and 5B, the movable mechanism accommodating recess 34 is formed between a pair of side surfaces 34a and 34c facing the rotational radius direction (direction perpendicular to the rotation axis L1) of the spin base 6 and the side surfaces 34a and 34c. And a bottom surface 34b for joining the two.

  The elastic member 37 may be a coil spring, a leaf spring, or the like. 5A and 5B show a coil spring as an example of the elastic member 37. FIG. This coil spring is a compression coil spring disposed between the outer side surface 34 a of the movable mechanism housing recess 34 and the movable support portion 35. Thereby, the movable support part 35 is urged | biased in the direction which goes to the rotation axis L1 side of the board | substrate W. Further, a stopper 38 protrudes from the bottom surface 34 b of the movable mechanism housing recess 34. The stopper 38 restricts the movement of the movable support portion 35 toward the rotation axis L <b> 1 against the urging force of the elastic member 37. Therefore, the movable support portion 35 can be displaced between the outer side surface 34 a and the stopper 38, and the movable pin 29 can be moved relative to the holding base 7 accordingly.

  When the holding base 7 is displaced from the holding position toward the release position, the movable support portion 35 stops at a position spaced apart from the side surface 34c of the movable mechanism housing recess 34 by a certain distance, thereby being separated from the peripheral end surface of the substrate W. To do. When the holding base 7 is in the contact range from the intermediate position closer to the holding position than the release position to the holding position, the movable contact portion 33 is in contact with the peripheral end surface of the substrate W. At this time, since the movable pin 29 (movable support portion 35) is pressed from the substrate W, the elastic member 37 is compressed. Accordingly, the movable pin 29 is urged toward the rotation axis L1 side of the substrate W by the urging force generated by the elastic member 37 and is pressed against the peripheral end surface of the substrate W.

  When the holding base 7 is rotated from the release position toward the holding position, the substrate W placed on the horizontal support pin 10 has a lower inclined surface of the movable contact portion 33 whose peripheral end surface is V-shaped. While being guided by 33b, it rises from the delivery height to the processing height. When the holding base 7 reaches the holding position, the substrate W enters the movable contact portion 33, and the peripheral end portions thereof are the upper inclined surface 33a and the lower inclined surface 33b of the V-shaped movable contact portion 33. Is held horizontally.

FIG. 6 is a process diagram showing an example of processing by the substrate processing apparatus 1.
The substrate W to be processed is transferred from the substrate transfer robot to the spin chuck 2 (substrate loading step). At this time, the spin chuck 2 is controlled to be in a rotation stop state, and all the holding bases 7 are in the release position. Therefore, the substrate W is placed on the horizontal support pins 10 on the holding base 7 and supported horizontally. Thereafter, the substrate transfer robot retracts, and the holding base rotation mechanism 31 rotates and displaces the holding base 7 from the release position to the holding position. As a result, the holding pins 9 (the fixed pins 28 and the movable pins 29) of each holding base 7 abut against the peripheral end surface of the substrate W, and the substrate W is separated upward from the horizontal support pins 10, so that the plurality of holding bases 7. Are held by holding pins 9 respectively.

  When the spin motor 8 is driven in this state, the spin base 6 is rotated at a predetermined liquid processing speed, whereby the substrate W is rotated around the rotation axis L1 (substrate rotation process). Further, by opening the chemical liquid valves 14 and 24, the chemical liquid is supplied from the chemical liquid nozzle 12 and the lower surface nozzle 19 to the upper surface and the lower surface of the substrate W, respectively. The supplied chemical solution spreads over the entire upper and lower surfaces of the substrate W by centrifugal force, and the entire surface of the substrate is processed by the chemical action (chemical solution processing step).

  After supplying the chemical solution over a predetermined chemical solution processing time, the chemical valves 14 and 24 are closed, and the supply of the chemical solution is stopped. Instead, the rinse liquid valves 17 and 25 are opened, so that the rinse liquid is supplied from the rinse liquid nozzle 15 and the lower surface nozzle 19 to the upper surface and the lower surface of the substrate W, respectively. The supplied rinsing liquid spreads over the entire area of the upper and lower surfaces of the substrate W by centrifugal force, and the chemical liquid on the entire surface of the substrate is replaced and washed away (rinsing step).

After supplying the rinsing liquid over a predetermined rinsing time, the rinsing liquid valves 17 and 25 are closed, and the supply of the rinsing liquid is stopped. Next, the rotation speed of the spin base 6 is accelerated from the liquid processing speed to a higher drying speed. Thereby, spin dry is performed in which the liquid component on the surface of the substrate W is shaken off by centrifugal force (drying step).
After spin drying is executed for a predetermined drying processing time, the spin motor 8 is stopped and the rotation of the spin base 6 is stopped. Thereafter, all the holding bases 7 are rotated to the release position. As a result, the holding of the substrate W is released, and the substrate W is placed on the horizontal support pins 10 of the holding base 7. In this state, the substrate transport robot unloads the processed substrate W from the spin chuck 2 (substrate unloading process).

  FIG. 7 is a graph for explaining the contradiction between the drying time and the contact width of the holding pin. When the holding base 7 is guided to the holding position and the circular holding pin 9 in plan view is brought into contact with the peripheral end surface of the substrate W, the outer circle of the holding pin 9 is a circle formed by the outer shape of the substrate W in plan view. Cut out a part (arc). The “contact width” is defined by the length of the arc (more precisely, the length of the string connecting both ends of the arc).

  In preparing the graph of FIG. 7, a plurality of types of holding pins formed to have contact widths of 6.0 mm, 5.5 mm, and 2.3 mm were prepared. For each type of holding pin, a spin chuck (comparative example) was manufactured in which the substrate was held by four holding pins of the same type arranged one by one at four locations set at equal intervals along the peripheral end surface of the substrate. Using each of the spin chucks, a liquid process for supplying a processing liquid to the substrate was performed, and then a spin dry process was performed to examine the drying time of the processing liquid. The drying time is the time required for the amount of processing liquid remaining on the substrate to be reduced to an allowable amount. More specifically, it is the time until the residual treatment liquid at the contact portion between the substrate and the holding pin cannot be visually confirmed. The rotation speed of the substrate during spin drying was 2500 rpm.

According to the measurement results, the drying time when the contact width is 6.0 mm is about 80 seconds, the drying time when the contact width is 5.5 mm is about 60 seconds, and the contact width is 2. The drying time in the case of 3 mm was about 20 seconds.
For example, if the standard drying time (the longest allowable time in the drying process) is 25 seconds, the contact width must be 2.5 mm or less. However, if the diameter of the holding pin is reduced to reduce the contact width, the strength of the holding pin becomes a problem. Specifically, the durability of the holding pin can be ensured when the contact width is 5.0 mm or more (the region where the durability of the pin can be ensured), but the holding pin is sufficient when the contact width is 2.5 mm or less. Cannot have strength. However, in the region where the contact width is 5.0 mm or more, the remaining treatment liquid around the holding pin appears remarkably, and the drying time greatly exceeds the standard drying time of 25 sec.

After all, as shown in FIG. 7, there is no overlapping portion between the region that can be dried in 25 sec or less and the region where pin durability can be ensured, and in the spin chuck of the configuration in which one holding pin is arranged at each holding position, It is impossible to achieve both short-time drying and sufficient strength of the holding pin.
In the first embodiment, a plurality of holding pins 9 (29, 28) are arranged at intervals on one holding base 7, and all of these abut against the peripheral end surface of the substrate W. Therefore, for example, the total contact width of the plurality of holding pins 9 (28, 29) is 5 while the contact width of each of the plurality of holding pins 9 (28, 29) is 2.5 mm or less. It can be designed to be 0 mm or more. Thereby, the plurality of holding pins 9 (28, 29) provided in one holding base 7 can have a necessary strength as a whole. Since the contact widths of the individual holding pins 9 (28, 29) are sufficiently small, the substrate W can be sufficiently dried in a drying time equal to or shorter than the standard drying time to eliminate the remaining processing liquid. In addition, since the plurality of holding pins 9 (28, 29) are arranged at intervals, the holding pins 9 (28, 29) are not united to block the processing liquid, and are caused by centrifugal force. Smooth discharge of processing liquid can be realized. This also contributes to shortening the drying time and improving the treatment liquid replacement efficiency.

  As described above, according to this embodiment, the plurality of holding pins 9 provided on each holding base 7 include one fixed pin 28 and a plurality of movable pins 29, so that all the holding pins 9 can be securely connected. The substrate W can be held in a state where it is in contact with the peripheral end surface of the substrate W. Therefore, since the stress applied to the substrate W is dispersed, adverse effects on the substrate W due to stress concentration and damage to the substrate W can be avoided. In addition, since all the holding pins 9 provided on the holding base 7 can be reliably brought into contact with the peripheral end surface of the substrate W, each holding pin 9 does not need to have high strength. Therefore, they can be designed relatively small. Thereby, the treatment liquid replacement efficiency in the vicinity of each holding pin 9 is improved, and the substrate W can be dried while suppressing or preventing the remaining of the treatment liquid. Therefore, high-quality substrate processing can be realized.

FIG. 8 is a schematic enlarged side view showing the configuration of the holding base and movable pins of the substrate processing apparatus 41 according to the second embodiment of the present invention. In FIG. 8, parts corresponding to the parts shown in FIGS. 4A and 4B are denoted by the same reference numerals as those given to the respective parts, and description of those parts is omitted.
In the substrate processing apparatus 41 according to the second embodiment, the movable pin 42 is fixed and supported on the holding base 43. More specifically, the movable pin 42 combines the movable contact portion 44 that contacts the peripheral end surface of the substrate W, the fixed portion 45 fixed to the holding base 43, and the fixed portion 45 and the movable contact portion 44. The elastic coupling portion 46 is integrally provided. The movable pin 42 is configured in a column shape.

  The fixing portion 45 is fixed and supported so as not to be displaced relative to the holding base 43. The elastic coupling portion 46 is configured by forming a notch on the side surface of the movable pin 42 from the outer side of the rotation radius of the spin base 6. That is, the elastic coupling portion 46 is configured to be elastically deformed by reducing the cross-sectional area. A movable contact portion 44 is coupled above the elastic coupling portion 46. When the movable contact portion 44 is pressed against the peripheral end surface of the substrate W, the elastic coupling portion 46 is elastically deformed so that the movable contact portion 44 moves away from the rotation axis L1 of the substrate W with respect to the fixed portion 45. Is relatively displaced. At this time, the movable contact portion 44 is urged toward the peripheral end surface of the substrate W by the restoring force generated by the elastic coupling portion 46 according to the deformation amount of the elastic coupling portion 46. That is, the elastic coupling portion 46 serves as a biasing unit that biases the movable contact portion 44 toward the peripheral end surface of the substrate W.

  According to this configuration, the movable pin 42 has a fixed relative position with respect to the holding base 43, but the movable contact portion 44 can be displaced relative to the holding base 43. As a result, the movable pin 42 can be configured with a simpler configuration without providing the movable mechanism accommodating recess 34 and the movable mechanism 36 accommodated therein as in the first embodiment. Thereby, both the fixed pin 28 and the movable pin 42 can be reliably brought into contact with the peripheral end surface of the substrate W with a simple configuration. As a result, the same effect as the substrate processing apparatus 1 can be achieved.

FIG. 9 is a schematic enlarged top view of the holding base of the substrate processing apparatus 51 according to the third embodiment of the present invention. In FIG. 9, parts corresponding to the parts shown in FIGS. 3A and 3B are denoted by the same reference numerals as those given to those parts, and the description of those parts is omitted.
In the substrate processing apparatus 51 according to the third embodiment, when the holding base 52 is displaced from the release position to the holding position, one of the two movable pins 53 (53a, 53b) arranged on the holding base 52 is used. The movable pin 53 is disposed at a position that comes into contact with the peripheral end surface of the substrate W earlier than the other movable pin 53. In FIG. 9, the movable pin 53a on the side close to the rotation axis L2 is disposed at a position where the movable pin 53a comes into contact with the peripheral end surface of the substrate W earlier than the movable pin 53b on the side far from the rotation axis L2. Thereby, when the holding base 52 is rotationally displaced from the release position to the holding position, one movable pin 53a first contacts the peripheral end surface of the substrate W, and then the other movable pin 53b is the peripheral end surface of the substrate W. Finally, the fixing pin 28 comes into contact with the peripheral end surface of the substrate W. When the holding base 52 is rotationally displaced from the holding position to the release position, the fixed pin 28 is separated from the peripheral end surface of the substrate W, then the movable pin 53b is separated from the peripheral end surface of the substrate W, and finally the movable pin 53a is moved. The substrate W is separated from the peripheral end surface. As described above, the plurality of movable pins 53b and 53b may be configured to sequentially contact / separate from the peripheral end surface of the substrate W.

FIG. 9 shows a configuration in which the movable pin 53a close to the rotation axis L2 is disposed so as to come into contact with the peripheral end surface of the substrate W earlier than the movable pin 53b, but is far from the rotation axis L2. The movable pin 53b on the side may be placed in contact with the peripheral end surface of the substrate W earlier than the movable pin 53a on the near side.
FIG. 10 is a schematic enlarged top view of the holding base of the substrate processing apparatus 61 according to the fourth embodiment of the present invention. In FIG. 10, parts corresponding to the parts shown in FIGS. 3A and 3B are denoted by the same reference numerals as those given to the respective parts, and description of those parts is omitted.

In the substrate processing apparatus 61 according to the fourth embodiment, a single fixed pin 62 and one movable pin 63 are disposed on a holding base 64. Thus, there can be only one movable pin.
[Other embodiments]
The description of the embodiment of the present invention is as described above, but the present invention is not limited to the contents of the first to fourth embodiments described above, and various modifications are possible within the scope of the claims. .

  For example, in the first embodiment described above, the two movable pins 29 are disposed so as to straddle the single fixed pin 28, but the fixed pin 28 and the other movable pin are sandwiched between the one movable pin 29. 29 may be arranged. That is, a plurality of movable pins 29 may be arranged on the same side in the circumferential direction of the substrate W with respect to the single fixed pin 28. Further, three or more movable pins 29 may be arranged.

In the first to fourth embodiments, the elliptical holding bases 7, 43, 52, and 64 are used. However, shapes other than the elliptical shape, for example, a circular shape or an egg shape may be used.
Furthermore, in the above-described embodiment, the configuration in which the holding base is rotationally displaced has been described, but the holding base may be configured to slide on the spin base 6 with respect to the peripheral end surface of the substrate.
In the above-described embodiment, the circular substrate W is taken as an example. However, the present invention can be similarly applied to a substrate processing apparatus that performs processing on a square substrate.

  In addition, various modifications can be made within the scope of the matters described in the claims.

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 7 Holding base 9 Holding pin 28 Fixed pin 29 Movable pin 32 Fixed contact part 33 Movable contact part 37 Elastic member 41 Substrate processing apparatus 42 Movable pin 43 Holding base 44 Movable contact part 45 Fixed part 46 Elastic coupling Unit 51 Substrate Processing Device 52 Holding Base 53 Movable Pin 61 Substrate Processing Device 62 Fixed Pin 63 Movable Pin 64 Holding Base W Substrate

Claims (3)

A substrate processing apparatus for holding a substrate and processing with a processing liquid,
A holding base that is displaceable between a holding position where the substrate is held and a release position where the holding of the substrate is released;
A fixed abutting portion whose relative position with respect to the holding base is fixed; and when the holding base is in the holding position, the fixed abutting portion abuts on a peripheral end surface of the substrate, and the holding base is in the release position A fixed pin supported by the holding base so that the fixed contact portion is separated from the peripheral end surface of the substrate when
A movable contact portion that is movable relative to the holding base, and the movable contact portion is located when the holding base is in a contact range from an intermediate position closer to the holding position than the release position to the holding position; A movable pin supported by the holding base so that the contact portion is in contact with the peripheral end surface of the substrate and the movable contact portion is separated from the peripheral end surface of the substrate when the holding base is in the release position;
And a biasing means for resiliently biasing the movable contact portion toward the peripheral end surface of the substrate in the contact range. The movable pin is supported so as to be movable relative to the holding base;
The substrate processing apparatus according to claim 1, wherein the urging means includes an elastic member disposed between the movable pin and the holding base. The movable pin includes a fixed portion fixed to the holding base;
The substrate processing apparatus according to claim 1, wherein the biasing unit includes an elastic coupling member that couples the fixed portion and the movable contact portion so as to be relatively displaceable.

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